CN112312744A

CN112312744A - Electronic device

Info

Publication number: CN112312744A
Application number: CN202011177737.2A
Authority: CN
Inventors: 陈蓬勃
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-10-28
Filing date: 2020-10-28
Publication date: 2021-02-02
Anticipated expiration: 2040-10-28
Also published as: CN112312744B

Abstract

The application discloses an electronic device, which comprises a mainboard, a first temperature equalizing plate, a second temperature equalizing plate and a heat conducting assembly; the first temperature equalizing plate is arranged on one side of the main plate; the second temperature equalizing plate is arranged on the other side of the main plate; the first temperature equalizing plate, the main board and the second temperature equalizing plate are distributed along the thickness direction of the electronic equipment; the heat conducting assembly is connected between the first temperature equalizing plate and the second temperature equalizing plate. The application provides an electronic equipment, not only the heat dissipation is more even, can show the radiating efficiency who improves electronic equipment moreover, and user experience is better.

Description

Electronic device

Technical Field

The application belongs to the field of communication, and particularly relates to an electronic device.

Background

With the continuous development of science and technology and the increasing diversification of user requirements, the performance of the terminal device becomes higher and higher, and correspondingly, the power consumption of the terminal device also becomes larger and larger. Meanwhile, an increase in power consumption of the terminal device leads to an increase in the amount of heat generated by the terminal device. In these miniaturized mobile terminal devices, heat is generated in a confined space, and it is necessary to conduct it out by using a heat dissipation structure.

The radiating effect of the radiating structure embedded in the terminal equipment is poor at present, and the terminal equipment is easy to have the phenomena of high temperature and uneven surface temperature, so that the experience of customers is greatly influenced.

Disclosure of Invention

The embodiment of the application aims to provide electronic equipment, and the problem that the heat dissipation effect of the existing electronic equipment is not good can be solved.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides an electronic device, where the electronic device includes:

a main board;

the first temperature-equalizing plate is arranged on one side of the main board;

the second temperature-equalizing plate is arranged on the other side of the main plate;

the first temperature equalizing plate, the main board and the second temperature equalizing plate are distributed along the thickness direction of the electronic equipment;

and the heat conduction assembly is connected between the first temperature equalizing plate and the second temperature equalizing plate.

In the embodiment of the application, along the length direction and the width direction of the electronic equipment, heat generated by a mainboard and the like is quickly dissipated by a first temperature-uniforming plate and a second temperature-uniforming plate on two sides of the mainboard; along the thickness direction of electronic equipment, the heat that mainboard etc. produced conducts to first samming board and second samming board through heat-conducting component fast, is distributed by second samming board and second samming board fast again, and this has not only improved electronic equipment's radiating efficiency widely, makes the heat dissipation of mainboard etc. more even moreover to guaranteed electronic equipment surface temperature's homogeneity, improved user's experience widely.

Drawings

FIG. 1 is an exploded schematic view of an electronic device provided herein;

FIG. 2 is a schematic structural diagram of a first vapor chamber of an electronic device provided in the present application;

FIG. 3 is an enlarged view of a detail A in FIG. 2;

FIG. 4 is a schematic structural diagram of a second temperature equalization plate of the electronic device provided in the present application;

FIG. 5 is a schematic structural view of a metal stent provided herein;

FIG. 6 is a plan view of a metal bracket provided herein;

FIG. 7 is a rear view of an electronic device provided herein;

FIG. 8 is a cross-sectional view B-B of FIG. 7 according to an embodiment provided herein;

FIG. 9 is an enlarged view of the detail at C in FIG. 8;

FIG. 10 is a cross-sectional view B-B of FIG. 7 of another embodiment provided herein;

FIG. 11 is an enlarged view of the detail D in FIG. 10;

in the figure: 1. a main board; 2. a first vapor chamber; 3. a second temperature equalization plate; 4. a heat conducting component; 411. a first thermally conductive sheet; 412. a second thermally conductive sheet; 421. heat-conducting fins; 4211. connecting the bosses; 422. a heat-conducting silica gel gasket; 5. a metal bracket; 51. a through hole; 6. a screen module; 7. a battery module; 8. a battery cover; 9. a screw post.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The electronic device provided by the embodiment of the present application is described in detail by specific embodiments with reference to the accompanying drawings.

