WO2015194897A1 - Heat radiation device - Google Patents

Abstract

Heat radiation devices according to various embodiments of the present invention may comprise: a heating plate; and a heat radiating area portion which is provided in the heating plate and has heat radiation pins having angles different from each other. Also, other various embodiments are possible.

Description

Heat dissipation

The present invention relates to a heat dissipation device, for example, to a heat dissipation device having heat dissipation fins in different directions.

Recently, various electronic devices have been provided to users, and components that generate high temperature heat (hereinafter, referred to as a 'heating module') among the components provided inside the electronic device due to the integration of functions in the electronic devices will be provided. Can be.

Failure to smoothly dissipate the high temperature heat generated by these heat generating modules can affect not only the heat generating module but also peripheral components, which can cause not only malfunction of parts but also damage, etc. In addition, in severe cases, breakage of components can render electronics unusable.

Accordingly, electronic devices are provided with various types of heat generating devices to dissipate heat generated from various heat generating modules.

As described above, as the heat generating module generating high temperature heat is mounted among various components mounted in the electronic device, the need for an efficient heat dissipation device is increasing.

1A and 1B are views illustrating a general heat dissipation device.

1A and 1B, a heat dissipation plate 11 may be provided on an outer surface of the electronic device.

The heat dissipation plate 11 may have the heat dissipation fins 12 adjacent to each other on the plate 11 long in one direction.

The plate 11 may be generally made of a metal material having excellent thermal conductivity such as aluminum, and the heat radiating fins 12 may be formed to protrude in a direction perpendicular to the plate 11.

As mentioned above, the heat dissipation fin 12 is a component that is formed long in one direction on the plate 11. Thus, the air flow direction should be in one direction from the other side can be efficiently radiated. For example, in the case of an electronic device mounted externally, such as an antenna device, the heat dissipation fins 12 formed in one direction on the plate 11 should be provided to the electronic device so as to be installed in the direction of gravity, thereby providing efficient heat dissipation using natural convection. You can do it.

However, in an electronic device such as an antenna device, a heat radiation fin 12 provided in the electronic device may not be installed in a gravity direction depending on a variable such as a place or a space to be installed. In particular, the heat dissipation fin 12 may be provided in the vertical direction of the gravity direction. In this case, the heat dissipation fin 12 and the adjacent heat dissipation fin 12 are blocked by the respective heat dissipation fins 12, and the heat dissipation efficiency due to convection is inevitably reduced.

Accordingly, since the conventional heat dissipation fin is formed to have one direction on the plate, the electronic device on which the heat dissipation fin is mounted should be installed in consideration of the air flow direction, thereby causing limitations in installation.

Various embodiments of the present invention to provide a heat dissipation device that can increase the degree of freedom of air flow even if the heat dissipation device is installed in any direction.

In addition, various embodiments of the present invention are not limited to the installation position of the heat dissipation device, etc., but to provide a heat dissipation device that can maintain a constant heat dissipation efficiency even in any direction.

According to one of various embodiments of the present disclosure, a heat dissipation device may include: a heat dissipation device comprising: a heat dissipation plate; And a heat radiating area portion provided on the heat radiating plate and provided with heat radiating fins of different angles.

The heat dissipation device according to various embodiments of the present disclosure has an advantage of increasing the degree of freedom of air flow even when the heat dissipation device is mounted in any direction of the electronic device or the electronic device having the heat dissipation device in any direction. have.

In addition, the heat dissipation device according to various embodiments of the present disclosure is not limited to the installation position of the heat dissipation device, and of course, the heat dissipation efficiency can be kept constant even if the heat dissipation device is installed in any direction.

1A and 1B are views showing a general heat dissipation device.

2 is a perspective view of a heat dissipation device according to a first embodiment of various embodiments of the present disclosure.

3 is a plan view of a heat dissipation device according to a first embodiment of various embodiments of the present disclosure.

4 is a perspective view of a heat dissipation device according to a second embodiment of various embodiments of the present disclosure.

5 is a plan view of a heat dissipation device according to a second embodiment of various embodiments of the present disclosure.

6 is a perspective view of a heat dissipation device according to a third embodiment of various embodiments of the present disclosure.

7 is a plan view of a heat dissipation device according to a third embodiment of various embodiments of the present disclosure.

8A to 8D are views illustrating various shapes of heat dissipation fins in the heat dissipation device according to one of various embodiments of the present disclosure.

9A to 9E are views illustrating various shapes of the inset part in the heat dissipation device according to one of various embodiments of the present disclosure.

10A and 10B are diagrams illustrating a distribution of temperature generated by a heat generating module in the heat dissipation device of the first and second embodiments of various embodiments of the present disclosure.

