TWM544035U - Heat spreader device - Google Patents

Description

Temperature plate device

The present invention relates to a temperature equalizing plate device, and more particularly to a temperature equalizing plate device for assisting an electronic product or a mechanical structure for heat dissipation.

Referring to Figure 1, a known temperature equalizing plate apparatus 1 includes a bottom wall 11, a cover wall 12, and a plurality of heat pipes 13. The heat pipes 13 are arranged on the bottom wall 11 at intervals. The cover wall 12 is disposed on the bottom wall 11 and the heat pipes 13 , and the heat pipes 13 are fixed between the cover wall 12 and the bottom wall 11 by heat pressing. In use, the temperature equalizing plate device 1 is disposed above a heat source (not shown) through which the heat energy of the heat source passes and is conducted into the heat pipes 13, and the heat pipes 13 can be quickly Thermal energy is conducted from adjacent one end of the bottom wall 11 to one end away from the bottom wall 11 and conducts heat energy to the cover wall 12 and is discharged outward. However, the known temperature equalizing plate device 1 has a disadvantage in that the side wall of the cover wall 12 away from the bottom wall 11 is an irregular surface having a high and low undulation, which is disadvantageous for subsequent assembly of other auxiliary parts such as heat dissipation fins.

Referring to Figure 2, another known temperature equalizing plate assembly 2 includes a bottom wall 21, a cover wall 22, and a working fluid 23. The cover wall 22 includes a cover portion 221 above the bottom wall 21, and a plurality of partition portions 222 extending downward from the cover portion 221 and welded to the bottom wall 21. The cover wall 22 cooperates with the bottom wall 21 to define a plurality of accommodating spaces 24 , and the working fluid 23 is filled in the accommodating spaces 24 . Although the cover wall 22 is a flat plane away from the side surface of the bottom wall 21, there is a slight gap between the cover wall 22 and the bottom wall 21 due to manufacturing tolerances or poor soldering, except that The problem that the working fluid 23 leaks out occurs at the edge joint of the bottom wall 21 and the cover wall 22, and also affects the heat transfer path of the working fluid 23, resulting in poor heat conduction efficiency.

In addition, there is also a known temperature equalizing plate device which uses two sheets of copper to form a hollow chamber between the two, and a copper chamber is placed in the hollow chamber and sintered at a high temperature, and is surrounded by A rough surface capillary structure is formed on the inner wall surface of the hollow chamber. The capillary structure is used to increase the heat exchange area in the hollow chamber and to increase the efficiency of heat exchange. However, in addition to the aforementioned problems encountered in the welding of the copper plates, the temperature equalizing plate device has a problem that the preparation steps are cumbersome. Furthermore, the instability of the capillary structure during high-temperature sintering preparation also indirectly increases the quality cost of the temperature equalization plate device and increases the burden on the producer.

Accordingly, it is an object of the present invention to provide a temperature equalization plate apparatus that overcomes at least one of the disadvantages of the prior art.

Thus, the novel temperature equalizing plate device comprises a thermally conductive substrate and a working fluid. The heat-conducting substrate is a plate body integrally extruded from a high thermal conductivity material, and includes a body portion, and two sealing portions respectively located on opposite sides of the body portion and parallel to a first direction, The main body portion has a heat dissipating surface on one side and connecting the sealing portions, a plurality of heat conducting chambers spaced apart from each other and tightly formed between the sealing portions, and a plurality of protruding into the heat conducting chambers and mutually The spaced thermal cycle sheets have a continuous plane that is parallel to a second direction that is perpendicular to the first direction. The working fluid includes a plurality of fluid portions respectively stored in the heat transfer chambers, each of the fluid portions not being filled with the corresponding heat transfer chamber.

The effect of the novel is that the integrated design of the heat-conducting substrate can prevent the leakage of the working fluid in the heat-conducting chambers in addition to being more compact in preparation. The continuous planar design of the heat dissipating surface can facilitate the assembly of other heat dissipating components.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to Figures 3 and 4, a first embodiment of the novel temperature equalizing plate apparatus includes a thermally conductive substrate 3, and a working fluid 4, and defines a first direction 6 and a first dimension on a horizontal plane and perpendicular to each other. The second direction is 7.

The heat conductive substrate 3 is a plate body integrally extruded from a high thermal conductivity material such as copper, aluminum, aluminum alloy, magnesium aluminum alloy, and the like, and includes a body portion 31 and two sealing portions 32. The sealing portions 32 are formed by heat sealing, and are respectively located on opposite sides of the body portion 31 and parallel to the first direction 6.

