CN105466263A - Uniform temperature board structure - Google Patents

Uniform temperature board structure Download PDF

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Publication number
CN105466263A
CN105466263A CN201410444381.2A CN201410444381A CN105466263A CN 105466263 A CN105466263 A CN 105466263A CN 201410444381 A CN201410444381 A CN 201410444381A CN 105466263 A CN105466263 A CN 105466263A
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China
Prior art keywords
equalizing plate
plate structure
structure according
tabular connector
arbitrary
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Granted
Application number
CN201410444381.2A
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Chinese (zh)
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CN105466263B (en
Inventor
林胜煌
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Asia Vital Components Co Ltd
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Asia Vital Components Co Ltd
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Priority to CN201410444381.2A priority Critical patent/CN105466263B/en
Publication of CN105466263A publication Critical patent/CN105466263A/en
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Publication of CN105466263B publication Critical patent/CN105466263B/en
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Abstract

The invention discloses a uniform temperature board structure. The uniform temperature board structure comprises a body provided with a chamber. The chamber is provided with a first side, a second side and a connecting body. The two axial ends of the connecting body are connected with the first side and the second side respectively. A first wick structure layer is arranged on the periphery of the radial outer side of the connecting body. The chamber is filled with operating fluid. Due to the arrangement of the connecting body, the body can be prevented from deformation caused by heating, and the effect for improving the heat conduction efficiency is achieved.

