TWM501091U - Structure of support for temperature-equalisation plate - Google Patents

Description

Mean temperature plate support structure

The present invention provides a temperature equalizing plate, in particular a temperature equalizing plate support structure which can improve the support and reduce the manufacturing cost.

Current mobile devices, personal computers, servers, communication chassis or other systems or devices are improved in computing efficiency, and the heat generated by their internal computing units is also increased. Therefore, a heat sink unit is required to assist in heat dissipation. Most of the operators choose heat sinks, heat pipes, temperature equalizing plates and other heat dissipating components to match the fan for auxiliary heat dissipation. When encountering a large area for heat dissipation, they use the uniform temperature plate to absorb heat and use the heat sink and cooling fan to force heat dissipation. The heat dissipating components need to be closely adhered to prevent the occurrence of thermal resistance, and the uniform temperature plate is a flat plate body, and a chamber for providing a vapor-liquid circulation is internally disposed for heat conduction, and the flat temperature is prevented. After the plate is subjected to pressure or heat to expand or deform, a plurality of support columns are arranged in the chamber as a chamber for supporting the temperature equalizing plate.

The uniform temperature plate is a heat transfer between the surface and the surface, and in the foregoing description, in order to prevent the temperature expansion plate from being thermally expanded or crushed by external force, a plurality of support columns are provided, but in the process, additional manufacturing man-hours and manufacturing are required. Cost (supporting cylinder), and if a plurality of external copper rings are combined to form a sintered ring, the copper column serves as a supporting action, the sintered ring is only used as a recirculation cycle, and the bottom flatness control is not easy, or a multi-groove copper column is used, the multi-groove The copper column acts as a support and recirculation cycle, and its bottom is flat The same degree of control is not easy to control, or the support cylinder and the vapor channel or the flow channel are directly etched on the plate body, but the time required for etching is relatively increased, and the deeper the depth, the longer the processing time is. And it is necessary to relatively increase the manufacturing man-hours through processes such as cleaning and drying.

Therefore, although the conventional technology solves the problems of deformation and the like, but increases the manufacturing man-hours and costs, and the difficulty in controlling the bottom flatness, it is still necessary to discuss the problem of how to reduce the manufacturing cost.

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a uniform temperature plate support structure, comprising: a first plate body and a second plate body and a support member and a working fluid, wherein The first board has a first side and a second side, and the second board covers the first board, and the second board has a third side and a fourth side. A chamber is formed between the three sides and the second side, and the support member is disposed in the chamber, and the support member has at least one base portion and a plurality of support portions, and the plurality of mutually connected passages are formed between the support portions. And the working fluid is filled in the chamber and flows through the first passage and the second passage; and through the creation of the uniform temperature plate support structure, the support structure can be formed by stamping to save manufacturing time and improve heat transfer. In addition to the effects of efficiency, etc., it can also solve the problems that the conventional uniform temperature plate is subjected to pressure compression deformation or the bottom flatness is difficult to control.

1‧‧‧Homothermal plate support structure

2‧‧‧ first board

21‧‧‧ first side

22‧‧‧ second side

221‧‧‧ Groove

3‧‧‧Second plate

31‧‧‧ third side

32‧‧‧ fourth side

33‧‧‧ chamber

4‧‧‧Support

41‧‧‧ base

42‧‧‧Support

43‧‧‧ passage

44‧‧‧First capillary structure

45‧‧‧Second capillary structure

5‧‧‧Working fluid

1 is a perspective exploded view of a first preferred embodiment of a structure of a uniform temperature plate support; FIG. 2 is a partial schematic view showing a first preferred embodiment of a structure of a uniform temperature plate support; FIG. The present invention is a schematic cross-sectional view of a first preferred embodiment of the present invention, and the fourth embodiment is a perspective exploded view of the second preferred embodiment of the structure of the uniform temperature plate support; 2 is a schematic cross-sectional view of a second preferred embodiment of the present invention; and FIG. 6 is a perspective exploded view of a third preferred embodiment of the structure of the uniform temperature plate support; Figure 7 is a partial schematic view showing a third preferred embodiment of the structure of the uniform temperature plate support.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

Please refer to FIG. 1 and FIG. 2 and FIG. 3 , which are perspective exploded views, partial schematic views and cross-sectional views of the first preferred embodiment of the present uniform temperature plate support structure, as shown in the figure. The temperature equalizing plate support structure 1 includes a first plate body 2 and a second plate body 3, a support body 4 and a working fluid 5; wherein the first plate body 2 has a first side 21 and a second side 22 opposite to the first side 21, and the second board 3 has a third side 31 and a fourth side 32 opposite the third side 31, wherein the second board 3 is assembled On the first plate body 2, and the first plate body 2 is assembled from the second side 22 toward the third side 31 of the second plate body 3, and the first plate body 2 is A groove 221 is formed at a position of the second side 22, and a cavity 33 is formed between the second side 22 and the third side 23, and the first plate 2 and the second plate 3 are made of a metal plate body, and The first plate body 2 and the second plate body 3 are made of a copper material or an aluminum material or a copper foil plus a graphite member or a thermally conductive conductor. In this embodiment, a copper material is used as an illustrative embodiment, but To be limited.

The support member 4 is disposed in the cavity 33 and is relatively received in the recess 221, and the support member 4 can be formed by stamping, milling, casting or other mechanical processing, and in this embodiment The support member is selected to be integrally formed by stamping, and the support member is stamped and formed with at least one base portion 41 and a plurality of support portions 42, and the position and shape of the base portion 41 and the support portion 42 are mutually formed according to requirements. In this embodiment, the base portion 41 presents a cross-web body and the third side 31 is attached to one side in a horizontal manner, and the base portion 41 is disposed on both sides of the support member 4, and the portion The support portion 42 is presented in a square manner and is extended and connected by the base portion 41. The other portion of the elongated support portion 42 is disposed in a central region of the support member 4 and the end edge is divided. The base portion 41 of the side is not extended, and the plurality of mutually communicating passages 43 are formed between the square support portion 42 at the two sides and the central elongated support portion 42, and the square support portion 42 at the two sides thereof is An array arrangement is presented, and the channels 43 are vertically staggered, and the support portions 42 may be in the form of a square or a rectangle or a trapezoid or a circular or elongated shape, and the support portion 42 is A first capillary structure 44 is disposed between the first plate body 2 and the first capillary structure 44 is disposed between the first plate body 2 and the support member 4, and the first capillary structure 44 is disposed between the first plate body 2 and the support member 4. The groove 221 is attached to one side of the first capillary structure 44, the support portion 42 is attached to the other side, and the interface between the first plate 2 and the second plate 3 is sealed and welded. The working chamber 5 is filled in the chamber 33, and the chamber 33 is vacuumed and sealed to form the temperature equalizing plate support structure 1, and the support member 4 is directly stamped. The base portion 41 and the support portion 42 are formed, and the base portion 41 and the support portion 42 can be effectively supported in the chamber 33. The first plate body 2 and the second plate body 3 are supported by the first capillary structure 44 to achieve the effect of the adsorption circulation of the working fluid 5, thereby saving the manufacturing time and improving the heat transfer by stamping and forming the support structure. In addition to the effects of efficiency, etc., it can also solve the problems that the conventional uniform temperature plate is subjected to pressure compression deformation or the bottom flatness is difficult to control.

Please refer to FIG. 4 and FIG. 5 , which are a perspective exploded view and a cross-sectional view of a second embodiment of the uniform temperature plate support structure of the present invention. As shown in the figure, the partial structure of the embodiment is the same as the foregoing. The embodiment is the same, so it will not be described here. However, the difference between the embodiment and the first embodiment is that the support member 4 and the second plate 3 have a second capillary structure 45, and the second The third side 31 is attached to one side of the capillary structure 45, and the base 41 is attached to the other side, and then the joint between the first plate 2 and the second plate 3 is sealed and welded. The working chamber 5 is filled in the chamber 33, and the chamber 33 is vacuumed and sealed to be combined into the temperature equalizing plate support structure 1, wherein the support member 4 is directly stamped and formed. The base portion 41 and the support portion 42 can effectively support the first plate body 2 and the support portion 42 in the chamber 33 by the base portion 41 and the support portion 42. The second plate body 3 simultaneously achieves the effect of the adsorption cycle of the working fluid 5 through the first capillary structure 44 and the second capillary structure 45, thereby achieving the saving of manufacturing man-hours and improving heat transfer efficiency by stamping and forming the support structure thereof. In addition to the effect, the problem that the conventional uniform temperature plate is subjected to pressure compression deformation or the bottom flatness is difficult to control can be solved.

Please refer to FIG. 6 and FIG. 7 , which are a perspective exploded view and a partial schematic view of a third embodiment of the uniform temperature plate support structure of the present invention. As shown in the figure, the partial structure of the embodiment is the first The embodiment is the same, and therefore will not be described again here. However, the difference between the embodiment and the first embodiment is that the position of the base portion 41 and the supporting portion 42 are changed from each other, and in this embodiment, The first base portion 41 of the first embodiment further extends the elongated support portion 42 to the outside, and one end of the elongated support portion 42 extending therefrom is connected to the cross-web base portion 41 and to the side base portion 41. The channel 43 is formed between the square support portions 42. However, the arrangement of the base portion 41 and the support portion 42 can be formed according to the requirements of stamping and support.

Although the present invention is disclosed in the above embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present invention. The scope of the patent application is subject to the provisions of the attached patent application.

1‧‧‧Homothermal plate support structure

2‧‧‧ first board

21‧‧‧ first side

22‧‧‧ second side

221‧‧‧ Groove

3‧‧‧Second plate

31‧‧‧ third side

32‧‧‧ fourth side

4‧‧‧Support

41‧‧‧ base

42‧‧‧Support

43‧‧‧ passage

44‧‧‧First capillary structure

Claims (10)

A uniform temperature plate support structure includes: a first plate body having a first side and a second side; a second plate body, the first plate body is assembled, and the second plate body has a third side and a fourth side, a chamber is formed between the third side and the second side; a support member is disposed in the chamber, the support member is formed with a base portion and a plurality of support portions, the support portions There are a plurality of channels that are connected to each other. The uniform temperature plate support structure according to claim 1, wherein a groove is formed at a position of the second side of the first plate body, and the support member is disposed in the groove and the support portion thereof is It is formed to extend in the second side direction. The uniform temperature plate support structure according to claim 2, wherein the support portion and the first plate body have a first capillary structure, and the first capillary structure is disposed in the groove and opposite The first board body is disposed between the first board body and the support member, and the second side of the first capillary structure is attached to the second side, and the other side is attached with the support portion. The uniform temperature plate support structure according to claim 3, wherein the base of the support member is attached to the third side. The uniform temperature plate support structure according to claim 3, wherein the support member and the second plate body have a second capillary structure, and the second capillary structure is attached to the third side on one side, and The base is attached to one side. The isothermal plate support structure according to claim 1, wherein the support portion has a geometric shape such as a square or a rectangle or a trapezoid or a circle or an elongated strip. The uniform temperature plate support structure according to claim 1, wherein the support portions are arranged in an array, and the channels are alternately staggered with each other. The uniform temperature plate support structure according to claim 1, wherein the first plate The body and the second plate system are metal plates. The uniform temperature plate support structure according to claim 6, wherein the first plate body and the second plate system are any of a copper material or an aluminum material or a copper foil plus a graphite member or a heat conductive conductor. The uniform temperature plate support structure according to claim 1, wherein the chamber is filled with a working fluid, and the working fluid flows through the passage.