As shown in fig. 1 to 11, the present embodiment provides an electronic device, wherein the electronic device may be a mobile phone, a tablet computer, a notebook computer, a palm computer, or the like.

Specifically, the electronic device includes a main board 1, because the main board 1 and each component arranged on the main board 1 are components with large energy consumption in the electronic device.

In this embodiment, as shown in fig. 1, the electronic device further includes a first temperature-uniforming plate 2, a second temperature-uniforming plate 3, and a heat-conducting assembly 4. First temperature-uniforming plate 2 sets up in the first side of mainboard 1, and first temperature-uniforming plate 2 gives off fast the first side production of heat of mainboard 1. The first temperature equalizing plate 2 can better improve the heat dissipation efficiency of the first side of the main board 1.

The second temperature equalizing plate 3 is arranged on a second side of the main plate 1, and the second side is opposite to the first side. The second temperature equalizing plate 3 can rapidly dissipate heat generated by the second side of the main board 1, so that the heat dissipation efficiency of the second side of the main board 1 can be improved well.

Further specifically, the first temperature equalizing plate 2, the main board 1, and the second temperature equalizing plate 3 are distributed along a thickness direction of the electronic device. The heat that electronic equipment's inside components and parts produced can be given off by the first temperature-uniforming plate 2 and the second temperature-uniforming plate 3 of 1 both sides of mainboard fast, and this makes 6 one side of electronic equipment's screen module and 8 one sides of battery cover have more balanced temperature, prevents that electronic equipment's the inhomogeneous phenomenon of surface temperature from taking place, and user's experience is better.

In this embodiment, the heat conducting assembly 4 is connected between the first temperature equalizing plate 2 and the second temperature equalizing plate 3. Other components are arranged between the first temperature equalizing plate 2 and the second temperature equalizing plate 3 besides the main board 1, and the other components can be a battery, a main board bracket and the like. The heat conducting assembly 4 can penetrate through the gap between the mainboard 1 and other components to connect the first temperature equalizing plate 2 and the second temperature equalizing plate 3; the first temperature equalizing plate 2 and the second temperature equalizing plate 3 can also be connected through gaps among other components; through holes can be formed in other components, and the heat conduction assembly 4 is connected with the first temperature-uniforming plate 2 and the second temperature-uniforming plate 3 through the through holes.

Along electronic equipment's thickness direction, inhomogeneous phenomenon appears easily in the heat dissipation, and heat conduction component 4 of this application can conduct the heat that electronic equipment's inside produced to first samming board 2 and second samming board 3 along electronic equipment's thickness direction fast, dispel the heat by first samming board 2 and second samming board 3 again, this heat dissipation that has guaranteed electronic equipment along thickness direction is balanced, help guaranteeing that electronic equipment has higher heat dissipation efficiency, also make electronic equipment's surperficial temperature more balanced simultaneously, user's comfort in use has been promoted widely.

In the embodiment of the application, along the length direction and the width direction of the electronic device, heat generated by the main board 1 and the like is quickly dissipated by the first temperature-uniforming plate 2 and the second temperature-uniforming plate 3 on the two sides of the main board 1; along electronic equipment's thickness direction, the heat that mainboard 1 etc. produced conducts to first samming board 2 and second samming board 3 through heat-conducting component 4 fast, is distributed by second samming board 3 and second samming board 3 fast again, and this not only has improved electronic equipment's radiating efficiency widely, makes the heat dissipation of mainboard 1 etc. more even moreover to guaranteed electronic equipment surface temperature's homogeneity, improved user's experience widely.

Optionally, the heat conducting assembly 4 includes a first heat conducting sheet 411 and a second heat conducting sheet 412, the first heat conducting sheet 411 is disposed on the first temperature uniforming plate 2, the second heat conducting sheet 412 is disposed on the second temperature uniforming plate 3, and the first heat conducting sheet 411 is in contact with the second heat conducting sheet 412. The first heat conducting fin 411 arranged on the first temperature equalizing plate 2 is in contact with the second heat conducting fin 412 arranged on the second temperature equalizing plate 3, so that the first temperature equalizing plate 2 is in heat conducting connection with the second temperature equalizing plate 3, and the heat radiating plate is simple in structure, convenient to install and good in heat radiating effect.

The first heat conduction sheet 411 may be integrally formed with the first vapor chamber 2; it is also possible to separately provide the first vapor chamber 2 and then fix the first heat conduction sheet 411 on the first vapor chamber 2. This simplifies the connection structure of the first heat conduction sheet 411 and the first vapor chamber 2, and contributes to improvement of the heat dissipation efficiency of the first heat conduction sheet 411.

The second heat conductive sheet 412 may be integrally formed with the second vapor chamber 3; or may be separately provided from the second vapor chamber 3, and then the second heat conductive sheet 412 is fixedly provided on the second vapor chamber 3. This simplifies the connection structure between the second thermally conductive sheet 412 and the second thermal plate, and contributes to improvement of the heat dissipation efficiency of the second thermally conductive sheet 412.

Optionally, the first heat conducting strip 411 and the second heat conducting strip 412 may be made of red copper, which has a good heat dissipation effect, so that the heat dissipation efficiency can be further improved.

Alternatively, the number of the first heat-conducting sheets 411 is at least one, and the number of the second heat-conducting sheets 412 is at least one; each group of the first heat-conducting fins includes two first heat-conducting fins 411 arranged oppositely, an accommodating groove is formed between the two first heat-conducting fins 411, and one second heat-conducting fin 412 is correspondingly embedded in the accommodating groove.

In a specific embodiment, the number of the first heat-conducting sheets 411 is one group, and the number of the second heat-conducting sheets 412 is one. The second heat conduction plate 412 is embedded in the accommodation groove between the two first heat conduction plates 411. This enables the first thermally conductive sheet 411 and the second thermally conductive sheet 412 to be connected together more stably, thereby facilitating heat conduction between the first thermally conductive sheet 411 and the second thermally conductive sheet 412, and improving uniformity of heat conduction in the thickness direction of the electronic apparatus.

In another specific embodiment, the number of the first heat-conducting sheets 411 is plural, and the number of the second heat-conducting sheets 412 is plural.

For example, the plurality of groups of first heat conduction fins 411 are distributed along the surface of the first temperature equalizing plate 2, for example, may be distributed along the edge of the surface of the first temperature equalizing plate 2; a plurality of second heat-conducting fins 412 are correspondingly distributed along the surface of the second temperature equalizing plate 3. Each of the second heat-conducting fins 412 is matched with the corresponding group of the first heat-conducting fins 411, so that the first heat-conducting fins 411 are in contact with the second heat-conducting fins 412, heat can be quickly conducted between the first heat-conducting fins 411 and the second heat-conducting fins 412, and uniformity of heat conduction of the electronic device in the thickness direction is improved. The plurality of sets of first heat-conducting fins 411 may be four sets, the four sets of first heat-conducting fins 411 form a rectangle on the surface of the first vapor chamber 2, and the four second heat-conducting fins 412 are disposed corresponding to the four sets of first heat-conducting fins 411. For another example, as shown in fig. 2 and 4, a group of first heat-conducting fins 411 may be disposed in the middle of the first temperature equalizing plate 2, for example, the group of first heat-conducting fins 411 is distributed along the width direction of the first temperature equalizing plate 2.

It should be noted that, the number, length, and position of the first heat conducting strip 411 and the second heat conducting strip 412 are specifically determined according to the surface condition of the first temperature equalizing plate 2 and the second temperature equalizing plate 3, on the premise that the internal layout of the electronic device is not affected, so that the heat conducting assembly 4 can realize more efficient heat conduction between the first heat conducting strip 411 and the second heat conducting strip 412, and the uniformity of heat conduction of the electronic device along the thickness direction is improved.

Optionally, the width of the accommodating groove is less than or equal to 0.1mm, so as to ensure that the first heat-conducting strip 411 and the second heat-conducting strip 412 have low thermal contact resistance.

Optionally, the inner surface of the accommodating groove is coated with a heat conductive silicone grease, which makes the first heat conducting sheet 411 and the second heat conducting sheet 412 in flexible contact, helps to protect the contact surface between the first heat conducting sheet 411 and the second heat conducting sheet 412, and reduces the thermal contact resistance between the first heat conducting sheet 411 and the second heat conducting sheet 412.

Optionally, the heat conducting assembly 4 includes a heat conducting fin 421 and a heat conducting silicone gasket 422, the heat conducting fin 421 is disposed on the second temperature uniforming plate 3 and extends toward the first temperature uniforming plate 2, and the heat conducting fin 421 is connected to the first temperature uniforming plate 2 through the heat conducting silicone gasket 422. This makes the structure of the heat conducting member 4 relatively simple, and the heat dissipation efficiency is high, which helps to ensure the uniformity of heat dissipation.

Optionally, one end of the heat conducting fin 421 close to the first vapor chamber 2 extends to two sides of the heat conducting fin 421 to form a connecting boss 4211, and the connecting boss 4211 is in contact with the heat conducting silicone gasket 422. The connection boss 4211 increases the contact area between the heat-conducting fin 421 and the first vapor chamber 2, reduces the heat transfer resistance between the heat-conducting fin 421 and the first vapor chamber, and improves the heat dissipation efficiency.

Optionally, the thickness of the heat-conducting silica gel gasket 422 is less than or equal to 0.3mm, which is beneficial to further reducing heat transfer resistance and improving the heat dissipation efficiency of the heat dissipation assembly.

Optionally, the number of the heat conducting components 4 is multiple. As the number of the heat conducting assemblies 4 increases, heat can be rapidly transferred between the first temperature equalizing plate 2 and the second temperature equalizing plate 3. The multi-group heat conduction assembly 4 is distributed along the surface of the first temperature equalizing plate 2, so that the heat dissipation efficiency between the first temperature equalizing plate 2 and the second temperature equalizing plate 3 can be improved well. In the area where the heat of the motherboard 1 is concentrated, the heat conduction assembly 4 may be additionally provided to further improve the heat conduction efficiency, which is helpful to ensure the uniformity of the temperature of each part of the electronic device.

Optionally, the electronic device further includes a metal bracket 5, the metal bracket 5 serves as an internal supporting component of the electronic device, and the main board 1 and the like may be fixed on the metal bracket 5, which helps to ensure internal stability of the electronic device.

The metal support 5 is located on one side, close to the first temperature equalizing plate 2, of the main board 1, the main board 1 is installed on the metal support 5, a through hole 51 is formed in the metal support 5, and the heat conducting assembly 4 is connected with the first temperature equalizing plate 2 and the second temperature equalizing plate 3 through the through hole 51. The heat conducting component 4 penetrates through the through hole 51 on the metal support 5 to be connected with the first temperature equalizing plate 2 and the second temperature equalizing plate 3, so that the structures of the first temperature equalizing plate 2 and the second temperature equalizing plate are more stable, and the heat dissipation stability of the first temperature equalizing plate 2 and the second temperature equalizing plate 3 is improved.

Optionally, the electronic device further includes a screen module 6, where the screen module 6 is disposed on one side of the first temperature equalizing plate 2, which is far away from the main board 1. The first temperature equalization plate 2 helps to ensure the heat dissipation uniformity of one side of the screen module 6 of the electronic device.

Optionally, the electronic device further includes a battery module 7 and a battery cover 8, the battery cover 8 is disposed on one side of the second temperature equalizing plate 3 away from the motherboard 1, and the battery module 7 is disposed on one side of the second temperature equalizing plate 3 close to the motherboard 1. The second vapor chamber 3 helps to ensure the uniformity of heat dissipation on the battery cover 8 side of the electronic device. Meanwhile, the second temperature equalizing plate 3 can rapidly dissipate heat and cool the battery module 7, and the performance of the battery module 7 is guaranteed.

Optionally, the second temperature equalization plate 3 covers the surface of the battery module 7 close to the battery cover 8. The heat dissipation efficiency of the battery is further improved, the performance of the battery is guaranteed, and the service life of the battery is prolonged. Meanwhile, the second temperature equalizing plate 3 can better protect the battery and improve the fireproof performance of the electronic equipment while improving the uniformity of internal heat dissipation of the electronic equipment.

Optionally, one side of the second temperature equalizing plate 3 close to the main plate 1 is provided with a screw post 9, and the main plate 1 is fixed on the screw post 9 of the second temperature equalizing plate 3 by a screw, so as to improve the stability of fixing the second temperature equalizing plate 3.

Optionally, a screw post 9 is disposed on one side of the metal bracket 5 close to the main board 1, and the main board 1 is fixed on the screw post 9 on the metal bracket 5 by a screw, so as to further improve the stability of connection among the metal bracket 5, the main board 1, and the second temperature-uniforming plate 3.

The application provides an electronic equipment, not only the heat dissipation is more even, can show the radiating efficiency who improves electronic equipment moreover, and user experience is better.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. An electronic device, characterized in that the electronic device comprises:

a main board;

2. The electronic device of claim 1, wherein the heat conducting assembly comprises a first heat conducting fin and a second heat conducting fin, the first heat conducting fin is disposed on the first temperature uniforming plate, the second heat conducting fin is disposed on the second temperature uniforming plate, and the first heat conducting fin is in contact with the second heat conducting fin.

3. The electronic device according to claim 2, wherein the number of the first heat-conductive sheets is at least one group, and the number of the second heat-conductive sheets is at least one;

every group first conducting strip includes two relative settings first conducting strip is formed with the holding tank two between the first conducting strip, one the second conducting strip corresponds to inlay and locates in the holding tank.

4. The electronic device according to claim 3, wherein an inner surface of the accommodating groove is coated with a heat conductive silicone grease.

5. The electronic device of claim 1, wherein the heat conducting assembly comprises a heat conducting fin and a heat conducting silicone gasket, the heat conducting fin is disposed on the second temperature equalizing plate and extends towards the first temperature equalizing plate, and the heat conducting fin is connected with the first temperature equalizing plate through the heat conducting silicone gasket.

6. The electronic device of claim 5, wherein one end of the heat-conducting fin close to the first vapor chamber extends to two sides of the heat-conducting fin to form a connecting boss, and the connecting boss contacts with the heat-conducting silicone gasket.

7. The electronic device of claim 5, wherein the number of the heat conducting components is a plurality of groups.

8. The electronic device of claim 1, further comprising a metal stand;

the metal support is located on one side, close to the first temperature equalizing plate, of the main board, the main board is installed on the metal support, a through hole is formed in the metal support, and the heat conducting assembly is connected with the first temperature equalizing plate and the second temperature equalizing plate through the through hole.

9. The electronic device according to claim 1, further comprising a battery module and a battery cover, wherein the battery cover is disposed on a side of the second temperature equalizing plate away from the motherboard, and the battery module is disposed on a side of the second temperature equalizing plate close to the motherboard.

10. The electronic device of claim 9, wherein the second temperature equalization plate covers a surface of the battery module near the battery cover.