Description

Equalizing plate structure
[technical field]
A kind of equalizing plate structure, espespecially a kind of equalizing plate structure promoting temperature-uniforming plate supporting degree and heat conduction efficiency.
[background technology]
Existing running gear, PC, servomechanism, the communication machine box heat that all internal compute unit produced because operation efficiency promotes is also along with lifting, the then relative heat-sink unit that more needs carrys out its heat radiation auxiliary, most dealer selects radiator, heat pipe, the heat dissipation element collocation fans such as temperature-uniforming plate carry out auxiliary heat dissipation, and then select temperature-uniforming plate to absorb heat when running into and needing large area to dispel the heat and arrange in pairs or groups radiator and radiator fan carry out forced heat radiation, owing to needing to fit tightly the generation preventing thermal chocking between each heat dissipation element, and temperature-uniforming plate is a flat plate body, and inside arranges one provides the chamber of steam-condensate circulating to carry out heat transfer, and because producing expansion or distortion after preventing the temperature-uniforming plate of flat to be stressed or to be heated, then be provided with complex root support cylinder in chamber to use as the chamber supporting temperature-uniforming plate.
Temperature-uniforming plate is the heat transmission in a kind of face and face, and in order to prevent temperature-uniforming plate expanded by heating or external force flattening deformation be provided with plural support cylinder in aforementioned explanation, but then need additionally to increase manufacturing man-hours and manufacturing cost (support cylinder) on processing procedure, if and select plural copper post outside combination sintered ring, copper post is as supporting role, sintered ring is only as reflux cycle, its base plane degree controls not easily, or use many grooves copper post, the copper post of this many groove is with as supporting and reflux cycle effect, and also identical control is not easily for its base plane degree.
Though original technology solves the problems such as distortion but add manufacturing man-hours and cost and the control of the base plane degree problem such as not easily, therefore still for how reducing this problem of manufacturing cost deeply must beg for.
[summary of the invention]
For effectively solving the above problems, the main purpose of the present invention, a kind of equalizing plate structure is provided, comprise: a body, have a chamber, this chamber has one first side and one second side and a tabular connector, and the axial two ends of this tabular connector connect this first and second side respectively, described tabular connector radial outside periphery is provided with one first capillary structure layer, has hydraulic fluid in described chamber.
Described body has more one first plate body and one second plate body, and first and second plate body correspondence described covers and jointly defines aforementioned cavity.
Described tabular connector is a metal plate.
Described tabular connector is that a copper material or an aluminium material or heat conduction good conductor are wherein arbitrary.
Described first capillary structure layer is that an agglomerated powder opisthosoma or groove are wherein arbitrary.
Described connector is in square or rectangle is trapezoidal or circular etc. that geometry is wherein arbitrary.
Have more a heat affected zone recessed wherein arbitrary in first and second side aforementioned, described tabular connector is arranged at this heat affected zone, first and second side described is more provided with one second capillary structure layer, and second capillary structure layer of this heat affected zone is thick compared with the area thickness of other non-heat affected zones.
Described tabular connector outer rim has more plural groove.
Described first capillary structure layer is in square or rectangle is trapezoidal or circular etc. that geometry is wherein arbitrary.
Described first capillary structure layer has more an inclination angle.
Through equalizing plate structure of the present invention except the distortion of known temperature-uniforming plate expanded by heating can be solved or be stressed except compression and the problem such as supporter base plane degree is wayward, also have to reach and save manufacturing man-hours and promote the advantage persons such as hot transfer efficiency.
[brief description of drawingsfig]
Fig. 1 is the three-dimensional exploded view of the first embodiment of the equalizing plate structure of the present invention;
Fig. 2 is the constitutional diagram sectional view of the first embodiment of the equalizing plate structure of the present invention;
Fig. 3 is the constitutional diagram sectional view of the second embodiment of the equalizing plate structure of the present invention;
Fig. 4 is the constitutional diagram sectional view of the 3rd embodiment of the equalizing plate structure of the present invention;
Fig. 5 is the constitutional diagram sectional view of the 4th embodiment of the equalizing plate structure of the present invention;
Fig. 6 is the equalizing plate structure schematic diagram of the present invention.
The component name that in figure, each Reference numeral is corresponding is:
Body 1
First plate body 1a
Second plate body 1b
Chamber 11
First side 111
Second side 112
Tabular connector 12
Groove 121
First capillary structure layer 13
Inclination angle 131
Heat affected zone 14
Second capillary structure layer 15
Hydraulic fluid 2
The working fluid 21 of steam state
The working fluid 22 of liquid state
Thermal source 3
[detailed description of the invention]
Characteristic on the above-mentioned purpose of the present invention and structure and fuction thereof, will be explained according to the preferred embodiment of institute's accompanying drawings.
As shown in Figure 1, 2, be stereo decomposing and the constitutional diagram sectional view of the first embodiment of the equalizing plate structure of the present invention, as shown in the figure, described equalizing plate structure, has a body 1;
Described body 1 has a chamber 11, this chamber 11 has one first side 111 and one second side 112 and a tabular connector 12, these axial two ends of tabular connector 12 connect this first and second side 111,112 respectively, described tabular connector 12 radial outside periphery is provided with one first capillary structure layer 13, have hydraulic fluid 2 in described chamber 11, described first capillary structure layer 13 is an agglomerated powder opisthosoma.
Described body 1 has more one first plate body 1a and one second plate body 1b, and described first and second plate body 1a, 1b correspondence covers and jointly defines aforementioned cavity 11.
Described tabular connector 12 is a metal plate, and described tabular connector 12 is that a copper material or an aluminium material or heat conduction good conductor are wherein arbitrary, and the present embodiment using copper material as explanation embodiment, but is not regarded it as and is limited.
Described tabular connector 12 is in square or rectangle is trapezoidal or circular etc. that geometry is wherein arbitrary, and the present embodiment as embodiment is described using square, but is not regarded it as and is limited.
As shown in Figure 3, for the constitutional diagram sectional view of the second embodiment of the equalizing plate structure of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, therefore will repeat no more at this, only the present embodiment and aforementioned first embodiment do not exist together for this body 1 that to have more a heat affected zone 14 recessed in aforementioned first, two sides 111, 112 is wherein arbitrary, the heat affected zone 14 of the present embodiment is recessed in this first side 111, described tabular connector 12 is arranged at this heat affected zone 14, described first, two sides 111, 112 are more provided with one second capillary structure layer 15, and the second capillary structure layer 15 of this heat affected zone 14 is thick compared with the area thickness of other non-heat affected zones 14.
As shown in Figure 4, for the three-dimensional exploded view of the 3rd embodiment of the equalizing plate structure of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, therefore will repeat no more at this, only not the existing together for described tabular connector 12 outer rim has more plural groove 121 of the present embodiment and aforementioned second embodiment.
As shown in Figure 5, for the constitutional diagram sectional view of the 4th embodiment of the equalizing plate structure of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, therefore will repeat no more at this, not existing together for described first capillary structure layer 13 has more an inclination angle 131 of the present embodiment and aforementioned first embodiment, the working fluid contributing to steam state is dispersed.
As shown in Figure 6, for the equalizing plate structure schematic diagram of the present invention, described body 1 contacts with at least one thermal source 3, and select body 1 to be provided with tabular connector 12 part as the position with this thermal source 3 dominant touch, this body 1 is provided with tabular connector 12 part, this tabular connector 12 uses as support, and when both mainly can be avoided to fit tightly, body 1 produces distortion.
Moreover, when this body 1 carries out heat transfer with thermal source 3, heat is directly passed to this tabular connector 12 and arranges in pairs or groups generation steam-condensate circulating at the working fluid 2 be aided with in chamber 11 by this first plate body 1a, major heat by this tabular connector 12 as transmission, and the working fluid 22 of the working fluid 21 and this liquid state that are evaporated rear steam state by this first capillary structure layer 13 evapotranspiration and backflow, can be used and reach splendid radiating effect.

Claims (10)

1. an equalizing plate structure, comprises:
One body, have a chamber, this chamber has one first side and one second side and a tabular connector, and the axial two ends of this tabular connector connect this first and second side respectively, described tabular connector radial outside periphery is provided with one first capillary structure layer, has hydraulic fluid in described chamber.
2. equalizing plate structure according to claim 1, it is characterized in that, described body has more one first plate body and one second plate body, and first and second plate body correspondence described covers and jointly defines aforementioned cavity.
3. equalizing plate structure according to claim 1, it is characterized in that, described tabular connector is a metal plate.
4. equalizing plate structure according to claim 3, is characterized in that, described tabular connector is that a copper material or an aluminium material or heat conduction good conductor are wherein arbitrary.
5. equalizing plate structure according to claim 1, it is characterized in that, described first capillary structure layer is that an agglomerated powder opisthosoma or groove are wherein arbitrary.
6. equalizing plate structure according to claim 1, is characterized in that, described connector is in square or rectangle or trapezoidal or circular geometry is wherein arbitrary.
7. equalizing plate structure according to claim 1, have more a heat affected zone recessed wherein arbitrary in first and second side aforementioned, it is characterized in that, described tabular connector is arranged at this heat affected zone, first and second side described is more provided with one second capillary structure layer, and second capillary structure layer of this heat affected zone is thick compared with the area thickness of other non-heat affected zones.
8. equalizing plate structure according to claim 1, wherein said tabular connector outer rim has more plural groove.
9. equalizing plate structure according to claim 1, is characterized in that, described first capillary structure layer is in square or rectangle or trapezoidal or circular geometry is wherein arbitrary.
10. equalizing plate structure according to claim 1, it is characterized in that, described first capillary structure layer has more an inclination angle.
CN201410444381.2A 2014-09-03 2014-09-03 Equalizing plate structure Active CN105466263B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410444381.2A CN105466263B (en) 2014-09-03 2014-09-03 Equalizing plate structure

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Application Number Priority Date Filing Date Title
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CN105466263B CN105466263B (en) 2019-08-02

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111595187A (en) * 2020-05-11 2020-08-28 奇鋐科技股份有限公司 Composite capillary structure of vapor chamber
JPWO2020255513A1 (en) * 2019-06-21 2021-09-13 株式会社村田製作所 Vapor chamber

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CN103196242A (en) * 2013-03-27 2013-07-10 中国石油大学(华东) Glass-cover-free tubular solar thermal collector
CN203432427U (en) * 2013-07-08 2014-02-12 奇鋐科技股份有限公司 Vapor chamber structure
US20140138057A1 (en) * 2012-11-18 2014-05-22 Chin-Hsing Horng Structure of low-profile heat pipe
CN203657579U (en) * 2013-12-24 2014-06-18 讯强电子(惠州)有限公司 Temperature homogenizing plate
CN103929924A (en) * 2013-01-11 2014-07-16 奇鋐科技股份有限公司 Uniform temperature plate structure
CN204085274U (en) * 2014-09-03 2015-01-07 奇鋐科技股份有限公司 Equalizing plate structure

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101004333A (en) * 2006-01-21 2007-07-25 富准精密工业(深圳)有限公司 Plate shaped heat pipe
CN201229543Y (en) * 2008-06-27 2009-04-29 索士亚科技股份有限公司 Temperature equalizing board and support construction thereof
CN101754656A (en) * 2008-12-10 2010-06-23 富准精密工业(深圳)有限公司 Uniform temperature plate
CN101927426A (en) * 2009-06-24 2010-12-29 富准精密工业(深圳)有限公司 Uniform-temperature panel and manufacturing method thereof
CN102878844A (en) * 2011-07-15 2013-01-16 奇鋐科技股份有限公司 Temperature-uniformizing plate structure and manufacturing method for temperature-uniformizing plate
CN102956583A (en) * 2011-08-29 2013-03-06 奇鋐科技股份有限公司 Temperature equalization plate structure and manufacturing method thereof
CN202307864U (en) * 2011-09-21 2012-07-04 奇鋐科技股份有限公司 Uniform temperature plate structure
CN202511667U (en) * 2012-02-07 2012-10-31 深圳市万景华科技有限公司 Temperature homogenizing plate
US20140138057A1 (en) * 2012-11-18 2014-05-22 Chin-Hsing Horng Structure of low-profile heat pipe
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CN103196242A (en) * 2013-03-27 2013-07-10 中国石油大学(华东) Glass-cover-free tubular solar thermal collector
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2020255513A1 (en) * 2019-06-21 2021-09-13 株式会社村田製作所 Vapor chamber
CN111595187A (en) * 2020-05-11 2020-08-28 奇鋐科技股份有限公司 Composite capillary structure of vapor chamber

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