CN217721850U

CN217721850U - Liquid cooling plate with uniform surface temperature performance and toothed cover plate

Info

Publication number: CN217721850U
Application number: CN202221335867.9U
Authority: CN
Inventors: 康乐; 谭超
Original assignee: Dongguan Dongyi Sichuang Electronics Co ltd
Current assignee: Dongguan Dongyi Sichuang Electronics Co ltd
Priority date: 2022-05-31
Filing date: 2022-05-31
Publication date: 2022-11-01
Anticipated expiration: 2032-05-31

Abstract

The utility model discloses a liquid cooling plate that surface samming performance, apron were taken tooth, including apron and bottom plate, apron and bottom plate cooperation installation, be provided with a plurality of liquid cooling fins on the bottom plate, be provided with a plurality of forced air cooling fins on the apron. The utility model discloses a set up a plurality of liquid cooling fins, after the coolant liquid got into the cavity, the area of contact of liquid cooling fin multiplicable and coolant liquid to reach excellent heat conduction effect, the heat can be taken away in the flow of coolant liquid, reached radiating effect, through setting up a plurality of forced air cooling fins, the distinguished and admirable flow, the distinguished and admirable contact with the forced air cooling fin on the apron, the distinguished and admirable heat of taking away on the apron and a plurality of forced air cooling fins has further promoted radiating effect.

Description

Liquid cooling plate with uniform surface temperature performance and toothed cover plate

Technical Field

The utility model relates to a liquid cooling board technical field specifically is a liquid cooling board that surface samming performance, apron take tooth.

Background

Under the large environment of the vigorous development of cloud computing and big data technology, the power consumption of infrastructures such as servers and the like is continuously increased, the internal heat dissipation scheme of a server cabinet is changed from the traditional air-cooled radiator to liquid-cooled heat dissipation, for example, the power consumption of a CPU and a GPU with large heat consumption in the server cabinet is usually more than 300W, so the CPU and the GPU aiming at the main heat generation power consumption are solved by adopting the liquid-cooled heat dissipation scheme.

However, a heat dissipation scheme is often not a traditional air cooling heat dissipation scheme for replacement in place, because a plurality of components with low power consumption and irregular layout are arranged in the server cabinet, the components cannot adopt a liquid cooling heat dissipation scheme, and the liquid cooling heat dissipation scheme is not needed, so that a fan can be still reserved in the whole server cabinet, and good ventilation and heat dissipation can be realized in the internal environment of the whole cabinet.

Based on this, in the liquid cooling scheme in the new day, the existing wind amount of the cabinet system must be utilized, so as to achieve the maximization of energy utilization.

The design of a general liquid cooling scheme of the liquid cooling plate only solves the heat dissipation problem of a CPU or a GPU contacted under the bottom of the liquid cooling plate, but often causes uneven temperature of the upper surface of the liquid cooling plate or overhigh local temperature of the upper surface, and has certain potential safety hazard.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a liquid cooling board that surface samming performance, apron take tooth has solved the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the liquid cooling plate with the surface temperature equalization performance and the cover plate with the teeth comprises a cover plate and a bottom plate, wherein the cover plate is installed with the bottom plate in a matched mode, a plurality of liquid cooling fins are arranged on the bottom plate, and a plurality of air cooling fins are arranged on the cover plate.

Preferably, the cover plate is provided with a protruding portion, a cavity is arranged in the protruding portion, and the liquid cooling fins are located in the cavity.

Preferably, two water gaps are reserved on the protruding portion, pagoda sockets are welded on the two water gaps, and the air cooling fins are located between the two pagoda sockets.

Preferably, mounting holes are reserved at four corners of the cover plate.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the utility model discloses a set up a plurality of liquid cooling fins, after the coolant liquid got into the cavity, the area of contact of liquid cooling fin multiplicable and coolant liquid to reach excellent heat conduction effect, the heat can be taken away in the flow of coolant liquid, reached radiating effect, through setting up a plurality of air-cooled fins, the distinguished and admirable flow, the distinguished and admirable air-cooled fin contact on with the apron, the distinguished and admirable heat of taking away on the apron and a plurality of air-cooled fins has further promoted radiating effect.

Drawings

FIG. 1 is an exploded view of the present invention;

fig. 2 is a schematic structural diagram of the present invention.

The reference numbers and designations in the drawings are as follows:

1. a cover plate; 2. a base plate; 3. cooling the fins by liquid; 4. air-cooling the fins; 5. a boss portion; 6. a water gap; 7. a pagoda interface; 8. and (7) installing holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "horizontal", "vertical", "top", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Referring to fig. 1 to fig. 2, the present invention provides an embodiment: the utility model provides a liquid cooling plate of surperficial samming performance, apron tooth, includes apron 1 and bottom plate 2, apron 1 and the cooperation installation of bottom plate 2, be provided with a plurality of liquid cooling fins 3 on the bottom plate 2, the area of contact of this a plurality of wavy fins 3 multiplicable and coolant to reach excellent heat conduction effect, the heat can be taken away in the flow of coolant liquid, has promoted heat dispersion, be provided with a plurality of air-cooled fins 4 on the apron 1, through setting up a plurality of air-cooled fins 4, the wind current flows, and the wind current contacts with air-cooled fins 4 on the apron 1, and the heat of a plurality of air-cooled fins 4 on the apron is taken away to the wind current, has further promoted radiating effect, has promoted heat dispersion.

Preferably, the cover plate 1 is provided with a protruding portion 5, a cavity is arranged in the protruding portion 5, and the liquid cooling fins 3 are located in the cavity.

Preferably, two water gaps 6 are reserved on the protruding portion 5, pagoda sockets 7 are welded on the two water gaps 6, the air cooling fins 4 are located between the two pagoda sockets 7, and the two pagoda sockets 7 are more convenient to insert with rubber hoses.

Preferably, mounting holes 8 are reserved at four corners of the cover plate 1, and the mounting holes 8 are used for mounting a connecting device, wherein the connecting device can be a connecting screw or a fastener, so that the liquid cooling plate is conveniently and fixedly connected with the CPU chip.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A liquid cooling plate with a toothed cover plate and surface temperature equalization performance is characterized in that: the liquid cooling fin structure comprises a cover plate and a base plate, wherein the cover plate is installed with the base plate in a matched mode, a plurality of liquid cooling fins are arranged on the base plate, and a plurality of air cooling fins are arranged on the cover plate.

2. The liquid cooling plate with toothed cover plate and surface temperature equalization performance as claimed in claim 1, wherein: the cover plate is provided with a protruding portion, a cavity is arranged in the protruding portion, and the liquid cooling fins are located in the cavity.

3. The liquid cooling plate with toothed cover plate and surface temperature equalization performance as claimed in claim 2, wherein: two water gaps are reserved on the protruding portion, pagoda sockets are welded on the two water gaps, and the air cooling fins are located between the two pagoda connectors.

4. A surface temperature equalization performance, cover plate toothed liquid cooling plate as claimed in any one of claims 1 or 2, wherein: mounting holes are reserved at four corners of the cover plate.