FIG. 11 is data illustrating temperature distribution of heat radiation according to a heat radiation fin in the heat dissipation device of the first and second embodiments of the present disclosure.

* Drawing symbol *

100: heat dissipation device 110: plate

121, 122, 123, 124: heat radiation fins 131, 132, 133, 134: heat radiation region

140: inset unit 170: heat generating module

Hereinafter, various embodiments of the present invention will be described in connection with the accompanying drawings. Various embodiments of the present invention may have various changes and various embodiments, and specific embodiments are illustrated in the drawings and related detailed descriptions are described. However, this is not intended to limit the various embodiments of the present invention to specific embodiments, it should be understood to include all modifications and / or equivalents and substitutes included in the spirit and scope of the various embodiments of the present invention. In the description of the drawings, similar reference numerals are used for similar elements.

Expressions such as "comprises" or "can include" as used in various embodiments of the present disclosure indicate the existence of a corresponding function, operation or component disclosed, and additional one or more functions, operations or It does not restrict the components. In addition, in various embodiments of the present invention, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, It should be understood that it does not exclude in advance the possibility of the presence or addition of one or more other features or numbers, steps, operations, components, parts or combinations thereof.

In various embodiments of the present disclosure, the expression “or” includes any and all combinations of words listed together. For example, "A or B" may include A, may include B, or may include both A and B.

Expressions such as “first,” “second,” “first,” or “second,” and the like used in various embodiments of the present disclosure may modify various elements of the various embodiments, but limit the elements. I never do that. For example, the above expressions do not limit the order and / or importance of the corresponding elements. The above expressions may be used to distinguish one component from another. For example, both a first user device and a second user device are user devices and represent different user devices. For example, without departing from the scope of the various embodiments of the present disclosure, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

When a component is said to be "connected" or "connected" to another component, the component may or may not be directly connected to or connected to the other component. It is to be understood that there may be new other components between the other components. On the other hand, when a component is referred to as being "directly connected" or "directly connected" to another component, it will be understood that there is no new other component between the component and the other component. Should be able.

The terminology used in the various embodiments of the present invention is merely used to describe specific embodiments, and is not intended to limit the various embodiments of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which various embodiments of the present disclosure belong. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art, and are ideally or excessively formal unless otherwise defined in various embodiments of the present invention. It is not interpreted in the sense.

An electronic device according to various embodiments of the present disclosure may include all of the devices that may include a heat dissipation device mounted therein to dissipate the heat dissipation device.

For example, it may include an antenna device and a lighting device.

In addition, the electronic device is not limited to the above devices, but may be a tablet personal computer (PC), a mobile phone, a desktop personal computer, a laptop PC, or a netbook computer. ), From communication devices such as personal digital assistants (PDAs) and portable multimedia players (PMPs), televisions, digital video disk (DVD) players, audio, refrigerators, air conditioners, cleaners, ovens, microwave ovens, washing machines, air cleaners, set-tops Smart like box-top boxes, TV boxes (e.g. Samsung HomeSyncTM, Apple TVTM, or Google TVTM), game consoles, electronic dictionaries, electronic keys, camcorders, or electronic frames It may be a smart home appliance, a projector, or a variety of measuring devices (eg, water, electricity, gas, or radio wave measuring devices, etc.), and one or more of the various devices described above. One can.

Hereinafter, a heat dissipation device according to various embodiments will be described with reference to FIGS. 2 through 11. In addition, hereinafter, three embodiments of the heat dissipation device according to various embodiments of the present disclosure will be representatively described, but the configuration is not limited thereto. That is, the number of heat dissipation region portions described later, or the angles of the heat dissipation fins provided on different heat dissipation region portions, may vary depending on various factors such as the location of the heat dissipation module of the electronic device on which the heat dissipation device is mounted, the mounting environment of the electronic device, the mounting space, and the mounting angle. Depending on the number of changes or modifications may be possible.

The heat dissipation device according to one of various embodiments of the present disclosure may include a heat dissipation plate and a heat radiating area portion provided on the heat dissipation plate and having heat dissipation fins of different angles. .

In addition, in the heat dissipation device according to one of various embodiments of the present disclosure, an inset portion may be provided between the heat dissipation area portion and the heat dissipation area portion adjacent to the heat dissipation area portion.

In addition, in the heat dissipation device according to one of various embodiments of the present disclosure, the heat dissipation fins formed in the heat dissipation region portion and the heat dissipation fins provided in the heat dissipation region portion adjacent to the heat dissipation region portion are the insets. It may be provided to have a 'V' shape around the part.

In addition, in the heat dissipation device according to one of various embodiments of the present disclosure, the inset portion may include at least two inset lines, and the inset lines may be formed to cross each other or bend each other.