The main body portion 31 has a bottom wall 311, a plurality of partition walls 312 extending upward from the bottom wall 311, and a top wall 313 which is connected to one side of the partition wall 311 away from the bottom wall 311. a side surface 314 parallel to the second direction 7 and connecting the sealing portions 32, a heat conducting surface 315 on the bottom side of the bottom wall 311 and connecting the sealing portions 32 and the side surfaces 314, a heat dissipating surface 316 on the top side of the top wall 313 and connecting the sealing portions 32 and the side surfaces 314 and spaced apart from the heat conducting surface 315, and a plurality of the bottom walls 311, the partition walls 312 and the top The wall 313 cooperates with the defined heat transfer chamber 33 and a plurality of heat cycle sheets 34 projecting from the bottom wall 311 and the top wall 313 into the heat transfer chambers 33. The heat conducting surface 315 and the heat dissipating surface 316 are parallel to each other, and the heat dissipating surface 316 has a continuous plane.

The heat transfer chambers 33 are spaced apart from each other and are hermetically formed between the seal portions 32, and each of the heat transfer chambers 33 is parallel to the second direction 7 and has a thermal evaporation zone 331 adjacent the upper edge. In the first embodiment, each of the heat conducting chambers 33 has a rectangular shape perpendicular to the cutting plane of the second direction 7. It should be noted that in other variations of the first embodiment, each of the heat transfer chambers 33 perpendicular to the second direction 7 may also have an elliptical shape extending along the upper and lower directions (see FIG. 5).

A plurality of the heat cycle sheets 34 project downwardly from the top wall 313 into the heat transfer chambers 33, and the other of the heat cycle sheets 34 are spaced apart from each other by the bottom. Wall 311 projects upwardly into the heat transfer chamber 33.

The working fluid 4 is a liquid that can be evaporated into a gaseous state after absorbing heat energy, such as purified water, a coolant or a refrigerant. The working fluid 4 includes a plurality of fluid portions 41 that are respectively stored in the heat transfer chambers 33. Each of the fluid portions 41 is not filled with the corresponding heat conduction chamber 33, and the thermal evaporation region 331 of the heat conduction chamber 33 remains.

When the first embodiment is in use, the heat conducting surface 315 of the body portion 31 is connected to a heat source (not shown), and the heat energy of the heat source is conducted upward to the bottom wall 311, and the heat conducting chambers. The heat circulating sheets 34 are connected to the bottom wall 311. The fluid portions 41 which are in a liquid state in the heat transfer chambers 33 absorb the heat energy from the bottom wall 311 and the heat cycle sheets 34 connected to the bottom wall 311, and a portion evaporates and is converted into a gaseous state. The gaseous portions 41 in the gaseous state are vaporized upward into the thermal evaporation zone 331 and contact the relatively low temperature of the top wall 313, and the thermal cycle sheets 34 connected to the top wall 313. The fluid portions 41 are again converted from the gaseous state back to the liquid state by condensation, and are dropped back into the fluid portion 41 which is originally in a liquid state to complete a cycle of heat conduction. The top wall 313 and the heat-recycling sheets 34 connected to the top wall 313 continue to conduct thermal energy upward to the relatively low-temperature heat-dissipating surface 316 after receiving the thermal energy, and the heat-dissipating surface 316 heats the heat upward. discharge. As apparent from the above, the heat cycle sheets 34 can increase the contact area when heat exchange is performed in the heat conduction chambers 33, and improve the efficiency of heat exchange.

Referring to FIG. 6 and FIG. 7, a second embodiment of the present invention has substantially the same structure as the first embodiment, and the difference is that the temperature equalizing plate device further comprises a material for connecting the thermally conductive substrate 3 and having high thermal conductivity. Heat sink fin set 5. The heat dissipation fin set 5 includes a bottom heat sink 51 connected to the heat conductive substrate 3 and closely attached to the heat dissipation surface 316, and a plurality of side heat sinks 52 extending upward from the bottom heat sink 51. The side fins 52 are spaced apart along the second direction 7.

In use of the second embodiment, the bottom fins 51 receive thermal energy conducted by the heat dissipating surface 316 and continue to conduct a portion of the thermal energy upwardly to the side fins 52. Since the bottom fins 51 and the side fins 52 have a large contact area with the atmosphere, the heat energy can be more quickly dissipated into the surrounding environment. Of course, in other variations of the second embodiment, the side fins 52 may also be arranged at an angle to the second direction 7, and a similar effect can be achieved.

In practical application, a thermal grease (not shown) is applied between the bottom heat sink 51 and the heat dissipation surface 316 for filling a small gap between the bottom heat sink 51 and the heat dissipation surface 316, and maintaining good Contact area, but if the structural design of the temperature equalizing plate device 1 as known in FIG. 1 is adopted, a large amount of the thermal conductive paste is required to fill the surface depression of the cover wall 12 in FIG. 1, thereby causing overall heat conduction. Efficiency is affected. Therefore, the flat design of the heat dissipating surface 316 of the second embodiment enables the bottom heat sink 51 of the heat dissipating fin set 5 to use a smaller amount of thermal conductive paste during assembly, which is more convenient in assembly. Good thermal conductivity.

