CN206371029U - Heat abstractor - Google Patents
Heat abstractor Download PDFInfo
- Publication number
- CN206371029U CN206371029U CN201590000741.8U CN201590000741U CN206371029U CN 206371029 U CN206371029 U CN 206371029U CN 201590000741 U CN201590000741 U CN 201590000741U CN 206371029 U CN206371029 U CN 206371029U
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- CN
- China
- Prior art keywords
- heat dissipation
- dissipation region
- mentioned
- cooling pin
- heat
- Prior art date
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
- B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
- B29C70/885—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding with incorporated metallic wires, nets, films or plates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Composite Materials (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model is related to heat abstractor, it may include：Radiate flat board；Heat dissipation region portion, is arranged at radiating flat board and is provided with multiple cooling pins of mutually different angle.Also, various other embodiment can be used.Even if heat abstractor is set towards either direction, the free degree of air flow can also be increased.
Description
Technical field
The utility model is related to a kind of heat abstractor, for example, be related to a kind of radiating dress of cooling pin with different directions
Put.
Background technology
Recently, various electronic installation for users to use, as the function in electronic installation is intensive, to electronic installation
Inside provide part in, it is possible to provide the hot part (hereinafter referred to as " heating module ") for producing high temperature.
If the heat of the high temperature produced by this heating module can not be discharged swimmingly, shadow not only is produced to the heating module
Ring, but also influence is produced on circumferential component, not only to cause the failure of part, but also breakage etc. can be caused, cause electronics
Device can not be worked orderly, and What is more, may lead to not use electronic product because of the breakage of part.
Therewith, various shapes are provided with the way of being radiated to the heat by various heating module generation in electronic installation
The electro-heat equipment of state.
As described above, with the hot heating module for producing high temperature being installed in various part of electronic installation
Installation, for efficient heat abstractor necessity increase.
Fig. 1 a and Fig. 1 b are the figure for showing general heat abstractor.
Reference picture 1a and Fig. 1 b, can be set in the lateral surface of electronic installation has radiating flat board 11.
Just radiated flat board 11, and adjacent multiple cooling pins 12 can in long way be formed to a direction on flat board 11.
Flat board 11 is generally made up of the outstanding metal material of the heat conductivities such as aluminium, on the top of this flat board 11, multiple scattered
Fast sale 12 can protrude to be formed towards the direction perpendicular with flat board 11.
As described above, cooling pin 12 is the structure formed in long way to a direction on the top of flat board 11.Here, air
Flow direction should be the direction from side to opposite side, could so form effective radiating.For example, being installed in antenna assembly etc.
In the case of outside electronic installation, it is formed at the cooling pin 12 of flat board 11 only to set towards gravity direction to a direction
Mode be installed on electronic installation, could effectively be radiated using free convection.
But, the electronic installation such as antenna assembly exists according to the parameter in the place or space of setting etc. and is installed on electronics dress
The situation that the cooling pin 12 put is set not towards gravity direction.Especially, cooling pin 12 can also be towards the vertical of gravity direction
Direction is set.In the case, stopped on the contrary by each cooling pin 12 between cooling pin 12 and adjacent cooling pin 12, cause to borrow
Helping the radiating efficiency of convection current reduces.
Therewith, conventional cooling pin is formed at flat board in the way of towards a direction, is provided with the electronic installation of cooling pin
Air-flow direction is considered as when setting, therefore the restriction on setting occurs.
Utility model content
The technical problem of solution
Various embodiment of the present utility model is intended providing following heat abstractor：Even if heat abstractor is towards either direction
Set, the free degree of air flow can also be increased.
Also, various embodiment of the present utility model is intended providing following heat abstractor：Do not set by heat abstractor
The limitation of position etc., even if being set towards any direction, can also consistently maintain radiating efficiency.
Technical scheme
The heat abstractor of one embodiment in various embodiment of the present utility model may include：Radiate flat board；
And heat dissipation region portion (heat radiating area portion), it is arranged at above-mentioned radiating flat board and is provided with mutually not
With the cooling pin of angle.
The effect of utility model
Had the following advantages according to the heat abstractor of various embodiment of the present utility model：Even if heat abstractor direction
Any direction of electronic installation is installed or the electronic installation with heat abstractor is set towards any direction, it may have Ke Yizeng
Plus the advantage of the free degree of air flow.
Also, according to the heat abstractor of various embodiment of the present utility model not only not by the set location of heat abstractor
Deng limitation, even and if heat abstractor towards any direction set, can also consistently maintain radiating efficiency.
Brief description of the drawings
Fig. 1 a and Fig. 1 b are the figure for showing general heat abstractor.
Fig. 2 is the solid for the heat abstractor for showing the first embodiment in various embodiment of the present utility model
Figure.
Fig. 3 is the vertical view for the heat abstractor for showing the first embodiment in various embodiment of the present utility model
Figure.
Fig. 4 is the solid for the heat abstractor for showing the second embodiment in various embodiment of the present utility model
Figure.
Fig. 5 is the vertical view for the heat abstractor for showing the second embodiment in various embodiment of the present utility model
Figure.
Fig. 6 is the solid for the heat abstractor for showing the 3rd embodiment in various embodiment of the present utility model
Figure.
Fig. 7 is the vertical view for the heat abstractor for showing the 3rd embodiment in various embodiment of the present utility model
Figure.
Fig. 8 a to Fig. 8 d are the heat abstractor for showing one embodiment in various embodiment of the present utility model
In cooling pin varied shapes figure.
Fig. 9 a to Fig. 9 e are the heat abstractor for showing one embodiment in various embodiment of the present utility model
In insertion section varied shapes figure.
Figure 10 a and Figure 10 b are to show the first embodiment and second by various embodiment of the present utility model
The figure of the Temperature Distribution of heating module heating in the heat abstractor of embodiment.
Figure 11 is to show dissipating for first embodiment and second embodiment in various embodiment of the present utility model
The data of the Temperature Distribution of the radiating of cooling pin in thermal.
The explanation of reference
100：Heat abstractor 110：Flat board
121、122、123、124：Cooling pin
131、132、133、134：Heat dissipation region portion
140：Insertion section 170：Heating module
Embodiment
Hereinafter, various embodiment of the present utility model is recorded with reference to accompanying drawing.Various embodiment of the present utility model can
Various change is carried out, there can be various embodiments, specific embodiment is illustrated in accompanying drawing, and describes the detailed description of correlation.