In the heat dissipation device according to one of the various embodiments of the present invention, the inset portion is formed to cross the '+' shape on the heat dissipation plate, the heat dissipation area portion of the first and second around the inset line It can be partitioned into 3,4 heat dissipation zones.

In the heat dissipation device according to one of various embodiments of the present disclosure, the first, second, third, and fourth heat dissipation fins on the first, second, third, and fourth heat dissipation regions are centered on the center of the inset line. It may have different angles of the 'X' shape.

In the heat dissipation device according to another embodiment of the present invention, the first, second, third, and fourth heat dissipation fins on the first, second, third, and fourth heat dissipation regions are different in a rhombus shape with respect to the center of the inset line. It can have an angle.

In the heat dissipation device according to another embodiment of the various embodiments of the present disclosure, the inset portion is formed to cross the 'X' shape on the heat dissipation plate, and the heat dissipation region portion includes first, second, The heat dissipation fins are divided into 3,4 heat dissipation zones, and the first, second, third and fourth heat dissipation fins on the first, second, third and fourth heat dissipation zones have different angles of '+' shape with respect to the center of the inset line. Can have

In addition, in the heat dissipation device according to one of various embodiments of the present invention, the heat dissipation fins may further include at least one of wrinkles, bends, protrusions, and openings to form turbulence.

In addition, in the heat dissipation device according to one of the various embodiments of the present disclosure, the heat dissipation area portions adjacent to each other may be provided symmetrically about the inset portion.

2 is a perspective view of a heat dissipation device according to a first embodiment of various embodiments of the present disclosure. 3 is a plan view of a heat dissipation device according to a first embodiment of various embodiments of the present disclosure. 4 is a perspective view of a heat dissipation device according to a second embodiment of various embodiments of the present disclosure. 5 is a plan view of a heat dissipation device according to a second embodiment of various embodiments of the present disclosure. 6 is a perspective view of a heat dissipation device according to a third embodiment of various embodiments of the present disclosure. 7 is a plan view of a heat dissipation device according to a third embodiment of various embodiments of the present disclosure. 8A to 8D are views illustrating various shapes of heat dissipation fins in the heat dissipation device according to one of various embodiments of the present disclosure. 9A to 9E are views illustrating various shapes of the inset part in the heat dissipation device according to one of various embodiments of the present disclosure.

2 to 9 together, the heat dissipation device 100 according to one of the various embodiments of the present invention, the heat radiating area portion 110 (hereinafter referred to as 'plate 110') ), And heat dissipation fins 121, 122, 123, and 124, and plate 110 may include at least one heat dissipation area portion 131, 132, 133, by an inset portion 140. 134).

The plate 110 is a component provided at the position of the heat generating module 170 in which heat is generated, such as an electronic device, for example, an antenna device or a lighting device. The plate 110 may be made of a material having high thermal conductivity such as copper and aluminum to receive heat generated from the heat generating module 170 (see FIG. 8). Copper or aluminum is illustrated as an example of the material of the plate 110 in an embodiment of the present invention. However, the present invention is not limited thereto, and thermal conductivity is appropriate in consideration of an environment in which an electronic device is used, a space, a design, an external environment, and the like. As long as the material with a change can be changed or modified.

In addition, the plate 110 according to an embodiment of the present invention may have a square or rectangular shape, and in various embodiments described below, the plate 110 will be described as an example of being formed in a square. However, the shape of the plate 110 is not limited thereto. For example, depending on the installation angle of the electronic device having the plate 110 or the mounting angle of the plate 110 is mounted in the electronic device may be provided in a form rotated in a square or rectangle, it may be formed in a circular or polygonal The shape of the plate 110, such as may be, may be modified or changed as much as possible.

The heat dissipation fins 121, 122, 123, and 124 are components that protrude in a vertical direction at regular intervals on the plate 110. The heat dissipation fins 121, 122, 123, and 124 may be provided to have a predetermined angle on the plate 110. The heat dissipation fins 121, 122, 123, and 124 according to an embodiment of the present invention have a predetermined angle on the plate 110 as well as at least one heat dissipation area portion 131 adjacent to each other on the plate 110. 132, 133, and 134 (heat radiating area portion).

For example, the heat dissipation fins 121, 122, 123, and 124 according to various embodiments of the present disclosure protrude in the vertical direction on the plate 110. However, the heat dissipation fins may protrude obliquely to have a predetermined angle on the plate. This may be changed as much as the process of the heat dissipation fin is assembled in the plate, and the inclination angle may be changed as much as the external environment in which the heat dissipation device is installed.

Specifically, the heat dissipation regions 131, 132, 133, and 134 are heat dissipation regions in which heat dissipation fins 121, 122, 123, and 124 protrude in parallel in the same direction on the plate 110. At least one may be formed on the plate 110. The heat radiation area portions 131, 132, 133, and 134 have a symmetrical shape on the plate 110, for example. However, the heat dissipation area portions 131, 132, 133, and 134 may be formed asymmetrically according to the position of the inset portion 140 or the position of the heating module 170 which will be described later. In addition, the heat dissipation regions 131, 132, 133, and 134 may be formed adjacent to each other along a direction on the plate, or may be formed in a vertical direction of the gravity direction and the gravity direction.

As described later, the heat dissipation area portions 131, 132, 133, and 134 according to various embodiments of the present disclosure include first, second, third, and fourth heat dissipation regions 131, 132, 133, and 134 that intersect with each other. For example, it may be divided into four regions that are formed symmetrically with respect to 140. However, the heat dissipation area parts 131, 132, 133, and 134 may be provided with at least one heat dissipation area part 131, 132, 133, and 134, and include two or more heat dissipation areas. As it may be, in consideration of the size of the plate 110, the location of the heat dissipation module, etc. may be modified or changed as much as possible.

The inset portion 140 includes heat dissipation region portions 131, 132, 133, and 134, and heat dissipation region portions 131, 132, 133, and 134 adjacent to the heat dissipation region portions 131, 132, 133, and 134. It may be provided between). In detail, the heat dissipation area parts 131, 132, 133, and 134 may be positioned adjacent to each other adjacent to each other with respect to the inset part 140. The inset unit 140 may change the air flowing into the turbulent flow from the inset unit 140 through the heat radiation fins 121, 122, 123, and 124 at different angles, thereby generating air flow as energy is generated. Can be. Accordingly, the flow of air can be made more active, and thus the movement of air can be efficiently generated between the heat dissipation fins 121, 122, 123, and 124, thereby increasing heat dissipation efficiency.

As mentioned above, the heat dissipation area portions 131, 132, 133, and 134 adjacent to each other according to one of various embodiments of the present disclosure may be partitioned symmetrically or asymmetrically based on the inset portion 140. In the heat dissipation device 100 according to various embodiments of the present disclosure described below, the heat dissipation area portions 131, 132, 133, and 134 are symmetrically divided with respect to the inset portion 140. . However, as each of the heat dissipation area parts 131, 132, 133, and 134 may be asymmetrically formed in size, the position of the inset part 140 may be deformed depending on the position of the heat generating module 170. It is obvious that the heat radiation area portions 131, 132, 133, and 134 may be asymmetrically formed.

The heat dissipation fins 121, 122, 123, and 124 formed in the heat dissipation region portions 131, 132, 133, and 134 adjacent to each other based on the inset portion 140, and the heat dissipation region portions 131, 132, and 133. , 134 and the heat dissipation fins 121, 122, 123, and 124 provided to the heat dissipation area portions 131, 132, 133, and 134 adjacent to each other, have different angles, specifically, a 'V' shape or an opposite shape thereof. Cockle shape). For example, when one inset portion 140 is provided, the heat dissipation fins 121, 122, 123, and 124 formed in one heat dissipation region portion 131, 132, 133, and 134, and neighbors thereof. The heat dissipation fins 121, 122, 123, and 124 of the heat dissipation area portions 131, 132, 133, and 134 of one other region have a 'V' shape or '∧' which is the reverse direction thereof with respect to the inset portion 140. The shapes may have different angles. In addition, when the two inset parts 140 are provided in parallel, the heat dissipation area parts 131, 132, 133, and 134 are left and right sides of the heat dissipation area parts 131, 132, 133, and 134. And the heat dissipation area portions 131, 132, 133, and 134 on the right side. In this case, the heat dissipation fins 121, 122, 123, and 124 formed in the heat dissipation area portions 131, 132, 133, and 134 from one side to the other side have one mountain shape, one valley shape, or one valley shape, and one valley shape. It may be formed to have a different angle in the shape of a mountain. The heat dissipation fins 121, 122, 123, and 124 formed on each plate 110 based on the inset 140 may have an angle of 20 ° to 80 °. In the present invention, for example, the heat radiation fins 121, 122, 123, and 124 have an angle of 45 ° with respect to the inset portion 140. However, the angles of the heat dissipation fins 121, 122, 123, and 124 may not be limited thereto. In addition, the heat radiation fins 121, 122, 123, and 124 formed in each of the heat dissipation area portions 131, 132, 133, and 134 form a predetermined angle to be symmetrically formed with respect to the inset portion 140. can do. For example, referring to FIG. 2, the first heat dissipation fin 121 of the first heat dissipation region 131 is 45 to the upper side of the horizontal inset portion 140 in the counterclockwise direction with respect to the horizontal inset portion 140. The second heat dissipation fin 122 of the second heat dissipation region 132 may be formed at an angle of 45 ° to the upper side of the horizontal inset portion 140 in a clockwise direction, and the third heat dissipation region. The third heat dissipation fin 123 of 133 may be formed at an angle of 45 ° below the horizontal inset 140 in the counterclockwise direction, and the fourth heat dissipation fin 124 of the fourth heat dissipation region 134 may be formed. May be formed at 45 ° below the horizontal inset 140 in a clockwise direction. However, the heat dissipation fins 121, 122, 123, and 124 formed in the heat dissipation area portions 131, 132, 133, and 134 may not be symmetrically formed, as in the previous case. That is, the heat dissipation fins 121, 122, 123, and 124 formed on the heat dissipation area portions 131, 132, 133, and 134 may have different angles.

Referring to FIG. 8, air introduced between the heat dissipation fins 121, 122, 123, and 124 may form turbulence on the surfaces of the heat dissipation fins 121, 122, 123, and 124 according to an embodiment of the present disclosure. A separate structure can be formed to make this possible. For example, as illustrated in FIG. 8A, the wrinkle part 126 may be formed to have a plurality of wrinkle shapes at predetermined positions of the heat radiation fins 121, 122, 123, and 124. In addition, unlike the wrinkle part 136, the bent part 127 may be formed to be bent to a predetermined position of the heat dissipation fins 121, 122, 123, and 124. In addition, unlike the wrinkle part 126 or the bent part 127, a protrusion 128 may be formed at which predetermined protrusions protrude from a predetermined position of the heat dissipation fins 121, 122, 123, and 124. In addition, unlike the previous pleats 126, the bent parts 127, and the protrusions 128, a plurality of openings 129 of holes or grooves may be formed at predetermined positions of the heat dissipation fins 121, 122, 123, and 124. have. In addition, at least one of the preceding pleats 126, the bent portion 127, the protrusion 128, and the bent portion 129 may be formed on the heat dissipation fins 121, 122, 123, and 124.

9A to 9E, the inset unit 140 according to various embodiments of the present disclosure will be described as an example in which at least two inset lines are formed to cross or bend each other. For example, as shown in FIG. 9 (a) or 9 (b), the two inset lines on the plate 110 may be formed to cross each other in a '+' or 'X' shape, and FIG. 9 (c) or As shown in (d) of FIG. 9, the inset line may be formed to be bent, such as a 'T' shape or a 'b' shape. In addition, as illustrated in FIG. 9E, at least one or more inset lines may be formed in parallel with each other, or an inset line crossing the parallel inset lines may be formed in combination. As such, the inset unit 140 may be deformed or changed as much as possible in consideration of the position of the heat generating module 170 or the heat dissipation efficiency.

As described above, the heat dissipation area parts 131, 132, 133, and 134 and the inset part 140 may be modified or changed as much as possible depending on the position of the heat generating module 170.

In addition, according to the structures of the heat dissipation area parts 131, 132, 133, and 134 and the inset part 140, directions and angles of the heat dissipation fins 121, 122, 123, and 124 adjacent to each other may be set. .

Hereinafter, a heat dissipation device 100 according to a first embodiment of various embodiments of the present disclosure will be described with reference to FIGS. 2 and 3.

2 and 3, the heat dissipation device 100 according to the first embodiment includes an inset portion 140 that crosses each other, and four heat dissipation region portions 131, based on the inset portion 140. 132, 133, and 134 may be provided. Specifically, the square plate 110 is provided with an inset portion 140 crossing each other in a horizontal direction and a direction perpendicular to the horizontal direction to cross in a '+' shape. Four heat dissipation region portions 131, 132, 133, and 134 of the 2,3,4 heat dissipation regions 131, 132, 133, and 134 may be included. In the present invention, the heat dissipation area portions 131, 132, 133, and 134 on the upper left side are referred to as the first heat dissipation area 131, and the heat dissipation area portions 131, 132, 133, 134 is called the second heat dissipation region 132, and the heat dissipation region portions 131, 132, 133, and 134 at the lower right side are called third heat dissipation region 133, and the heat dissipation region portions 131, 132, 133 and 134 may be referred to as a fourth heat radiation region 134. This is for ease of description, and the first, second, third, and fourth heat dissipation areas 131, 132, 133, and 134 may be changed.

The first heat dissipation region 131 may be provided to be adjacent to the second heat dissipation region 132 and the fourth heat dissipation region 134 based on the intersecting inset unit 140. In addition, the second heat dissipation region 132 may be provided to be adjacent to the first heat dissipation region 131 and the third heat dissipation region 133 on the basis of the inset portion 140 intersecting. In addition, the third heat dissipation region 133 may be provided adjacent to the second heat dissipation region 132 and the fourth heat dissipation region 134. In addition, the fourth heat radiation region 134 may be provided adjacent to the third heat radiation region 133 and the first heat radiation region 131.