It can be seen from the above that the heat-conducting substrate 3 of the novel temperature equalizing plate device is integrally molded and extruded, and no additional assembly work is required. In addition to being more compact in preparation, it is also possible to avoid dimensional tolerances or assembly methods. Preferably, the working fluid 4 in the heat transfer chambers 33 is caused to leak out. Furthermore, the continuous planar design of the heat dissipating surface 316 not only reduces the amount of the thermal grease used, but also facilitates the assembly of other heat dissipating components, and also maintains good heat dissipation. Therefore, the purpose of this new type can be achieved.

However, the above is only the embodiment of the present invention, and when it is not possible to limit the scope of the present invention, all the simple equivalent changes and modifications according to the scope of the patent application and the contents of the patent specification are still This new patent covers the scope.

3‧‧‧thermal substrate
31‧‧‧ Body Department
311‧‧‧ bottom wall
312‧‧‧ next door
313‧‧‧ top wall
314‧‧‧ side surface
315‧‧‧heat conduction surface
316‧‧‧heating surface
32‧‧‧ Sealing Department
33‧‧‧Hot Conduction Room
331‧‧‧ Thermal evaporation zone
34‧‧‧Hot cycle film
4‧‧‧Working fluid
41‧‧‧ Fluid Department
5‧‧‧Fixing fin group
51‧‧‧ bottom heat sink
52‧‧‧ Side heat sink
6‧‧‧First direction
7‧‧‧second direction

Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is an incomplete cross-sectional view of a known temperature equalizing plate device; FIG. 2 is another known 3 is a perspective view of a thermally conductive substrate of a first embodiment of the present invention; FIG. 4 is an incomplete cross-sectional view of the first embodiment; FIG. An incomplete cross-sectional view of another variation of an embodiment; FIG. 6 is a perspective view of a second embodiment of the present invention; and FIG. 7 is an incomplete cross-sectional view of the second embodiment.

3‧‧‧thermal substrate

31‧‧‧ Body Department

311‧‧‧ bottom wall

312‧‧‧ next door

313‧‧‧ top wall

315‧‧‧heat conduction surface

316‧‧‧heating surface

33‧‧‧Hot Conduction Room

331‧‧‧ Thermal evaporation zone

34‧‧‧Hot cycle film

4‧‧‧Working fluid

41‧‧‧ Fluid Department

Claims (8)

A temperature equalizing plate device comprising: a heat conducting substrate, a plate body integrally extruded from a high thermal conductivity material, and comprising a body portion, and two opposite sides on the opposite sides of the body portion and parallel a sealing portion in a first direction, the body portion having a heat dissipating surface on one side and connecting the sealing portions, a plurality of heat conducting chambers spaced apart from each other and tightly formed between the sealing portions, and a plurality of a heat-recycling sheet projecting into the heat-conducting chambers and spaced apart from each other, the heat-dissipating surface being in a continuous plane, the heat-conducting chambers being parallel to a second direction perpendicular to the first direction; and a working fluid comprising a plurality of The fluid portions are respectively stored in the heat transfer chambers, and each of the fluid portions is not filled with the corresponding heat transfer chamber. The temperature equalizing plate device of claim 1, wherein the body portion further has two side faces parallel to the second direction and connecting the sealing portions, and a connecting the sealing portions and the sides a heat conducting surface that is spaced apart from the heat dissipating surface. The temperature equalizing plate device of claim 2, wherein the body portion further has a bottom wall, a plurality of partition walls extending upward from the bottom wall by the bottom wall, and a body connecting the partition walls away from the bottom a top wall on one side of the wall, the bottom wall, the partition walls cooperating with the top wall to define the heat transfer chambers. The temperature equalizing plate device of claim 3, wherein a plurality of the heat cycle sheets project downwardly from the top wall into the heat transfer chambers, and the other ones of the heat cycle sheets are The bottom wall projects upwardly into the heat transfer chamber. The temperature equalizing plate device according to claim 4, wherein the sealing portions are formed by heat sealing. The temperature equalizing plate device of claim 5, further comprising a heat dissipating fin set connected to the heat conducting substrate, the heat dissipating fin set comprising a bottom heat sink connecting the heat dissipating surface of the heat conducting substrate, and a plurality of spaced intervals A side fin extending upward from the bottom fin. The temperature equalizing plate device according to any one of claims 1 to 6, wherein each of the heat conducting chambers has an elliptical shape perpendicular to a cutting plane of the second direction. The temperature equalizing plate device according to any one of claims 1 to 6, wherein each of the heat conducting chambers has a rectangular shape perpendicular to a cutting plane of the second direction.