But, this is not that various embodiment of the present utility model is defined in into specific embodiment, it is thus understood that this practicality is new
Having altered included in the thought and technical scope of various embodiment of type and/or equivalent are to substitute.On attached
The explanation of figure, similar reference has been used for similar structural element.
The vocabulary of workable " comprising " or " may include " etc. refers to disclosure in various embodiment of the present utility model
(disclosure) presence of the function, work or structural element etc., is not intended to limit additional more than one function, work
Or structural element etc..And, it should be understood that in various embodiment of the present utility model, " comprising " or " having " etc.
Term is used to specify feature described in specification, numeral, step, work, structural element, the presence of components or groups thereof, and
It is not to exclude other one or more features or numeral, step, work, structural element, components or groups thereof in advance
In the presence of or additional possibility.
In various embodiment of the present utility model, the vocabulary of "or" etc. includes any combination for the word together enumerated
And all combinations.For example, " including A or B " refers to, can include A, can also include B or including A and B.
The vocabulary of " the 1st ", " the 2nd ", " first " or " second " that is used in various embodiment of the present utility model etc.
Various structural element of various embodiment can be modified, but does not limit the structural element.For example, above-mentioned vocabulary is not limited
Order and/or importance of the structural element etc..Above-mentioned vocabulary can be used for distinguishing a structural element and another structural element.
For example, the first user equipment and second user equipment are user equipment, but represent different user equipmenies.For example, not surpassing
In the case of the interest field of various embodiment more of the present utility model, first structure key element can be named as the second structure will
Element, similarly, the second structural element can also be named as first structure key element.
When being related to some structural element with another structural element " being connected " or " being connected ", above-mentioned arbitrary structures
Key element can be directly connected to or couple with another above-mentioned structural element, it is to be understood that for above-mentioned arbitrary structures key element with it is upper
State between another structural element and there is new other structures key element.Tied on the contrary, being related to some structural element with another
When structure key element " be joined directly together and connect " or " being directly connected ", it can be understood as some above-mentioned structural element with it is above-mentioned another
New other structures key element is not present between structural element.
The term used in various embodiment of the present utility model is merely to illustrate specific embodiment, does not limit
Various embodiment of the present utility model.Unless defined otherwise on context, representing the vocabulary of odd number includes plural number.
Unless otherwise defined, including technical term or scientific and technical terminology, all terms as used herein have and this reality
The implication identical meaning being commonly understood by with the those of ordinary skill in new various embodiment art.It is conventional
The term for having dictionary definition should be interpreted that the meaning consistent with the contextual meaning of correlation technique, unless new in this practicality
Explicitly defined in various embodiment of type, be not interpreted as the meaning that is preferable or excessively formalizing.
It may include heating module is internally installed according to the electronic installation of various embodiment of the present utility model, and set
It is equipped with the equipment of the heat abstractor for being radiated to heating module.
For example, it may include antenna assembly, lighting device.
Can be tablet personal computer (tablet personal also, electronic installation is not only defined in above-mentioned equipment
Computer), mobile phone (mobile phone), desktop computer (desktop personal computer), notebook electricity
Brain (laptop personal computer), net book (netbook computer), palm PC (personal
Digital assistant), the communicator such as portable media player (portable multimedia player) with
And TV, digital video disk (digital video disk) player, sound equipment, refrigerator, air-conditioning, scavenging machine, baking box, microwave
Stove, washing machine, air cleaner, set top box (set-top box), TV set-top box are (for example, Samsung HomeSyncTM, apple
TVTM or Google TVTM), game machine (game consoles), electronic dictionary, electronic lock, video camera (camcorder) or electronics
The intelligent appliance such as photo frame product (smart home appliance), can also be projecting apparatus (projector) or various measurements
Equipment (example：Water, electricity, gas or wave measuring device etc.), and can also be one kind or one kind in above-mentioned various device
Combination above.
Hereinafter, with reference to appended Fig. 2 to Figure 11 to being observed according to the heat abstractor of various embodiment.Also, with
Under three kinds of embodiments of the heat abstractor according to various embodiment of the present utility model are stressed, but do not limit
In this.That is, the quantity in heat dissipation region portion described later or the angle of the cooling pin provided to different heat dissipation region portions can be according to peaces
Fill many of heating module position, the installation environment of electronic installation, installing space, the setting angle of electronic installation of heat abstractor etc.
The factor of sample is changed or deformed.
The heat abstractor of one embodiment in various embodiment of the present utility model may include：Radiate flat board；
Heat dissipation region portion (heat radiating area portion), is arranged at above-mentioned radiating flat board, is provided with mutually different angle
Cooling pin.
Also, the heat abstractor of one embodiment in various embodiment of the present utility model is in above-mentioned radiating area
Insertion section (inset portion) can be provided between domain portion and the heat dissipation region portion adjacent with above-mentioned heat dissipation region portion.
Also, in the heat abstractor of one embodiment in various embodiment of the present utility model, it is formed at
Multiple above-mentioned cooling pins in above-mentioned heat dissipation region portion and it is arranged on many of the heat dissipation region portion adjacent with above-mentioned heat dissipation region portion
Individual above-mentioned cooling pin can have " V " word shape centered on above-mentioned insertion section.
Also, it is above-mentioned to insert in the heat abstractor of one embodiment in various embodiment of the present utility model
Entering portion may include at least two insertion lines, and above-mentioned insertion line can intersect or warpage.
It is above-mentioned to insert in the heat abstractor of above-mentioned one embodiment in various embodiment of the present utility model
Entering portion can be intersected to form in above-mentioned radiating flat board with "+" shape, and above-mentioned heat dissipation region portion, can be with centered on above-mentioned insertion line
It is divided into the first heat dissipation region, the second heat dissipation region, the 3rd heat dissipation region, the 4th heat dissipation region.
In the heat abstractor of above-mentioned one embodiment in various embodiment of the present utility model, above-mentioned
One heat dissipation region, the second heat dissipation region, the 3rd heat dissipation region, the first cooling pin of the 4th heat dissipation region, the second cooling pin, the 3rd
Cooling pin, the 4th cooling pin can have the mutually different angle of " X " word shape centered on the central portion of above-mentioned insertion line.
