CN209201440U - Hand-hold communication device and its slim average-temperature structure - Google Patents
Hand-hold communication device and its slim average-temperature structure Download PDFInfo
- Publication number
- CN209201440U CN209201440U CN201821439693.4U CN201821439693U CN209201440U CN 209201440 U CN209201440 U CN 209201440U CN 201821439693 U CN201821439693 U CN 201821439693U CN 209201440 U CN209201440 U CN 209201440U
- Authority
- CN
- China
- Prior art keywords
- temperature
- slim
- average
- heat
- bulge loop
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model is about a kind of hand-hold communication device and its slim average-temperature structure, this slim average-temperature structure includes a heat-conducting plate and a temperature-uniforming plate, heat-conducting plate has a top surface, a bottom surface and the consistent wears groove through top and bottom, an internal ring wall is formed through the inner peripheral of slot, internal ring wall and bottom surface is coextensive a bulge loop block；Temperature-uniforming plate build-in is positioned in through slot and by bulge loop block institute's clip, and a burnishing surface has been collectively formed in temperature-uniforming plate, bulge loop block and bottom surface.Whereby, avoid accumulation of heat in heat generating component, to reach the radiating efficiency for promoting slim average-temperature structure.
Description
Technical field
The utility model relates to a kind of radiator structure, and in particular to a kind of hand-hold communication device and its slim
Average-temperature structure.
Background technique
The hand-hold communication devices such as mobile phone, tablet computer, PDA, GPS, calculation function and efficiency increasingly increases, and causes
The internal components such as central processor and integrated circuit can generate high temperature when operating, and damage is easy if internal component persistently maintains high temperature
It is bad.Therefore, it is necessary to first disperse the heat of internal component, the operational paradigm and service life of hand-hold communication device could be maintained.
It is conventionally used to the radiator structure of hand-hold communication device, mainly includes a heat-conducting plate, this heat-conducting plate is contour by copper, aluminium
Conductive metal is constituted, and the direct heat posted of heat-conducting plate connects the internal components such as central processing unit and integrated circuit, makes internal component heat
On conduction to heat-conducting plate, then penetrates heat-conducting plate and heat is dissipated into external environment.But the radiating rate of heat-conducting plate is not at present
And internal component heat generates speed.
It is fixed on heat-conducting plate in view of this, heat conducting pipe or temperature-uniforming plate can also be welded or be sticked together by general industry, so as to reaching
To quick conductive and heat dissipation purpose.But for being particular about light and short hand-hold communication device, heat pipe or temperature-uniforming plate are but increased
With the stack thickness of heat-conducting plate, limits hand-hold communication device and pursue further thinning space.
The present inventor is directed to the above-mentioned prior art then, and spy concentrates on studies and cooperate the utilization of scientific principle, and one zero storehouses of exploitation are thick
The slim average-temperature structure of degree (containing temperature-uniforming plate and heat-conducting plate), combines quick conductive heat dissipation and ultra-thin requirement.
Summary of the invention
The utility model provides a kind of hand-hold communication device and its slim average-temperature structure, is pasted using temperature-uniforming plate and heat-conducting plate
The heat for connecing and dissipating heat generating component generation, avoids accumulation of heat in heat generating component, promotes dissipating for slim average-temperature structure to reach
The thermal efficiency.
In the utility model embodiment, the utility model provides a kind of slim average-temperature structure, comprising: a heat-conducting plate, tool
There are a top surface, a bottom surface and the consistent wears groove through the top surface and the bottom surface, an internal ring wall should be formed through the inner peripheral of slot, it should
The internal ring wall and bottom surface is coextensive a bulge loop block；And a temperature-uniforming plate, build-in is in this through slot and by the bulge loop block card
Tug positioning, a burnishing surface has been collectively formed in the temperature-uniforming plate, the bulge loop block and the bottom surface.
In the utility model embodiment, the utility model provides a kind of hand-hold communication device, comprising: a shell, it is internal
Equipped with a cavity；One heat generating component is accommodated in the cavity；And such as above-mentioned slim average-temperature structure, it is accommodated in the cavity, it should
Temperature-uniforming plate heat posted is connected to the heat generating component.
Preferably, above-mentioned temperature-uniforming plate includes the upper housing being mutually assembled and a lower case, which has a periphery
Section and centre have protrude from the circumferential section one prominent section, which is positioned by bulge loop block institute's clip, should
The burnishing surface is collectively formed in prominent section, the bulge loop block and the bottom surface.
Preferably, it is extended with plural trip at the top of above-mentioned bulge loop block, which is equipped with plural fixation hole, respectively the trip
It is sticked in the respectively fixation hole.
Preferably, the top of above-mentioned bulge loop block has one first stage and position above a second-order of first stage
Platform, for the plural number trip from the top elongation moulding of second stage, which, which has, protrudes from the circumferential section outer peripheral edge
One amplification section, the plural number fixation hole open up molding from the amplification section, which corresponds to first stage and be fitted into, the amplification
The corresponding second-order platform of section is chimeric.
Preferably, above-mentioned each trip close type is sticked in the respectively fixation hole.
Preferably, it is formed with a chamber between above-mentioned prominent section and the upper housing, which also includes to be coated on
The indoor capillary structure of the chamber.
Preferably, the thickness of above-mentioned temperature-uniforming plate is equal to or less than the thickness of the heat-conducting plate.
Preferably, the utility model further includes a thermal grease, a heat-conducting glue or a sealant, the thermal grease, the heat-conducting glue
Or it fills out this and close fills between the temperature-uniforming plate, the internal ring wall and the bulge loop block.
Preferably, the utility model further include:
One shell, inside are equipped with a cavity；
One heat generating component is accommodated in the cavity；And
Above-mentioned slim average-temperature structure, is accommodated in the cavity, which is connected to the heat generating component.
Preferably, the bottom surface of above-mentioned heat-conducting plate and the bulge loop block heat posted are connected to the heat generating component.
Based on above-mentioned, temperature-uniforming plate is set in slot, and the lower case of temperature-uniforming plate is positioned by bulge loop block clip, and then is made
Warm plate can be assembled quickly and strong fix is in slot, provide close contact needed for improving transverse heat transfer, also to reach
The characteristics of promoting slim average-temperature structure assembling convenience, structural stability and radiating efficiency.
Detailed description of the invention
Fig. 1 is the stereogram exploded view of the slim average-temperature structure of the utility model；
Fig. 2 is the three-dimensional combination figure of the slim average-temperature structure of the utility model；
Fig. 3 is the exploded sectional view of the slim average-temperature structure of the utility model；
Fig. 4 is the assembled sectional view of the slim average-temperature structure of the utility model；
Fig. 5 is the stereogram exploded view of the utility model hand-hold communication device；
Fig. 6 is the three-dimensional combination figure of the utility model hand-hold communication device；
Fig. 7 is the exploded sectional view of another embodiment of the slim average-temperature structure of the utility model；
Fig. 8 is the assembled sectional view of another embodiment of the slim average-temperature structure of the utility model.
[main component symbol description]
100 ... hand-hold communication devices
10 ... slim average-temperature structures
1 ... heat-conducting plate
11 ... top surfaces
12 ... bottom surfaces
13 ... run through slot
131 ... internal ring walls
14 ... bulge loop blocks
141 ... first stages
142 ... second stages
143 ... trips
2 ... temperature-uniforming plates
21 ... upper housings
211 ... amplification sections
212 ... fixation holes
22 ... lower cases
221 ... periphery areas
222 ... prominent sections
23 ... capillary structures
20 ... shells
201 ... cavities
30 ... heat generating components
40 ... circuit boards
A ... burnishing surface
S ... chamber
H1, h2 ... thickness.
Specific embodiment
Related the utility model is described in detail and technology contents, cooperation schema is described as follows, however appended attached drawing is only made
For illustrative purposes, it is not intended to limitation the utility model.
It please referring to shown in Fig. 1 to Fig. 6, the utility model provides a kind of hand-hold communication device and its slim average-temperature structure, this
Hand-hold communication device 100 mainly includes a shell 20, a heat generating component 30 and slim average-temperature structure 10；Slim average-temperature structure 10 is main
It to include a heat-conducting plate 1 and a temperature-uniforming plate 2.
As shown in Figures 1 to 6, heat-conducting plate 1 has a top surface 11, a bottom surface 12 and through the consistent of top surface 11 and bottom surface 12
Wears groove 13 forms an internal ring wall 131 through the inner peripheral of slot 13, internal ring wall 131 and bottom surface 12 is coextensive a bulge loop block 14.
As shown in Figures 1 to 6,2 build-in of temperature-uniforming plate is in through slot 13 and by the 14 clips positioning of bulge loop block, temperature-uniforming plate 2, convex
A burnishing surface a has been collectively formed in ring block 14 and bottom surface 12.
Detailed description are as follows, and temperature-uniforming plate 2 includes that the upper housing 21 being mutually assembled and a lower case 22, lower case 22 have
One circumferential section 221 and centre have protrude from circumferential section 221 one prominent section 222, and circumferential section 221 is by bulge loop block 14
Burnishing surface a is collectively formed in the positioning of institute's clip, prominent section 222, bulge loop block 14 and bottom surface 12.
In addition, being formed with a chamber s between prominent section 222 and upper housing 21, temperature-uniforming plate 2 also includes to be coated on chamber
A capillary structure 23 in s, capillary structure 23 are channel form, latticed, fibrous, sintering powder, wavy thin plate one kind
Or it is a variety of compound.
Furthermore the thickness h 2 of temperature-uniforming plate 2 is equal to or less than the thickness h 1 of heat-conducting plate 1, so that slim average-temperature structure 10 reaches
The advantage of slimming, allow slim average-temperature structure 10 have volume it is frivolous, do not take up space, ease of assembly the effect of.Wherein, this implementation
For the thickness h 1 of the heat-conducting plate 1 of example between 0.4 to 0.6mm, the thickness h 2 of temperature-uniforming plate 2 is about 0.4mm, system that but not limited to this.
In addition, the slim average-temperature structure 10 of the utility model further includes that (figure is not taken off for a thermal grease, a heat-conducting glue or a sealant
Show), thermal grease, heat-conducting glue or sealant are filled between temperature-uniforming plate 2, internal ring wall 131 and bulge loop block 14, thermal grease, heat-conducting glue
To improve the heat transfer area between temperature-uniforming plate 2, internal ring wall 131 and bulge loop block 14, sealant, heat-conducting glue are to by temperature-uniforming plate
2, internal ring wall 131 and bulge loop block 14 are cemented together, but thermal grease, heat-conducting glue or sealant be not slim average-temperature structure 10 must
Component is wanted, therefore thermal grease, heat-conducting glue or sealant optionally can increase or delete.
As shown in Figure 5 to Figure 6, a cavity 201 is equipped with inside shell 20；It is further described below, shell 20 is by a upper casing
And one lower casing assembled, cavity 201 is formed in the inside of upper casing and lower casing, and heat generating component 30 can be central processing unit and collection
At components such as circuits, but not limited to this, and heat generating component 30 is mounted on circuit board 40, and heat generating component 30 and circuit board 40 are total
It is same to be accommodated in cavity 11, and circuit board 40 and heat-conducting plate 1 are arranged in storehouse shape.
Above-mentioned slim average-temperature structure 10 is also accommodated in cavity 201, and 2 heat posted of temperature-uniforming plate is connected to heat generating component 30.Wherein,
Heat-conducting plate 1 and bulge loop block 14 can heat posted connect or heat posted is not connected to heat generating component 30, i.e. heat-conducting plate 1 and the visual fever group of bulge loop block 14
The size of part 30 connects size voluntarily to adjust the heat posted between heat generating component 30.
In addition, burnishing surface a is collectively formed in prominent section 222, bulge loop block 14 and bottom surface 12, this burnishing surface a because surfacing,
No concave-convex, the surface that heat generating component 30 can also be pasted without segment difference, to reinforce the radiating efficiency of slim average-temperature structure 10.
As shown in Figures 4 to 6, the use state of the utility model hand-hold communication device 100 and slim average-temperature structure 10,
System is connected to heat generating component 30 using 2 heat posted of temperature-uniforming plate, and the heat that heat generating component 30 generates uniformly is directed at heat-conducting plate through temperature-uniforming plate 2
On 1, avoid accumulation of heat in heat generating component 30 and its surrounding, to reach the radiating efficiency for promoting slim average-temperature structure 10.
In addition, temperature-uniforming plate 2 is set in slot 13, the lower case 22 of temperature-uniforming plate 2 is positioned by 14 clip of bulge loop block, in turn
So that temperature-uniforming plate 2 is quickly assembled and strong fix running through in slot 13, close contact needed for also providing improvement transverse heat transfer,
To reach the assembling convenience for promoting slim average-temperature structure 10, structural stability and the feature of radiating efficiency.
It please refers to shown in Fig. 7 to Fig. 8, is another embodiment of the slim average-temperature structure 10 of the utility model, Fig. 7 to Fig. 8 is real
It applies example and Fig. 1 to Fig. 4 embodiment is roughly the same, Fig. 7 to Fig. 8 embodiment and Fig. 1 to Fig. 4 embodiment are the difference is that bulge loop block
14 and temperature-uniforming plate 2 be fixedly connected with each other.
It is further described below, the top of bulge loop block 14 has one first stage 141 and position above the first stage 141
One second stage 142, the top of the second stage 142 is extended with plural trip 143, and upper housing 21, which has, protrudes from circumferential section
One amplification section 211 of 221 outer peripheral edges, amplification section 211 offer plural fixation hole 212, corresponding first stage of circumferential section 221
141 is chimeric, and corresponding second stage 142 of amplification section 211 is chimeric, and each trip 143 is sticked in each fixation hole 212, makes 14 He of bulge loop block
Temperature-uniforming plate 2 is fixed together, and also improves the structural strength and stability of slim average-temperature structure 10.Wherein, each card of the present embodiment
Tenon 143 is first arranged in each fixation hole 212, each trip 143 be stamped again deformation and close type is sticked in each fixation hole 212, but
The fixed connection mode of trip 143 and fixation hole 212 is not limited system, and visual actual conditions are adjusted.
In conclusion the utility model hand-hold communication device and its slim average-temperature structure, really can reach and are expected using purpose,
And known missing is solved, and there is industry applications, novelty and progressive, patent application important document is complied fully with, hence according to special
Sharp method is filed an application, and detailed survey and this case patent please be checked and approved, to ensure the right of utility model people.
Claims (10)
1. a kind of slim average-temperature structure, characterized by comprising:
One heat-conducting plate has a top surface, a bottom surface and the consistent wears groove through the top surface and the bottom surface, should be through the inner peripheral of slot
An internal ring wall is formed, the internal ring wall and bottom surface is coextensive a bulge loop block；And
One temperature-uniforming plate, for build-in in this through slot and by bulge loop block institute's clip positioning, the temperature-uniforming plate, the bulge loop block and the bottom surface are total
It is same to be formed with a burnishing surface.
2. slim average-temperature structure as described in claim 1, it is characterised in that above-mentioned temperature-uniforming plate includes the upper housing being mutually assembled
And a lower case, the lower case is with a circumferential section and intermediate has protrude from the circumferential section one prominent section, this week
Edge section is positioned by bulge loop block institute's clip, and the burnishing surface is collectively formed in the protrusion section, the bulge loop block and the bottom surface.
3. slim average-temperature structure as claimed in claim 2, it is characterised in that it is extended with plural trip at the top of above-mentioned bulge loop block, it should
Temperature-uniforming plate is equipped with plural fixation hole, and respectively the trip is sticked in the respectively fixation hole.
4. slim average-temperature structure as claimed in claim 3, it is characterised in that the top of above-mentioned bulge loop block have one first stage and
One second stage of the position above first stage, top elongation moulding of the plural number trip from second stage, the upper casing
Body has the amplification section for protruding from the circumferential section outer peripheral edge, which opens up molding, this week from the amplification section
Edge section corresponds to first stage and is fitted into, and it is chimeric which corresponds to the second-order platform.
5. slim average-temperature structure as claimed in claim 4, it is characterised in that above-mentioned each trip close type is sticked in the respectively fixation hole
In.
6. the slim average-temperature structure as described in claim 2,3,4 or 5, it is characterised in that above-mentioned prominent section and the upper housing it
Between be formed with a chamber, which also includes to be coated on the indoor capillary structure of the chamber.
7. slim average-temperature structure as claimed in claim 6, it is characterised in that it is thermally conductive that the thickness of above-mentioned temperature-uniforming plate is equal to or less than this
The thickness of plate.
8. slim average-temperature structure as claimed in claim 7, it is characterised in that further include a thermal grease, a heat-conducting glue or a sealing
Glue, the thermal grease, the heat-conducting glue or fills out this and close fills between the temperature-uniforming plate, the internal ring wall and the bulge loop block.
9. a kind of hand-hold communication device, characterized by comprising:
One shell, inside are equipped with a cavity；
One heat generating component is accommodated in the cavity；And
The slim average-temperature structure as described in any one of claims 1 to 8, is accommodated in the cavity, which is connected to this
Heat generating component.
10. hand-hold communication device as claimed in claim 9, it is characterised in that the bottom surface of above-mentioned heat-conducting plate and the bulge loop block heat
It amplexiforms in the heat generating component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821439693.4U CN209201440U (en) | 2018-09-03 | 2018-09-03 | Hand-hold communication device and its slim average-temperature structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821439693.4U CN209201440U (en) | 2018-09-03 | 2018-09-03 | Hand-hold communication device and its slim average-temperature structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209201440U true CN209201440U (en) | 2019-08-02 |
Family
ID=67405509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821439693.4U Expired - Fee Related CN209201440U (en) | 2018-09-03 | 2018-09-03 | Hand-hold communication device and its slim average-temperature structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209201440U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110678046A (en) * | 2019-10-15 | 2020-01-10 | 联德精密材料（中国）股份有限公司 | Thin type integrated structure temperature equalizing plate |
| CN112312744A (en) * | 2020-10-28 | 2021-02-02 | 维沃移动通信有限公司 | Electronic device |
-
2018
- 2018-09-03 CN CN201821439693.4U patent/CN209201440U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110678046A (en) * | 2019-10-15 | 2020-01-10 | 联德精密材料（中国）股份有限公司 | Thin type integrated structure temperature equalizing plate |
| CN112312744A (en) * | 2020-10-28 | 2021-02-02 | 维沃移动通信有限公司 | Electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101628801B1 (en) | Cooling structure for portable electronic device | |
| US9057565B2 (en) | Cooling device and electronic device | |
| CN110234216B (en) | Shell assembly, preparation method thereof and electronic equipment | |
| CN110191626B (en) | Shell assembly, preparation method thereof and electronic equipment | |
| US20120307452A1 (en) | Portable electronic device with heat pipe | |
| CN110267499B (en) | Shell assembly, preparation method thereof and electronic equipment | |
| CN110740611A (en) | Radiator and electronic device with same | |
| CN209201440U (en) | Hand-hold communication device and its slim average-temperature structure | |
| JP2015137848A (en) | Heat radiator for portable electric device | |
| CN207852661U (en) | Hand-hold communication device and its thin heat radiation structure | |
| CN112399787A (en) | Power adapter | |
| CN110012643B (en) | Heat dissipation assembly, preparation method thereof and electronic equipment | |
| CN212086656U (en) | Electronic device with heat radiation structure | |
| TWI533791B (en) | Handheld communication apparatus and thin heat-dissipating structure thereof | |
| CN104302150A (en) | Handheld communication device and thin radiator thereof | |
| CN111432598A (en) | Shell assembly of electronic equipment and electronic equipment | |
| CN109413929B (en) | Heat sink and method for manufacturing the same | |
| CN110149784A (en) | Radiating subassembly and electronic equipment | |
| CN108231713A (en) | Hand-hold communication device and its thin heat radiation structure | |
| CN115297674A (en) | Radiator, manufacturing method of radiator and electronic equipment | |
| WO2021190552A1 (en) | Mobile terminal and middle frame assembly | |
| CN210573485U (en) | Portable flat notebook | |
| CN211577827U (en) | Electronic device | |
| CN110267491B (en) | Middle frame assembly and electronic equipment | |
| CN108601286B (en) | Electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190802 Termination date: 20200903 |