US20170097196A1

US20170097196A1 - Heat radiation device

Info

Publication number: US20170097196A1
Application number: US15/383,476
Authority: US
Inventors: Chang-Woo Yoo; Min-Sik Park; So-Hyeon Mun; Hye-Yeon Kim
Original assignee: KMW Inc
Current assignee: KMW Inc
Priority date: 2014-06-18
Filing date: 2016-12-19
Publication date: 2017-04-06
Also published as: JP6526067B2; WO2015194897A1; JP2017521861A; CN206371029U; KR20150145084A

Abstract

Heat radiation devices according to various embodiments of the present invention may comprise: a heating plate; and a heat radiating area portion which is provided in the heating plate and has heat radiation pins having angles different from each other. Also, other various embodiments are possible.

Description

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of an International Application No. PCT/KR2015/006216 filed on Jun. 18, 2015, which claims priority to Korean Patent Application No. 10-2014-0074424 filed on Jun. 18, 2014, the entire disclosures of which are incorporated herein by reference.

TECHNICAL FIELD

The present invention relates to a heat dissipation device and, for example, to a heat dissipation device having heat dissipation fins oriented in different directions.

BACKGROUND ART

Recently, various types of electronic devices have been provided for users. As a variety of functions are integrated in electronic devices, components (hereinafter, referred to as “the heat radiating modules”) to generate high-temperature heat may be provided in the electronic devices.
If the high-temperature heat generated by the heat radiating modules is not effectively released, the heat may affect peripheral components, as well as the corresponding heat radiating modules, to cause malfunctions and damages to the components, and the electronic devices may not be able to perform their functions and in severe cases, may not be able to be used due to the damage to the components.
Accordingly, electronic devices are provided with various types of heat dissipation devices to dissipate heat generated by diverse heat radiating modules.
Since various components mounted in electronic devices include heat radiating modules that generate high-temperature heat, as mentioned above, the need for effective heat dissipation devices is increasing.
FIGS. 1A and 1B illustrate a general heat dissipation device.
Referring to FIGS. 1A and 1B, a heat dissipation plate 11 may be provided on the exterior of an electronic device.
The heat dissipation plate 11 may have heat dissipation fins 12 thereon that are adjacent to each other and extend in one direction.
The plate 11 may be generally made of high-conductive metal, such as aluminum, and the heat dissipation fins 12 may be formed on the plate 11 to protrude in the direction perpendicular to the plate 11.
As described above, the heat dissipation fins 12 on the plate 11 extend in one direction. Accordingly, the heat dissipation fins 12 may efficiently dissipate heat when air flows from one side to an opposite side thereof. For example, in the case of an electronic device that is mounted on the outside, such as an antenna device, the heat dissipation fins 12 formed on the plate 11 in one direction have to be provided on the electronic device so as to be oriented in the direction of the gravitational force to efficiently dissipate heat by natural convection.
However, the heat dissipation fins 12 provided on an electronic device, such as an antenna device, may not be installed in the direction of the gravitational force on account of variables, such as installation place, space, etc. Particularly, the heat dissipation fins 12 may be installed in the direction perpendicular to that of the gravitational force. In this case, heat-dissipation efficiency by means of convection may be degraded since the space between the heat dissipation fins 12 adjacent to each other is blocked by the heat dissipation fins 12.
Since the heat dissipation fins in the related art are formed on the plate in one direction, an electronic device having the heat dissipation fins mounted thereon has to be installed considering the direction of an air flow, and thus has a limitation in the installation thereof.

SUMMARY

The present invention has been made in view of the above-mentioned problems, and an aspect of various embodiments the present invention is to provide a heat dissipation device that can increase the degree of freedom of an air flow irrespective of the direction in which the heat dissipation device is installed.
Another aspect of various embodiments of the present invention is to provide a heat dissipation device that has no limitation in the installation position thereof and can maintain the heat dissipation efficiency thereof at a uniform level irrespective of the direction in which the heat dissipation device is installed.
A heat dissipation device, according to one of various embodiments of the present invention, may include: a heat dissipation plate; and heat dissipation areas provided on the heat dissipation plate, wherein heat dissipation fins having different angles are provided in the heat dissipation areas.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B illustrate a general heat dissipation device;

FIG. 2 is a perspective view of a heat dissipation device according to a first embodiment of the present invention;

FIG. 3 is a plan view of the heat dissipation device according to the first embodiment of the present invention;

FIG. 4 is a perspective view of a heat dissipation device according to a second embodiment of the present invention;

FIG. 5 is a plan view of the heat dissipation device according to the second embodiment of the present invention;

FIG. 6 is a perspective view of a heat dissipation device according to a third embodiment of the present invention;

FIG. 7 is a plan view of the heat dissipation device according to the third embodiment of the present invention;

FIGS. 8A to 8D illustrate various shapes of heat dissipation fins in a heat dissipation device according to one of various embodiments of the present invention;

FIGS. 9A to 9E illustrate various shapes of inset portions in a heat dissipation device according to one of various embodiments of the present invention;

FIGS. 10A and 10B illustrate temperature distributions in the heat dissipation devices, according to the first and third embodiments of the present invention, which are caused by heat released from heat radiating modules; and

FIG. 11 illustrates temperature distribution data by means of the heat dissipation fins in the heat dissipation devices according to the first and third embodiments of the present invention.

DETAILED DESCRIPTION

Hereinafter, various embodiments of the present invention will be described more fully in conjunction with the accompanying drawings. The present invention may have various embodiments, and modifications and changes may be made therein. Therefore, the present invention will be described in detail with reference to particular embodiments shown in the accompanying drawings. However, it should be understood that there is no intent to limit various embodiments of the present invention to the particular embodiments disclosed herein, but the present invention should be construed to cover all modifications, equivalents, and/or alternatives falling within the spirit and scope of the various embodiments of the present invention. In connection with descriptions of the drawings, like reference numerals designate like elements.
As used in various embodiments of the present invention, the expressions “include”, “may include”, and other conjugates refer to the existence of a corresponding disclosed function, operation, or constituent element, and do not limit one or more additional functions, operations, or constituent elements. Further, as used in various embodiments of the present invention, the terms “include”, “have”, and their conjugates are intended merely to denote a certain feature, numeral, step, operation, element, component, or a combination thereof, and should not be construed to initially exclude the existence of or a possibility of the addition of one or more other features, numerals, steps, operations, elements, components, or combinations thereof.
Further, as used in various embodiments of the present invention, the expression “or” includes any or all combinations of words enumerated together. For example, the expression “A or B” may include A, may include B, or may include both A and B.
While expressions including ordinal numbers, such as “first” and “second”, as used in various embodiments of the present invention may modify various constituent elements, such constituent elements are not limited by the above expressions. For example, the above expressions do not limit the sequence and/or importance of the elements. The above-described expressions may be used to distinguish an element from another element. For example, a first user device and a second user device indicate different user devices although both of them are user devices. For example, a first element may be termed a second element, and likewise a second element may also be termed a first element without departing from the scope of various embodiments of the present invention.
It should be noted that if it is described that one component element is “coupled” or “connected” to another component element, the first component element may be directly coupled or connected to the second component, and a third component element may be “coupled” or “connected” between the first and second component elements. Conversely, when one component element is “directly coupled” or “directly connected” to another component element, it may be construed that a third component element does not exist between the first component element and the second component element.
The terms as used in various embodiments of the present invention are merely for the purpose of describing particular embodiments and are not intended to limit the various embodiments of the present invention. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Unless defined otherwise, all terms used herein, including technical terms and scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which various embodiments of the present invention pertain. Such terms as those defined in a generally used dictionary are to be interpreted to have the meanings equal to the contextual meanings in the relevant field of art, and are not to be interpreted to have ideal or excessively formal meanings unless clearly defined in various embodiments of the present invention.
An electronic device, according to various embodiments of the present invention, may include any device that has a heat dissipation device to dissipate heat released from a heat radiating module mounted therein.
For example, the electronic device may include an antenna device, a lighting device, etc.
In addition, without being limited thereto, the electronic device may be a communication device (for example, a tablet personal computer (PC), a mobile phone, a desktop PC, a laptop PC, a netbook computer, a personal digital assistant (PDA), a portable multimedia player (PMP), etc.), a smart home appliance (for example, a television, a digital video disk (DVD) player, an audio, a refrigerator, an air-conditioner, a vacuum cleaner, an oven, a microwave oven, a washing machine, an air-cleaner, a set-top box, a TV box (for example, Samsung HomeSync™, Apple TV™, or Google TV™), a game console, an electronic dictionary, an electronic key, a camcorder, an electronic picture frame, etc.), a projector, various types of measuring instruments (for example, a water, electricity, gas, or electric-wave meter), or a combination of one or more thereof.
Hereinafter, heat dissipation devices, according to various embodiments, will be described with reference to the accompanying FIGS. 2 to 11. While three embodiments of the heat dissipation devices, according to various embodiments of the present invention, will be representatively described below, the present invention is not limited thereto. Namely, the number of heat dissipation areas, which will be described below, or the angles of heat dissipation fins provided in different heat dissipation areas may be changed or modified without any specific limitation according to various factors, such as the position of a heat radiating module within the electronic device on which the heat dissipation device is mounted and the mounting environment, space, and angle of the electronic device.
A heat dissipation device, according to one of various embodiments of the present invention, may include: a heat dissipation plate; and heat dissipation areas provided on the heat dissipation plate, wherein heat dissipation fins having different angles are provided in the heat dissipation areas.
In the heat dissipation device, according to the embodiment of the present invention, an inset portion may be provided between the heat dissipation areas adjacent to each other.
In the heat dissipation device, according to the embodiment of the present invention, the heat dissipation fins formed in the heat dissipation areas adjacent to each other may be provided to form the shape of “V” with respect to the inset portion.
In the heat dissipation device, according to the embodiment of the present invention, the inset portion may include at least two inset lines that are formed to cross each other or to be bent.
In the heat dissipation device, according to the embodiment of the present invention, the inset lines of the inset portion may be formed on the heat dissipation plate to cross each other in the shape of “+”, and the heat dissipation areas may include first to fourth heat dissipation areas divided from each other with respect to the inset lines.
In the heat dissipation device, according to the embodiment of the present invention, first to fourth heat dissipation fins in the first to fourth heat dissipation areas may have different angles to form the shape of “X” with respect to the central portion of the inset lines.
In the heat dissipation device, according to the embodiment of the present invention, first to fourth heat dissipation fins in the first to fourth heat dissipation areas may have different angles to form a rhombic shape with the central portion of the inset lines as the center thereof.
In the heat dissipation device, according to the embodiment of the present invention, the inset lines of the inset portion may cross each other in the shape of “X” on the heat dissipation plate, the heat dissipation areas may include first to fourth heat dissipation areas divided from each other with respect to the inset lines, and first to fourth heat dissipation fins in the first to fourth heat dissipation areas may have different angles to form the shape of “+” with respect to the central portion of the inset lines.
In the heat dissipation device, according to the embodiment of the present invention, each of the heat dissipation fins may include at least one of a corrugated portion, a groove, a protrusion, and an opening to form a turbulent flow.
In the heat dissipation device, according to the embodiment of the present invention, the heat dissipation areas adjacent to each other may be provided in a symmetric structure with respect to the inset portion.
FIG. 2 is a perspective view of a heat dissipation device according to a first embodiment of the present invention. FIG. 3 is a plan view of the heat dissipation device according to the first embodiment of the present invention. FIG. 4 is a perspective view of a heat dissipation device according to a second embodiment of the present invention. FIG. 5 is a plan view of the heat dissipation device according to the second embodiment of the present invention. FIG. 6 is a perspective view of a heat dissipation device according to a third embodiment of the present invention. FIG. 7 is a plan view of the heat dissipation device according to the third embodiment of the present invention. FIGS. 8A to 8D illustrate various shapes of heat dissipation fins in a heat dissipation device according to one of various embodiments of the present invention. FIGS. 9A to 9E illustrate various shapes of inset portions in a heat dissipation device according to one of various embodiments of the present invention.
Referring to FIGS. 2 to 9, a heat dissipation device 100, according to one of various embodiments of the present invention, may include a heat dissipation plate 110 (hereinafter, referred to as “the plate 110”) and heat dissipation fins 121, 122, 123, and 124, and the plate 110 may be divided into one or more heat dissipation areas 131, 132, 133, and 134 by inset portions 140.
The plate 110 is provided in the position of a heat radiating module 170 of an electronic device (for example, an antenna device or a lighting device) that radiates heat. The plate 110 may be formed of a material having a high thermal conductivity, such as copper, aluminum, or the like, to receive heat radiating from the heat radiating module 170 (refer to FIG. 8). While copper or aluminum exemplifies the material of the plate 110 in one embodiment of the present invention, the plate 110 is not limited thereto, and any material having a suitable thermal conductivity may be used for the plate 110 without any specific limitation in consideration of the environment in which the electronic device is used, a space, a design, an external environment, etc.
Furthermore, the plate 110, according to one embodiment of the present invention, may have a square or rectangular shape. In various embodiments to be described below, it will be exemplified that the plate 110 is formed in a square shape. However, the shape of the plate 110 is not limited thereto. The shape of the plate 110 may be changed or modified without any specific limitation. For example, the plate 110 may have the shape of a rotated square or rectangle according to the installation angle of an electronic device provided with the plate 110 or the angle by which the plate 110 is mounted on the electronic device, or may have a circular or polygonal shape.
The heat dissipation fins 121, 122, 123, and 124 vertically protrude from the plate 110 with a predetermined interval therebetween. These heat dissipation fins 121, 122, 123, 124 may be provided on the plate 110 so as to be inclined at predetermined angles. The heat dissipation fins 121, 122, 123, and 124, according to one embodiment of the present invention, may be provided adjacent to each other in the one or more heat dissipation areas 131, 132, 133, and 134 on the plate 110 while being inclined at the predetermined angles on the plate 110.
It will be exemplified that the heat dissipation fins 121, 122, 123, and 124, according to various embodiments of the present invention, vertically protrude from the plate 110. However, the heat dissipation fins may protrude so as to be inclined at a predetermined angle relative to the plate. This may be changed without any specific limitation according to a process in which the heat dissipation fins are assembled to the plate, and the inclination angle may be varied without any specific limitation according to an external environment in which the heat dissipation device is installed.
Specifically, the plate 110 may have the one or more heat dissipation areas 131, 132, 133, and 134 formed thereon in which the heat dissipation fins 121, 122, 123, and 124 protrude from the plate 110 in parallel to each other in the same direction. It will be exemplified that the heat dissipation areas 131, 132, 133, and 134 are located in a symmetric arrangement on the plate 110. However, the heat dissipation areas 131, 132, 133, and 134 may be formed in an asymmetric structure according to the positions of the inset portions 140, which will be described below, or the position of the heat radiating module 170. Furthermore, the heat dissipation areas 131, 132, 133, and 134 may also be formed adjacent to each other on the plate in one direction, and may also be formed in the direction of the gravitational force and in the direction perpendicular to that of the gravitational force.
It will be exemplified that heat dissipation areas, including the first to fourth heat dissipation areas 131 to 134, according to various embodiments of the present invention, may be divided from each other in a symmetric structure with respect to the inset portions 140 that cross each other. However, the heat dissipation areas 131, 132, 133, and 134 may be changed or modified without any specific limitation in consideration of the size of the plate 110 or the position of the heat radiating module. For example, one heat dissipation area 131, 132, 133, or 134 or two or more heat dissipation areas may be provided.
The inset portions 140 may be provided between the adjacent heat dissipation areas 131, 132, 133, and 134. Specifically, the heat dissipation areas 131, 132, 133, and 134 may be located adjacent to each other with respect to the inset portions 140. Air introduced into the inset portions 140 through the heat dissipation fins 121, 122, 123, and 124, which are inclined at different angles, may become turbulent to generate energy, thereby resulting in an air flow. Accordingly, air can more actively flow so that the air can efficiently run between the heat dissipation fins 121, 122, 123, and 123 to increase heat dissipation efficiency.
As described above, the adjacent heat dissipation areas 131, 132, 133, and 134, according to one of various embodiments of the present invention, may be divided from each other in a symmetric or asymmetric structure with respect to the inset portions 140. It will be exemplified that the heat dissipation areas 131, 132, 133, and 134 are divided from each other in a symmetric structure with respect to the inset portions 140 in the heat dissipation device 100, which will be described below, according to various embodiments of the present invention. However, the positions of the inset portions 140 may be changed or modified without any specific limitation according to the position of the heat radiating module 170. For example, the heat dissipation areas 131, 132, 133, and 134 may be formed asymmetric to each other to have different sizes. Accordingly, it will be apparent that the heat dissipation areas 131, 132, 133, and 134 may be formed in an asymmetric structure.
The heat dissipation fins 121, 122, 123, or 124 formed in the heat dissipation area 131, 132, 133, or 134 and the heat dissipation fins 121, 122, 123, or 124 provided in the adjacent heat dissipation area 131, 132, 133, or 134 may have different angles and, specifically, may form the shape of “{hacek over ( )}” or an inverted shape (conical shape) with respect to the inset portions 140. For example, in a case where one inset portion 140 is provided, heat dissipation fins 121, 122, 123, or 124 formed in one heat dissipation area 131, 132, 133, or 134 and heat dissipation fins 121, 122, 123, or 124 in the other adjacent heat dissipation area 131, 132, 133, or 134 may have different angles to form the shape of “{hacek over ( )}” or the shape of “̂”, which is an inverted shape, with respect to the inset portions 140. Alternatively, in a case where two inset portions 140 are provided parallel to each other, heat dissipation areas 131, 132, 133, and 134 may include a central heat dissipation area 131, 132, 133, or 134 and left and right heat dissipation areas 131, 132, 133, and 134 on the left and right sides of the central heat dissipation area. In this case, heat dissipation fins 121, 122, 123, and 124 formed in the heat dissipation areas 131, 132, 133, and 134 from one side to an opposite side thereof may have different angles to form a shape having one crest and one root or a shape having one root and one crest. The heat dissipation fins 121, 122, 123, and 124 formed on the plate 110 may have an angle of 20° to 80° with respect to the inset portions 140. It will be exemplified that the heat dissipation fins 121, 122, 123, and 124 in the present invention has an angle of 45° with respect to the inset portions 140. However, the angle of the heat dissipation fins 121, 122, 123, and 124 is not limited thereto. Furthermore, the heat dissipation fins 121, 122, 123, and 124 formed in the respective heat dissipation areas 131, 132, 133, and 134 may have predetermined angles so as to be formed in a symmetric structure with respect to the inset portions 140. For example, referring to FIG. 2, the first heat dissipation fins 121 in the first heat dissipation area 131 may be formed on the upper side of the horizontal inset portion 140 so as to be inclined at an angle of 45° with respect to the same in the counterclockwise direction, and the second heat dissipation fins 122 in the second heat dissipation area 132 may be formed on the upper side of the horizontal inset portion 140 so as to be inclined at an angle of 45° with respect to the same in the clockwise direction. The third heat dissipation fins 123 in the third heat dissipation area 133 may be formed on the lower side of the horizontal inset portion 140 so as to be inclined at an angle of 45° with respect to the same in the counterclockwise direction, and the fourth heat dissipation fins 124 in the fourth heat dissipation area 134 may be formed on the lower side of the horizontal inset portion 140 so as to be inclined at an angle of 45° with respect to the same in the clockwise direction. However, the heat dissipation fins 121, 122, 123, and 124 in the respective heat dissipation areas 131, 132, 133, and 134 may not be necessarily formed in a symmetric structure. For example, the heat dissipation fins 121, 122, 123, and 124 may be formed similar to those in the examples mentioned above. Namely, the heat dissipation fins 121, 122, 123, and 124 formed in the respective heat dissipation areas 131, 132, 133, and 134 may have different angles.
Referring to FIGS. 8A to 8D, the heat dissipation fins 121, 122, 123, and 124, according to one embodiment of the present invention, may have separate structures formed on the surfaces thereof to enable air introduced between the heat dissipation fins 121, 122, 123, and 124 to become turbulent. For example, as illustrated in FIG. 8A, each of the heat dissipation fins 121, 122, 123, and 124 may have a corrugated portion 126 formed in a predetermined position thereof, which has a plurality of folds. Further, each of the heat dissipation fins 121, 122, 123, and 124 may have grooves 127 formed in predetermined positions thereof, which differ from the corrugated portion 126. Furthermore, each of the heat dissipation fins 121, 122, 123, and 124 may have separate protrusions 128 formed in predetermined positions thereof, which differ from the corrugated portion 126 or the grooves 127. Moreover, each of the heat dissipation fins 121, 122, 123, and 124 may have a plurality of openings 129 (such as holes or recesses) formed in predetermined positions thereof, which differ from the corrugated portion 126, the grooves 127, and the protrusions 128 mentioned above. Also, a combination of one or more of the corrugated portion 126, the grooves 127, the protrusions 128, and the openings 129 mentioned above may be formed on each of the heat dissipation fins 121, 122, 123, and 124.
Referring to FIGS. 9A to 9E, it will be exemplified that the inset portion 140, according to various embodiments of the present invention, has at least two inset lines crossing each other, or an inset line that is bent. For example, as illustrated in FIGS. 9A and 9B, two inset lines may be formed on the plate 110 to cross each other in the shape of “+” or “X”, and as illustrated in FIGS. 9C and 9D, an inset line may be bent in the shape of “T” or “┐” Alternatively, as illustrated in FIG. 9E, two or more inset lines may be formed parallel to each other, and parallel inset lines and an inset line crossing the same may be combined. As described above, the inset portion 140 may be changed or modified without any specific limitation in consideration of the position of the heat radiating module 170 or heat dissipation efficiency.
As described above, the heat dissipation areas 131, 132, 133, and 134 and the inset portions 140 may be changed or modified without any specific limitation according to the position of the heat radiating module 170.
In addition, the directions and angles of the adjacent heat dissipation fins 121, 122, 123, and 124 may be set according to the structures of the heat dissipation areas 131, 132, 133, and 134 and the inset portions 140.
Hereinafter, the heat dissipation device 100, according to the first embodiment of the present invention, will be described with reference to FIGS. 2 and 3.
Referring to FIGS. 2 and 3, the heat dissipation device 100, according to the first embodiment, may include inset portions 140 crossing each other and four heat dissipation areas 131, 132, 133, and 134 divided from each other with respect to the inset portions 140. Specifically, the heat dissipation device 100 may include: the inset portions 140 formed on a square plate 110 in a horizontal direction and in the direction perpendicular to the horizontal direction to cross each other in the shape of “+”; and the first to fourth heat dissipation areas 131, 132, 133, and 134 divided from each other with respect to the inset portions 140. In the present invention, based on FIG. 3, the upper left heat dissipation area may be referred to as the first heat dissipation area 131, the upper right heat dissipation area in the clockwise direction may be referred to as the second heat dissipation area 132, the lower right heat dissipation area may be referred to as the third heat dissipation area 133, and the lower left heat dissipation area may be referred to as the fourth heat dissipation area 134. This is only for the convenience of description, and the first to fourth heat dissipation areas 131, 132, 133, and 134 may be changed without any specific limitation.
The first heat dissipation area 131 may be provided adjacent to the second and fourth heat dissipation areas 132 and 134 with respect to the inset portions 140 crossing each other. Furthermore, the second heat dissipation area 132 may be provided adjacent to the first and third heat dissipation areas 131 and 133 with respect to the inset portions 140 crossing each other. Moreover, the third heat dissipation area 133 may be provided adjacent to the second and fourth heat dissipation areas 132 and 134. Also, the fourth heat dissipation area 134 may be provided adjacent to the first and third heat dissipation areas 131 and 133.
First to fourth heat dissipation fins 121, 122, 123, and 124 having different angles may be provided in the first to fourth heat dissipation areas 131, 132, 133, and 134. Furthermore, the first to fourth heat dissipation fins 121, 122, 123, and 124 formed in the first to fourth heat dissipation areas 131, 132, 133, and 134 may be provided to have the same shape irrespective of whether the plate 110 is located in the direction of the gravitational force or in the direction perpendicular to that of the gravitational force.
In addition, among the first to fourth heat dissipation fins 121, 122, 123, and 124, according to the first embodiment of the present invention, the adjacent heat dissipation fins may have different angles to form a root shape (“{hacek over ( )}”) together. Accordingly, the first to fourth heat dissipation fins 121, 122, 123, and 124 adjacent to each other may different angles to form the shape of “X” together with respect to the central portion of the inset lines.
Specifically, the first heat dissipation area 131 is adjacent to the second and fourth heat dissipation areas 132 and 134. The first heat dissipation fins 121 formed in the first heat dissipation area 131 may have an angle different from those of the second and fourth heat dissipation fins 122 and 124 formed in the second and fourth heat dissipation areas 132 and 134. Accordingly, the first heat dissipation fins 121 and the second heat dissipation fins 122 may have different angles to form the shape of “{hacek over ( )}” with respect to the center of the inset portions 140, and the first heat dissipation fins 121 and the fourth heat dissipation fins 124 may have different angles to form the shape of “{hacek over ( )}” with respect to the center of the inset portions 140. Likewise, the second heat dissipation area 132 is adjacent to the first and third heat dissipation areas 131 and 133, and the second heat dissipation fins 122 formed in the second heat dissipation area 132 may have an angle different from those of the first and third heat dissipation fins 121 and 123 formed in the first and third heat dissipation areas 131 and 133.
Accordingly, the first heat dissipation fins 121 and the second heat dissipation fins 122 may have different angles to form the shape of “{hacek over ( )}” as described above, and the second heat dissipation fins 122 and the third heat dissipation fins 123 may have different angles to form the shape of “{hacek over ( )}” with respect to the center of the inset portions 140. Likewise, the third heat dissipation area 133 is adjacent to the second and fourth heat dissipation areas 132 and 134, and the third heat dissipation fins 123 formed in the third heat dissipation area 133 may have an angle different from those of the second and fourth heat dissipation fins 122 and 124. Accordingly, the second heat dissipation fins 122 and the third heat dissipation fins 123 may have different angles to form the shape of “{hacek over ( )}” as described above, and the third heat dissipation fins 123 and the fourth heat dissipation fins 124 may have different angles to form the shape of “{hacek over ( )}” with respect to the inset portions 140. In addition, the fourth heat dissipation area 134 is adjacent to the first and third heat dissipation areas 131 and 133, and the fourth heat dissipation fins 124 formed in the fourth heat dissipation area 134 may have an angle different from those of the first and third heat dissipation fins 121 and 123. Accordingly, the third heat dissipation fins 123 and the fourth heat dissipation fins 124 may have different angles to form the shape of “{hacek over ( )}” with respect to the inset portions 140 as described above, and the first heat dissipation fins 121 and the fourth heat dissipation fins 124 may have different angles to form the shape of “{hacek over ( )}” with respect to the inset portions 140.
Accordingly, the first heat dissipation fins 121 in the first heat dissipation area 131 and the third heat dissipation fins 123 in the third heat dissipation area 133, according to the first embodiment of the present invention, may have the same angle, and the second heat dissipation fins 122 in the second heat dissipation area 132 and the fourth heat dissipation fins 124 in the fourth heat dissipation area 134 may have the same angle. As a result, the first to fourth heat dissipation fins 121, 122, 123, and 124 in the first to fourth heat dissipation areas 131, 132, 133, and 134, according to the first embodiment of the present invention, may have different angles to form the shape of “X” with respect to the central portion of the inset lines.
As described above, when the plate 110 is located in the direction of the gravitational force, the first to fourth heat dissipation fins 121, 122, 123, and 124 may have different angles to form the shape of “X” with respect to the inset portions 140 that cross each other in the shape of “+.” Even though the plate 110 is located in the direction perpendicular to that of the gravitational force by rotation, the inset portions 140 may cross each other in the shape of “+,” and the first to fourth heat dissipation fins 121, 122, 123, and 124 may have different angles to form the shape of “X” with respect to the inset portions 140. Accordingly, the shape of the heat dissipation fins 121, 122, 123, and 124 can always be uniformly maintained irrespective of whether an electronic device having the heat dissipation device 100 is installed in the direction of the gravitational force, or in the direction perpendicular to that of the gravitational force, according to an installation environment.
As a result, heat dissipation efficiency can be maintained at a uniform level irrespective of whether the heat dissipation device 100 is installed in the direction of the gravitational force or in the direction perpendicular to that of the gravitational force.
Hereinafter, the heat dissipation device 100, according to the second embodiment, will be described with reference to FIGS. 4 and 5.
The heat dissipation device 100 according to the second embodiment of the present invention differs from the heat dissipation device 100 according to the first embodiment described above in terms of the angles of first to fourth heat dissipation fins 121, 122, 123, and 124 formed in first to fourth heat dissipation areas 131, 132, 133, and 134. Accordingly, in describing the second embodiment of the present invention, the preceding embodiment may be applied to contents or configurations identical with those described above. Furthermore, the following description will be focused on a difference therebetween while the preceding embodiment is applied to contents identical with those described above.
Referring to FIGS. 4 and 5, the heat dissipation device 100, according to the second embodiment, may include inset portions 140 crossing each other in the shape of “+” on a plate 110 and the first to fourth heat dissipation areas 131, 132, 133, and 134 divided from each other with respect to the inset portions 140. The first to fourth heat dissipation fins 121, 122, 123, and 124 having different angles may be formed in the first to fourth heat dissipation areas 131, 132, 133, and 134.
In particular, among the first to fourth heat dissipation fins 121, 122, 123, and 124, according to the second embodiment of the present invention, the adjacent heating dissipation fins may have different angles to form a crest shape (“̂”) together. Accordingly, the first to fourth heat dissipation fins 121, 122, 123, and 124 in the heat dissipation areas 131, 132, 133, and 134 adjacent to each other may have different angles to form a rhombic shape with the central portion of the inset lines as the center thereof.
The heat dissipation device 100, according to the second embodiment, can also identically maintain the directions of the heat dissipation fins 121, 122, 123, and 124 formed in the respective heat dissipation areas irrespective of whether the plate 110 is located in the direction of the gravitational force or in the direction perpendicular to that of the gravitational force.
As a result, heat dissipation efficiency can be maintained at a uniform level irrespective of whether the heat dissipation device 100 is installed in the direction of the gravitational force or in the direction perpendicular to that of the gravitational force.
Hereinafter, the heat dissipation device 100, according to the third embodiment, will be described with reference to FIGS. 6 and 7.
The heat dissipation device 100 according to the third embodiment of the present invention differs from the heat dissipation device 100 according to the first or second embodiment described above in terms of the shape in which a plate 110 is installed, the shape in which inset portions cross each other, and the angles by which first to fourth heat dissipation fins 121, 122, 123, and 124 are formed in first to fourth heat dissipation areas 131, 132, 133, and 134.
Referring to FIGS. 6 and 7, in the heat dissipation device 100, according to the third embodiment of the present invention, the inset portions 140 may be formed on the square plate 110 to connect corners of the square plate and to cross each other. Namely, the inset portions 140 formed of two inset lines may be formed on the plate 110 to cross each other in the shape of “X.”
The plate 110 may be divided into the first to fourth heat dissipation areas 131, 132, 133, and 134 with respect to the central portion of the inset lines. Among the heat dissipation areas 131, 132, 133, and 134, according to the third embodiment of the present invention, the heat dissipation area in the uppermost position of the plate 110 may be referred to as the first heat dissipation area 131, and the remaining heat dissipation areas may be referred to as the second to fourth heat dissipation areas 132, 133, and 134 in the clockwise direction with respect to the first heat dissipation area 131. This is only for the convenience of description, and the positions of the first to fourth heat dissipation areas 131, 132, 133, and 134 may be changed without any specific limitation.
Accordingly, among the first to fourth heat dissipation fins 121, 122, 123, and 124, according to the third embodiment of the present invention, the adjacent heating dissipation fins may have different angles. In particular, in the third embodiment of the present invention, the first and third heat dissipation fins 121 and 123 may be formed in the direction of the gravitational force, and the second and fourth heat dissipation fins 122 and 124 may be formed in the direction perpendicular to that of the gravitational force. Accordingly, the inset portions 140, according to the third embodiment, may be formed in the shape of “X,” and the first to fourth heat dissipation fins 121, 122, 123, and 124 may have different angles to form the shape of “+” with the central portion of the inset lines as the center thereof.
The heat dissipation device 100, according to the third embodiment, can also identically maintain the directions of the heat dissipation fins 121, 122, 123, and 124 formed in the respective heat dissipation areas irrespective of whether the plate 110 is located in the direction of the gravitational force or in a direction perpendicular to that of the gravitational force.
As a result, heat dissipation efficiency can be maintained at a uniform level irrespective of whether the heat dissipation device 100 is installed in the direction of the gravitational force or in a direction perpendicular to that of the gravitational force.
Hereinafter, data obtained by a simulation of heat dissipation efficiency of the heat dissipation devices, according to the first and third embodiments of the present invention, will be described in brief.
FIGS. 10A and 10B illustrate temperature distributions in the heat dissipation devices, according to the first and third embodiments of the present invention, which are caused by heat released from heat radiating modules. FIG. 11 illustrates temperature distribution data by means of the heat dissipation fins in the heat dissipation devices according to the first and third embodiments of the present invention.
Referring to FIGS. 10A, 10B, and 11, temperature distributions in the heat dissipation devices may be identified in a state in which the plates 110 of the heat dissipation devices 100 have the same thickness, size, and material, the heat dissipation fins 121, 122, 123, and 124 have the same interval, material, thickness, and protruding height, and two high-temperature heat radiating modules 170 are provided on each of the heat dissipation devices 100.
In a case where the plates 110 are installed in the direction of the gravitational force, when high-temperature heat released from the heat radiating modules 170, which are provided on one side and on an opposite side of each heat dissipation device, is dissipated through the heat dissipation fins 121, 122, 123, and 124, the temperature is about 126° in the case of the first embodiment and about 124° in the case of the second embodiment. In this case, since the heat is dissipated by the heat dissipation fins 121, 122, 123, and 124, the temperatures of the heat radiating modules 170, which are provided on one side and on the opposite side of each heat dissipation device, may decrease to about 109° to about 110° in the case of the first embodiment and may decrease to about 107° to about 108° in the case of the second embodiment.
In a case where the plates 110 are installed in the direction perpendicular to that of the gravitational force (that is, in the horizontal direction), the shapes of the heat dissipation fins 121, 122, 123, and 124 are not significantly different from those in the case where the plates 110 are installed in the direction of the gravitational force. Accordingly, when the temperatures of heat released from the heat radiating modules 170, which are provided on one side and on the opposite side of each heat dissipation device, are about 126° in the case of the first embodiment and about 124° in the case of the second embodiment, the temperatures of the heat radiating module 170 may decrease to about 108° to about 109° in the case of the first embodiment and may decrease to about 107° to about 108° in the case of the second embodiment due to the heat dissipation of the heat dissipation fins 121, 122, 123, and 124, similarly to those when the plates are installed in the direction of the gravitational force.
Accordingly, it can be seen that the heat dissipation efficiency of the heat dissipation devices 100 that dissipate the heat released from the heat radiating modules 170 can be maintained at a uniform level or can be enhanced irrespective of whether the plates 110 are installed in the direction of the gravitational force or in the direction perpendicular to that of the gravitational force.
The heat dissipation device, according to the various embodiments of the present invention, can increase the degree of freedom of an air flow irrespective of the direction in which the heat dissipation device is mounted on an electronic device or the direction in which the electronic device having the heat dissipation device mounted thereon is installed.
In addition, the heat dissipation device, according to the various embodiments of the present invention, has no limitation in the position where the heat dissipation device is installed, and can maintain the heat dissipation efficiency thereof at a uniform level irrespective of the direction in which the heat dissipation device is installed.
Various embodiments of the present invention disclosed in this specification and the drawings are merely specific examples presented in order to easily describe technical details of the present invention and to help the understanding of the present invention, and are not intended to limit the scope of the present invention. Therefore, it should be construed that, in addition to the embodiments disclosed herein, all modifications and changes or modified and changed forms derived from the technical idea of various embodiments of the present invention fall within the scope of the present invention.

Claims

1. A heat dissipation device comprising:

a heat dissipation plate; and

heat dissipation areas provided on the heat dissipation plate, wherein heat dissipation fins having different angles are provided in the heat dissipation areas.

2. The heat dissipation device as claimed in claim 1, wherein an inset portion is provided between the heat dissipation areas adjacent to each other.

3. The heat dissipation device as claimed in claim 2, wherein the heat dissipation fins formed in the heat dissipation areas adjacent to each other are provided to form the shape of “V” with respect to the inset portion.

4. The heat dissipation device as claimed in claim 2, wherein the inset portion comprises at least two inset lines that are formed to cross each other or to be bent.

5. The heat dissipation device as claimed in claim 4, wherein the inset lines of the inset portion are formed on the heat dissipation plate to cross each other in the shape of “+,” and the heat dissipation areas comprise first to fourth heat dissipation areas divided from each other with respect to the inset lines.

6. The heat dissipation device as claimed in claim 5, wherein first to fourth heat dissipation fins in the first to fourth heat dissipation areas have different angles to form the shape of “X” with respect to the central portion of the inset lines.

7. The heat dissipation device as claimed in claim 5, wherein first to fourth heat dissipation fins in the first to fourth heat dissipation areas have different angles to form a rhombic shape with the central portion of the inset lines as the center thereof.

8. The heat dissipation device as claimed in claim 4, wherein the inset lines of the inset portion cross each other in the shape of “X” on the heat dissipation plate, the heat dissipation areas comprise first to fourth heat dissipation areas divided from each other with respect to the inset lines, and first to fourth heat dissipation fins in the first to fourth heat dissipation areas have different angles to form the shape of “+” with respect to the central portion of the inset lines.

9. The heat dissipation device as claimed in claim 1, wherein each of the heat dissipation fins comprises at least one of a corrugated portion, a groove, a protrusion, and an opening to form a turbulent flow.

10. The heat dissipation device as claimed in claim 1, wherein the heat dissipation areas adjacent to each other are provided in a symmetric structure with respect to the inset portion.