CN102253698A - Electronic device - Google Patents
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- CN102253698A CN102253698A CN2010101757222A CN201010175722A CN102253698A CN 102253698 A CN102253698 A CN 102253698A CN 2010101757222 A CN2010101757222 A CN 2010101757222A CN 201010175722 A CN201010175722 A CN 201010175722A CN 102253698 A CN102253698 A CN 102253698A
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- heat
- thermal insulation
- casing
- insulation barriers
- electronic installation
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Abstract
The invention relates to an electronic device which comprises a shell, at least an electronic component and a heat radiator for radiating heat of the electronic component, wherein a containing space is formed in the shell; the electronic component is contained in the containing space; an air vent is formed on the shell; a heat insulation piece is also arranged in the containing space of the shell; a heat radiation channel is formed in the heat insulation piece; the heat radiation channel is communicated with the air vent of the shell and isolated with the containing space outside the heat insulation piece in the shell; the heat radiator is arranged in the heat radiation channel; and the heat radiation piece prevents the heat in the heat radiation channel from spreading to the containing space outside the heat insulation piece in the shell.
Description
Technical field
The present invention relates to a kind of electronic installation, particularly a kind of radiator structure of electronic installation.
Background technology
At present electronic installation such as computing machine in, usually by at the heating radiator that is sticked on the circuit board with to being located at the heat-generating electronic elements on the circuit board, dispel the heat as central processing unit (CPU), north bridge chips (NB) etc.Sometimes in order to strengthen radiating efficiency, also can on heating radiator, assemble a fan, be used for providing a cooling draught with the distributing of accelerated heat, and heat is blown out the system outside by the ventilating opening on the casing of computing machine heating radiator.
Yet along with development of electronic technology and progress, computing machine is towards frivolous, short and small trend development, one-body molded desktop PC that display screen and main frame are integrated occurred, i.e. all-in-one (all-in-one) computer.In the integrated computer system,, adopt passive heat radiation device (promptly not having the fan heating radiator) to dispel the heat usually for heat-generating electronic elements for avoiding noise problem.Heating radiator is dispersed into heat in the total system after absorbing the heat of heat-generating electronic elements.In addition, on computer chassis, offer air vent internal system is connected with external environment condition, thereby realize the heat interchange of internal system and external environment condition by natural convection.Yet because the radiating rate of natural convection is slower, and the heat of disperse in total system be difficult to discharge by limited ventilating opening timely and effectively, causes heat to be stranded in the computer system, and serious harm is to the serviceability and the life-span of electronic component.
Summary of the invention
In view of this, be necessary the electronic installation that provides a kind of radiating efficiency preferable.
A kind of electronic installation, comprise a casing, at least one electronic component and be used to a heating radiator of this electronic element radiating, form an accommodation space in this casing, this electronic component is contained in this accommodation space, be formed with a ventilating opening on this casing, also be provided with a thermal insulation barriers in the accommodation space of this casing, form a heat dissipation channel in this thermal insulation barriers, this heat dissipation channel be connected with the ventilating opening of this casing and with casing in to be positioned at the accommodation space of thermal insulation barriers outside isolated, this heating radiator is positioned at this heat dissipation channel, and this thermal insulation barriers prevents that the heat diffusion in this heat dissipation channel is positioned at the accommodation space of thermal insulation barriers outside to the casing.
Thermal insulation barriers in the radiator structure of this electronic installation prevents that the interior heat diffusion of this heat dissipation channel is to thermal insulation barriers accommodation space in addition, and because heat dissipation channel is connected with the ventilating opening of casing, heat can promptly be expelled to the system outside by ventilating opening, thereby avoided heat to be stranded in internal system effectively, improved radiating efficiency.
Description of drawings
Fig. 1 is the three-dimensional combination figure of electronic installation one embodiment of the present invention.
Fig. 2 is the exploded view of electronic installation shown in Figure 1.
Fig. 3 is the unit assembly drawing of electronic installation shown in Figure 2.
Fig. 4 is the constitutional diagram of electronic installation shown in Figure 2, has wherein omitted the cover plate of this electronic installation.
The main element symbol description
Integrated computer 100
Casing 30
The first side wall 31
Ventilating opening 310
Heat abstractor 70
Adiabatic section 746
Fluting 768
Embodiment
Fig. 1 shows the electronic installation shown in one embodiment of the invention, and in the present embodiment, this electronic installation is an integrated computer 100.This integrated computer 100 comprises a rectangular pedestal 10, be embedded at a display screen of pedestal 10 bottom surfaces (figure does not show) and be connected in a host computer system 20 of pedestal 10 end faces.
Please consult Fig. 2 simultaneously, this host computer system 20 comprises a casing 30, be contained in a circuit board 40 in the casing 30, be located at two electronic components 50,60 on the circuit board 40, and with the heat abstractor 70 of electronic component 50,60 hot tie-ins so that electronic component 50,60 is dispelled the heat.Wherein, this two electronic component 50,60 is respectively central processing unit 50 and north bridge chips 60.
This casing 30 comprises two the first side walls 31, two second sidewalls 32 and a cover plate 33.This first side wall 31 and second sidewall 32 all extend vertically upward from the end face of this pedestal 10 and form, and this two the first side wall 31 is parallel to each other and is oppositely arranged, and this two second sidewall 32 is parallel to each other and is oppositely arranged.Described first, second sidewall 31,32 surrounds a hollow, rectangular jointly.This cover plate 33 is rectangular, and the size of its size and described first, second sidewall 31,32 hollow, rectangular that surrounded is suitable.This cover plate 33 is covered on the top of this first, second sidewall 31,32, and four edges of this cover plate 33 are connected with the top margin of these four sidewalls 31,32 respectively.The end face of this cover plate 33, this first, second sidewall 31,32 and this pedestal 10 encloses the accommodation space 34 that forms a rectangle jointly.Described circuit board 40, electronic component 50,60 and heat abstractor 70 are contained in this accommodation space 34.Form one " U " shape ventilating opening 310 on this two the first side wall 31 respectively.This ventilating opening 310 extends certain distance from the top margin of this first side wall 31 towards the base.This ventilating opening 310 is along the height of the degree of depth on the first side wall 31 short transverses less than this first side wall 31.Ventilating opening 310 on this two the first side wall 31 is oppositely arranged.
This circuit board 40 is contained in this casing 30, and is attached at the end face of this pedestal 10.This central processing unit 50 and north bridge chips 60 are located at the middle part of the upper surface of this circuit board 40.
This heat abstractor 70 comprises two absorber plates 72, two heat pipes 74, a thermal insulation barriers 76 and a heating radiator 78.This two absorber plate 72 is attached at respectively on described central processing unit 50 and the north bridge chips 60, to absorb the heat that central processing unit 50 and north bridge chips 60 produce respectively.Be formed with two accepting grooves 720 on this two absorber plate 72 respectively.Two accepting grooves 720 that each heat absorption is pulled on 72 are parallel to each other and the space setting.
This thermal insulation barriers 76 be positioned at this absorber plate 72 the top and with this absorber plate 72 separately.This thermal insulation barriers 76 is the lengthwise shape, and the spacing that two the first side walls of length that it is longitudinally gone up and described casing 30 are 31 is suitable.This thermal insulation barriers 76 comprises a leveling board 762 and two vertical plates 764 that extend vertically upward from the long relative dual-side of this leveling board 762.This thermal insulation barriers 76 cross section horizontally roughly is " U " shape.The leveling board 762 of this thermal insulation barriers 76 and two vertical plates 764 surround a heat dissipation channel 766 jointly.The size of the ventilating opening 310 on the first side wall 31 of the face size of this heat dissipation channel 766 and described casing 30 is suitable.This thermal insulation barriers 76 passes the low material of coefficient ratio heating radiator 78 by heat, makes such as plastic cement, and therefore, this thermal insulation barriers 76 can finely prevent that heat diffusion in the heat dissipation channel 766 is to thermal insulation barriers 76 outsides.One end of this leveling board 762 is provided with two flutings 768.This two fluting 768 longitudinally extends certain-length towards the middle part of leveling board 762 from the edge of an end of this leveling board 762.The degree of depth that height that this thermal insulation barriers 76 is vertically gone up and the ventilating opening 310 on the first side wall 31 are vertically gone up is suitable.
This heating radiator 78 is contained in the heat dissipation channel 766 of this thermal insulation barriers 76.This heating radiator 78 comprises a substrate 782 and the some heat radiator 784 that extend vertically upward from substrate 782.Space between these some heat radiator 784.
This heat pipe 74 roughly takes the shape of the letter U.Comprise an evaporator section 742, a condensation segment 744 parallel, and be connected in the adiabatic section 746 between this evaporator section 742 and the condensation segment 744 with evaporator section 742.
Please consult Fig. 3 and Fig. 4 simultaneously, when assembling this heat abstractor 70, the adiabatic section 746 of this two heat pipe 74 sticks into this two fluting 768 from the edge of the leveling board 762 of thermal insulation barriers 76 respectively, and is resisted against the end of fluting 768.The condensation segment 744 of this heat pipe 74 and evaporator section 742 lay respectively at the both sides up and down of this leveling board 762.The evaporator section 742 of this two heat pipe 74 is contained in respectively in two accepting grooves 720 of each absorber plate 72.The bottom hot tie-in of the substrate 782 of this condensation segment 744 and this heating radiator 78.
When being assembled in heat abstractor 70 in the casing 30, two absorber plates 72 of this heat abstractor 70 are attached at respectively on described central processing unit 50 and the north bridge chips 60, are used for absorbing respectively the heat of central processing unit 50 and north bridge chips 60 generations.The two ends of this thermal insulation barriers 76 are resisted against the inboard of two the first side walls 31 of this casing 30 respectively, and the two ends of this heat dissipation channel 766 are communicated with ventilating opening 310 on this two the first side wall 31 respectively.The top of the vertical plate 764 of this thermal insulation barriers 76 is resisted against the bottom surface of described cover plate 33 respectively.Because the size of these heat dissipation channel 766 end faces is suitable with the size of this ventilating opening 310, therefore, the leveling board 762 of this thermal insulation barriers 76 and the two ends of vertical plate 764 are resisted against the periphery of this two ventilating opening 310 respectively, thereby the two ends of heat dissipation channel 766 are in communication with the outside via ventilating opening 310, and the leveling board 762 of this thermal insulation barriers 76 and vertical plate 764 are isolated this heat dissipation channel 766 mutually with internal system.
During 70 work of this heat abstractor, absorber plate 72 absorb heat that central processing units 50 and north bridge chips 60 produce and by heat pipe 74 with heat transferred to heating radiator 78, heating radiator 78 is dispersed into heat in the heat dissipation channel 766.Because this thermal insulation barriers 76 passes the lower material of coefficient by heat and makes, therefore, this thermal insulation barriers 76 can intercept heat in heat dissipation channel 766 effectively, and finally by the ventilating opening on the first side wall 31 310 heat is dispersed into the external world.This integrated computer 100 is by forming a heat dissipation channel 766 that is connected with external environment and isolates mutually with internal system in it, not only avoid the heat disperse to whole casing 30 and cause heat to be stranded in the casing 30 effectively, and, because heat abstractor 70 is directed at heat dissipation channel 766 with the heat concentrated area that heat-generating electronic elements produces, strengthened the temperature difference of this heat dissipation channel 766, thereby promoted the heat exchanger effectiveness of natural convection with external environment.
Claims (10)
1. electronic installation, comprise a casing, at least one electronic component and be used to a heating radiator of this electronic element radiating, form an accommodation space in this casing, this electronic component is contained in this accommodation space, be formed with a ventilating opening on this casing, it is characterized in that: also be provided with a thermal insulation barriers in the accommodation space of this casing, form a heat dissipation channel in this thermal insulation barriers, this heat dissipation channel be connected with the ventilating opening of this casing and with casing in to be positioned at the accommodation space of thermal insulation barriers outside isolated, this heating radiator is positioned at this heat dissipation channel, and this thermal insulation barriers prevents that the heat diffusion in this heat dissipation channel is positioned at the accommodation space of thermal insulation barriers outside to the casing.
2. electronic installation as claimed in claim 1 is characterized in that: this heat dissipation channel takes the shape of the letter U.
3. electronic installation as claimed in claim 1, it is characterized in that: also comprise at least one absorber plate and at least one heat pipe, this absorber plate is positioned at the outside of heat dissipation channel and contacts with described electronic component, this heat pipe comprises an evaporator section and a condensation segment, this evaporator section is connected with this absorber plate, and this condensation segment is connected with this heating radiator.
4. electronic installation as claimed in claim 3 is characterized in that: this thermal insulation barriers cross section is " U " shape.
5. electronic installation as claimed in claim 4 is characterized in that: this thermal insulation barriers comprises a leveling board and two vertical plates that extend from leveling board, and this leveling board is provided with a fluting and is used for heating tube and passes.
6. electronic installation as claimed in claim 5 is characterized in that: this fluting extends a predeterminable range from the edge of this leveling board to its middle part.
7. electronic installation as claimed in claim 5, it is characterized in that: this heat pipe is " U " shape, this evaporator section and this condensation segment are parallel to each other, and the middle part of this heat pipe is arranged in the fluting of leveling board of this thermal insulation barriers, and the condensation segment of this heat pipe and evaporator section lay respectively at the both sides up and down of this leveling board.
8. electronic installation as claimed in claim 1 is characterized in that: also be provided with another ventilating opening on this casing, the two ends of the heat dissipation channel of this thermal insulation barriers are connected with the external world by described two ventilating openings respectively.
9. electronic installation as claimed in claim 1 is characterized in that: this thermal insulation barriers passes the low material of coefficient ratio heating radiator by heat and makes.
10. as any described electronic installation of claim 1 to 9, it is characterized in that: this electronic installation is an integrated computer, this integrated computer also comprises a pedestal, this casing is connected in the side on this pedestal, the opposite side of this pedestal is provided with a display screen, this casing comprises a plurality of sidewalls and a cover plate that extends from a side of this pedestal, and described ventilating opening is located on the described sidewall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101757222A CN102253698A (en) | 2010-05-18 | 2010-05-18 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101757222A CN102253698A (en) | 2010-05-18 | 2010-05-18 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102253698A true CN102253698A (en) | 2011-11-23 |
Family
ID=44981002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101757222A Pending CN102253698A (en) | 2010-05-18 | 2010-05-18 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102253698A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111246705A (en) * | 2018-11-29 | 2020-06-05 | 广州力及热管理科技有限公司 | Thermal management system of thin electronic device |
| CN111491483A (en) * | 2019-01-29 | 2020-08-04 | 康舒科技股份有限公司 | High power density power supply device for vehicle |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6038128A (en) * | 1998-07-14 | 2000-03-14 | Dell U.S.A., L.P. | Computer and computer/docking assembly with improved internal cooling |
| CN1819755A (en) * | 2005-02-08 | 2006-08-16 | 株式会社东芝 | Heat radiating apparatus in electronic device and heat radiating method |
| US20070095510A1 (en) * | 2005-11-03 | 2007-05-03 | Foxconn Technology Co., Ltd. | Heat-pipe type heat sink |
| US7312992B2 (en) * | 2004-11-30 | 2007-12-25 | General Electric Company | Apparatus and method for transferring heat from processors |
-
2010
- 2010-05-18 CN CN2010101757222A patent/CN102253698A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6038128A (en) * | 1998-07-14 | 2000-03-14 | Dell U.S.A., L.P. | Computer and computer/docking assembly with improved internal cooling |
| US7312992B2 (en) * | 2004-11-30 | 2007-12-25 | General Electric Company | Apparatus and method for transferring heat from processors |
| CN1819755A (en) * | 2005-02-08 | 2006-08-16 | 株式会社东芝 | Heat radiating apparatus in electronic device and heat radiating method |
| US20070095510A1 (en) * | 2005-11-03 | 2007-05-03 | Foxconn Technology Co., Ltd. | Heat-pipe type heat sink |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111246705A (en) * | 2018-11-29 | 2020-06-05 | 广州力及热管理科技有限公司 | Thermal management system of thin electronic device |
| CN111491483A (en) * | 2019-01-29 | 2020-08-04 | 康舒科技股份有限公司 | High power density power supply device for vehicle |
| CN111491483B (en) * | 2019-01-29 | 2022-08-19 | 康舒科技股份有限公司 | High power density power supply device for vehicle |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111123 |