First, second, third, and fourth heat dissipation regions 131, 132, 133, and 134 may be provided with first, second, third, and fourth heat dissipation fins 121, 122, 123, and 124 having different angles. In addition, the first, second, third, and fourth heat dissipation fins 121, 122, 123, and 124 formed in the first, second, third, and fourth heat dissipation regions 131, 132, 133, and 134 may rotate the plate 110. It may be provided to have the same shape even if it is positioned in the vertical direction of the gravity direction or the gravity direction.

In addition, the first, second, third, and fourth heat dissipation fins 121, 122, 123, and 124 according to the first embodiment of the present invention have adjacent heat dissipation fins 121, 122, 123, and 124 with respect to each other. The bone shape may be formed to have different angles. Accordingly, the first, second, third, and fourth heat dissipation fins 121, 122, 123, and 124 are adjacent to the heat dissipation fins 121, 122, 123, and 124 in an 'X' shape with respect to the center of the inset line. It can be formed at different angles.

In detail, the first heat dissipation region 131 and the second and fourth heat dissipation regions 132 and 134 are adjacent to each other. Accordingly, the first heat dissipation fin 121 and the second and fourth heat dissipation fins 122 and 124 formed in the first heat dissipation region 131 and the second and fourth heat dissipation regions 132 and 134 may have different angles. will be. Accordingly, the first heat dissipation fin 121 and the second heat dissipation fin 122 may have different angles in a 'V' shape with respect to the inset portion 140, and the first heat dissipation fin 121 and the fourth heat dissipation fin 121 may be formed. The heat dissipation fins 124 may have different angles in a 'V' shape with respect to the inset portion 140. Similarly, the second heat dissipation region 132 and the first and third heat dissipation regions 133 are adjacent to each other, and the second heat dissipation fin 122 and the first and third heat dissipation regions (132) are formed in the second heat dissipation region 132. The first and third heat sink fins 123 formed on the 133 may have different angles. Therefore, as described above, the second heat dissipation fin 122 and the first heat dissipation fin 121 may have different angles to each other in a 'V' shape, and the second heat dissipation fin 122 and the third heat dissipation fin 123 may be different from each other. ) May have different angles in a 'V' shape with respect to the insent portion. Similarly, the third heat dissipation region 133 and the second and fourth heat dissipation regions 134 are adjacent to each other, and the third heat dissipation fins 123 formed in the third heat dissipation region 133 are second and fourth heat dissipation fins. It will have a different angle than the (122, 124). Accordingly, the third heat dissipation fin 123 and the second heat dissipation fin 122 may have different angles having a 'V' shape as described above, and the third heat dissipation fin 123 and the fourth heat dissipation fin 124 may have different angles. May have different angles in a 'V' shape with respect to the inset unit 140. In addition, the fourth heat dissipation region 134 and the first and third heat dissipation regions 131 and 133 are adjacent to each other, and the fourth heat dissipation fins 124 formed in the fourth heat dissipation region 134 are first and third heat dissipation. It may have a different angle from the pins 123. Accordingly, as described above, the fourth heat dissipation fin 124 and the third heat dissipation fin 123 may form different angles having a 'V' shape with respect to the inset 140 as described above. The fourth heat dissipation fin 124 and the first heat dissipation fin 121 may form different angles having a 'V' shape with respect to the insent portion.

Thus, the first heat dissipation fin 121 and the third heat dissipation fin 123 of the first heat dissipation region 131 and the third heat dissipation region 133 according to the first embodiment of the present invention may have the same angle. The second heat dissipation fin 122 of the second heat dissipation region 132 and the fourth heat dissipation fin 124 of the fourth heat dissipation region 134 may have the same angle. Therefore, the first, second, third, and fourth heat dissipation fins 121, 122, 123, and 124 on the first, second, third, and fourth heat dissipation regions 131, 132, 133, and 134 according to the first embodiment of the present invention. ) May be formed to have different angles in the 'X' shape around the center of the inset line.

As mentioned above, when the plate 110 is located in the gravity direction, the first, second, third, and fourth heat dissipation fins 121, 122, 123, based on the inset portion 140 intersecting in a '+' shape, 124 may be formed at different angles in the 'X' shape. In this case, even when the plate 110 is rotated in the vertical direction of the gravitational direction, the inset portion 140 intersects in a '+' shape, and the first, second, and third portions of the inset portion 140 are referred to. The heat dissipation fins 121, 122, 123, and 124 may have different angles in a 'X' shape. Therefore, the shape of the heat dissipation fins 121, 122, 123, and 124 may always be constant even if the electronic device having the heat dissipation device 100 is installed in the direction of gravity or the direction perpendicular to the direction of gravity, depending on the installation environment.

Thus, even if the heat dissipation device 100 is installed in the direction of gravity, or installed in the vertical direction of the gravity direction, the heat dissipation efficiency may be kept constant.

Hereinafter, the heat dissipation device 100 according to the second embodiment will be described with reference to FIGS. 4 and 5.

The heat dissipation device 100 according to the second embodiment of the present invention is provided in the first, second, third, and fourth heat dissipation regions 131, 132, 133, and 134 in the heat dissipation device 100 according to the first embodiment. There is a difference in the angle at which the formed first, second, third and fourth heat dissipation fins 121, 122, 123, and 124 are formed. Thus, in the description of the second embodiment of the present invention, the same embodiments as described above or the same may be applied mutatis mutandis. In addition, duplicate or identical to the above description will be described in detail with respect to the configuration of the difference in the following while applying the preceding embodiment mutatis mutandis.

4 and 5, the heat dissipation device 100 according to the second embodiment may refer to the inset part 140 and the inset part 140 that cross each other in a '+' shape on the plate 110. Four first, second, third, and fourth heat dissipation regions 131, 132, 133, and 134 may be included. The first, second, third, and fourth heat dissipation regions 131, 132, 133, and 134 have first, second, third, and fourth heat dissipation fins 121, 122, 123, which form different angles between adjacent heat dissipation regions. 124 may be formed.

In particular, the first, second, third, and fourth heat dissipation fins 121, 122, 123, and 124 according to the second embodiment of the present invention may be formed to have a different angle from each other to form a mountain shape with respect to each other. . Accordingly, the first, second, third, and fourth heat dissipation fins 121, 122, 123, and 124 are heat dissipation fins of neighboring heat dissipation region portions 131, 132, 133, and 134 in a rhombus shape around the center of the inset line. 121, 122, 123, and 124 may be formed at different angles.

The heat dissipation device 100 according to the second embodiment also has heat dissipation fins 121, 122, and 123 formed in respective heat dissipation regions when the plate 110 is located in the gravity direction and when the plate 110 is located in the vertical direction of the gravity direction. , 124 may be formed in the same direction.

Thus, even if the heat dissipation device 100 is installed in the direction of gravity, or installed in the vertical direction of the gravity direction, the heat dissipation efficiency may be kept constant.

Hereinafter, the heat dissipation device 100 according to the third embodiment will be described with reference to FIGS. 6 and 7.

In the heat dissipation device 100 according to the third embodiment of the present invention, in the heat dissipation device 100 according to the first embodiment or the second embodiment described above, a shape in which the plate 110 is installed and an insen portion cross each other And, accordingly, the angles at which the first, second, third and fourth heat dissipation fins 121, 122, 123, and 124 are formed in the first, second, third, and fourth heat dissipation regions 131, 132, 133, and 134. There is a difference.

6 and 7, in the heat dissipation device 100 according to the third embodiment of the present disclosure, the inset part 140 may be formed to connect the edges and the edges to the square plate 110. . That is, the inset part 140 formed of two inset lines may be formed to cross the 'X' shape on the plate 110.

The plate 110 may be divided into four first, second, third, and fourth heat dissipation regions 131, 132, 133, and 134 based on the center portion of the inset line. In the heat dissipation area parts 131, 132, 133, and 134 according to the third embodiment of the present invention, the heat dissipation area parts 131, 132, 133, and 134 of the uppermost part of the plate 110 are disposed in the first heat dissipation area 131. ), And may be referred to as the second, third, and fourth heat radiation regions 134 in the clockwise direction. This is for convenience or convenience of description, and the positions of the first, second, third, and fourth heat dissipation regions 131, 132, 133, and 134 may be changed.

Accordingly, the first, second, third, and fourth heat dissipation fins 121, 122, 123, and 124 according to the third embodiment of the present invention may also form different angles with respect to each other. In particular, in the third embodiment of the present invention, the first and third heat dissipation fins 123 may be formed in the direction of gravity, and the second and fourth heat dissipation fins 121, 122, 123, and 124 are in the vertical direction of the gravity direction. Can be formed. Accordingly, the inset portion 140 according to the third embodiment may be formed in an 'X' shape, and the first, second, third, and fourth heat dissipation fins 121, 122, 123, and 124 are formed at the center of the inset line. In the '+' shape with respect to each other may be formed to have different angles in the bone shape with respect to each other.

In addition, the heat dissipation device 100 according to the third embodiment also includes heat dissipation fins 121 and 122 formed in respective heat dissipation regions when the plate 110 is located in the gravity direction and when the plate 110 is located in the vertical direction of the gravity direction. , 123 and 124 may be formed in the same direction.

Thus, even if the heat dissipation device 100 is installed in the direction of gravity, or installed in the vertical direction of the gravity direction, the heat dissipation efficiency may be kept constant.

Hereinafter, the data simulating the heat dissipation efficiency of the heat dissipation device according to the first and third embodiments of the present invention will be described by way of example.

10A and 10B are diagrams illustrating a distribution of temperature generated by a heat generating module in the heat dissipation device of the first and second embodiments of various embodiments of the present disclosure. FIG. 11 is data illustrating temperature distribution of heat radiation according to a heat radiation fin in the heat dissipation device of the first and second embodiments of the various embodiments of the present disclosure.

10A to 11, the thickness, size, and material of the plate 110 of the heat dissipation device 100 are the same, and the spacing, material, thickness, and protrusion of the heat dissipation fins 121, 122, 123, and 124 are equal to each other. In a state where the height and the like are the same, in the state in which two high temperature heat generating modules 170 are provided to the heat dissipation device 100, the temperature distribution by the heat dissipation device can be confirmed.

That is, when the plate 110 is installed in the gravity direction, the temperature distribution at which the high temperature heat generated by the heat generating module 170 provided at one side and the other side is radiated by the heat dissipation fins 121, 122, 123, and 124 is first implemented. In the example, about 126 ° and in the second embodiment, about 124 °. In this case, as the heat is radiated by the heat dissipation fins 121, 122, 123, and 124, the temperature of the heat generating module 170 provided on one side and the other side may be reduced to about 109 ° to 110 ° in the first embodiment. In the case of the second embodiment it may be reduced to about 107 ° ~ 108 °.

On the contrary, when the plate 110 is installed in the vertical direction of the gravity direction, that is, in the horizontal direction, the shape of the heat dissipation fins 121, 122, 123, and 124 does not change greatly when the plate 110 is installed in the gravity direction. Therefore, when the temperature distribution generated from the heat generating module 170 provided on one side and the other side is about 126 ° in the first embodiment and about 124 ° in the second embodiment, the heat dissipation fins 121, 122, 123, and 124. Due to heat dissipation due to the heat dissipation, the temperature of the heat generating module 170 may be reduced to about 108 ° to 109 ° in the first embodiment and similar to about 107 ° in the second embodiment, similarly to the installation in the gravity direction. It can be reduced to about 108 °.

Therefore, even if the plate 110 is installed in the direction of gravity or perpendicular to the direction of gravity, the heat dissipation efficiency of the heat generating module 170 by the heat dissipation device 100 is not only constant but also know that the heat dissipation efficiency can be increased. Can be.

And the embodiments of the present invention disclosed in the specification and drawings are merely to illustrate the technical contents of according to the embodiments of the present invention and to present specific examples to help the understanding of the embodiments of the present invention, the scope of the embodiments of the present invention It is not intended to be limiting. Therefore, the scope of various embodiments of the present invention should be construed that all changes or modifications derived based on the technical spirit of the various embodiments of the present invention in addition to the embodiments disclosed herein are included in the scope of various embodiments of the present invention.

Claims (10)

1. In the heat dissipation device,

   Heat dissipation plate; And

   And a heat radiating area portion provided on the heat radiating plate and having heat radiating fins of different angles.
2. The method of claim 1,

   And an inset portion between the heat dissipation region portion and the heat dissipation region portion adjacent to the heat dissipation region portion.
3. The method of claim 2,

   The heat dissipation fins formed in the heat dissipation region portion, and the heat dissipation fins provided in the heat dissipation region portion adjacent to the heat dissipation region portion are provided to have a 'V' shape around the inset portion.
4. The method of claim 2,

   The inset portion includes at least two inset lines,

   The inset line is formed to cross each other or bent.
5. The method of claim 4, wherein

   The inset portion is formed to cross the '+' shape on the heat dissipation plate,

   The heat dissipation area is divided into first, second, third, and fourth heat dissipation area around the inset line.
6. The method of claim 5,

   The first, second, third, and fourth heat dissipation fins on the first, second, third, and fourth heat dissipation regions have different angles having an 'X' shape with respect to the center of the inset line.
7. The method of claim 5,

   The first, second, third, fourth heat dissipation fins on the first, second, third, and fourth heat dissipation regions have different angles having a rhombus shape with respect to the center of the inset line.
8. The method of claim 4, wherein

   The inset portion is formed to cross the 'X' shape on the heat dissipation plate,

   The heat dissipation area is divided into first, second, third, and fourth heat dissipation areas about the inset line,

   The first, second, third and fourth heat dissipation fins on the first, second, third and fourth heat dissipation regions have different angles having a '+' shape with respect to the center of the inset line.
9. The method of claim 1,

   The heat dissipation device further comprises at least one of the wrinkles, bent portions, protrusions, openings to form a turbulent flow.
10. The method of claim 1,

    The heat dissipation area parts adjacent to each other are provided symmetrically about the inset part.

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