US20110232880A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20110232880A1 US20110232880A1 US12/785,622 US78562210A US2011232880A1 US 20110232880 A1 US20110232880 A1 US 20110232880A1 US 78562210 A US78562210 A US 78562210A US 2011232880 A1 US2011232880 A1 US 2011232880A1
- Authority
- US
- United States
- Prior art keywords
- heat dissipation
- guide plate
- dissipation device
- housing
- fin group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 30
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure generally relates to heat dissipation devices and, particularly, to a heat dissipation device mechanism used in an electronic device.
- a commonly used heat dissipation device includes an electronic fan, a heat sink, and a guiding device arranged between the electronic fan and the heat sink.
- the guiding device includes a guiding pipe and a plurality of guiding sheets received in the guiding pipe. Opposite ends of the guiding pipe communicate with the electronic fan and the heat sink, respectively. Wind created by the electronic fan passes through the guiding device and dissipates the heat of the heat sink.
- the guiding sheets can disperse the wind in the guiding pipe, which increases the dissipation efficiency.
- the heat dissipation device may only help dissipating the heat of the components facing the heat sink. The components arranged on opposite sides of the heat sink or spaced from the heat sink may not get a good dissipation efficiency.
- FIG. 1 is an assembled, isometric view of an exemplary heat dissipation device as disclosed, including an electronic fan, a fin group, a housing and a guide plate.
- FIG. 2 is similar to FIG. 1 , but shows a view from another aspect.
- FIG. 3 is an isometric view of a guide plate used in the heat dissipation device of FIG. 1 .
- FIG. 4 shows the heat dissipation device of FIG. 1 mounted on a circuit board.
- FIG. 5 shows the guide plate of FIG. 3 latching with a housing used in the heat dissipation device of FIG. 1 .
- a heat dissipation device 100 used in a computer and to be arranged on a circuit board 50 includes an electronic fan 10 , a fin group 20 , a housing 30 , and a guide plate 40 .
- the electronic fan 10 and the fin group 20 are connected to the housing 30 .
- the guide plate 40 is rotatably connected to the housing 30 .
- the fin group 20 includes a support bracket 21 and a plurality of parallel and spaced-apart dissipation fins 23 .
- the dissipation fins 23 define a plurality of air passages (not labeled) between neighboring fins 23 for airflow from the electronic fan 10 to flow therethrough to dissipate heat created by the electronic components to the ambient environment.
- the housing 30 includes a top plate 31 and connecting plates 33 extending from opposite edges of the top plate 31 .
- Each connecting plate 33 includes a first connecting portion 331 , a second connecting portion 333 , and a third connecting portion 335 arranged between the first and second connecting portions 331 , 333 . Both ends of the first and second connecting portions 331 , 333 are spaced from the top plate 31 and define a fixing hole 337 .
- the third connecting portion 335 has an edge 3350 slanted to the top plate 31 and a hook 3351 protruding from the edge 3350 .
- the third connecting portion 335 further defines two connecting holes 3353 at opposite sides of the hook 3351 .
- the guide plate 40 has latching blocks 41 for receiving the connecting holes 3353 of the housing 30 at a first edge and a positioning portion 43 at an opposite second edge .
- the guide plate 40 further defines a latching hole 45 for engaging with the hook 3351 of the housing 30 .
- the latching hole 45 is defined between the latching blocks 41 .
- the guide plate 40 further includes a shaft 47 correspondingly formed with the latching hole 45 .
- the surface of the shaft 47 that is located in the latching hole 45 of the guide plate 40 is curved, which allows the guide plate 40 to smoothly rotate.
- each dissipation fin 23 faces the heat component, such as a central processing unit, therefore, the heat can flow into the air passages between neighboring dissipation fins 23 and be dissipated to the ambient environment.
- the electronic fan 10 may be connected to the first connecting portion 331 of the housing 30 .
- the first connecting portion 331 and the second connecting portion 333 of the housing 30 are connected to the support bracket 21 of the fin group 20 .
- the connecting plates 33 and the dissipation fins 23 are parallel Thus, wind created by the electronic fan 10 can flow into the air passages between neighboring dissipation fins 23 .
- the hook 3351 of the housing 30 is latched in the latching hole 45 of the guide plate 40 , and the guide plate 40 can be rotated relative to the housing around the shaft 47 .
- the latching blocks 41 are gradually received in the connecting holes 3353 of the housing 30 , respectively.
- the guide plate 40 is substantially perpendicular to the connecting plate 33 of the housing 30 , the latching blocks 41 are received in the connecting holes 3353 of the housing totally, the guide plate 40 is prevented from rotating.
- a heat component 60 may also be arranged on the circuit board 50 and located at a side of the fin group 20 , adjacent to one of the end dissipation fins 23 , neighboring to one of the connecting plates 33 of the housing 30 . If the heat produced by the heat component 60 is small, the single dissipation fin 23 may be enough to effectively dissipate the heat of the heat component 60 ⁇ watch your word order>. If not, the single dissipation fin 23 may not help dissipate the heat.
- the guide plate 40 can be used to dissipate the heat of the heat component 60 . The location and inclined angle of the guide plate 40 may be adjusted according to the location of the heat component 60 , with the heat component 60 arranged under the guide plate 40 .
- the heat dissipation device 100 may help both the components facing and beside the fin group 20 to dissipate heat.
- the guide plate 40 is rotatably connected to the housing 30 , the guide plate 40 may rotate to cover the connecting plate 33 of the housing 30 and be positioned by the positioning portion 43 of the guide plate 40 to latch with the edge of the second connecting portion 333 of the housing 30 (see in FIG. 5 ). Thus, less space is occupied.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- 1. Technical Field
- The present disclosure generally relates to heat dissipation devices and, particularly, to a heat dissipation device mechanism used in an electronic device.
- 2. Description of Related Art
- With the development of the electronic technology, more and more electronic components are arranged in an electronic device, which causes the electronic components to have to deal with substantial heat. If the heat is not quickly dissipated from the electronic components, stable and fast performance of the electronic components will not be sustained. Usually, those skilled in the art install a heat dissipation device on an electronic component to help dissipate the heat of the electronic component. However, decreasing available space in the electronic device limits the number of the heat dissipation device. Therefore, a heat dissipation device with high efficiency is needed.
- A commonly used heat dissipation device includes an electronic fan, a heat sink, and a guiding device arranged between the electronic fan and the heat sink. The guiding device includes a guiding pipe and a plurality of guiding sheets received in the guiding pipe. Opposite ends of the guiding pipe communicate with the electronic fan and the heat sink, respectively. Wind created by the electronic fan passes through the guiding device and dissipates the heat of the heat sink. The guiding sheets can disperse the wind in the guiding pipe, which increases the dissipation efficiency. However, the heat dissipation device may only help dissipating the heat of the components facing the heat sink. The components arranged on opposite sides of the heat sink or spaced from the heat sink may not get a good dissipation efficiency.
- Therefore, there is room for improvement within the art.
- The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout several views, and all the views are schematic.
-
FIG. 1 is an assembled, isometric view of an exemplary heat dissipation device as disclosed, including an electronic fan, a fin group, a housing and a guide plate. -
FIG. 2 is similar toFIG. 1 , but shows a view from another aspect. -
FIG. 3 is an isometric view of a guide plate used in the heat dissipation device ofFIG. 1 . -
FIG. 4 shows the heat dissipation device ofFIG. 1 mounted on a circuit board. -
FIG. 5 shows the guide plate ofFIG. 3 latching with a housing used in the heat dissipation device ofFIG. 1 . - Referring to
FIG. 1 , aheat dissipation device 100 used in a computer and to be arranged on a circuit board 50 (see inFIG. 4 ) includes anelectronic fan 10, afin group 20, ahousing 30, and aguide plate 40. Theelectronic fan 10 and thefin group 20 are connected to thehousing 30. Theguide plate 40 is rotatably connected to thehousing 30. - Referring to
FIG. 2 , thefin group 20 includes asupport bracket 21 and a plurality of parallel and spaced-apart dissipation fins 23. Thedissipation fins 23 define a plurality of air passages (not labeled) between neighboringfins 23 for airflow from theelectronic fan 10 to flow therethrough to dissipate heat created by the electronic components to the ambient environment. - The
housing 30 includes atop plate 31 and connectingplates 33 extending from opposite edges of thetop plate 31. Each connectingplate 33 includes a first connectingportion 331, a second connectingportion 333, and a third connectingportion 335 arranged between the first and second connectingportions portions top plate 31 and define afixing hole 337. The third connectingportion 335 has anedge 3350 slanted to thetop plate 31 and ahook 3351 protruding from theedge 3350. The third connectingportion 335 further defines two connectingholes 3353 at opposite sides of thehook 3351. - Referring to
FIGS. 2 and 3 , theguide plate 40 haslatching blocks 41 for receiving the connectingholes 3353 of thehousing 30 at a first edge and apositioning portion 43 at an opposite second edge . Theguide plate 40 further defines alatching hole 45 for engaging with thehook 3351 of thehousing 30. Thelatching hole 45 is defined between thelatching blocks 41. Theguide plate 40 further includes ashaft 47 correspondingly formed with thelatching hole 45. The surface of theshaft 47 that is located in thelatching hole 45 of theguide plate 40 is curved, which allows theguide plate 40 to smoothly rotate. - Referring to
FIGS. 2 through 4 , when assembling theheat dissipation device 100 to thecircuit board 50, thesupport bracket 21 is connected to thecircuit board 50, and thefin group 20 is fixed to thesupport bracket 21. One edge of eachdissipation fin 23 faces the heat component, such as a central processing unit, therefore, the heat can flow into the air passages between neighboring dissipation fins 23 and be dissipated to the ambient environment. Theelectronic fan 10 may be connected to the first connectingportion 331 of thehousing 30. The first connectingportion 331 and the second connectingportion 333 of thehousing 30 are connected to thesupport bracket 21 of thefin group 20. The connectingplates 33 and thedissipation fins 23 are parallel Thus, wind created by theelectronic fan 10 can flow into the air passages between neighboring dissipation fins 23. Thehook 3351 of thehousing 30 is latched in thelatching hole 45 of theguide plate 40, and theguide plate 40 can be rotated relative to the housing around theshaft 47. When theguide plate 40 has been rotated a certain angle, thelatching blocks 41 are gradually received in the connectingholes 3353 of thehousing 30, respectively. When theguide plate 40 is substantially perpendicular to the connectingplate 33 of thehousing 30, thelatching blocks 41 are received in the connectingholes 3353 of the housing totally, theguide plate 40 is prevented from rotating. - A
heat component 60 may also be arranged on thecircuit board 50 and located at a side of thefin group 20, adjacent to one of the end dissipation fins 23, neighboring to one of the connectingplates 33 of thehousing 30. If the heat produced by theheat component 60 is small, thesingle dissipation fin 23 may be enough to effectively dissipate the heat of theheat component 60 <watch your word order>. If not, thesingle dissipation fin 23 may not help dissipate the heat. Theguide plate 40 can be used to dissipate the heat of theheat component 60. The location and inclined angle of theguide plate 40 may be adjusted according to the location of theheat component 60, with theheat component 60 arranged under theguide plate 40. When theelectronic fan 10 is turned on, airflow from theelectronic fan 10 reaches thefin group 20 and theguide plate 40. The airflow reaching thefin group 20 is capable of helping dissipating heat of the component facing thefin group 20. Therefore, by rotatingguide plate 40, the direction of the airflow reaching theguide plate 40 can be diverted or adjusted, and the airflow can reach aheat component 60 located under theguide plate 40 and therefore help dissipating the heat of theheat component 60. Thus, theheat dissipation device 100 may help both the components facing and beside thefin group 20 to dissipate heat. - The
guide plate 40 is rotatably connected to thehousing 30, theguide plate 40 may rotate to cover the connectingplate 33 of thehousing 30 and be positioned by thepositioning portion 43 of theguide plate 40 to latch with the edge of the second connectingportion 333 of the housing 30 (see inFIG. 5 ). Thus, less space is occupied. - Finally, while various exemplary embodiments have been described and illustrated, the disclosure is not to be construed as being limited thereto. Various modifications can be made to the exemplary embodiments by those skilled in the art without departing from the true spirit and scope of the disclosure as defined by the appended claims.
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010133493.8 | 2010-03-26 | ||
CN2010101334938A CN102202487A (en) | 2010-03-26 | 2010-03-26 | Heat abstractor |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110232880A1 true US20110232880A1 (en) | 2011-09-29 |
Family
ID=44655024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/785,622 Abandoned US20110232880A1 (en) | 2010-03-26 | 2010-05-24 | Heat dissipation device |
Country Status (2)
Country | Link |
---|---|
US (1) | US20110232880A1 (en) |
CN (1) | CN102202487A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150090435A1 (en) * | 2013-09-29 | 2015-04-02 | Huawei Technologies Co., Ltd. | Support plateheat dissipation apparatus |
US9454194B2 (en) | 2012-04-05 | 2016-09-27 | Wistron Corporation | Heat dissipating module capable of enhancing heat dissipating efficiency |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116133309B (en) * | 2023-04-14 | 2023-08-22 | 太原斯泰森电子科技有限公司 | Heat radiation assembly for electronic equipment |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4790374A (en) * | 1987-06-15 | 1988-12-13 | Pinfin, Inc. | Airflow directional vane for a heatsink |
US6155920A (en) * | 1998-12-18 | 2000-12-05 | Lite-On Enclosure Inc. | Air ducts structure of a radiating fan |
US6181557B1 (en) * | 1999-10-29 | 2001-01-30 | Motorola, Inc. | Electronic component, method of cooling, and damper therefor |
US20010014284A1 (en) * | 1999-08-04 | 2001-08-16 | Mccabe Francis J. | Intake and exhaust damper with movable motor fan assembly |
US6736196B2 (en) * | 2002-01-30 | 2004-05-18 | Hon Hai Precision Ind. Co., Ltd. | Fan duct assembly |
US7021368B2 (en) * | 2003-11-12 | 2006-04-04 | Cpumate Inc. | Heat dissipating device with uniform heat points |
US7349212B2 (en) * | 2006-07-24 | 2008-03-25 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20080101018A1 (en) * | 2006-10-27 | 2008-05-01 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20090316358A1 (en) * | 2008-06-20 | 2009-12-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with a fan holder attached with a position-adjustable air guiding member |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7228889B1 (en) * | 2006-01-09 | 2007-06-12 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7729119B2 (en) * | 2007-11-28 | 2010-06-01 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
CN101677503B (en) * | 2008-09-17 | 2012-01-11 | 纬创资通股份有限公司 | Heat radiating device |
-
2010
- 2010-03-26 CN CN2010101334938A patent/CN102202487A/en active Pending
- 2010-05-24 US US12/785,622 patent/US20110232880A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4790374A (en) * | 1987-06-15 | 1988-12-13 | Pinfin, Inc. | Airflow directional vane for a heatsink |
US6155920A (en) * | 1998-12-18 | 2000-12-05 | Lite-On Enclosure Inc. | Air ducts structure of a radiating fan |
US20010014284A1 (en) * | 1999-08-04 | 2001-08-16 | Mccabe Francis J. | Intake and exhaust damper with movable motor fan assembly |
US6181557B1 (en) * | 1999-10-29 | 2001-01-30 | Motorola, Inc. | Electronic component, method of cooling, and damper therefor |
US6736196B2 (en) * | 2002-01-30 | 2004-05-18 | Hon Hai Precision Ind. Co., Ltd. | Fan duct assembly |
US7021368B2 (en) * | 2003-11-12 | 2006-04-04 | Cpumate Inc. | Heat dissipating device with uniform heat points |
US7349212B2 (en) * | 2006-07-24 | 2008-03-25 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20080101018A1 (en) * | 2006-10-27 | 2008-05-01 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20090316358A1 (en) * | 2008-06-20 | 2009-12-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with a fan holder attached with a position-adjustable air guiding member |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9454194B2 (en) | 2012-04-05 | 2016-09-27 | Wistron Corporation | Heat dissipating module capable of enhancing heat dissipating efficiency |
US20150090435A1 (en) * | 2013-09-29 | 2015-04-02 | Huawei Technologies Co., Ltd. | Support plateheat dissipation apparatus |
US11604035B2 (en) * | 2013-09-29 | 2023-03-14 | Huawei Technologies Co., Ltd. | Support plateheat dissipation apparatus |
Also Published As
Publication number | Publication date |
---|---|
CN102202487A (en) | 2011-09-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TANG, XIAN-XIU;YE, ZHEN-XING;REEL/FRAME:024428/0431 Effective date: 20100507 Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TANG, XIAN-XIU;YE, ZHEN-XING;REEL/FRAME:024428/0431 Effective date: 20100507 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |