CN203432427U - Vapor chamber structure - Google Patents
Vapor chamber structure Download PDFInfo
- Publication number
- CN203432427U CN203432427U CN201320404020.6U CN201320404020U CN203432427U CN 203432427 U CN203432427 U CN 203432427U CN 201320404020 U CN201320404020 U CN 201320404020U CN 203432427 U CN203432427 U CN 203432427U
- Authority
- CN
- China
- Prior art keywords
- condensing zone
- plate structure
- equalizing plate
- evaporating area
- contrary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a vapor chamber structure and a manufacturing method of the vapor chamber structure. The vapor chamber structure comprises a body, a capillary structure and working fluid. The body is provided with a condensation area, an evaporation area and a chamber. The condensation area and the evaporation area are arranged on the two sides of the chamber respectively. The evaporation area is provided with a first side face and a second side face, and the first side face is provided with a protruded part. The capillary structure is arranged on the inner surface of the chamber, and the working fluid is filled into the chamber. The protruded part is formed in a machining mode and plays a role in supporting the structure and improving the strength of the structure, and cost can be reduced substantially for a manufacturer.
Description
Technical field
The utility model belongs to a kind of equalizing plate structure, relates in particular to a kind of equalizing plate structure that can significantly reduce manufacturing cost.
Background technology
With existing electronic equipment, using gradually the frivolous publicity as bragging about, thus each item all must with minification, but the size of electronic equipment is dwindled the heat of following and producing, and becomes the major obstacle of electronic equipment and system enhancement performance.The semiconductor dimensions that no matter forms electronic component is constantly dwindled, and still requires constantly to increase performance.
When semiconductor dimensions is dwindled, result heat flux increases, it is only all increases of heat that heat flux increase cause surpasses the cooling challenge of product, overheated because the increase of heat flux causes at different time and the meeting of different length size, may cause electronic failure or damage.
So those skilled in the art are for solving above-mentioned prior art because of the narrow and small problem of heat-dissipating space, a kind of VC (Vapor chamber) Heat Sink of usining is placed in chip top and uses as radiator, in order to increase capillary limitation, utilize copper post coating sintering, sintering post, the capillary structures such as foaming column are used for supporting as backflow road, but due to lower wall thickness on micro-temperature-uniforming plate thinner (1.5mm applies below), utilize above-mentioned this capillary structure as the conventional construction supporting in being applied on micro-temperature-uniforming plate, can cause this micro-temperature-uniforming plate having copper post, the ground of sintering post or foaming column has support just now, and all the other are provided with, do not locate to form collapse limit or depression, cause integral planar degree and the intensity of this micro-equalizing plate structure to maintain, therefore cannot realize slimming.
Working fluid in above-mentioned temperature-uniforming plate is when the territory that is heated by evaporation region produces evaporation, working fluid is converted to steam state by liquid state, the working fluid of steam state transforms into liquid state by steam state condensation to the condenser zone of temperature-uniforming plate, be back to again evaporation region and continue circulation, the condenser zone of temperature-uniforming plate is generally shiny surface, or for thering is the capillary structure aspect of sintering, the working fluid of steam state is condensed into after liquid droplet shape in this condenser zone, because the relation of gravity or capillary structure makes to be back to evaporation region, but the structure of aforementioned known condenser zone is owing to being to be shiny surface, cause the condensed liquid globule need store up to a constant volume just now according to vertical of gravity, cause its backflow efficiency real inadequate, and because of liquid working fluid reflux rate excessively slow, make fluid free in evaporation region and produce the state of dry combustion method, make heat conduction efficiency significantly reduce, if it is known indispensable structure that the backflow efficiency of reinforcement working fluid is set up capillary structure, but the setting of this capillary structure (as sintered body or grid) makes temperature-uniforming plate cannot realize the effect of slimming.
Slimming hot plate is mainly by etched mode, in this plate body, to offer groove to do capillary structure or on plate body, form supporting construction, but because etched shortcoming is that precision does not live, and add and expend time in man-hour, make slimming hot plate or temperature-uniforming plate manufacturing cost reduce.
Utility model content
The utility model, for solving the shortcoming of above-mentioned prior art, provides a kind of equalizing plate structure that reduces manufacturing cost.
For reaching above-mentioned purpose the utility model, provide a kind of equalizing plate structure, comprising: a body, there is a condensing zone and an evaporating area and a chamber, described condensing zone and this evaporating area are divided into the both sides of this chamber; One protuberance is to select by this evaporating area or condensing zone arbitrary protruding institute configuration wherein; One capillary structure, is located at aforementioned cavity surface; One working fluid, is filled in aforementioned cavity.
Preferably, described protuberance has a plurality of convex bodys, and described convex body extends institute by this evaporating area to the direction of contrary this evaporating area and forms, and the periphery place correspondence of the adjacent described convex body of this body is concavity.
Preferably, described protuberance has a plurality of convex bodys, and described convex body is by this condensing zone, to the direction of contrary this condensing zone, to extend institute to form, and the periphery place correspondence of the adjacent described convex body of this body is concavity.
Preferably, described body has first and second plate body correspondence described in one first plate body and one second plate body and covers and jointly define aforementioned cavity, and described condensing zone is located at this first plate body one side, and this second plate body one side is located in this evaporating area.
Preferably, described body is a flat-shaped body.
Preferably, described convex body has a free end, and this free end is connected with this condensing zone, between described convex body and this condensing zone, has aforementioned capillary structure.
Preferably, described protuberance has a plurality of convex bodys, and described convex body is by this evaporating area, to the direction of contrary this evaporating area, to extend institute to form, and the opposite side place correspondence of the contrary described convex body of this body is concavity.
Preferably, described protuberance has a plurality of convex bodys, and described convex body is by this condensing zone, to the direction of contrary this condensing zone, to extend institute to form, and the opposite side place correspondence of the contrary described convex body of this body is concavity.
By the utility model, can significantly reduce the manufacturing cost of temperature-uniforming plate, and further can promote accuracy of manufacture person.
Accompanying drawing explanation
Fig. 1 is the three-dimensional exploded view of the utility model equalizing plate structure the first embodiment;
Fig. 2 is the three-dimensional combination figure of the utility model equalizing plate structure the first embodiment;
Fig. 3 is the cutaway view of novel equalizing plate structure the first embodiment of this real friend;
Fig. 4 is the cutaway view of the utility model equalizing plate structure the second embodiment;
Fig. 5 is the cutaway view of the novel equalizing plate structure of this real friend the 3rd embodiment;
Fig. 6 is the cutaway view of the utility model equalizing plate structure the 4th embodiment;
Fig. 7 is the flow chart of steps of the utility model equalizing plate structure manufacture method the first embodiment;
Fig. 8 is the flow chart of steps of the utility model equalizing plate structure manufacture method the second embodiment;
Fig. 9 is the flow chart of steps of novel equalizing plate structure manufacture method the 3rd embodiment of this real friend;
Figure 10 is the flow chart of steps of the utility model equalizing plate structure manufacture method the 4th embodiment.
[symbol description]
The first plate body lla
The second plate body llb
Convex body 1111
Free end 11lla
Working fluid 3
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail:
Referring to the 1st, 2,3 figure, is stereo decomposing and combination and the cutaway view of equalizing plate structure the first embodiment of the present invention, and as shown in the figure, described equalizing plate structure is to comprise: a body 11, a protuberance 111, a capillary structure 2, a working fluid 3;
Described body 11 has a condensing zone 112 and an evaporating area 113 and a chamber 114, and described body 11 has more first and second plate body 11a described in one first plate body 11a and one second plate body 11b, 11b correspondence covers and jointly define aforementioned cavity 114, described condensing zone 112 is located at this first plate body 11a mono-side, this second plate body 11b mono-side is located in this evaporating area 113, and described condensing zone 112 and this evaporating area 113 are divided into the both sides of this chamber 114 mutually corresponding.
Described protuberance 111 is to select by this evaporating area 113 or condensing zone 112 arbitrary or the two (evaporating area 113 wherein, condensing zone 112) protruding institute configuration all, the described protuberance 111 of the present embodiment has a plurality of convex bodys 1111, described convex body 1111 is by this evaporating area 113, to the direction of contrary this evaporating area 113, to prolong secondary institute to form, and this convex body 1111 has a free end 1111a, this free end 1111a is connected with aforementioned condensing zone 112, the periphery place of the adjacent described convex body 1111 of this body 11 is that correspondence is concavity, the described convex body 1111 of the present embodiment is by pressing the moulding of sludge ice method institute, therefore another side-line of described convex body 1111 is flat condition.
Described capillary structure 2 is located at aforementioned cavity 114 surfaces, and 112 of described convex body 1111 and this condensing zones have aforementioned capillary structure 2, and this working fluid 3 is filled in aforementioned cavity 114.
Refer to the 4th figure, it is the cutaway view of equalizing plate structure the second embodiment of the present invention, as shown in the figure, the present embodiment is identical with aforementioned the first embodiment part-structure technical characterictic, therefore will repeat no more at this, only this example and not existing together of aforementioned the first embodiment are that the relative opposite side of a plurality of convex bodys 1111 of described evaporating area 113 is to be concavity.
Refer to the 5th figure, cutaway view for equalizing plate structure of the present invention the 3rd embodiment, as shown in the figure, the present embodiment system is identical with aforementioned the first embodiment part-structure technical characterictic, therefore will repeat no more at this, only this example is for described protuberance 111 has a plurality of convex bodys 1111 with not existing together of aforementioned the first embodiment, and described convex body 1111 is by this condensing zone 112, to the direction of contrary this condensing zone 112, to extend institute to form, and the periphery place correspondence of the adjacent described convex body 1111 of this body 11 is concavity.
Refer to the 6th figure, cutaway view for equalizing plate structure of the present invention the 4th embodiment, as shown in the figure, the present embodiment is identical with aforementioned first, second and third embodiment part-structure technical characterictic, therefore at this, will repeat no more, only this example and aforementioned first, second and third embodiment do not exist together for described body 11 be a flat-shaped body.
Referring to the 7th figure, is the flow chart of steps of equalizing plate structure manufacture method the first embodiment of the present invention, and consults in the lump aforementioned 1st～6 figure, and as shown in the figure, described equalizing plate structure manufacture method, comprises the following step:
S1: one first plate body and one second plate body are provided;
One first plate body 11a and one second plate body 11b are provided, and described first and second polar body 11a, 11b are for thermal conductive property material preferably, as copper or aluminium material.
S2: select in aforementioned first and second plate body at least one convex body of arbitrary moulding wherein by the mode of machining;
By select at least one convex body 1111 of arbitrary upper moulding wherein in aforementioned first and second plate body 11a, 11b in the mode of machining, described machining may be selected to be punch process or embossing processing or forges processing wherein arbitrary, described punch process also can select to press sludge ice method or compression moulding or raising method wherein either type form this convex body.
S3: first and second plate body correspondence is covered, it is all around sealed and vacuumized and the operation of inserting working fluid.
Will be by after machining moulding convex body 1111, first and second plate body 11a, 11b correspondence being covered, and this first and second plate body 11a, 11b are sealed in the mode of welding or diffusion bond, and vacuumize and insert the operations such as working fluid 3.Refer to the 8th figure, be the flow chart of steps of equalizing plate structure manufacture method the second embodiment of the present invention, and consult in the lump 1st～6 figure, as shown in the figure, described equalizing plate structure manufacture method, comprises the following step:
S1: one first plate body and one second plate body are provided;
S2: select in aforementioned first and second plate body at least one convex body of arbitrary moulding wherein by the mode of machining;
S3: first and second plate body correspondence is covered, it is all around sealed and vacuumized and the operation of inserting working fluid.
The present embodiment part steps is identical with aforementioned the first embodiment, therefore will repeat no more at this, only not existing together of wooden embodiment and aforementioned the first embodiment is described step S2: by the mode of machining, select wherein to have more a step S4 after this step of at least one convex body of arbitrary moulding in aforementioned first and second plate body:.
Described capillary structure 2 can be selected sintered powder structure or the mode inserting grid body or offer groove arranges capillary structure 2 in addition in this first and second plate body 11a, 11b.
Refer to the 9th figure, be the flow chart of steps of equalizing plate structure manufacture method the 3rd embodiment of the present invention, and consult in the lump 1st～6 figure, as shown in the figure, described equalizing plate structure manufacture method, comprises the following step:
A1: a flat body is provided;
It is the flat body of open shape that at least one end is provided.
A2: the mode by machining is at least one convex body of the inner side moulding of light-emitting diode body;
By selecting in the mode of machining at least one convex body 1111 of the inner side moulding of light-emitting diode body, described machining be may be selected to be punch process or embossing processing or forge processing wherein arbitrary, described punch process also can select to press sludge ice method or compression moulding or raising method wherein either type form this convex body l111.
A3: by this body closed at both ends and vacuumize and the operation of inserting working fluid.
The one end that is open shape by this flat body after machining moulding convex body is sealed in the mode of welding or diffusion bond, and vacuumized and insert the operations such as working fluid.
Refer to the 10th figure, be the flow chart of steps of equalizing plate structure manufacture method the 4th embodiment of the present invention, and consult in the lump 1st～6 figure, as shown in the figure, described equalizing plate structure manufacture method, comprises the following step:
A1: a flat body is provided;
A2: the mode by machining is at least one convex body of the inner side moulding of light-emitting diode body;
A3: by this body closed at both ends and vacuumize and the operation of inserting working fluid.
The present embodiment part steps system is identical with aforementioned the 3rd embodiment, therefore will repeat no more at this, only not existing together of the present embodiment and aforementioned the first embodiment is steps A 2: the mode by machining has more a steps A 4 after this step of at least one convex body of the inner side moulding of light-emitting diode body: in inner moulding one capillary structure 2 of this body, described capillary structure 2 can be selected sintered powder structure or the mode inserting grid body or offer groove arranges capillary structure 2 in addition in this body inside.
Machining described in above embodiment all may be selected to be punch process or embossing processing or forges processing or roll that to roll over processing or mint-mark processing or casting processing wherein arbitrary.
By equalizing plate structure of the present invention and manufacture method thereof, can further provide a kind of while saving worker and the equalizing plate structure and the manufacture method that promote the accuracy of manufacture.
Claims (8)
1. an equalizing plate structure, is characterized in that, comprising:
One body, has a condensing zone and an evaporating area and a chamber, and described condensing zone and this evaporating area are divided into the both sides of this chamber;
One protuberance, selects by this evaporating area or condensing zone arbitrary protruding institute configuration wherein;
One capillary structure, is located at aforementioned cavity surface;
One working fluid, is filled in aforementioned cavity.
2. equalizing plate structure as claimed in claim 1, is characterized in that, wherein said protuberance has a plurality of convex bodys, and described convex body is by this evaporating area, to the direction of contrary this evaporating area, to extend institute to form, and the periphery place correspondence of the adjacent described convex body of this body is concavity.
3. equalizing plate structure as claimed in claim 1, is characterized in that, wherein said protuberance has a plurality of convex bodys, and described convex body is by this condensing zone, to the direction of contrary this condensing zone, to extend institute to form, and the periphery place of the adjacent described convex body of this body is that correspondence is concavity.
4. equalizing plate structure as claimed in claim 1, it is characterized in that, wherein said body has one first plate body and one second plate body, described first and second plate body correspondence covers and jointly defines aforementioned cavity, described condensing zone is located at this first plate body one side, and this second plate body one side is located in this evaporating area.
5. equalizing plate structure as claimed in claim 1, is characterized in that, wherein said body is a flat-shaped body.
6. equalizing plate structure as claimed in claim 2, is characterized in that, wherein said convex body has a free end, and this free end is connected with this condensing zone, between described convex body and this condensing zone, has aforementioned capillary structure.
7. equalizing plate structure as claimed in claim 1, is characterized in that, wherein said protuberance has a plurality of convex bodys, and described convex body is by this evaporating area, to the direction of contrary this evaporating area, to extend institute to form, and the opposite side place of the contrary described convex body of this body is that correspondence is concavity.
8. equalizing plate structure as claimed in claim 1, is characterized in that, wherein said protuberance has a plurality of convex bodys, and described convex body is by this condensing zone, to the direction of contrary this condensing zone, to extend institute to form, and the opposite side place correspondence of the contrary described convex body of this body is concavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320404020.6U CN203432427U (en) | 2013-07-08 | 2013-07-08 | Vapor chamber structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320404020.6U CN203432427U (en) | 2013-07-08 | 2013-07-08 | Vapor chamber structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203432427U true CN203432427U (en) | 2014-02-12 |
Family
ID=50061461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320404020.6U Expired - Lifetime CN203432427U (en) | 2013-07-08 | 2013-07-08 | Vapor chamber structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203432427U (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104279899A (en) * | 2013-07-08 | 2015-01-14 | 奇鋐科技股份有限公司 | Uniform temperature plate structure and manufacturing method thereof |
| CN104976909A (en) * | 2014-04-04 | 2015-10-14 | 奇鋐科技股份有限公司 | Uniform-temperature plate structure and manufacturing method thereof |
| CN105277032A (en) * | 2015-10-21 | 2016-01-27 | 上海利正卫星应用技术有限公司 | High-power and low-heat-resistance temperature evening plate |
| CN105466263A (en) * | 2014-09-03 | 2016-04-06 | 奇鋐科技股份有限公司 | Uniform temperature board structure |
| CN105722372A (en) * | 2014-12-05 | 2016-06-29 | 奇鋐科技股份有限公司 | Temperature-equalization plate support body structure |
| CN105865241A (en) * | 2016-04-11 | 2016-08-17 | 广州华钻电子科技有限公司 | Ultrathin soaking plate and manufacturing method thereof |
| CN106996710A (en) * | 2016-01-25 | 2017-08-01 | 昆山巨仲电子有限公司 | Thin type equalizing plate structure |
| CN108302968A (en) * | 2018-02-23 | 2018-07-20 | 奇鋐科技股份有限公司 | Temperature-uniforming plate water filling portion's edge sealing structure and its manufacturing method |
| CN109870054A (en) * | 2017-12-04 | 2019-06-11 | 泰硕电子股份有限公司 | Without gas removing pipe samming board fabrication method |
| US11306975B2 (en) | 2018-02-13 | 2022-04-19 | Asia Vital Components Co., Ltd. | Vapor chamber water-filling section sealing structure |
-
2013
- 2013-07-08 CN CN201320404020.6U patent/CN203432427U/en not_active Expired - Lifetime
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104279899A (en) * | 2013-07-08 | 2015-01-14 | 奇鋐科技股份有限公司 | Uniform temperature plate structure and manufacturing method thereof |
| CN104976909A (en) * | 2014-04-04 | 2015-10-14 | 奇鋐科技股份有限公司 | Uniform-temperature plate structure and manufacturing method thereof |
| CN105466263A (en) * | 2014-09-03 | 2016-04-06 | 奇鋐科技股份有限公司 | Uniform temperature board structure |
| CN105466263B (en) * | 2014-09-03 | 2019-08-02 | 奇鋐科技股份有限公司 | Equalizing plate structure |
| CN105722372A (en) * | 2014-12-05 | 2016-06-29 | 奇鋐科技股份有限公司 | Temperature-equalization plate support body structure |
| CN105722372B (en) * | 2014-12-05 | 2019-03-08 | 奇鋐科技股份有限公司 | Supporter structure of soaking plate |
| CN105277032A (en) * | 2015-10-21 | 2016-01-27 | 上海利正卫星应用技术有限公司 | High-power and low-heat-resistance temperature evening plate |
| CN105277032B (en) * | 2015-10-21 | 2018-08-28 | 上海利正卫星应用技术有限公司 | High power low thermal resistance temperature-uniforming plate |
| CN106996710B (en) * | 2016-01-25 | 2018-11-23 | 昆山巨仲电子有限公司 | Thin type equalizing plate structure |
| CN106996710A (en) * | 2016-01-25 | 2017-08-01 | 昆山巨仲电子有限公司 | Thin type equalizing plate structure |
| CN105865241B (en) * | 2016-04-11 | 2018-07-24 | 广州华钻电子科技有限公司 | A kind of ultra-thin soaking plate and preparation method thereof |
| CN105865241A (en) * | 2016-04-11 | 2016-08-17 | 广州华钻电子科技有限公司 | Ultrathin soaking plate and manufacturing method thereof |
| CN109870054A (en) * | 2017-12-04 | 2019-06-11 | 泰硕电子股份有限公司 | Without gas removing pipe samming board fabrication method |
| US11306975B2 (en) | 2018-02-13 | 2022-04-19 | Asia Vital Components Co., Ltd. | Vapor chamber water-filling section sealing structure |
| US11525635B2 (en) | 2018-02-13 | 2022-12-13 | Asia Vital Components Co., Ltd. | Vapor chamber water-filling section sealing structure |
| CN108302968A (en) * | 2018-02-23 | 2018-07-20 | 奇鋐科技股份有限公司 | Temperature-uniforming plate water filling portion's edge sealing structure and its manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203432427U (en) | Vapor chamber structure | |
| CN104279899A (en) | Uniform temperature plate structure and manufacturing method thereof | |
| CN104976909A (en) | Uniform-temperature plate structure and manufacturing method thereof | |
| US8286693B2 (en) | Heat sink base plate with heat pipe | |
| CN101026946B (en) | Loop heat-conducting device | |
| US20110005727A1 (en) | Thermal module and manufacturing method thereof | |
| CN105722372B (en) | Supporter structure of soaking plate | |
| CN101738114B (en) | Flat plate type heat pipe and manufacture method thereof | |
| CN101478868A (en) | Heat radiating device and manufacturing process thereof | |
| US20170082377A1 (en) | Heat dissipation device | |
| US20170080533A1 (en) | Heat dissipation device manufacturing method | |
| CN201364062Y (en) | Sintering-type thermotube-type soaking board with convex platform | |
| TW201822621A (en) | Heat dissipation device having heat pipes in parallel arrangement and manufacturing method thereof capable of achieving excellent heat conduction effect and bonding strength | |
| US20170246712A1 (en) | Manufacturing method of vapor chamber | |
| CN205609497U (en) | Packaging structure with little heat pipe cooling frame | |
| CN101907416A (en) | Heat radiating plate and manufacture method thereof | |
| CN203224159U (en) | Heat pipe structure | |
| CN202254982U (en) | Thin heat pipe structure | |
| CN104034192B (en) | Heat pipe structure | |
| CN203967068U (en) | Be applicable to the heat abstractor of heater members | |
| CN102623421B (en) | Micro temperature-uniforming plate structure | |
| CN202679890U (en) | High-efficiency heat radiation device | |
| CN209930774U (en) | Side separation type phase change temperature-uniforming plate and radiator | |
| TW201502457A (en) | Vapor chamber structure and manufacturing method thereof | |
| CN100367492C (en) | Method for making radiating structure of rectifier |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140212 |
|
| CX01 | Expiry of patent term |