CN209949741U - Heat radiation module with upper and lower temperature equalizing plates - Google Patents
Heat radiation module with upper and lower temperature equalizing plates Download PDFInfo
- Publication number
- CN209949741U CN209949741U CN201920339865.9U CN201920339865U CN209949741U CN 209949741 U CN209949741 U CN 209949741U CN 201920339865 U CN201920339865 U CN 201920339865U CN 209949741 U CN209949741 U CN 209949741U
- Authority
- CN
- China
- Prior art keywords
- heat
- uniforming plate
- cavity
- temperature
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat radiation module with an upper uniform temperature plate and a lower uniform temperature plate, which comprises a lower uniform temperature plate, an upper uniform temperature plate, a heat pipe and a plurality of fins, wherein a first containing cavity is arranged inside the lower uniform temperature plate; the upper temperature-uniforming plate is arranged above the lower temperature-uniforming plate, and a second containing cavity is formed in the upper temperature-uniforming plate; the heat pipe is fixedly connected between the lower temperature-uniforming plate and the upper temperature-uniforming plate, a third containing cavity is formed in the heat pipe, and the first containing cavity, the second containing cavity and the third containing cavity are not communicated with each other; the plurality of radiating fins are vertically and parallelly arranged between the lower temperature-uniforming plate and the upper temperature-uniforming plate, and the bottom end of each radiating fin is connected with the lower temperature-uniforming plate and the top end of each radiating fin is connected with the upper temperature-uniforming plate. Therefore, the heat conduction efficiency and the heat dissipation efficiency of the heat dissipation module are improved.
Description
Technical Field
The present invention relates to a heat dissipation module with a vapor chamber, and more particularly to a heat dissipation module with upper and lower vapor chambers.
Background
As the operation speed of electronic devices is increasing, the generated heat is also increasing, and in order to effectively solve the problem of high heat generation, heat pipes (HeatPipe) and vapor chambers (vapor chamber) with good heat conduction characteristics are combined into a heat sink for application, thereby improving the heat dissipation efficiency.
However, most existing heat sinks employ heat pipes or condensation ends of temperature-equalizing plates to thermally attach heat dissipation fins, but the heat dissipation fins are conducted only by using pressure difference caused by temperature change of the environment, so that the heat conduction efficiency of the heat dissipation fins is greatly limited, heat is easily accumulated at the condensation ends of the heat pipes or the temperature-equalizing plates, and finally the condensation effect fails, thereby resulting in poor heat dissipation efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model provides a heat dissipation module with upper and lower samming board, its aim at utilizes heat pipe and heat radiation fins rigid coupling under between samming board and the last samming board to promote heat conduction efficiency and radiating efficiency of heat dissipation module.
In order to achieve the above object, the utility model provides a heat dissipation module with upper and lower temperature equalization board, include: the lower temperature-uniforming plate is internally provided with a first containing cavity; the upper temperature-uniforming plate is arranged above the lower temperature-uniforming plate, and a second containing cavity is formed in the upper temperature-uniforming plate; the heat pipe is fixedly connected between the lower temperature-uniforming plate and the upper temperature-uniforming plate, a third cavity is formed in the heat pipe, and the first cavity, the second cavity and the third cavity are not communicated with each other; and a plurality of heat dissipation fins which are vertically arranged between the lower temperature-uniforming plate and the upper temperature-uniforming plate in parallel, wherein the bottom end of each heat dissipation fin is connected with the lower temperature-uniforming plate, and the top end of each heat dissipation fin is connected with the upper temperature-uniforming plate.
Optionally, a plurality of the plurality of heat dissipation fins are connected to the heat pipe.
Optionally, the lower vapor chamber has a first side and a second side opposite to each other, the lower vapor chamber further has a middle section located between the first side and the second side, the number of the heat pipes is one, and the heat pipes are disposed in the middle section.
Optionally, the lower vapor chamber has a first side and a second side opposite to each other, the lower vapor chamber further has a middle section located between the first side and the second side, the number of the heat pipes is plural, and the plural heat pipes are arranged in the middle section at equal intervals.
Optionally, the lower vapor chamber has a first capillary structure and a first working fluid therein, the first capillary structure is only covered on the inner wall surface of the first cavity, and the first working fluid is only contained in the first cavity.
Optionally, the upper temperature-uniforming plate has a second capillary structure and a second working fluid therein, the second capillary structure is only covered on the inner wall surface of the second cavity, and the second working fluid is only contained in the second cavity.
Optionally, the heat pipe has a third capillary structure and a third working fluid inside, the third capillary structure is only covered on the inner wall surface of the third cavity, and the third working fluid is only contained in the third cavity.
