CN114001336B

CN114001336B - High-power heat source heat dissipation device and structure thereof

Info

Publication number: CN114001336B
Application number: CN202111406407.0A
Authority: CN
Inventors: 李想; 刘新生; 张晓屿; 叶青松; 倪杨; 连红奎; 孙萌; 薛鹏飞
Original assignee: Changzhou Weihan Thermal Control Technology Co ltd; Beijing Weihan Technology Co Ltd
Current assignee: Changzhou Weihan Thermal Control Technology Co ltd; Beijing Weihan Technology Co Ltd
Priority date: 2021-11-24
Filing date: 2021-11-24
Publication date: 2022-11-29
Anticipated expiration: 2041-11-24
Also published as: CN114001336A

Abstract

A high-power heat source heat dissipation device and a structure thereof relate to the technical field of heat dissipation. The high-power heat source heat dissipation device comprises heat dissipation fins, a heat conduction pipe, an evaporator and a heat dissipation base connected with a heat source; the heat dissipation base is provided with at least one evaporator; a plurality of heat conduction pipes are connected to each evaporator; the heat dissipation fins are fixedly connected with the heat conduction pipes, and the heat dissipation fins are sleeved on the heat conduction pipes; the radiating fins are provided with radiating through holes. The high-power heat source structure comprises a high-power heat source heat dissipation device. The invention aims to provide a high-power heat source heat dissipation device and a structure thereof, which solve the technical problem that the heat dissipation effect in the prior art is difficult to meet the heat dissipation requirement to a certain extent.

Description

High-power heat source heat dissipation device and structure thereof

Technical Field

The invention relates to the technical field of heat dissipation, in particular to a high-power heat source heat dissipation device and a structure thereof.

Background

High-power heat source structures, such as high-heat-flux LED lamps, high-power court LED lamps and other products, can generate a large amount of heat during working; the existing heat dissipation mode has limited heat dissipation performance, and the heat dissipation effect is difficult to meet the heat dissipation requirement.

Disclosure of Invention

The invention aims to provide a high-power heat source heat dissipation device and a structure thereof, so as to solve the technical problem that the heat dissipation effect in the prior art is difficult to meet the heat dissipation requirement to a certain extent.

In order to achieve the purpose, the invention provides the following technical scheme:

a high-power heat source heat dissipation device comprises heat dissipation fins, a heat conduction pipe, an evaporator and a heat dissipation base connected with a heat source;

the heat dissipation base is provided with at least one evaporator;

a plurality of heat conduction pipes are connected to each evaporator;

the heat radiating fins are fixedly connected with the heat conducting pipes, and the heat radiating fins are sleeved on the heat conducting pipes;

and the radiating fins are provided with radiating through holes.

In any of the above technical solutions, optionally, along a first direction of the heat dissipation base, a plurality of rows of the evaporators are arranged on the heat dissipation base at intervals, and the evaporators extend along a second direction of the heat dissipation base;

the heat dissipation fin comprises a plurality of fin assemblies; the fin assemblies are sequentially arranged at intervals along the second direction of the heat dissipation base and extend along the first direction of the heat dissipation base; the first direction of the heat dissipation base is perpendicular to the second direction of the heat dissipation base, and the first direction of the heat dissipation base is perpendicular to the thickness direction of the heat dissipation base;

in each evaporator, a plurality of heat conduction pipes are sequentially arranged at intervals along the second direction of the heat dissipation base;

the heat conduction pipes corresponding to the plurality of evaporators are fixedly connected with the same fin assembly.

In any of the above solutions, optionally, the fin assembly comprises a plurality of fin singlets; the plurality of fin single pieces are sequentially arranged along the height direction of the heat dissipation base;

the heat dissipation through holes are arranged on the fin single pieces.

