CN116133309B - Heat radiation assembly for electronic equipment - Google Patents

Heat radiation assembly for electronic equipment Download PDF

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Publication number
CN116133309B
CN116133309B CN202310396296.2A CN202310396296A CN116133309B CN 116133309 B CN116133309 B CN 116133309B CN 202310396296 A CN202310396296 A CN 202310396296A CN 116133309 B CN116133309 B CN 116133309B
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CN
China
Prior art keywords
drain pan
mounting
electronic equipment
fixed mounting
rotating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202310396296.2A
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Chinese (zh)
Other versions
CN116133309A (en
Inventor
王剑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyuan Sitaisen Electronic Technology Co ltd
Original Assignee
Taiyuan Sitaisen Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN202310396296.2A priority Critical patent/CN116133309B/en
Publication of CN116133309A publication Critical patent/CN116133309A/en
Application granted granted Critical
Publication of CN116133309B publication Critical patent/CN116133309B/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0213Venting apertures; Constructional details thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1401Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1401Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209Thermal management, e.g. fan control
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides a heat radiation component for electronic equipment, which belongs to the technical field of heat radiation of electronic equipment, and aims to solve the technical problem of providing the heat radiation component for the electronic equipment, wherein the heat radiation component comprises the following components in parts by weight: a radiator unit for electronic equipment includes, the drain pan, the inside mid-mounting of drain pan has radiator fan, the top fixed mounting of drain pan has the top cap, the equal symmetrical fixed mounting in inside both ends of drain pan has radiating fin, this radiator unit for electronic equipment can be through the inside wind direction of transition mechanism selectivity to electronic equipment that is equipped with on the equipment adjust for the flow rate of the inside wind of electronic equipment, the inside to electronic equipment that can be better cools down, both can pertinence cooling down to a certain position, simultaneously, can increase the inside whole air flowability of electronic equipment, also can cool down, in addition, clamping mechanism's setting can carry out the installation of suitability to the equipment, more do benefit to the user and use.

Description

Heat radiation assembly for electronic equipment
Technical Field
The invention discloses a heat radiation assembly for electronic equipment, and belongs to the technical field of heat radiation of electronic equipment.
Background
Along with the continuous development of electronic equipment, a great amount of heat can be generated in the use process of the electronic equipment, so that the electronic equipment needs to be cooled and radiated, the current circuit board is radiated and cooled by adopting a directional radiating component, and wind is led out of the electronic equipment, but the radiating component is not fully installed in the electronic equipment, so that more points are heated when the electronic equipment operates, and the electronic equipment needs to be cooled and radiated.
Accordingly, there is a need to provide a new heat dissipation assembly for electronic devices that solves the above-mentioned problems.
Disclosure of Invention
In order to solve the technical problems, the invention provides a heat dissipation assembly for electronic equipment.
The heat dissipation assembly for an electronic device provided by the invention comprises: the inside mid-mounting of drain pan has radiator fan, and the top fixed mounting of drain pan has the top cap, and the equal symmetrical fixed mounting in inside both ends of drain pan has radiating fin, and the top fixed mounting of drain pan has the top cap, and the lateral wall and the lower fixed surface of conduction board of top cap are passed to the one end of two radiating fin, and conversion mechanism is all installed at the both ends of drain pan, and the bottom mid-mounting of drain pan has fixture, and conversion mechanism includes: and the two rotating plates are respectively connected to the two ends of the bottom shell in a rotating way, the two ends of the two rotating plates penetrate through the side wall of the bottom shell and are fixedly provided with mounting blocks, and the mounting blocks are provided with rotating columns.
Preferably, one ends of the two radiating fins are arranged in a step shape, and the two radiating fins are provided with protruding blocks matched with the conducting plates at one ends.
Preferably, the conversion mechanism further includes: the connecting block, the drain pan passes through the connecting block and installs the gib block, and the gib block passes through slider and pivoted post sliding connection, and slider fixed mounting is in pivoted post one side, and the air outlet of mutually supporting between the board is all offered at the both ends of drain pan and the pivoted.
Preferably, the guide strip is provided with an arc-shaped guide groove, and the sliding block is mutually matched with the guide strip in an extrusion mode.
Preferably, the clamping mechanism comprises: the horizontal pole, horizontal pole fixed mounting has the cardboard in the bottom of drain pan, the upper surface symmetry fixed mounting of horizontal pole, the draw-in groove of mutual joint complex between cardboard has been seted up to the both sides of drain pan, the both ends of horizontal pole are to car sliding connection have the sliding plate, equal threaded connection in bottom of two sliding plates has rolling bolts, rolling bolts's one end all passes the lateral wall rotation of sliding plate and is connected with the extrusion piece, extrusion complex cooperation groove between the extrusion piece has been seted up with the lower surface of horizontal pole, the mounting groove has been seted up on one side of the top of sliding plate, symmetrical fixed mounting has the erection column in the top mounting groove of sliding plate, auxiliary spring has all been cup jointed on the erection column, one side of sliding plate is equipped with the grip block, the grip block is through limiting plate and sliding connection each other between the sliding plate, and limiting plate symmetrical fixed mounting grip block is close to one side of sliding plate.
Preferably, the clamping groove is in a trapezoid arrangement, and a trapezoid block matched with the clamping groove is arranged on one side of the clamping plate.
Preferably, guide grooves which are matched with the sliding plates in a sliding way are symmetrically formed on two sides of the cross rod.
Preferably, a protective pad is fixedly arranged on one side of the limiting plate.
Compared with the related art, the heat dissipation assembly for the electronic equipment has the following beneficial effects:
the invention provides a heat radiation component for electronic equipment, when the equipment is used, a user firstly installs the equipment, the installation position of the equipment is fixed through a clamping mechanism, the adjustability of the clamping mechanism can increase the installation matching property between the equipment and a circuit board, afterwards, the wind direction in the electronic equipment can be adjusted in a targeted manner according to the actual heat radiation wind direction in the electronic equipment through a conversion mechanism, the air flow speed on the surface of the circuit board in the electronic equipment is increased, the speed of taking away heat by wind is accelerated, the better cooling is realized, the heat radiation component for the electronic equipment can selectively adjust the wind direction in the electronic equipment through the conversion mechanism arranged on the equipment, the flow speed of wind in the electronic equipment is accelerated, the better cooling is realized in the electronic equipment, the important cooling is realized in a certain part, meanwhile, the whole air flow in the electronic equipment can be increased, the cooling can be realized in the same way, the clamping mechanism can be arranged in an adaptive manner, and the equipment is more beneficial to the use of the user.
Drawings
FIG. 1 is a schematic diagram of a heat dissipation assembly for an electronic device according to a preferred embodiment of the present invention;
FIG. 2 is a schematic diagram showing a second embodiment of a heat dissipating assembly for an electronic device according to the present invention;
FIG. 3 is a schematic view of the partial explosion of FIG. 1;
FIG. 4 is a schematic diagram of the switching mechanism shown in FIG. 1;
FIG. 5 is a partially enlarged schematic illustration of the conversion mechanism of FIG. 1;
fig. 6 is a schematic structural view of the clamping mechanism shown in fig. 1.
Reference numerals in the drawings: 1. a bottom case; 2. a heat radiation fan; 3. a top cover; 4. a heat radiation fin; 5. a top cover; 6. a conductive plate; 7. a conversion mechanism; 8. a clamping mechanism; 9. a rotating plate; 10. a mounting block; 11. rotating the column; 12. a connecting block; 13. a guide bar; 14. a slide block; 15. an air outlet; 16. a cross bar; 17. a clamping plate; 18. a clamping groove; 19. a sliding plate; 20. rotating the bolt; 21. extruding a block; 22. a mating groove; 23. a mounting groove; 24. a mounting column; 25. an auxiliary spring; 26. a clamping plate; 27. a limiting plate; 28. and a guide groove.
Detailed Description
The invention will be further described with reference to the drawings and embodiments.
In the concrete implementation process, as shown in fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, a heat dissipation fan 2 is installed in the middle of the inside of the bottom shell 1, a top cover 3 is fixedly installed at the top end of the bottom shell 1, heat dissipation fins 4 are symmetrically and fixedly installed at both ends of the inside of the bottom shell 1, a top cover 5 is fixedly installed at the top end of the bottom shell 1, one ends of the two heat dissipation fins 4 penetrate through the side wall of the top cover 5 and are fixedly connected with the lower surface of a conducting plate 6, a conversion mechanism 7 is installed at both ends of the bottom shell 1, a clamping mechanism 8 is fixedly installed at the middle of the bottom end of the bottom shell 1, and the conversion mechanism 7 comprises: the rotating plates 9, two the rotating plates 9 are respectively connected to two ends of the bottom shell 1 in a rotating mode, two ends of each rotating plate 9 penetrate through the side wall of the bottom shell 1 to be fixedly provided with a mounting block 10, and the mounting blocks 10 are provided with rotating columns 11.
It should be noted that: when using equipment, the user installs equipment earlier, realizes the fixed to equipment mounted position through fixture 8 earlier, and fixture 8 has the adjustability, can make equipment install on the not unidimensional product, increases the convenience of equipment when using, later, adjusts through transition mechanism 7 according to the inside heat dissipation wind direction of actual electronic equipment, can artificial wind direction to the inside of electronic equipment carries out the targeted adjustment, increases the air flow speed on electronic equipment inner circuit board surface for the wind takes away the speed of heat, better cooling.
Referring to fig. 3, one ends of the two radiating fins 4 are arranged in a stepped manner, and one ends of the two radiating fins 4 are provided with protruding blocks matched with the conducting plate 6.
It should be noted that: the stepped radiating fins 4 facilitate the assembly of the device and can be connected with the conducting plate 6, thereby facilitating the heat transfer of the electronic device.
Referring to fig. 4 and 5, the switching mechanism 7 further includes: connecting block 12, drain pan 1 installs guide bar 13 through connecting block 12, guide bar 13 passes through slider 14 and rotates post 11 sliding connection, and slider 14 fixed mounting is in rotation post 11 one side, drain pan 1's both ends all have seted up the air outlet 15 that mutually support between 9 and the rotor plate.
It should be noted that: when the air outlet direction of the equipment is selected, at this time, according to actual use conditions, a user drives the rotating column 11 to rotate along the guide strip 13 through the sliding block 14, the rotating column 11 is fixedly connected with the rotating plate 9, and the rotating plate 9 can follow and rotate along with the rotation of the rotating column 11, so that the air outlet 15 is selectively opened, the direction of the air outlet can be adjusted manually, and the air circulation inside the equipment can be adjusted.
Referring to fig. 5, the guide bar 13 is provided with an arc-shaped guide groove, and the sliding block 14 is in press fit with the guide bar 13.
It should be noted that: the arc-shaped guide groove on the guide strip 13 is convenient for guiding the rotating column 11 to rotate, and the extrusion fit between the sliding block 14 and the guide strip 13 enables the rotating column 11 to have resistance when rotating, and the rotating column cannot move under the action of no external force.
Referring to fig. 6, the clamping mechanism 8 includes: the horizontal pole 16, horizontal pole 16 fixed mounting is in the bottom of drain pan 1, the upper surface symmetry fixed mounting of horizontal pole 16 has cardboard 17, the draw-in groove 18 of mutual joint complex between cardboard 17 has been seted up to the both sides of drain pan 1, the both ends of horizontal pole 16 are to car sliding connection has slide plate 19, two the equal threaded connection of bottom of slide plate 19 has rotation bolt 20, two rotation bolt 20's one end all passes the lateral wall rotation of slide plate 19 and is connected with extrusion piece 21, the mating groove 22 of extrusion complex between the extrusion piece 21 has been seted up to the lower surface of horizontal pole 16, mounting groove 23 has been seted up on top one side of slide plate 19, symmetrical fixed mounting has erection column 24 in the top mounting groove 23 of slide plate 19, auxiliary spring 25 has all been cup jointed on the erection column 24, one side of slide plate 19 is equipped with grip block 26, the grip block 26 is through limiting 27 and slide plate 19 between each other sliding connection, and limiting 27 symmetry fixed mounting grip block 26 is close to one side of slide plate 19.
It should be noted that: when the electronic equipment needs to be clamped, at this time, a user properly adjusts the space between the two cross bars 16, and adjusts the space to a proper position, at this time, the user rotates the rotating bolt 20 to realize the jacking of the extruding block 21, the matching groove 22 on the cross bars 16 is extruded, along with the increase of the friction force between the extruding block 21 and the matching groove 22, the position of the sliding plate 19 is relatively static, at this time, the user clamps the electronic equipment on the clamping mechanism 8, the sliding plate 19 is provided with a buffer protection mechanism, the limiting plate 27 can clamp the electronic equipment, the limiting plate 27 is provided with the auxiliary spring 25, a certain buffer protection effect is achieved when the electronic equipment is clamped, and the mounting column 24 is convenient for mounting the auxiliary spring 25.
Referring to fig. 6, the clamping groove 18 is arranged in a trapezoid shape, and a trapezoid block matched with the clamping groove 18 is arranged on one side of the clamping plate 17.
It should be noted that: the clamping groove 18 arranged in a trapezoid shape is convenient to be matched with the clamping plate 17 for clamping, and the installation stability of the clamping mechanism 8 is improved.
Referring to fig. 6, guide grooves 28 which are in sliding fit with the sliding plates 19 are symmetrically formed on two sides of the cross bar 16.
It should be noted that: the provision of the guide slots 28 on the rail 16 facilitates increased stability of movement of the slide plate 19 on the rail 16.
Referring to fig. 6, a protection pad is fixedly installed at one side of the limiting plate 27.
It should be noted that: the protective pad is arranged to protect the housing of the electronic device when the clamping mechanism 8 clamps the electronic device.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.

Claims (6)

1. A heat dissipation assembly for an electronic device, comprising: the utility model provides a drain pan (1), the inside mid-mounting of drain pan (1) has radiator fan (2), the top fixed mounting of drain pan (1) has top cap (3), the equal symmetrical fixed mounting in inside both ends of drain pan (1) has fin (4), the top fixed mounting of drain pan (1) has top cap (5), two the lateral wall and the lower fixed surface of conduction board (6) of top cap (5) are passed to the one end of fin (4), conversion mechanism (7) are all installed at the both ends of drain pan (1), the bottom mid-mounting of drain pan (1) has fixture (8), conversion mechanism (7) include: the two rotating plates (9) are respectively connected to two ends of the bottom shell (1) in a rotating mode, the two ends of the two rotating plates (9) penetrate through the side wall of the bottom shell (1) and are fixedly provided with mounting blocks (10), and the mounting blocks (10) are provided with rotating columns (11);
the conversion mechanism (7) further comprises: the connecting block (12), the drain pan (1) is installed guide bar (13) through connecting block (12), guide bar (13) pass through slider (14) and pivoted column (11) sliding connection, and slider (14) fixed mounting is in pivoted column (11) one side, air outlet (15) mutually supporting between rotating plate (9) are all offered at the both ends of drain pan (1);
the guide strip (13) is provided with an arc-shaped guide groove, and the sliding block (14) is mutually matched with the guide strip (13) in an extrusion mode.
2. The heat dissipation assembly for electronic equipment according to claim 1, wherein one end of two heat dissipation fins (4) is arranged in a step shape, and one end of each heat dissipation fin (4) is provided with a bump matched with the conducting plate (6).
3. The heat dissipation assembly for electronic devices as recited in claim 1, characterized in that the mounting mechanism (8) comprises: clamping grooves (16), two the both sides at drain pan (1) are offered to clamping groove (16) symmetry, drain pan (1) is through fixture block (18) joint installation mounting bracket (17), and fixture block (18) symmetry fixed mounting is in the inboard of mounting bracket (17), joint cooperation between clamping groove (16) and fixture block (18), the both sides symmetry fixed mounting of mounting bracket (17) has mounting panel (19), rotate on mounting panel (19) and be connected with mounting bolt (20), threaded column (21) are installed in the bottom central authorities rotation of drain pan (1), threaded column (21) pass the lateral wall fixed mounting of mounting bracket (17) and are connected with rotating block (22), and threaded connection between the lateral wall of threaded column (21) and drain pan (1).
4. A heat dissipation assembly for electronic equipment according to claim 3, wherein the clamping groove (16) is arranged in a trapezoid, and two sides of the clamping block (18) are provided with protruding blocks matched with the clamping groove (16).
5. A heat dissipating assembly for an electronic device according to claim 3, wherein the connection of the mounting bracket (17) to the mounting plate (19) is provided with stiffening ribs.
6. A heat dissipating assembly for an electronic device according to claim 3, wherein the outer ring of the rotating block (22) is provided with anti-skid grooves at equal intervals.
CN202310396296.2A 2023-04-14 2023-04-14 Heat radiation assembly for electronic equipment Active CN116133309B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310396296.2A CN116133309B (en) 2023-04-14 2023-04-14 Heat radiation assembly for electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310396296.2A CN116133309B (en) 2023-04-14 2023-04-14 Heat radiation assembly for electronic equipment

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CN116133309A CN116133309A (en) 2023-05-16
CN116133309B true CN116133309B (en) 2023-08-22

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CN111668714A (en) * 2020-07-08 2020-09-15 陕西宇澳电器有限公司 Power distribution cabinet
CN215528673U (en) * 2021-09-30 2022-01-14 深圳市为尚科技有限公司 Travelling charger with lamp and back clip
CN217160321U (en) * 2022-02-18 2022-08-09 陕钢集团汉中钢铁有限责任公司 Heat dissipation protection assembly for electrical equipment
CN216795610U (en) * 2022-03-01 2022-06-21 浙江大华技术股份有限公司 Heat dissipation casing and have its intelligent device
CN115460879A (en) * 2022-09-15 2022-12-09 深圳市德瑞斯电气技术有限公司 Servo driver shell capable of efficiently radiating and servo driver thereof

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