Optionally, the first capillary structure, the second capillary structure and the third capillary structure are respectively one or a combination of more of groove-shaped, grid-shaped, fiber-shaped, sintered powder and wavy thin plate.
Optionally, the position of the heat pipe is opposite to the position of the heating element.
Based on the above, the heat pipe and the heat dissipation fins are fixedly connected between the lower temperature equalizing plate and the upper temperature equalizing plate, so that the heat absorbed by the lower temperature equalizing plate can be conducted through the heat dissipation fins by the pressure difference caused by the temperature change of the environment, and the heat pipe and the upper temperature equalizing plate can also conduct heat quickly through the convection of the working fluid vapor back to the liquid, so that the heat of the lower temperature equalizing plate can be dissipated to the upper temperature equalizing plate and the external environment quickly, and the double temperature equalizing plate type heat dissipation module has excellent heat conduction efficiency and heat dissipation efficiency.
Drawings
Fig. 1 is a schematic perspective view of the heat dissipation module of the present invention.
Fig. 2 is a schematic cross-sectional view of the heat dissipation module of the present invention.
Fig. 3 is another schematic cross-sectional view of the heat dissipation module of the present invention.
Fig. 4 is another schematic cross-sectional view of the heat dissipation module of the present invention.
Fig. 5 is a schematic cross-sectional view of another embodiment of the heat dissipation module of the present invention.
Fig. 6 is a schematic cross-sectional view illustrating another embodiment of a heat dissipation module according to the present invention.
Fig. 7 is a schematic cross-sectional view of another embodiment of the heat dissipation module of the present invention.
In the figure:
10 … heat sink module; 1, temperature-uniforming plate under 1 …; 11 … first volume; 12 … a first side edge; 13 … second side edge; 14 … middle section; 15 … a first capillary structure; 2 … temperature equalizing plate; 21 … second cavity; 22 … second capillary structure; 3 … heat pipe; 31 … third volume; 32 … third capillary structure; 4 … heat sink fins; 100 … heating element.
Detailed Description
The detailed description and technical contents of the present invention will be described below with reference to the accompanying drawings, which are provided for illustrative purposes only and are not intended to limit the present invention.
Referring to fig. 1 to 4, the present invention provides a heat dissipation module having upper and lower temperature-uniforming plates for a heat generating element 100, wherein the heat dissipation module 10 mainly includes a lower temperature-uniforming plate 1, an upper temperature-uniforming plate 2, a heat pipe 3 and a plurality of heat dissipation fins 4.
The lower temperature-uniforming plate 1 is internally provided with a first containing cavity 11, the upper temperature-uniforming plate 2 is arranged above the lower temperature-uniforming plate 1, and the upper temperature-uniforming plate 2 is internally provided with a second containing cavity 21.
The heat pipe 3 is fixedly connected between the lower temperature-uniforming plate 1 and the upper temperature-uniforming plate 2, the position of the heat pipe 3 is opposite to the position of the heating element 100 (as shown in fig. 4), a third cavity 31 is formed inside the heat pipe 3, and the first cavity 11, the second cavity 21 and the third cavity 31 are not communicated with each other. The shape of the heat pipe 3 is a vertical strip, but not limited thereto.
As described in detail below, the lower temperature uniforming plate 1 has a first capillary structure 15 and a first working fluid therein, the first capillary structure 15 is only covered on the inner wall surface of the first cavity 11, and the first working fluid is only contained in the first cavity 11.
In addition, the upper temperature-uniforming plate 2 has a second capillary structure 22 and a second working fluid therein, the second capillary structure 22 is only covered on the inner wall surface of the second cavity 21, and the second working fluid is only contained in the second cavity 21.
Furthermore, the heat pipe 3 has a third capillary structure 32 and a third working fluid inside, the third capillary structure 32 is only covered on the inner wall surface of the third cavity 31, and the third working fluid is only contained in the third cavity 31.
The first capillary structure 15, the second capillary structure 22, and the third capillary structure 32 are respectively one or a combination of a plurality of grooves, grids, fibers, sintered powder, and wavy sheets.
A plurality of heat dissipation fins 4 are vertically arranged between the lower temperature-uniforming plate 1 and the upper temperature-uniforming plate 2 in parallel, the bottom end of each heat dissipation fin 4 is connected to the lower temperature-uniforming plate 1, the top end of each heat dissipation fin 4 is connected to the upper temperature-uniforming plate 2, and parts of the plurality of heat dissipation fins 4 are connected to the heat pipe 3. In this embodiment, each heat dissipation fin 4 is connected to the lower temperature uniforming plate 1, the upper temperature uniforming plate 2 and the heat pipe 3 in an integrated manner, but not limited thereto, each heat dissipation fin 4 may also be connected to the lower temperature uniforming plate 1, the upper temperature uniforming plate 2 and the heat pipe 3 in an inserting manner or an adhering manner.
As described further below, the lower vapor chamber 1 has a first side 12 and a second side 13 opposite to each other, the lower vapor chamber 1 further has a middle section 14 located between the first side 12 and the second side 13, the number of the heat pipes 3 is one, and the heat pipes 3 are disposed in the middle section 14.
The utility model discloses radiating module 10's user state, it utilizes heat pipe 3 and 4 rigid couplings of heat radiation fin under between temperature equalizing plate 1 and last temperature equalizing plate 2, make the absorptive heat of temperature equalizing plate 1 down, except that heat radiation fin 4 carries out heat-conduction through the pressure differential that causes with ambient temperature change, heat pipe 3 also can be through the quick heat conduction of the convection current that working fluid vapour returned toward liquid with last temperature equalizing plate 2, let the heat of temperature equalizing plate 1 dissipate supreme temperature equalizing plate 2 and external environment fast down, have good heat conduction efficiency and radiating efficiency with reaching two temperature equalizing plate formula radiating module 10.
Furthermore, the position of the heat pipe 3 is opposite to the position of the heat generating element 100 (as shown in fig. 4), so as to accelerate the heat transfer of the heat generating element 100 to the heat pipe 3.
Please refer to fig. 5, which is another embodiment of the heat dissipation module 10 of the present invention, the embodiment of fig. 5 is substantially the same as the embodiment of fig. 1 to 4, but the embodiment of fig. 5 is different from the embodiment of fig. 1 to 4 in that the shape of the heat pipe 3 is different, the shape of the heat pipe 3 is a horizontal strip, but not limited thereto, and the shape of the heat pipe 3 of the present invention can be any geometric shape.
Please refer to fig. 6, which is another embodiment of the heat dissipation module 10 of the present invention, the embodiment of fig. 6 is substantially the same as the embodiment of fig. 1 to 4, but the embodiment of fig. 6 is different from the embodiment of fig. 1 to 4 in that the number of the heat pipes 3 is plural, the plural heat pipes 3 are arranged in the middle section 14 in an equidistant manner, and the increase of the number of the heat pipes 3 can further dissipate the heat of the lower temperature equalizing plate 1 quickly, so as to enhance the heat dissipation efficiency of the dual temperature equalizing plate heat dissipation module 10.
Please refer to fig. 7, which is a further embodiment of a heat dissipation module 10 of the present invention, the embodiment of fig. 7 is substantially the same as the embodiment of fig. 1 to 4, but the embodiment of fig. 7 is different from the embodiment of fig. 1 to 4 in that each heat dissipation fin 4 is connected to the lower temperature uniforming plate 1, the upper temperature uniforming plate 2 and the heat pipe 3 by plugging, but not limited thereto, and each heat dissipation fin 4 may also be connected to the lower temperature uniforming plate 1, the upper temperature uniforming plate 2 and the heat pipe 3 by integral molding or bonding.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.
Claims (9)
1. A heat dissipation module with upper and lower temperature-uniforming plates is used for a heating element, and is characterized by comprising:
the lower temperature-uniforming plate is internally provided with a first containing cavity, and the heating element is thermally attached to the lower temperature-uniforming plate;
the upper temperature-uniforming plate is arranged above the lower temperature-uniforming plate, and a second containing cavity is formed in the upper temperature-uniforming plate;
the heat pipe is fixedly connected between the lower temperature-uniforming plate and the upper temperature-uniforming plate, a third cavity is formed in the heat pipe, and the first cavity, the second cavity and the third cavity are not communicated with each other; and
a plurality of heat dissipation fins vertically arranged between the lower temperature-uniforming plate and the upper temperature-uniforming plate in parallel, wherein the bottom end of each heat dissipation fin is connected to the lower temperature-uniforming plate and the top end is connected to the upper temperature-uniforming plate.
2. The heat dissipating module of claim 1, wherein a plurality of the heat dissipating fins are connected to the heat pipe.
3. The heat dissipating module of claim 1, wherein the lower vapor chamber has a first side and a second side opposite to each other, the lower vapor chamber further has a middle section located between the first side and the second side, the number of the heat pipes is one, and the heat pipes are disposed in the middle section.
4. The heat dissipating module of claim 1, wherein the lower plate has a first side and a second side opposite to each other, and a middle section located between the first side and the second side, the number of the heat pipes is plural, and the plural heat pipes are arranged in the middle section at equal intervals.
5. The heat dissipating module of claim 1, wherein the lower vapor chamber has a first capillary structure and a first working fluid therein, the first capillary structure is disposed only on an inner wall of the first cavity, and the first working fluid is disposed only in the first cavity.
6. The heat dissipating module of claim 5, wherein the upper vapor chamber has a second capillary structure and a second working fluid therein, the second capillary structure is only covered on the inner wall of the second cavity, and the second working fluid is only contained in the second cavity.
7. The heat dissipating module of claim 6, wherein the heat pipe has a third wick structure and a third working fluid, the third wick structure is only covered on the inner wall of the third cavity, and the third working fluid is only contained in the third cavity.
8. The heat dissipating module of claim 7, wherein the first capillary structure, the second capillary structure and the third capillary structure are individually one or more of a combination of grooves, grids, fibers, sintered powder and corrugated sheets.
9. The heat dissipating module of claim 1, wherein the heat pipe is located opposite to the heat generating component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920339865.9U CN209949741U (en) | 2019-03-18 | 2019-03-18 | Heat radiation module with upper and lower temperature equalizing plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920339865.9U CN209949741U (en) | 2019-03-18 | 2019-03-18 | Heat radiation module with upper and lower temperature equalizing plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209949741U true CN209949741U (en) | 2020-01-14 |
Family
ID=69124304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920339865.9U Active CN209949741U (en) | 2019-03-18 | 2019-03-18 | Heat radiation module with upper and lower temperature equalizing plates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209949741U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112087925A (en) * | 2020-09-07 | 2020-12-15 | 上海船舶电子设备研究所(中国船舶重工集团公司第七二六研究所) | Underwater equipment heat radiation structure based on three-dimensional temperature-uniforming plate and underwater equipment |
| CN112312744A (en) * | 2020-10-28 | 2021-02-02 | 维沃移动通信有限公司 | Electronic device |
| CN113966135A (en) * | 2020-07-20 | 2022-01-21 | 春鸿电子科技(重庆)有限公司 | Three-dimensional heat dissipation device |
-
2019
- 2019-03-18 CN CN201920339865.9U patent/CN209949741U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113966135A (en) * | 2020-07-20 | 2022-01-21 | 春鸿电子科技(重庆)有限公司 | Three-dimensional heat dissipation device |
| CN112087925A (en) * | 2020-09-07 | 2020-12-15 | 上海船舶电子设备研究所(中国船舶重工集团公司第七二六研究所) | Underwater equipment heat radiation structure based on three-dimensional temperature-uniforming plate and underwater equipment |
| CN112087925B (en) * | 2020-09-07 | 2023-03-03 | 上海船舶电子设备研究所(中国船舶重工集团公司第七二六研究所) | Underwater equipment heat radiation structure based on three-dimensional temperature-uniforming plate and underwater equipment |
| CN112312744A (en) * | 2020-10-28 | 2021-02-02 | 维沃移动通信有限公司 | Electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209949741U (en) | Heat radiation module with upper and lower temperature equalizing plates | |
| US8737071B2 (en) | Heat dissipation device | |
| CN101193531B (en) | Heat radiator | |
| US20100139894A1 (en) | Heat sink with vapor chamber | |
| TWI622342B (en) | Heat dissipation apparatus | |
| TWM517314U (en) | Heat dissipation apparatus | |
| US20150285562A1 (en) | Vapor chamber heat sink and method for making the same | |
| CN110779369A (en) | Take capillary structure inflation formula aluminium temperature-uniforming plate | |
| US10492335B1 (en) | Heat dissipation device for pluggable device or module | |
| CN215773996U (en) | Heat sink device | |
| TW201947180A (en) | Loop vapor chamber conducive to separation of liquid and gas | |
| WO2023010836A1 (en) | Heat dissipation module and electronic device | |
| CN208093545U (en) | Large power heat pipe radiator | |
| CN209949742U (en) | Double-temperature-equalizing plate type heat dissipation module | |
| CN116263309A (en) | Three-dimensional heat transfer device | |
| CN217428571U (en) | Radiator and power module | |
| CN111712099B (en) | Double-temperature-equalizing plate type heat dissipation module | |
| TWI691256B (en) | Duel vapor chamber heat dissipation module | |
| CN215269268U (en) | Integrated high-power heat dissipation module | |
| TW201719101A (en) | Heat dissipation device | |
| CN114001336B (en) | High-power heat source heat dissipation device and structure thereof | |
| CN211178085U (en) | Take capillary structure inflation formula aluminium temperature-uniforming plate | |
| TWM558388U (en) | Heat-dissipation module | |
| CN106793671B (en) | Heat radiation unit | |
| CN215683028U (en) | Temperature-uniforming plate with brazing structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |