CN102623421B - Micro temperature-uniforming plate structure - Google Patents
Micro temperature-uniforming plate structure Download PDFInfo
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- CN102623421B CN102623421B CN201110029124.9A CN201110029124A CN102623421B CN 102623421 B CN102623421 B CN 102623421B CN 201110029124 A CN201110029124 A CN 201110029124A CN 102623421 B CN102623421 B CN 102623421B
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- condensation part
- plate structure
- convex body
- equalizing plate
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Abstract
A micro temperature-uniforming plate structure, comprising: a first plate body, and a second plate body. The first plate body possesses a condensing zone which is formed by a plurality of convex bodies, the second plate body possesses a plurality of catchment and an evaporation zone. The condensing zone corresponds to the catchment and the evaporation zone, the first plate body and the second plate body are covered correspondingly, the working fluid after being cooled can be rapidly concentrated through the convex body, and then accelerated and refluxed to the evaporation zone in order to improve a vapor liquid circulation of the working fluid.
Description
Technical field
A kind of micro-equalizing plate structure, espespecially a kind of condenser zone in micro-temperature-uniforming plate is provided with can for concentrating the convex body hanging down and drip fast by condensed working fluid, to accelerate working fluid return to evaporating area, and then promote micro-equalizing plate structure of steam-condensate circulating efficiency of micro-temperature-uniforming plate.
Background technology
With existing electronic equipment gradually using the frivolous demand as bragging about, therefore every assembly all must reduce its size thereupon, but the thermal change that the size of electronic equipment reduces with and produces becomes the major obstacle of electronic equipment and system enhancement performance.The semiconductor dimensions no matter forming electronic building brick constantly reduces, and still requires constantly to increase performance.
When semiconductor dimensions reduces, result heat flux increases, heat flux increases institute and causes that the challenge that product cools to be exceeded be only all hot increases because the increase of heat flux cause can be overheated at different time and different length size, electronic failure or damage may be caused.
For solving above-mentioned prior art because of the narrow and small problem of heat-dissipating space, therefore be placed in above chip using a kind of VC (Vaporchamber) Heat Sink and use as radiator, in order to increase capillary limitation, copper post coating is utilized to sinter, sintering post, the capillary structures such as foaming column are in order to support as backflow road, but due to lower wall thickness on micro-temperature-uniforming plate thinner (below 1.5mm applies), utilize this capillary structure above-mentioned as the existing structure supported in being applied on micro-temperature-uniforming plate, this existing micro-temperature-uniforming plate can be caused to have copper post, just there is support at the place of sintering post or foaming column, and all the other be not provided with part namely formed collapse limit or depression, the integral planar degree of this micro-equalizing plate structure and intensity is caused to maintain, therefore slimming cannot be realized.
Working fluid in aforementioned temperature-uniforming plate is when producing evaporation by evaporation region by thermal domain, working fluid is converted to steam state by liquid state, the working fluid of steam state transforms into liquid state by steam state condensation to the condenser zone of temperature-uniforming plate, reflux again in evaporation region and continue circulation, the condenser zone of temperature-uniforming plate is generally shiny surface, or for having the capillary structure aspect of sintering, the working fluid of steam state is after this condenser zone is condensed into liquid droplet shape, because the relation of gravity or capillary structure makes to be back to evaporation region, but the structure of aforementioned existing condenser zone is owing to being shiny surface, cause the condensed liquid globule need store up to a constant volume just now according to vertical of gravity, cause its backflow efficiency real inadequate, and because of gaseous working fluid reflux rate excessively slow, make fluid free in evaporation region and produce the state of dry combustion method, heat conduction efficiency is made significantly to reduce, if it is then structure indispensable at present that the backflow efficiency strengthening working fluid then sets up capillary structure, but the setting of this capillary structure (as sintered body or grid) then makes temperature-uniforming plate cannot realize effect of slimming, therefore prior art has its own shortcomings:
1. working fluid return is excessively slow;
2. heat is preached efficiency difference;
3. slimming cannot be realized.
Summary of the invention
For effectively solving the above problems, the invention provides a kind of micro-equalizing plate structure of slimming.
Another object of the present invention, provides a kind of micro-equalizing plate structure significantly promoting steam-condensate circulating efficiency.
