1315177 九、發明說明： 【發明所屬之技術領域】 本發明涉及-種板型熱管，尤指_種應用於電子元件之散埶裝 置。 【先前技術】 電子元件〇巾央處理器）運行時產生大量歸，而使其本身及 系統溫度升高，_導致其運行性能下^為雜電子元件能正常運 行，通常在電子元件上安裝散熱裝置，排出其所產生之熱量。1315177 IX. Description of the Invention: [Technical Field] The present invention relates to a plate type heat pipe, and more particularly to a diverging device for electronic components. [Prior Art] The electronic component wipes the central processor) to generate a large amount of return during operation, and the temperature of the system itself and the system rises, resulting in the running performance of the hybrid electronic components, and the heat dissipation is usually installed on the electronic components. The device discharges the heat it generates.
第-圖所示為-種傳統之板型鮮，該板麵管包括—密封之腔 至及填充於該腔室内之工作液體如水等。該腔室包括與發熱元件如中 央處理器（CPU) 30等接觸之底板12，以及罩設於該底板12上之蓋 ，14。該板型熱管還包括設于該蓋板14上之複數散熱片2〇以加速熱 量散發。使用時，底板12吸收中央處理器3〇產生之熱量並使其内之 水夂熱开>成水蒸η* ’水蒸汽流向蓋板14，並將吸收之熱量傳遞給蓋板 14而冷凝成液態水回流到底板12，再次吸收熱量以便不斷將熱量從 底板12傳遞到蓋板14 ;蓋板14通過其上之散熱片2〇將吸收之熱量 散發到周圍環境中。 如上述所述，傳統之板型熱管通過水之相變潛熱來傳遞熱量，這 有助於將中央處理器30產生之熱量均勻地分佈到整個蓋板14，進而 &升散熱性能。惟’只有底板12上之一小部分與中央處理器接觸， 該接觸部分之溫度要比底板12上其他部分之溫度高很多，導致位於 接觸部分上之水之溫度過高，甚至形成干燒，即板型熱管與中央處理 器30接觸之部分内沒有液態水，只能利用水蒸汽通過顯熱來傳遞熱 里’不此繼績快速、有效地將熱量從底板12傳遞到蓋板μ。 【發明内容】 有鑒於此’有必要提供一種改進之板型熱管。 一種板型熱管，包括由頂壁及底壁圍成之中空密封腔室，該腔室 内盛裝有工作液體，其中一導熱塊位於該腔室内並與頂壁及底壁接 觸’複數具有毛細作用之肋條位於該腔室之内表面。 6 1315177 相較于習知技術，當板型熱管局部區域内沒有液態工作液體時， 導熱塊仍可以繼續將底壁上之熱量不斷地傳遞至頂壁。此外，肋條可 加速工作液體回流，可緩解干燒對板型熱管之損壞，提升板型熱管之 可靠性。 【實施方式】The first figure shows a conventional plate type, which includes a sealed cavity and a working liquid such as water filled in the chamber. The chamber includes a bottom plate 12 that is in contact with a heat generating component such as a central processing unit (CPU) 30, and a cover, 14 that is disposed on the bottom plate 12. The plate type heat pipe further includes a plurality of fins 2 disposed on the cover plate 14 to accelerate heat dissipation. In use, the bottom plate 12 absorbs the heat generated by the central processing unit 3 and causes the water therein to be hot. <Water vaporization η* 'Water vapor flows to the cover plate 14 and transfers the absorbed heat to the cover plate 14 to condense. The liquid water is returned to the bottom plate 12, again absorbing heat to continuously transfer heat from the bottom plate 12 to the cover plate 14; the cover plate 14 dissipates the absorbed heat to the surrounding environment through the fins 2 on it. As described above, the conventional plate type heat pipe transfers heat by the latent heat of phase change of water, which contributes to evenly distributing the heat generated by the central processing unit 30 to the entire cover plate 14 to further improve the heat dissipation performance. However, only a small portion of the bottom plate 12 is in contact with the central processing unit. The temperature of the contact portion is much higher than the temperature of other portions of the bottom plate 12, causing the temperature of the water on the contact portion to be too high, or even forming a dry burn. That is, there is no liquid water in the portion where the plate type heat pipe is in contact with the central processing unit 30, and only the water vapor can be used to transfer heat through the sensible heat. This is not the case, and the heat is quickly and efficiently transferred from the bottom plate 12 to the cover plate μ. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide an improved plate type heat pipe. A plate type heat pipe comprises a hollow sealed chamber surrounded by a top wall and a bottom wall, wherein the chamber contains a working liquid, wherein a heat conducting block is located in the chamber and is in contact with the top wall and the bottom wall. The ribs are located on the inner surface of the chamber. 6 1315177 Compared with the prior art, when there is no liquid working liquid in a local area of the plate type heat pipe, the heat conducting block can continue to continuously transfer the heat on the bottom wall to the top wall. In addition, the ribs accelerate the backflow of the working fluid, which can alleviate the damage of the dry heat to the plate type heat pipe and improve the reliability of the plate type heat pipe. [Embodiment]
請參閱第二至五圖，係本發明板型熱管之一實施例。該板型埶管 包括一底壁100、一頂壁200、以及第一、第二多孔板3⑻、4〇〇，^第 、第一多孔板300、400分別設置於底壁1〇〇與頂壁2〇〇相對之表面 内。底壁100與頂壁200通過焊接等方式共同形成一中空之密封腔室， 該腔室内含有適量之工作液體，如水'乙醇等。第一、第二多孔板3〇〇、 400可通過金屬粉末如銅粉燒結等方法分別製成，其上分別具有大量 微小孔洞從而使其具有毛細作用。第一、第二多孔板3〇〇、4〇〇利用其 毛細作用可驅動頂壁200上冷凝之工作液體快速回流並且均勻地分佈 到底壁100上。 底壁100包括一矩型底板110，及沿該底板11〇之四邊向上垂直延 伸而出之四個第一側壁12〇。一導熱塊130凸設於該底板110上表面之 中心位置，該導熱塊130係由導熱性能良好之金屬材料如銅、鋁等製 成，且導熱塊130與四個第一側壁120之間形成一環形空間以容納第一 多孔板300。 第一多孔板300包括一矩型基板310及設於該基板31〇四邊之四個 外侧壁320。基板310中部形成一第一通孔330用於容置底壁1〇〇上之導 熱塊130，且在該第一通孔33〇之邊緣形成有四個内侧壁34〇，該等内 側壁340圍設在導熱塊13〇周圍。在該四個内側壁34〇與四個外側壁320 之間設有複數具有毛細作用之肋條350，該等肋條350從内側壁340向 外側壁320呈放射狀延伸並將底壁10〇内之環形空間劃分為複數獨立 之小空間。如第四圖所示，當第一多孔板3〇〇被固定在底壁1〇〇内後， 第一多孔板300之基板310及四個外側壁320分別貼靠在底壁1〇〇之底 板110及四個第一側板上120。同時，第一多孔板300之四個内側壁340 貼靠在導熱塊130周圍。 頂壁200包括一矩型之頂板210 ’及分別從該頂板21〇四邊垂直向 下朝向底壁100之四個第一側壁12〇延伸之四個第二側壁22〇。這樣， 7 1315177 頂壁200内形成一槽形空間以容置第二多孔板400。第二多孔板4〇〇呈 扁平狀，其中心位置設有一第二通孔410，該第二通孔410與第一多孔 板300上之第一通孔330對應以容置導熱塊130之頂部。Referring to Figures 2 to 5, it is an embodiment of the plate type heat pipe of the present invention. The plate type manifold includes a bottom wall 100, a top wall 200, and first and second perforated plates 3 (8), 4, and the first perforated plates 300 and 400 are respectively disposed on the bottom wall 1〇〇. In the surface opposite to the top wall 2〇〇. The bottom wall 100 and the top wall 200 together form a hollow sealed chamber by welding or the like, and the chamber contains an appropriate amount of working liquid such as water 'ethanol. The first and second porous plates 3, 400 may be separately formed by a method such as sintering of a metal powder such as copper powder, and each of them has a large number of minute holes to have a capillary action. The first and second perforated plates 3, 4, 〇〇 can be used to drive the condensed working liquid on the top wall 200 to rapidly recirculate and uniformly distribute the bottom wall 100. The bottom wall 100 includes a rectangular bottom plate 110 and four first side walls 12 垂直 extending vertically upwardly along the four sides of the bottom plate 11 . A heat conducting block 130 is protruded from a center of the upper surface of the bottom plate 110. The heat conducting block 130 is made of a metal material having good thermal conductivity, such as copper, aluminum, or the like, and the heat conducting block 130 is formed between the first sidewalls 120. An annular space accommodates the first perforated plate 300. The first porous plate 300 includes a rectangular substrate 310 and four outer sidewalls 320 disposed on four sides of the substrate 31. A first through hole 330 is formed in the middle of the substrate 310 for receiving the heat conducting block 130 on the bottom wall 1 , and four inner side walls 34 are formed at the edge of the first through hole 33 , and the inner side walls 340 are formed. Surrounded by the heat conducting block 13〇. Between the four inner side walls 34 〇 and the four outer side walls 320 are a plurality of ribs 350 having capillary action, the ribs 350 extending radially from the inner side wall 340 to the outer side wall 320 and lining the bottom wall 10 The annular space is divided into a plurality of independent small spaces. As shown in the fourth figure, after the first perforated plate 3 is fixed in the bottom wall 1 , the substrate 310 and the four outer walls 320 of the first perforated plate 300 respectively abut against the bottom wall 1〇. The bottom plate 110 and the four first side plates 120. At the same time, the four inner side walls 340 of the first perforated plate 300 abut against the heat conducting block 130. The top wall 200 includes a rectangular top plate 210' and four second side walls 22a extending from the four sides of the top plate 21, respectively, downwardly toward the four first side walls 12 of the bottom wall 100. Thus, a grooved space is formed in the top wall 200 of the 7 1315177 to accommodate the second perforated plate 400. The second porous plate 4 is flat, and has a second through hole 410 at a central position thereof. The second through hole 410 corresponds to the first through hole 330 on the first porous plate 300 to receive the heat conductive block 130. The top.
第六圖所示為本發明板型熱管用於冷卻中央處理器500。如圖中 所示，底壁100與頂壁200通過焊接而組成一中空之密封腔室，且使第 一及第二多孔板300、400容置於該密封腔室内。同時，導熱塊13〇依 次穿過第一、第二多孔板300、400上之第一及第二通孔330、410後與 頂壁200直接接觸’而第一及第二多孔板3〇〇、400也形成圍繞該導熱 塊130之一環形腔室。第一多孔板3〇〇上之肋條350將該環形腔室内之 空間分隔成複數獨立之小空間以容納汽化之工作液體。冷凝成液態之 工作液體在第一及第二多孔板300、400之毛細作用下快速回流並均勻 地分佈在底壁100及導熱塊130上。 第七圖至第十圖所示為本發明板型熱管之另一實施例。該實施例 與上述實施例相近’主要不同之處在於頂壁2〇〇,上設有一第三通孔 230。導熱塊130依次穿過第一、第二多孔板3〇〇、400上之第一及第二 通孔330、410後，再穿過頂壁200,上第三通孔230，且導熱塊130之 頂面1302與頂壁200’之外表面共面。 本發明板型熱管使用時，底壁100吸收中央處理器5〇〇產生之熱 量。一部分熱量通過導熱塊130直接傳導至頂壁200、200,，即利用導 熱塊130之高熱傳導性進行導熱；一部分熱量被位於底壁1〇〇及導熱塊 130上之工作液體吸收並使工作液體汽化，進而可通過工作液體之相 態變化將熱量傳遞給頂壁200、200’。最後，頂壁200、200,將熱量散 發到周圍環境中達到冷卻中央處理器500之目的。第一、第二多孔板 300、400覆蓋底壁1〇〇與頂壁200、200’之内表面，並將導熱塊13〇之外 表面緊密包裹，故可將頂壁200上冷凝之工作液體快速而均勻地分佈 到底壁100及導熱塊130表面，可以避免板型熱管局部區域（通常為板 型熱管與中央處理器500接觸之部分）干燒；同時可以充分利用工作 液體之相態變化來傳遞熱量，提升板型熱管之熱傳導效率。此外，當 板型熱管局部區域内沒有液態工作液體時，導熱塊13〇仍可將底壁1〇〇 上之熱量不斷地傳遞至頂壁2〇0、2〇0’以降低中央處理器5〇〇之溫度。 為進一步提升散熱效果，可在頂壁200、200,上表面設置複數之散 熱片以加速頂壁200、200’上之熱量散發。在上述實施例中，肋條35〇 8The sixth figure shows a plate type heat pipe of the present invention for cooling the central processing unit 500. As shown in the figure, the bottom wall 100 and the top wall 200 are welded to form a hollow sealed chamber, and the first and second perforated plates 300, 400 are housed in the sealed chamber. At the same time, the heat conducting block 13〇 sequentially passes through the first and second through holes 330, 410 on the first and second perforated plates 300, 400 and then directly contacts the top wall 200' while the first and second perforated plates 3 The crucible 400 also forms an annular chamber surrounding the thermally conductive block 130. The ribs 350 on the first perforated plate 3 divide the space within the annular chamber into a plurality of separate small spaces to accommodate the vaporized working liquid. The working liquid condensed into a liquid is rapidly reflowed under the capillary action of the first and second perforated plates 300, 400 and uniformly distributed on the bottom wall 100 and the heat conducting block 130. 7 to 11 show another embodiment of the plate type heat pipe of the present invention. This embodiment is similar to the above embodiment. The main difference is that the top wall 2 is provided with a third through hole 230. The heat conducting block 130 sequentially passes through the first and second through holes 330, 410 on the first and second perforated plates 3, 400, and then passes through the top wall 200, the upper third through hole 230, and the heat conducting block The top surface 1302 of 130 is coplanar with the outer surface of the top wall 200'. When the plate type heat pipe of the present invention is used, the bottom wall 100 absorbs the heat generated by the central processing unit 5〇〇. A part of the heat is directly transmitted to the top wall 200, 200 through the heat conducting block 130, that is, the heat conduction is performed by the high thermal conductivity of the heat conducting block 130; a part of the heat is absorbed by the working liquid located on the bottom wall 1 and the heat conducting block 130 and the working liquid is absorbed. Vaporization, in turn, transfers heat to the top wall 200, 200' by phase changes in the working fluid. Finally, the top walls 200, 200 dissipate heat to the surrounding environment for cooling of the central processor 500. The first and second perforated plates 300, 400 cover the inner surfaces of the bottom wall 1 and the top wall 200, 200', and the outer surface of the heat conducting block 13 is tightly wrapped, so that the condensation on the top wall 200 can be performed. The liquid is quickly and evenly distributed on the surface of the bottom wall 100 and the heat conducting block 130, so that a part of the heat pipe of the plate type (usually the portion where the plate type heat pipe is in contact with the central processing unit 500) can be avoided, and the phase change of the working liquid can be fully utilized. To transfer heat and improve the heat transfer efficiency of the plate type heat pipe. In addition, when there is no liquid working liquid in a local area of the plate type heat pipe, the heat conducting block 13〇 can continuously transfer the heat on the bottom wall 1〇〇 to the top wall 2〇0, 2〇0′ to lower the central processing unit 5 The temperature of 〇〇. To further enhance the heat dissipation effect, a plurality of heat sinks may be disposed on the top surfaces of the top walls 200, 200 to accelerate the heat dissipation on the top walls 200, 200'. In the above embodiment, the ribs 35〇 8