In the above-mentioned heat abstractor according to another embodiment of the present utility model, above-mentioned first heat dissipation region, second
Heat dissipation region, the 3rd heat dissipation region, the first cooling pin of the 4th heat dissipation region, the second cooling pin, the 3rd cooling pin, the 4th radiating
Pin can have the mutually different angle of diamond shape centered on the central portion of above-mentioned insertion line.
In the heat abstractor of a further embodiment in various embodiment of the present utility model, above-mentioned insertion section
It can be intersected to form in above-mentioned radiating flat board with " X " word shape, above-mentioned heat dissipation region portion can be drawn centered on above-mentioned insertion line
It is divided into the first heat dissipation region, the second heat dissipation region, the 3rd heat dissipation region, the 4th heat dissipation region, above-mentioned first heat dissipation region, second
Heat dissipation region, the 3rd heat dissipation region, the first cooling pin of the 4th heat dissipation region, the second cooling pin, the 3rd cooling pin, the 4th radiating
Pin can be centered on the central portion of above-mentioned insertion line, the mutually different angle with "+" word shape.
Also, in the heat abstractor of one embodiment in various embodiment of the present utility model, multiple
In above-mentioned cooling pin, at least one in pleated portions, joggling part, protuberance, opening portion can also be included in the way of forming sinuous flow
Kind.
Also, it is adjacent in the heat abstractor of one embodiment in various embodiment of the present utility model
Above-mentioned heat dissipation region portion can in a symmetrical be set centered on above-mentioned insertion section.
Fig. 2 is the stereogram of the heat abstractor of the first embodiment in various embodiment of the present utility model.Fig. 3
For the top view of the heat abstractor of the first embodiment in various embodiment of the present utility model.Fig. 4 is according to this reality
With the stereogram of the heat abstractor of the second embodiment in new various embodiment.Fig. 5 is according to of the present utility model many
The top view of the heat abstractor of second embodiment in the embodiment of sample.Fig. 6 is according to various embodiment of the present utility model
In 3rd embodiment heat abstractor stereogram.Fig. 7 is real for the 3rd in various embodiment of the present utility model
Apply the top view of the heat abstractor of example.Fig. 8 a to Fig. 8 d are the reality shown in various embodiment of the present utility model
Apply the figure of various shape of multiple cooling pins in the heat abstractor of example.Fig. 9 a to Fig. 9 e are to show according to of the present utility model
The figure of various shape of insertion section in the heat abstractor of one embodiment in various embodiment.
Together reference picture 2 is to Fig. 9, the heat abstractor of one embodiment in various embodiment of the present utility model
100 may include：Radiating flat board 110 (heat radiating area portion, hereinafter referred to as " flat board 110 ") and it is multiple
Cooling pin 121,122,123,124, flat board 110 can be divided at least more than one by insertion section 140 (inset portion)
Heat dissipation region portion 131,132,133,134.
Flat board 110 is that one kind is arranged at electronic installation, and the heating mould of heating is produced such as antenna assembly or lighting device
The structure of the position of block 170.Flat board 110 can be made up of the high material of the heat conductivities such as copper, aluminium, to receive by heating module
The heat that (170, reference picture 8) are produced.In an embodiment of the present utility model, as one of the material of flat board 110, exemplified with copper
Or aluminium, but it is not limited to this, it is contemplated that using environment or space, design, external environment condition of electronic installation etc., as long as have
The material of suitable pyroconductivity, can be carried out changing or deforms.
Also, there can be the shape of square or rectangular according to the flat board 110 of an embodiment of the present utility model, rear
In the various embodiment stated, the situation that flat board 110 is formed as square is illustrated.But, the shape of flat board 110 is not limited
Due to this.For example, being installed on the peace of electronic installation according to the setting angle or flat board 110 of the electronic installation for being provided with flat board 110
Angle is filled, there can be the form rotated from square or rectangular, may be formed as the flat board 110 of circular or polygon etc.
Shape can be deformed or changed.
Multiple cooling pins 121,122,123,124 are that have predetermined distance on flat board 110, prominent to vertical direction
Structure.This multiple cooling pins 121,122,123,124 can be set in the way of having predetermined angle on flat board 110
Put.Can not only be had according to multiple cooling pins 121,122,123,124 of an embodiment of the present utility model on flat board 110
Predetermined angle, but also the heat dissipation region portion of at least more than one can be arranged in a neighboring manner on flat board 110
131、132、133、134(heat radiating area portion)。
Illustrate according to the cooling pin 121,122,123,124 of various embodiment of the present utility model in flat board 110
On the situation prominent to vertical direction.But cooling pin can also be tilted on flat board in the way of with predetermined angle it is prominent
Go out.Therefore, process assembled according to cooling pin in flat board etc., can arbitrarily be changed, the outside installed according to heat abstractor
Environment etc., angle of inclination can arbitrarily be changed.
Specifically, heat dissipation region portion 131,132,133,134 is that the parallel protrusion of oriented same direction is formed on flat board 110
Multiple cooling pins 121,122,123,124 heat dissipation region, heat dissipation region can be formed on flat board 110 at least one with
On.Heat dissipation region portion 131,132,133,134 is exemplified below has a case that symmetric shape on flat board 110.But dissipate
Thermal region portion 131,132,133,134 can be according to the position or the position of heating module 170 of insertion section 140 described later, can be with
Asymmetric manner is formed.Also, heat dissipation region portion 131,132,133,134 can be formed along a direction is adjacent on flat board,
It can also be formed along gravity direction and the direction vertical with gravity direction.
Be exemplified below heat dissipation region portion 131 described later according to various embodiment of the present utility model, 132,
133rd, 134 it can be divided into including the first heat dissipation region portion 131, the second heat dissipation region portion 132, the 3rd heat dissipation region portion the 133, the 4th
Heat dissipation region portion 134, four symmetrical regions centered on the insertion section 140 of intersection.But, heat dissipation region portion 131,
132nd, 133,134 it may be configured as the heat dissipation region portion 131,132,133,134 of at least more than one, i.e. may be configured as one and dissipate
Thermal region portion 131,132,133,134, but also two or more heat dissipation regions can be included, therefore in view of flat board
110 size or the position of radiating module etc., arbitrarily can be deformed or be changed.
(inset portion) may be disposed at heat dissipation region portion 131,132,133,134 and and radiating area for insertion section 140
Between adjacent heat dissipation region portion 131,132,133,134 of domain portion 131,132,133,134.Specifically, heat dissipation region portion 131,
132nd, 133,134 can in a mutually adjacent manner it be set centered on insertion section 140.By with mutually different angle
Multiple leaked-in airs of cooling pin 121,122,123,124 can be converted to sinuous flow in insertion section 140, and energy is produced therewith to occur
Air flow.Therewith, air flow can be made more active so that air effectively to multiple cooling pins 121,122,123,
Flowed between 124, thus increase radiating efficiency.
As described above, the adjacent heat dissipation region portion 131 of one in various embodiment of the present utility model,
132nd, 133,134 can be on the basis of insertion section 140 with model split symmetrically or non-symmetrically.It is exemplified below described later
According in the heat abstractor 100 of various embodiment of the present utility model, heat dissipation region portion 131,132,133,134 is with insertion section
Situation about being divided in a symmetrical on the basis of 140.But each heat dissipation region portion 131,132,133,134 can be in different sizes
, asymmetric manner is formed, according to position of heating module 170 etc., arbitrarily the position of insertion section 140 can be deformed or
Change, heat dissipation region portion 131,132,133,134 can be natural with asymmetric manner formation therewith.
The multiple cooling pins formed in adjacent heat dissipation region portion 131,132,133,134 on the basis of insertion section 140
121st, 122,123,124 and be arranged at above-mentioned heat dissipation region portion 131,132,133,134 and adjacent heat dissipation region portion 131,
132nd, 133,134 multiple cooling pins 121,122,123,124 can have mutually different angle, can specifically have " V " word
Shape or its negative shape (peaky shape).For example, in the case where being provided with an insertion section 140, being formed at a radiating
Multiple cooling pins 121,122,123,124 in region portion 131,132,133,134 and the radiating in other regions adjacent thereto
Multiple cooling pins 121,122,123,124 in region portion 131,132,133,134 can be on the basis of insertion section 140, with " V " word
" ∧ " shape of shape or its opposite direction has mutually different angle.Also, situation about being be arranged in parallel two insertion sections 140
Under, heat dissipation region portion 131,132,133,134 is centered on the heat dissipation region portion 131,132,133,134 in center, both sides Ke Bao
Include the heat dissipation region portion 131,132,133,134 on left side and right side.In the case, it is formed at radiating from side towards opposite side
Multiple cooling pins 121,122,123,124 in region portion 131,132,133,134 can be with a peak shape and a paddy shape
Or the mode that a paddy shape and a peak shape have mutually different angle is formed.On the basis of insertion section 140, it is formed at each
Each cooling pin 121,122,123,124 of individual flat board 110 can have 20 °~80 ° of angle.In the utility model, citing
Illustrate that multiple cooling pins 121,122,123,124 on the basis of insertion section 140, have a case that 45 ° of angle.But, it is multiple
The angle of cooling pin 121,122,123,124 is not limited to this.Also, be formed at each heat dissipation region portion 131,132,133,
134 multiple cooling pins 121,122,123,124 can be formed with predetermined angle, enabling on the basis of insertion section 140, with
It is symmetrically formed.For example, referring to Fig. 2, on the basis of the insertion section 140 of horizontal direction, the first of the first heat dissipation region 131 dissipates
Fast sale 121 can be along counter clockwise direction towards horizontal direction insertion section 140 upside formed with 45 ° of angle, the second radiating area
Second cooling pin 122 in domain 132 can clockwise towards horizontal direction insertion section 140 upside with 45 ° of angle shape
Into the 3rd cooling pin 123 of the 3rd heat dissipation region 133 can be along counter clockwise direction towards the downside of horizontal direction insertion section 140
Formed with 45° angle degree, the 4th cooling pin 124 of the 4th heat dissipation region 134 can be inserted towards horizontal direction clockwise
The downside in portion 140 is formed with 45 ° of angle.But, it is formed at each radiating in each heat dissipation region portion 131,132,133,134
Not only being symmetrically formed with illustration of pin 121,122,123,124.That is, be formed at each heat dissipation region portion 131,
132nd, 133,134 multiple cooling pins 121,122,123,124 can have different angle.
Reference picture 8, can on the surface of multiple cooling pins 121,122,123,124 according to an embodiment of the present utility model
Extra structure is formed with, is made to leaked-in air formation sinuous flow between multiple cooling pins 121,122,123,124.For example,
As shown in Figure 8 a, it can be formed in the way of the precalculated position in cooling pin 121,122,123,124 has multiple crimp shapes
There are pleated portions 126.Also, it is different from pleated portions 136, the pre-determined bit of oriented cooling pin 121,122,123,124 can also be formed
Put the joggling part 127 of the shape of warpage.Also, it is different from pleated portions 126 or joggling part 127, it can also be formed with cooling pin
121st, 122,123,124 precalculated position protrudes the protuberance for being formed with extra multiple projections.Also, with foregoing pleated portions
126th, joggling part 127 and protuberance 128 are different, could be formed with the precalculated position of cooling pin 121,122,123,124 multiple
Hole or the opening portion of groove 129.At least one of foregoing pleated portions 126, joggling part 127, protuberance 128 and joggling part 129
Cooling pin 121,122,123,124 can be formed in the way of being combined above.
Reference picture 9a to Fig. 9 e, is illustrated according to the insertion section 140 of various embodiment of the present utility model with least
The intersect mode of (cross) of two insertion lines is formed, or situation about being formed in the way of at least two insertion line warpages.
For example, as shown in Fig. 9 a or Fig. 9 b, two insertion lines can be intersected on flat board 110 with "+" or X-shaped state to be formed, such as Fig. 9 c
Or shown in Fig. 9 d, insertion line can also with " T " word shape orWord shape warpage is formed.Also, as shown in figure 9e, insert
Line can be formed in the way of at least more than one insertion line is parallel to each other, additionally it is possible to what is intersected with parallel insertion line
Insertion line is combined.As described above, it is considered that position or the radiating efficiency of heating module 170, can be arbitrarily to insertion section 140
Deformed or changed.
As described above, position according to heating module 170 etc., can be arbitrarily to heat dissipation region portion 131,132,133,134
Deformed or changed with insertion section 140.
Also, according to the structure in heat dissipation region portion 131,132,133,134 and insertion section 140, adjacent cooling pin 121,
122nd, 123,124 settable directions and angle.
Referring to Fig. 2 and Fig. 3, the radiating to the first embodiment in various embodiment of the present utility model is filled
100 are put to illustrate.
Reference picture 2 and Fig. 3, have cross one another insertion section 140 according to the heat abstractor 100 of first embodiment is settable,
And on the basis of insertion section 140, it is settable to have four heat dissipation region portions 131,132,133,134.Specifically, in the flat of square
It is provided with and is intersected with horizontal direction and the direction vertical with horizontal direction on plate 110, the insertion intersected with "+" shape
Portion 140, on the basis of insertion section 140, it may include the first heat dissipation region 131, the second heat dissipation region 132, the 3rd heat dissipation region
133rd, four heat dissipation region portions 131,132,133,134 of the 4th heat dissipation region 134.In the utility model, using Fig. 3 as base
Standard, the heat dissipation region portion 131,132,133,134 of left side upper end is the first heat dissipation region 131, in a clockwise direction right side upper end
Heat dissipation region portion 131,132,133,134 be the second heat dissipation region 132, the heat dissipation region portion 131 of right side lower end, 132,133,
134 be the 3rd heat dissipation region 133, and the heat dissipation region portion 131,132,133,134 of left side lower end is the 4th heat dissipation region 134.This
It is to be named for the convenience of explanation, arbitrarily the first heat dissipation region 131, the second heat dissipation region the 132, the 3rd can be radiated
Region 133, the 4th heat dissipation region 134 are changed.
First heat dissipation region 131 is defined by the insertion section 140 of intersection, can with the second heat dissipation region the 132, the 4th radiate
The adjacent mode in region 134 is set.Also, the 4th heat dissipation region 134 can with the 3rd heat dissipation region 133, the first radiating area
The adjacent mode in domain 131 is set.
Can be with the first heat dissipation region 131, the second heat dissipation region 132, the 3rd heat dissipation region 133, the 4th heat dissipation region 134
It is provided with the first cooling pin 121 with mutually different angle, the second cooling pin 122, the 3rd cooling pin 123, the 4th cooling pin
124.Even if also, above-mentioned flat board 110 is located at the vertical direction of gravity direction or gravity direction, is formed at the first heat dissipation region
131st, the second heat dissipation region 132, the 3rd heat dissipation region 133, the first cooling pin 121, the second cooling pin of the 4th heat dissipation region 134
122nd, the 3rd cooling pin 123, the 4th cooling pin 124 can also be of similar shape.
Also, radiated according to the first cooling pin 121 of first embodiment of the present utility model, the second cooling pin the 122, the 3rd
Pin 123, the 4th cooling pin 124 can have mutually mutually different with adjacent cooling pin 121,122,123,124 with paddy shape
The mode of angle is formed.Therewith, the first cooling pin 121, the second cooling pin 122, the 3rd cooling pin 123, the 4th cooling pin 124 with
On the basis of the central portion for inserting line so that can be with mutually different with the cooling pin 121,122,123,124 that " X " word shape is adjacent
Angle is formed.
Specifically, the first heat dissipation region 131, the second heat dissipation region 132 and the 4th heat dissipation region 134 are adjacent regions.
Therewith, the first cooling pin 121 for being formed at the first heat dissipation region 131 and the second cooling pin for being formed at the second heat dissipation region 132
122nd, being formed at the 4th cooling pin 124 of the 4th heat dissipation region 134 has different angles.Therefore, the first cooling pin 121 and
Two cooling pins 122 can have different angles, the first cooling pin 121 and centered on insertion section 140 with " V " word shape
Four cooling pins 124 can have different angles centered on insertion section 140 with " V " word shape.It is identical with this, the second radiating
The heat dissipation region 131 of region 132 and first, the 3rd heat dissipation region 133 are adjacent region, are formed at the second heat dissipation region 132
Second cooling pin 122 and it is formed at the first cooling pin 121 of the first heat dissipation region 131, is formed at the of the 3rd heat dissipation region 133
Three cooling pins 123 are by with different angles.Therewith, as described above, the second cooling pin 122 and the first cooling pin 121 can be with
" V " word shape has different angles, and the second cooling pin 122 and the 3rd cooling pin 123 can be centered on insertion sections, with " V "
Word shape has different angles.It is identical with this, the 3rd heat dissipation region 133 and the second heat dissipation region 132, the 4th heat dissipation region
134 be adjacent region, and being formed at multiple 3rd cooling pins 123 of the 3rd heat dissipation region 133 can have and the multiple second radiatings
The different angle of pin 122, multiple 4th cooling pins 124.Therewith, as described above, the 3rd cooling pin 123 and the second cooling pin 122
There can be different angles with " V " word shape, the 3rd cooling pin 123 and the 4th cooling pin 124 can be base with insertion section 140
Standard, has mutually different angle with " V " word shape.Also, the 4th heat dissipation region 134 and the first heat dissipation region the 131, the 3rd dissipate
Thermal region 133 is adjacent region, is formed at multiple 4th cooling pins 124 of the 4th heat dissipation region 134 and can have and multiple the
The different angle of one cooling pin 121, multiple 3rd cooling pins 123.Therewith, as described above, as described above, the 4th cooling pin 124
The different angles of " V " word shape, the 4th cooling pin 124 on the basis of insertion section 140, can be formed with the 3rd cooling pin 123
The different angles of " V " word shape on the basis of insertion section, can be formed with the first cooling pin 121.
According to the first cooling pin 121 of the first heat dissipation region 131 of first embodiment of the present utility model and the 3rd radiating
3rd cooling pin 123 in region 133 can have identical angle, and the second cooling pin 122 and the 4th of the second heat dissipation region 132 dissipates
4th cooling pin 124 of thermal region 134 can have identical angle.Therewith, according to the upper of first embodiment of the present utility model
State the first heat dissipation region 131, the second heat dissipation region 132, the 3rd heat dissipation region 133, the first radiating in the 4th heat dissipation region 134
Pin 121, the second cooling pin 122, the 3rd cooling pin 123, the 4th cooling pin 124 can be using the central portions of above-mentioned insertion line in
The heart, has different angles with " X " word shape.
As described above, in the case that flat board 110 is set to gravity direction, being with the insertion section 140 that "+" word shape intersects
Benchmark, the first cooling pin 121, the second cooling pin 122, the 3rd cooling pin 123, the 4th cooling pin 124 can with " X " word shape,
Formed at different angles.In this state, flat board 110 is made to rotate the situation to set to the vertical direction of gravity direction
Under, insertion section 140 is intersected with "+" word shape, on the basis of this insertion section 140, the first cooling pin 121, the second cooling pin
122nd, the 3rd cooling pin 123, the 4th cooling pin 124 can have different angles with X-shaped shape.Therewith, even if being provided with scattered
The electronic installation of thermal 100 is set according to environment etc. is set to the perpendicular direction of gravity direction or gravity direction, many
The shape of individual cooling pin 121,122,123,124 can remain constant.
Even if in this regard, heat abstractor 100 is set to gravity direction, or is set to the vertical direction of gravity direction, also can
Maintain constant radiating efficiency.
Hereinafter, reference picture 4 and Fig. 5, are illustrated for the heat abstractor 100 according to second embodiment.
According to the heat abstractor 100 of second embodiment of the present utility model and dissipating according to first embodiment as described above
The difference of thermal 100 is, be formed at the first heat dissipation region 131, the second heat dissipation region 132, the 3rd heat dissipation region 133,
First cooling pin 121 of the 4th heat dissipation region 134, the second cooling pin 122, the 3rd cooling pin 123, the shape of the 4th cooling pin 124
It is angled.In this regard, during being illustrated to second embodiment of the present utility model, with interior perhaps structure as described above
Embodiment as described above applicable etc. identical.Also, repeated with explanation as described above or identical content will use as
Upper described embodiment, the structure that have difference will be specifically described below.
Reference picture 4 and Fig. 5, may include according to the heat abstractor 100 of second embodiment：Mutually with "+" word on flat board 110
Insertion section 140 that shape intersects and the first heat dissipation region 131, the second heat dissipation region divided on the basis of insertion section 140
132nd, four heat dissipation regions such as the 3rd heat dissipation region 133, the 4th heat dissipation region 134.In the radiating of the first heat dissipation region 131, second
Region 132, the 3rd heat dissipation region 133, the 4th heat dissipation region 134 can be formed with and form different between adjacent heat dissipation region
The first cooling pin 121, the second cooling pin 122, the 3rd cooling pin 123, the 4th cooling pin 124 of angle.
Especially, dissipated according to the first cooling pin 121 of second embodiment of the present utility model, the second cooling pin the 122, the 3rd
Fast-selling 123, the 4th cooling pin 124 can be to mutually form chevron shape, and the mode with mutually different angle is formed.Therewith,
In the first cooling pin 121, the second cooling pin 122, the 3rd cooling pin 123, the 4th cooling pin 124, with above-mentioned insertion line
Centered on the portion of centre, with the energy of cooling pin 121,122,123,124 in the adjacent heat dissipation region portion 131,132,133,134 of diamond shape
It is enough to be formed at different angles.
It is also situation about being set in flat board 110 to gravity direction and to weight according to the heat abstractor 100 of second embodiment
In the case that the vertical direction of force direction is set, the energy of multiple cooling pins 121,122,123,124 of each heat dissipation region is formed at
It is enough to be formed in the same direction.
, can also even if in this regard, heat abstractor 100 is set to gravity direction, or setting to the vertical direction of gravity direction
Keep constant radiating efficiency.
Hereinafter, reference picture 6 and Fig. 7, are illustrated to the heat abstractor 100 according to 3rd embodiment.
According to the heat abstractor 100 of 3rd embodiment of the present utility model and first embodiment as described above or according to the
The difference of the heat abstractor 100 of two embodiments is, shape and shape that shape that flat board 110 is set, insertion section intersect
Into in the first heat dissipation region 131, the second heat dissipation region 132, the 3rd heat dissipation region 133, the 4th heat dissipation region 134 first radiating
Angle that pin 121, the second cooling pin 122, the 3rd cooling pin 123, the 4th cooling pin 124 are formed etc..
Reference picture 6 and Fig. 7, in the heat abstractor 100 according to 3rd embodiment of the present utility model, the energy of insertion section 140
Enough flat boards 110 by square shape connect corner and corner to be formed in the way of intersecting.That is, formed with two insertion lines
Insertion section 140 can be intersected to form on flat board 110 with X-shaped shape.
Flat board 110 can be divided into the first heat dissipation region 131, the second radiating area on the basis of the central portion for inserting line
Four heat dissipation regions such as domain 132, the 3rd heat dissipation region 133, the 4th heat dissipation region 134.Real according to the of the present utility model 3rd
In the heat dissipation region portion 131,132,133,134 for applying example, the heat dissipation region portion 131,132,133,134 of the topmost of flat board 110
The first heat dissipation region 131 is can be described as, as benchmark, the second heat dissipation region the 132, the 3rd is can be described as respectively clockwise and dissipates
Thermal region 133, the 4th heat dissipation region 134.This is named, the first heat dissipation region for the convenience and simplicity of explanation
131st, the second heat dissipation region 132, the 3rd heat dissipation region 133, the position of the 4th heat dissipation region 134 can arbitrarily be changed.
Therewith, radiated according to the first cooling pin 121 of 3rd embodiment of the present utility model, the second cooling pin the 122, the 3rd
Pin 123, the 4th cooling pin 124 can also mutually form different angles.Especially in 3rd embodiment of the present utility model, the
One cooling pin 121, the 3rd cooling pin 123 can be formed to gravity direction, and the second cooling pin 122, the 4th cooling pin 124 can be to gravity
The vertical direction in direction is formed.Therewith, it can be formed according to the insertion section 140 of 3rd embodiment with X-shaped shape, the first cooling pin
121st, the second cooling pin 122, the 3rd cooling pin 123, the 4th cooling pin 124 can centered on the central portion of above-mentioned insertion line,
With "+" word shape, mutually there are different angles with paddy shape.
Also, be also according to the heat abstractor 100 of 3rd embodiment, situation about being set to gravity direction in flat board 110 with
And to gravity direction vertical direction set in the case of, be formed at each heat dissipation region multiple cooling pins 121,122,123,
124 can form in the same direction.
, can also even if in this regard, heat abstractor 100 is set to gravity direction, or setting to the vertical direction of gravity direction
Keep constant radiating efficiency.
Hereinafter, simply illustrate to the heat abstractor according to first embodiment of the present utility model and 3rd embodiment
The data simulated of radiating efficiency.
Figure 10 a and Figure 10 b are to show the first embodiment and second embodiment in various embodiment of the present utility model
Heat abstractor in heating module in the figure of Temperature Distribution that is generated heat.Figure 11 is to show by of the present utility model various
The data for the Temperature Distribution that first embodiment in embodiment and the cooling pin in the heat abstractor of second embodiment are radiated.
Reference picture 10a to Figure 11, is consistent the thickness or size and material of the flat board 110 of heat abstractor 100, is making
In the state of interval, material, thickness, height of protrusion of multiple cooling pins 121,122,123,124 etc. are consistent, it can confirm
The Temperature Distribution by heat abstractor in the state of the heating module 170 that heat abstractor 100 sets two high temperature.
That is, in the case where flat board 110 is set to gravity direction, it is being arranged at the heating module 170 of side and opposite side
In produced by the Temperature Distribution that is radiated in cooling pin 121,122,123,124 of heat of high temperature be, in first embodiment
In the case of be about 126 ° or so, be about 124 ° or so in the case of the second embodiment.Now, with by multiple cooling pins
121st, 122,123,124 are radiated, be arranged at side and opposite side heating module 170 temperature first embodiment feelings
Under condition, 109 °~110 ° or so are fallen to approximately, in the case of the second embodiment, 107 °~108 ° or so are fallen to approximately.
Unlike this, when flat board 110 is set to the vertical direction of gravity direction, i.e. in the case of horizontally arranged,
The shape of multiple cooling pins 121,122,123,124 has no big change compared with the situation that flat board 110 is set to gravity direction
Change.Therewith, the Temperature Distribution produced by the heating module 170 of side and opposite side is arranged at is in the case of the first embodiment
Be about 126 ° or so, when being about 124 ° or so in the case of the second embodiment, because by multiple cooling pins 121,122,123,
124 radiating, the temperature of heating module 170 is similar with situation about being set as described above to gravity direction, in first embodiment
In the case of, 108 °~109 ° or so can be fallen to approximately, in the case of the second embodiment, 107 °~108 ° left sides can be fallen to approximately
It is right.
Even if it follows that flat board 110 is set to gravity direction, or is set to the direction vertical with gravity direction, not only
It can make to keep constant by the radiating efficiency of the heating module 170 of heat abstractor 100, but also radiating efficiency can be improved.
Also, the embodiment of the present utility model disclosed in the specification and drawings is only used for illustrating root with being easily understood
According to the technology contents of embodiment of the present utility model, pointed out specific to contribute to the understanding of embodiment of the present utility model
Example, does not limit the scope of embodiment of the present utility model.Scope accordingly, with respect to various embodiment of the present utility model is needed
It is explained that in addition to the embodiment disclosed herein, the technological thought based on various embodiment of the present utility model come
The derived form for having altered or deforming is both contained in the scope of various embodiment of the present utility model.
Claims (10)
1. a kind of heat abstractor, it is characterised in that including：
Radiate flat board；And
Heat dissipation region portion, is arranged at above-mentioned radiating flat board and is provided with multiple cooling pins of mutually different angle.
2. heat abstractor according to claim 1, it is characterised in that above-mentioned heat dissipation region portion and with above-mentioned radiating area
Domain portion is provided with insertion section between adjacent heat dissipation region portion.
3. heat abstractor according to claim 2, it is characterised in that be formed at the multiple above-mentioned scattered of above-mentioned heat dissipation region portion
Multiple above-mentioned cooling pins that are fast-selling and being arranged on the heat dissipation region portion adjacent with above-mentioned heat dissipation region portion using above-mentioned insertion section as
Center has " V " word shape.
4. heat abstractor according to claim 2, it is characterised in that above-mentioned insertion section includes at least two insertion lines, on
Insertion line is stated to intersect or warpage.
5. heat abstractor according to claim 4, it is characterised in that above-mentioned insertion section is in above-mentioned radiating flat board with "+" shape
Shape is intersected to form, above-mentioned heat dissipation region portion centered on above-mentioned insertion line, be divided into the first heat dissipation region, the second heat dissipation region,
3rd heat dissipation region, the 4th heat dissipation region.
6. heat abstractor according to claim 5, it is characterised in that above-mentioned first heat dissipation region, the second heat dissipation region,
Three heat dissipation regions, the first cooling pin of the 4th heat dissipation region, the second cooling pin, the 3rd cooling pin, the 4th cooling pin are inserted with above-mentioned
Enter the mutually different angle with " X " word shape centered on the central portion of line.
7. heat abstractor according to claim 5, it is characterised in that above-mentioned first heat dissipation region, the second heat dissipation region,
Three heat dissipation regions, the first cooling pin of the 4th heat dissipation region, the second cooling pin, the 3rd cooling pin, the 4th cooling pin are inserted with above-mentioned
Enter the mutually different angle with diamond shape centered on the central portion of line.
8. heat abstractor according to claim 4, it is characterised in that above-mentioned insertion section is in above-mentioned radiating flat board with " X " word
Shape is intersected to form, above-mentioned heat dissipation region portion be divided into centered on above-mentioned insertion line the first heat dissipation region, the second heat dissipation region,
3rd heat dissipation region, the 4th heat dissipation region,
Above-mentioned first heat dissipation region, the second heat dissipation region, the 3rd heat dissipation region, the first cooling pin of the 4th heat dissipation region, second
Cooling pin, the 3rd cooling pin, the 4th cooling pin centered on the central portion of above-mentioned insertion line, with "+" word shape mutually not
Same angle.
9. heat abstractor according to claim 1, it is characterised in that in multiple above-mentioned cooling pins, to form sinuous flow
Mode also includes at least one of pleated portions, joggling part, protuberance, opening portion.
10. heat abstractor according to claim 1, it is characterised in that adjacent above-mentioned heat dissipation region portion is with above-mentioned insertion
Set in a symmetrical centered on portion.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0074424 | 2014-06-18 | ||
| KR1020140074424A KR20150145084A (en) | 2014-06-18 | 2014-06-18 | Radiating device |
| PCT/KR2015/006216 WO2015194897A1 (en) | 2014-06-18 | 2015-06-18 | Heat radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206371029U true CN206371029U (en) | 2017-08-01 |
Family
ID=54935805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201590000741.8U Active CN206371029U (en) | 2014-06-18 | 2015-06-18 | Heat abstractor |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20170097196A1 (en) |
| JP (1) | JP6526067B2 (en) |
| KR (1) | KR20150145084A (en) |
| CN (1) | CN206371029U (en) |
| WO (1) | WO2015194897A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019227393A1 (en) * | 2018-05-31 | 2019-12-05 | 深圳市大疆创新科技有限公司 | Heat dissipating system and photographic device |
| CN112352348A (en) * | 2018-04-11 | 2021-02-09 | 株式会社Kmw | Multiple input/output antenna device |
| WO2021036249A1 (en) * | 2019-08-30 | 2021-03-04 | 华为技术有限公司 | Heat dissipation device, electronic apparatus, and automobile |
| CN112602232A (en) * | 2018-05-31 | 2021-04-02 | 株式会社Kmw | Heat sink for antenna device |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015157523A1 (en) * | 2014-04-10 | 2015-10-15 | Advanced Thermal Solutions, Inc. | Multiple flow entrance heat sink |
| CN107105595A (en) * | 2016-02-19 | 2017-08-29 | 恩佐科技股份有限公司 | Low blast demand, low noise, dynamical radiator are reached using radiator arrangement |
| CN106255384B (en) * | 2016-08-22 | 2019-06-04 | 山东久久星新能源车辆科技有限公司 | A kind of radiator and the battery truck using the radiator |
| CN108303837B (en) * | 2017-01-12 | 2020-12-18 | 中强光电股份有限公司 | Projection device, heat dissipation module and heat dissipation fin set |
| CN108105088A (en) * | 2018-01-30 | 2018-06-01 | 重庆大学 | A kind of mixed type whirlpool disk radiator structure of oil-free turbo-compressor |
| JP7021013B2 (en) * | 2018-06-25 | 2022-02-16 | トヨタ自動車株式会社 | Cooler |
| JP7118788B2 (en) * | 2018-07-19 | 2022-08-16 | 株式会社フジクラ | Cold plate and cold plate manufacturing method |
| CN208834080U (en) | 2018-07-23 | 2019-05-07 | 中强光电股份有限公司 | Projection arrangement, radiating module and radiating fin |
| US11011452B2 (en) * | 2018-11-29 | 2021-05-18 | Micron Technology, Inc. | Heat spreaders for semiconductor devices, and associated systems and methods |
| USD971192S1 (en) | 2019-06-03 | 2022-11-29 | Space Exploration Technologies Corp. | Antenna apparatus |
| USD976242S1 (en) | 2019-06-03 | 2023-01-24 | Space Exploration Technologies Corp. | Antenna apparatus |
| USD971900S1 (en) | 2019-06-03 | 2022-12-06 | Space Exploration Technologies Corp. | Antenna apparatus |
| CN112698541A (en) * | 2019-10-22 | 2021-04-23 | 中强光电股份有限公司 | Heat dissipation module and projection device using same |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3313339A (en) * | 1965-03-15 | 1967-04-11 | Wakefield Engineering Company | Heat transfer apparatus |
| US4587595A (en) * | 1983-09-06 | 1986-05-06 | Digital Equipment Corporation | Heat sink arrangement with clip-on portion |
| JPH0888301A (en) * | 1994-09-19 | 1996-04-02 | Mitsubishi Electric Corp | Heat-dissipating fin |
| US5582240A (en) * | 1994-09-19 | 1996-12-10 | Motorola, Inc. | Pneumatically coupled heat sink assembly |
| JP3552559B2 (en) * | 1998-03-11 | 2004-08-11 | 株式会社デンソー | Heating element cooling device |
| JP3076220U (en) * | 2000-09-08 | 2001-03-30 | 奇▲宏▼股▲ふん▼有限公司 | Heat sink structure |
| US6418020B1 (en) * | 2001-03-30 | 2002-07-09 | Advanced Thermal Technologies | Heat dissipation device with ribbed fin plates |
| US7046515B1 (en) * | 2002-06-06 | 2006-05-16 | Raytheon Company | Method and apparatus for cooling a circuit component |
| CN1578614B (en) * | 2003-06-30 | 2010-04-21 | 山洋电气株式会社 | Axial-flow fan unit and heat-emitting element cooling apparatus |
| KR100719702B1 (en) * | 2005-05-25 | 2007-05-17 | 삼성에스디아이 주식회사 | Plasma Display Device |
| US7423877B2 (en) * | 2006-09-01 | 2008-09-09 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| US20080128110A1 (en) * | 2006-11-30 | 2008-06-05 | Foxconn Technology Co., Ltd. | Heat sink assembly having a fan mounting device |
| US20090129019A1 (en) * | 2007-11-15 | 2009-05-21 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with fan holder |
| TWI334531B (en) * | 2007-12-05 | 2010-12-11 | Wistron Corp | Heat sink and electronic apparatus using the same |
| TWM339033U (en) * | 2008-04-16 | 2008-08-21 | Asia Vital Components Co Ltd | Heat sink |
-
2014
- 2014-06-18 KR KR1020140074424A patent/KR20150145084A/en active Application Filing
-
2015
- 2015-06-18 CN CN201590000741.8U patent/CN206371029U/en active Active
- 2015-06-18 JP JP2016574121A patent/JP6526067B2/en active Active
- 2015-06-18 WO PCT/KR2015/006216 patent/WO2015194897A1/en active Application Filing
-
2016
- 2016-12-19 US US15/383,476 patent/US20170097196A1/en not_active Abandoned
Cited By (6)
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|---|---|---|---|---|
| CN112352348A (en) * | 2018-04-11 | 2021-02-09 | 株式会社Kmw | Multiple input/output antenna device |
| WO2019227393A1 (en) * | 2018-05-31 | 2019-12-05 | 深圳市大疆创新科技有限公司 | Heat dissipating system and photographic device |
| CN110785701A (en) * | 2018-05-31 | 2020-02-11 | 深圳市大疆创新科技有限公司 | Heat dissipation system and photographic equipment |
| CN112602232A (en) * | 2018-05-31 | 2021-04-02 | 株式会社Kmw | Heat sink for antenna device |
| WO2021036249A1 (en) * | 2019-08-30 | 2021-03-04 | 华为技术有限公司 | Heat dissipation device, electronic apparatus, and automobile |
| CN115175519A (en) * | 2019-08-30 | 2022-10-11 | 华为技术有限公司 | Radiator, electronic equipment and car |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150145084A (en) | 2015-12-29 |
| JP6526067B2 (en) | 2019-06-05 |
| US20170097196A1 (en) | 2017-04-06 |
| JP2017521861A (en) | 2017-08-03 |
| WO2015194897A1 (en) | 2015-12-23 |
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