In any of the above technical solutions, optionally, a fin tube seat is provided on the fin single piece; the heat conduction pipe penetrates through the finned pipe seat and is fixedly connected with the finned pipe seat;

the fin single piece is provided with a fin with a through hole; the fins at the through holes are positioned on one side of the heat dissipation through holes;

the fin at the through hole and the fin tube seat are arranged on the same surface of the fin single piece;

in each fin assembly, the fins at the through holes are fixedly connected with the adjacent fin single pieces, or the fins at the through holes are arranged at intervals with the adjacent fin single pieces.

In any of the above solutions, optionally, the fin unit is non-planar;

a fin tube seat notch is formed in the fin tube seat; a fin single piece through hole communicated with the notch of the fin tube seat is formed in the fin single piece;

the fins at the through holes and the heat dissipation through holes are formed by punching the fin single piece.

In any of the above technical solutions, optionally, the evaporator includes an evaporator shell, an evaporation structure layer, and an evaporation cavity; the evaporation structure layer and the evaporation cavity are respectively arranged in the evaporator shell, the evaporation structure layer is connected with the inner wall of the bottom of the evaporator shell, and the outer wall of the bottom of the evaporator shell is connected with the heat dissipation base;

the heat conduction pipe comprises a heat conduction pipe shell and a heat conduction pipe cavity arranged in the heat conduction pipe shell; the heat conducting pipe shell is fixedly connected with the top of the evaporator shell, and the heat conducting pipe cavity is communicated with the evaporation cavity.

In any of the above technical solutions, optionally, a position-avoiding column is disposed inside the evaporator shell; the avoiding column is respectively connected with the top of the evaporator shell and the bottom of the evaporator shell; the heat dissipation base is provided with a heat source fixing hole for connecting the heat source; the heat source fixing hole extends into the avoidance column;

or a support column is arranged inside the evaporator shell; the supporting columns are respectively connected with the top of the evaporator shell and the bottom of the evaporator shell;

or the inner wall of the heat conduction pipe shell is provided with a plurality of grooves in the heat conduction pipe, the grooves in the heat conduction pipe are sequentially arranged along the circumferential direction of the heat conduction pipe, and the grooves in the heat conduction pipe extend along the length direction of the heat conduction pipe;

or an evaporation pipe seat is arranged at the top of the evaporator shell; the heat conduction pipe is fixedly connected with the evaporation pipe seat.

In any of the above technical solutions, optionally, multiple rows of the evaporators are arranged on the heat dissipation base at intervals along the second direction of the heat dissipation base;

the radiating fins are made of aluminum or copper;

the heat conduction pipe is an aluminum pipe or a copper pipe;

the evaporator is a temperature-equalizing plate;

the heat dissipation base is made of aluminum or copper;

the heat dissipation base is provided with a groove for accommodating the evaporator.

A high-power heat source structure comprises a heat source and a high-power heat source heat dissipation device;

the heat source is fixedly connected with the heat dissipation base of the high-power heat source heat dissipation device.

In any of the above solutions, optionally, the heat source includes a plurality of LED lamps;

the LED lamps are distributed in an array.

The invention has the following beneficial effects:

the invention provides a high-power heat source heat dissipation device and a structure thereof, comprising heat dissipation fins, a heat conduction pipe, an evaporator and a heat dissipation base; the heat of the heat source is conducted to the evaporator through the heat dissipation base, conducted to the plurality of heat conduction pipes through the evaporator and then conducted to the heat dissipation fins for heat dissipation; the high-power heat source heat dissipation device has the advantages that the speed of heat conduction of the heat source to the heat dissipation fins is increased through the evaporator and the heat conduction pipes, the heat dissipation performance is improved to a certain extent, the heat dissipation performance is further improved through the heat dissipation through holes formed in the heat dissipation fins, and the heat source can be effectively dissipated.

In order to make the aforementioned and other objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1-1 is an exploded view of a high power heat source heat sink according to an embodiment of the present invention;

fig. 1-2 are perspective views of a high-power heat source heat sink according to an embodiment of the present invention;

fig. 1-3 are front views of high-power heat source heat dissipation devices provided in embodiments of the present invention;

FIGS. 1-4 are top views of the high power heat source heat sink shown in FIGS. 1-3;

fig. 1-5 are heat energy flow diagrams of a high-power heat source heat dissipation device provided by an embodiment of the invention;

FIG. 2-1 is a perspective view of a portion of a fin assembly provided by an embodiment of the present invention;

FIG. 2-2 is a front view of the fin assembly shown in FIG. 2-1;

FIGS. 2-3 are perspective views of fin singlets provided in accordance with embodiments of the present invention;

FIGS. 2-4 are enlarged views of area A of the fin singlet shown in FIGS. 2-3;

FIG. 3-1 is a perspective view of an evaporator provided in accordance with an embodiment of the present invention;

3-2 are perspective views from another perspective of an evaporator according to an embodiment of the present invention;

3-3 are front views of evaporators provided in accordance with embodiments of the present invention;

FIGS. 3-4 are sectional views B-B of the evaporator shown in FIGS. 3-3;

FIG. 4 is a cross-sectional view of a heat pipe provided in an embodiment of the present invention;

FIG. 5-1 is a schematic structural diagram of a high-power heat source structure according to an embodiment of the present invention;

fig. 5-2 is a schematic view of a lamp housing, not shown, of the high power heat source structure shown in fig. 5-1;

FIG. 6-1 is a simulation diagram of a conventional high-power heat source heat sink;

fig. 6-2 is a simulation diagram of a development process of a high-power heat source heat dissipation device according to an embodiment of the present invention;

fig. 6-3 are simulation diagrams of a high-power heat source heat dissipation device according to an embodiment of the present invention.

Icon: 100-heat dissipation fins; 110-heat dissipating through holes; 120-a fin assembly; 121-fin singlets; 1211-a fin tube base; 1212-fins at the through holes; 1213-pin seat gap; 1214-fin single piece through holes; 200-a heat pipe; 210-a thermally conductive enclosure; 220-heat pipe cavity; 230-inner groove of heat conducting pipe; 300-an evaporator; 310-an evaporator shell; 320-evaporating the structural layer; 330-an evaporation cavity; 340-avoidance column; 350-support column; 360-evaporating tube seat; 400-a heat dissipation base; 500-heat source fixing holes; 600-a heat source; 700-lamp shade.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.

Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments and features of the embodiments described below can be combined with each other without conflict.

Examples

The embodiment provides a high-power heat source heat dissipation device and a structure thereof; referring to fig. 1-1 to 6-3, fig. 1-1 is an exploded view of a high-power heat source heat dissipation device provided in this embodiment; fig. 1-2 are perspective views of the high-power heat source heat sink provided in the present embodiment; fig. 1-3 are front views of the high-power heat source heat sink provided in the present embodiment; FIGS. 1-4 are top views of the high power heat source heat sink shown in FIGS. 1-3; fig. 1-5 are heat energy flow diagrams of the high-power heat source heat sink provided in the present embodiment.

FIG. 2-1 is a perspective view of a portion of the fin assembly provided in the present embodiment, showing 5 fin singlets, and FIG. 2-2 is a front view of the fin assembly shown in FIG. 2-1; fig. 2-3 are perspective views of the fin singlets provided in the present embodiment, and fig. 2-4 are enlarged views of the region a of the fin singlets shown in fig. 2-3.

Fig. 3-1 and 3-2 are perspective views from two perspectives of the evaporator provided in this embodiment, and fig. 3-3 are front views of the evaporator provided in this embodiment, in which the evaporation structure layer is shown by hatching for better illustration of the structure; fig. 3-4 are B-B sectional views of the evaporator shown in fig. 3-3.

Fig. 4 is a cross-sectional view of the heat conducting pipe provided in this embodiment.

Fig. 5-1 is a schematic structural view of the high-power heat source structure provided in this embodiment, and fig. 5-2 is a schematic structural view of a lampshade, not shown, of the high-power heat source structure shown in fig. 5-1.

FIG. 6-1 is a simulation diagram of a conventional high-power heat source heat sink; fig. 6-2 is a simulation diagram of the high-power heat source heat dissipation device provided in this embodiment in the development process; fig. 6-3 are simulation diagrams of the high-power heat source heat dissipation device provided in the present embodiment.

The high-power heat source heat dissipation device provided by the embodiment is used for heat dissipation of a high-power heat source structure, and is particularly used for heat dissipation of products such as high-heat-flux-density LED lamps and high-power court LED lamps.

Referring to fig. 1-1 to 4, the high power heat source heat sink of the present embodiment includes heat dissipating fins 100, a heat pipe 200, an evaporator 300, and a heat dissipating base 400 for connecting with a heat source. The heat source is, for example, a plurality of LED lamps, a plurality of light bulbs, or the like arranged in an array.

At least one evaporator 300 is provided on the heat-radiating base 400.

A plurality of heat conductive pipes 200 are connected to each evaporator 300.

The heat dissipation fins 100 are fixedly connected with the heat conduction pipes 200, and the heat dissipation fins 100 are sleeved on the heat conduction pipes 200; alternatively, heat conductive pipe 200 and heat radiating fin 100 are both disposed above evaporator 300.

The heat dissipating fin 100 is provided with a heat dissipating through-hole 110.

The high-power heat source heat sink in this embodiment comprises heat dissipation fins 100, heat conduction pipes 200, an evaporator 300 and a heat dissipation base 400; the heat of the heat source is conducted to the evaporator 300 through the heat dissipation base 400, conducted to the plurality of heat conduction pipes 200 through the evaporator 300, and then conducted to the heat dissipation fins 100 for heat dissipation; the high-power heat source heat dissipation device has the advantages that the speed of heat conduction of a heat source to the heat dissipation fins 100 is increased through the evaporator 300 and the heat conduction pipe 200, the heat dissipation performance is improved to a certain extent, the heat dissipation performance is further improved through the heat dissipation through holes 110 formed in the heat dissipation fins 100, and the heat source can be effectively dissipated.

Referring to fig. 1-1 to 1-5, in an alternative of the present embodiment, a plurality of rows of evaporators 300 are spaced apart on the heat dissipation base 400 in a first direction of the heat dissipation base 400, and the evaporators 300 extend in a second direction of the heat dissipation base 400; alternatively, along the second direction of the heat sink base 400, a plurality of rows of evaporators 300 are arranged on the heat sink base 400 at intervals, that is, the plurality of evaporators 300 are distributed in rows and columns.

Optionally, the heat sink fin 100 includes a plurality of fin assemblies 120; the plurality of fin assemblies 120 are sequentially arranged at intervals along the second direction of the heat dissipation base 400, and the fin assemblies 120 extend along the first direction of the heat dissipation base 400; wherein, the first direction of the heat dissipation base 400 is perpendicular to the second direction of the heat dissipation base 400, and the first direction of the heat dissipation base 400 is perpendicular to the thickness direction of the heat dissipation base 400; that is, the first direction of the heat sink base 400, the second direction of the heat sink base 400, and the thickness direction of the heat sink base 400 are perpendicular to each other. The plurality of rows of evaporators 300 are arranged on the heat dissipation base 400 at intervals along the first direction of the heat dissipation base 400, and the plurality of fin assemblies 120 are sequentially arranged at intervals along the second direction of the heat dissipation base 400, i.e. the arrangement direction of the fin assemblies 120 and the arrangement direction of the evaporators 300 are staggered, so that the heat of a heat source is more uniformly conducted to the heat dissipation fins 100 through the evaporators 300 and the heat conduction pipes 200 to dissipate heat, the phenomenon that the local temperature of the heat source is too high can be effectively avoided or reduced, and the stability of the overall work of the heat source is ensured.

Alternatively, in each of the evaporators 300, the plurality of heat conductive pipes 200 are arranged in series at intervals in the second direction of the heat radiating base 400, that is, the plurality of heat conductive pipes 200 are arranged in series at intervals in the extending direction of the evaporators 300.

The heat conductive pipes 200 corresponding to the plurality of evaporators 300 are fixedly connected to the same fin assembly 120. The heat conducting pipes 200 are sequentially arranged at intervals along the second direction of the heat radiating base 400, and the heat conducting pipes 200 corresponding to the evaporators 300 are fixedly connected with the same fin assembly 120, so that the heat of the heat source is further uniformly conducted to the heat radiating fins 100 through the evaporators 300 and the heat conducting pipes 200 to radiate the heat, the phenomenon that the local temperature of the heat source is too high can be effectively avoided or reduced, and the stability of the overall work of the heat source is further ensured.

1-2-4, in an alternative version of the present embodiment, the fin assembly 120 includes a plurality of fin singlets 121; the plurality of fin elements 121 are sequentially arranged in the height direction of the heat dissipation base 400.

The heat dissipation through-holes 110 are provided on the fin singlets 121. The heat dissipation through holes 110 increase the cross flow of air flow between the heat dissipation fins 100, thereby increasing the heat dissipation performance of the heat dissipation fins 100.

Optionally, the fin unit 121 is provided with a plurality of heat dissipation through-holes 110.

Alternatively, in the same fin assembly 120, the heat dissipation through holes 110 of all the fin units 121 are oppositely arranged to form a fin airflow channel for circulating airflow; the fin airflow passage extends in the thickness direction of the heat dissipation base 400.

Referring to fig. 2-4, in an alternative embodiment, fin singlets 121 are provided with fin tube seats 1211; heat pipe 200 passes through fintube seat 1211, and heat pipe 200 is fixedly connected to fintube seat 1211; the heat conductive pipes 200 are facilitated to transfer heat to the fin singlets 121 by the fin base 1211 to increase the contact area between the fin singlets 121 and the heat conductive pipes 200.

Referring to fig. 2-1 to 2-4, in an alternative embodiment, the fin unit 121 is provided with through-hole fins 1212; the through hole fin 1212 is located at one side of the heat dissipation through hole 110. The fins 1212 are provided through the through holes to increase the heat dissipation area of the fin single-piece 121, thereby increasing the heat dissipation performance of the fin single-piece 121.

The fin 1212 and the fin base 1211 at the through hole are provided on the same surface of the fin single piece 121.

In each fin assembly 120, the fins 1212 at the through holes are fixedly connected with the adjacent fin units 121 so as to improve the connection strength of the fin assembly 120; alternatively, in each fin assembly 120, the fins 1212 at the through holes are spaced apart from the adjacent fin elements 121.

2-1-2-4, in an alternative to this embodiment, the fin singlets 121 are non-planar; by using the fin elements 121 having a non-planar shape, the flow of air between the fin elements 121 can be promoted to improve the heat dissipation performance of the fin elements 121. Alternatively, the fin element 121 may have a cross-section in the shape of a W, a groove, a zigzag, or the like.

Referring to fig. 2-4, in an alternative embodiment, the fintube seat 1211 is provided with a fintube seat notch 1213; the fin single piece 121 is provided with a fin single piece through hole 1214 communicated with the fin tube seat notch 1213; through fintube socket notches 1213 to facilitate passage of heat pipe 200 through fintube socket 1211; the fin single-piece through holes 1214 and the fin base notches 1213 improve the series flow of air flow between the heat dissipating fins 100, thereby improving the heat dissipating performance of the heat dissipating fins 100.

Referring to fig. 2-4, in an alternative embodiment, the fins 1212 and the heat dissipating through holes 110 at the through holes are stamped and formed from the fin singlets 121. That is, the fins 1212 and the heat dissipation through holes 110 are formed at the same time when the fin unit 121 is stamped; by adopting the stamping process, the processing difficulty and the processing cost of the fin single piece 121 are reduced, and further the processing difficulty and the processing cost of the radiating fin 100 are reduced.

Referring to fig. 3-1 to 3-4, in an alternative embodiment, evaporator 300 includes evaporator shell 310, evaporation structure layer 320 and evaporation cavity 330; the evaporation structure layer 320 and the evaporation cavity 330 are respectively arranged inside the evaporator shell 310, the evaporation structure layer 320 is connected with the inner wall of the bottom of the evaporator shell 310, and the outer wall of the bottom of the evaporator shell 310 is connected with the heat dissipation base 400; the heat of the heat sink base 400 is absorbed by the evaporation structure layer 320 and dissipated to the evaporation cavity 330.

Referring to figures 1-5 and 4, optionally, heat pipe 200 comprises a heat pipe shell 210 and a heat pipe cavity 220 disposed within heat pipe shell 210; the heat conducting pipe shell 210 is fixedly connected with the top of the evaporator shell 310, and the heat conducting pipe cavity 220 is communicated with the evaporation cavity 330. Optionally, the top of the evaporator shell 310 is provided with a through hole communicating with the heat pipe cavity 220. The heat pipe cavity 220 is communicated with the evaporation cavity 330 to improve the efficiency of heat transferred from the evaporator 300 to the heat pipe 200, thereby improving the heat dissipation performance of the high-power heat source heat dissipation device.

Alternatively, the evaporation structure layer 320 is a sintered powder layer or a mesh layer or other structure layer with capillary force.

Referring to fig. 3-3 and 3-4, in an alternative of the present embodiment, a position-avoiding post 340 is provided inside the evaporator shell 310; the avoiding column 340 is respectively connected with the top of the evaporator shell 310 and the bottom of the evaporator shell 310; the heat-dissipating base 400 is provided with a heat source fixing hole 500 for connecting a heat source; the heat source fixing hole 500 extends into the avoiding post 340; the length of the heat source fixing hole 500 is extended by the offset column 340, so that the heat source can be firmly fixed on the high-power heat source heat sink.

Referring to fig. 3-3 and 3-4, in an alternative to this embodiment, a support column 350 is provided inside the evaporator shell 310; the support columns 350 are respectively connected with the top of the evaporator shell 310 and the bottom of the evaporator shell 310; the support columns 350 can improve the connection strength of the evaporator shell 310. Optionally, support columns 350 are disposed adjacent to heat conductive pipes 200.

Referring to fig. 3-1 to 3-4, in an alternative of the present embodiment, an evaporator case 310 is provided at the top thereof with an evaporation tube holder 360; heat pipe 200 is fixedly connected to evaporation pipe holder 360. By evaporating the tube holder 360, the contact area between the heat conductive pipe 200 and the evaporator case 310 is increased to improve the connection strength between the heat conductive pipe 200 and the evaporator case 310; alternatively, the heat pipe 200 and the evaporation pipe base 360 are fixedly connected by welding.

Referring to fig. 4, in an alternative of this embodiment, the inner wall of the heat-conducting pipe case 210 is provided with a plurality of heat-conducting pipe inner grooves 230, the plurality of heat-conducting pipe inner grooves 230 are arranged in sequence along the circumferential direction of the heat-conducting pipe 200, and the heat-conducting pipe inner grooves 230 extend along the length direction of the heat-conducting pipe 200; the liquid reflux can be promoted by the plurality of grooves 230 in the heat pipe 200 to increase the internal heat exchange area of the heat pipe.

Optionally, the heat dissipation fin 100 is made of aluminum or copper; or other materials.

Optionally, heat pipe 200 is an aluminum pipe or a copper pipe; or other materials.

Optionally, the evaporator 300 is a vapor plate.

Optionally, the heat dissipation base 400 is made of aluminum or copper; or other materials.

Optionally, the heat sink base 400 is provided with a groove to accommodate the evaporator 300. Through the groove, the connection firmness between the evaporator 300 and the heat dissipation base 400 can be improved, the distance between the evaporator 300 and a heat source can be shortened, and the heat dissipation of the evaporator 300 to the heat source is facilitated.

As shown in fig. 1-5, the arrows indicate the flow of heat energy; when the heat source is powered on, a part of electric power is converted into optical energy, the other part of the electric power is converted into thermal energy, the thermal energy is conducted to the evaporator 300 through the heat dissipation base 400, the temperature of the evaporator 300 rises, a refrigerant in the evaporation structure layer 320 of the evaporator 300 absorbs heat and is rapidly vaporized into gas, the gas conducts the heat into the heat pipe cavities 220 of the heat conduction pipes 200 through the evaporation cavities 330 which are communicated with each other, the heat conduction pipes 200 are connected with the heat dissipation fins 100, the heat dissipation fins 100 dissipate the heat into air, the refrigerant gas releases the heat and is liquefied into liquid, the liquid flows to the evaporation structure layer 320 along the pipe walls of the heat conduction pipes 200, and the liquid flows back to the heat source by utilizing the capillary force of the capillary structure of the evaporation structure layer 320, so that the circulation is not stopped. This cycle is rapid and heat can be conducted away from the heat source.

The traditional heat dissipation device adopts a heat pipe, and the heat pipe cannot be transmitted in a long distance, so that the heat dissipation efficiency of the heat dissipation device is influenced; in addition, the heat pipe is usually fixed by welding, and has high thermal resistance and low heat transfer efficiency. The high-power heat source heat dissipation device of the present embodiment utilizes the evaporation cavity 330 and the heat pipe cavity 220 to rapidly conduct heat to the heat dissipation fins 100, and rapidly dissipates heat to the heat source through radiation and convection of the heat dissipation fins 100. Compared with the traditional heat pipe scheme, the high-power heat source heat dissipation device of the embodiment is interconnected through the evaporation cavity 330 and the heat conduction pipe cavity 220 to form a three-dimensional temperature equalizing plate, so that heat can be quickly conducted to the heat dissipation fins 100 on the premise of reducing diffusion thermal resistance, the contact thermal resistance is reduced, and the heat transfer quantity is increased.

Optionally, the refrigerant in the evaporation cavity 330 and the heat pipe cavity 220 is acetone, R134a, R123, 1233ZD, 1234ZE, or the like.

Optionally, the end of heat pipe 200 remote from evaporator 300 is closed, so that heat pipe cavity 220 is a closed cavity.

Referring to fig. 5-1 and 5-2, the present embodiment further provides a high power heat source structure, which includes a heat source 600 and the high power heat source heat sink according to any of the above embodiments.

The heat source 600 is fixedly connected with the heat-dissipating base 400 of the high-power heat-source heat-dissipating device.

The high-power heat source structure provided by the embodiment comprises the high-power heat source heat dissipation device, the technical characteristics of the disclosed high-power heat source heat dissipation device are also applicable to the high-power heat source structure, and the technical characteristics of the disclosed high-power heat source heat dissipation device are not described repeatedly. The high-power heat source structure in the embodiment has the advantages of the high-power heat source heat sink, and the advantages of the high-power heat source heat sink disclosed above are not described repeatedly herein.

Referring to fig. 5-1 and 5-2, in an alternative to the present embodiment, the heat source 600 includes a plurality of LED lamps; the LED lamps are distributed in an array.

Optionally, the high power heat source structure further comprises a lamp housing 700; a plurality of LED lamps are located inside the lamp cover 700.

For a clearer understanding of the present embodiment, the following simulation experiments are used to illustrate:

in simulation experiment, the heat source adopts LED lamp with the model number

P3737 (3W), bead size 3 × 1mm, single bead electrical power consumption is 3W, according to 30% photoelectric conversion rate, thermal power consumption =3 × 70% =2.1W, 432 beads altogether, total thermal power consumption =432 × 2.1=907.2w. The lamp beads are shown in figure 2-1:

FIG. 6-1 is a simulation diagram of a conventional high-power heat source heat sink; the simulation condition input is as follows:

1. the total heat consumption is 907.2w;

2. the size of the radiator is as follows: l570 × W368 × H474mm;

3. ambient temperature: at 50 ℃.

Fig. 6-2 is a simulation diagram of the high-power heat source heat dissipation device provided in this embodiment in the development process; the high-power heat source heat sink is based on the high-power heat source heat sink shown in figure 6-1, and the heat sink fins are provided with through holes; the simulation condition input is as follows:

1. the total heat consumption is 907.2w;

2. the size of the radiator: l570 × W368 × H474mm;

3. ambient temperature: at 50 deg.C.

Fig. 6-3 are simulation diagrams of the high-power heat source heat dissipation device provided in the present embodiment. The high-power heat source heat sink is based on the high-power heat source heat sink shown in fig. 6-1, and the heat sink fins are provided with through holes and are arranged into a plurality of fin assemblies; the simulation condition input is as follows:

1. the total heat consumption is 907.2w;

2. the size of the radiator is as follows: l570 × W368 × H474mm;

3. ambient temperature: at 50 deg.C.

See table 1 for a summary of simulation experiments: as can be seen from the simulation results, the temperature of the high-power heat source heat dissipation device provided by the embodiment is the lowest. Because the simulation can not have an inclined plane, the non-planar fin single piece adopts a step type.

TABLE 1

Scheme(s)	LED temperature (. Degree. C.)	Pad temperature (. Degree.C.)	Remarks for note
				1	136.00	132.00	FIG. 6-1
2	111.00	107.00	FIG. 6-2
				3	95.30	91.10	FIGS. 6-3

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-power heat source heat dissipation device is characterized by comprising heat dissipation fins, a heat conduction pipe, an evaporator and a heat dissipation base connected with a heat source;

the heat dissipation base is provided with at least one evaporator;

a plurality of heat conduction pipes are connected to each evaporator;

the heat dissipation fins are fixedly connected with the heat conduction pipes, and the heat dissipation fins are sleeved on the heat conduction pipes;

the radiating fins are provided with radiating through holes;

along a first direction of the heat dissipation base, a plurality of rows of the evaporators are arranged on the heat dissipation base at intervals, and the evaporators extend along a second direction of the heat dissipation base;

2. The high power heat source heat sink according to claim 1, wherein the fin assembly comprises a plurality of fin singlets; the plurality of fin single pieces are sequentially arranged along the height direction of the heat dissipation base;

the heat dissipation through holes are arranged on the fin singlets.

3. The high power heat source heat sink according to claim 2, wherein the fin single piece is provided with a fin socket; the heat conduction pipe penetrates through the finned pipe seat and is fixedly connected with the finned pipe seat;

the fin single piece is provided with a fin at a through hole; the fins at the through holes are positioned on one side of the heat dissipation through holes;

4. The high power heat source heat sink according to claim 3, wherein the fin unit is non-planar;

5. The high power heat source heat sink according to claim 1, wherein the evaporator comprises an evaporator shell, an evaporation structure layer and an evaporation cavity; the evaporation structure layer and the evaporation cavity are respectively arranged in the evaporator shell, the evaporation structure layer is connected with the inner wall of the bottom of the evaporator shell, and the outer wall of the bottom of the evaporator shell is connected with the heat dissipation base;

6. The high power heat source heat sink according to claim 5, wherein a position-avoiding column is arranged inside the evaporator shell; the avoiding column is respectively connected with the top of the evaporator shell and the bottom of the evaporator shell; the heat dissipation base is provided with a heat source fixing hole used for connecting the heat source; the heat source fixing hole extends into the avoidance column;

7. The high power heat source heat sink according to claim 1, wherein a plurality of rows of the evaporators are arranged on the heat sink base at intervals along the second direction of the heat sink base;

the radiating fins are made of aluminum or copper;

the heat conduction pipe is an aluminum pipe or a copper pipe;

the evaporator is a temperature-equalizing plate;

the heat dissipation base is made of aluminum or copper;

8. A high power heat source structure comprising a heat source and the high power heat source heat dissipating device as claimed in any one of claims 1 to 7;

9. The high power heat source structure of claim 8, wherein the heat source comprises a plurality of LED lamps;

the LED lamps are distributed in an array.