In order to achieve the above object, the invention provides a kind of micro-equalizing plate structure and at least one thermal source collocation group is established, this micro-equalizing plate structure, comprises: the first plate body, second plate body; This first plate body has first side and second side, and this first side has at least one condensing zone, and this condensing zone has plural convex body; This second plate body has the 3rd side and the 4th side, and the 3rd side is corresponding with aforementioned first side to be covered, and the 3rd side has plural afflux district and at least one evaporating area, and the 4th side and aforementioned thermal source are sticked.
Through the setting of this condensing zone plural number convex body, the working fluid of steam state can be made to obtain when condensing zone condensation is converted to liquid state collect rapidly and quick backflow to these afflux district and evaporating area, also follow significantly to promote the inner overall vapour-liquid of micro-temperature-uniforming plate; Therefore the present invention has following advantages:
1. structure is simple;
2. realize slimming;
3. heat conduction efficiency is high.
Accompanying drawing explanation
1st figure is the three-dimensional exploded view of micro-equalizing plate structure first embodiment of the present invention;
2nd figure is the three-dimensional combination figure of micro-equalizing plate structure first embodiment of the present invention;
3rd figure is the assembled sectional view of micro-equalizing plate structure first embodiment of the present invention;
4th figure is the first plate body cutaway view of micro-equalizing plate structure second embodiment of the present invention;
5th figure is the first plate body cutaway view of micro-equalizing plate structure the 3rd embodiment of the present invention;
6th figure is the first plate body cutaway view of micro-equalizing plate structure the 4th embodiment of the present invention;
7th figure is the first plate body cutaway view of micro-equalizing plate structure the 5th embodiment of the present invention;
8th figure is the first plate body cutaway view of micro-equalizing plate structure the 6th embodiment of the present invention;
9th figure is the first plate body cutaway view of micro-equalizing plate structure the 7th embodiment of the present invention;
10th figure is the enforcement schematic diagram of the micro-equalizing plate structure of the present invention.
Primary clustering symbol description
Thermal source 1
Micro-temperature-uniforming plate 2
First plate body 21
First side 211
Second side 212
Condensing zone 213
First condensation part 2131
Spacing 2131a
Second condensation part 2132
Spacing 2132a
3rd condensation part 2133
Spacing 2133a
Convex body 214
Groove 2141
Groove 2142
Sintered powder ring body 215
Groove 2151
Second plate body 22
3rd side 221
Afflux district 2211
Runner 2211a
Evaporating area 2212
Runner 2212a
4th side 222
Working fluid 3
Gaseous working fluid 31
Steam state working fluid 32
Embodiment
Characteristic on above-mentioned purpose of the present invention and structure and fuction thereof, is explained the preferred embodiment according to institute's accompanying drawings.
Refer to the 1st, 2,3 figure are the stereo decomposing of micro-equalizing plate structure first embodiment of the present invention and constitutional diagram and cutaway view, as shown in the figure, micro-temperature-uniforming plate of the present invention and at least one thermal source 1 collocation group are established, and this micro-temperature-uniforming plate 2 structure, comprises: first plate body 21, second plate body 22;
Described first plate body 21 has first side 211 and second side 212, this first side 211 has at least one condensing zone 213, and this condensing zone 213 has plural convex body 214, this convex body can be set as not isometrical kenel, and end can be set as sharp end in order to vertical, described convex body 214 is a copper post.
Described condensing zone 213 has more at least one first condensation part 2131 and at least one the second condensation part 2132, first and second condensation part 2131,2132 described is made up of plural convex body 214, and this both sides, the first condensation part 2131 are located in this second condensation part 2132, and the convex body 214 of this second condensation part 2132 height is cumulative to this first condensation part 2131, mean convex body 214 height of convex body 214 height higher than this second condensation part 2132 of described first condensation part 2131.
Described second plate body 22 has the 3rd side 221 and the 4th side 222,3rd side 221 is corresponding with aforementioned first side 211 to be covered, 3rd side 221 has plural afflux district 2211 and at least one evaporating area 2212,4th side 222 is sticked with aforementioned thermal source 1, described afflux district 2211 and evaporating area 2212 have plural runner 2211a, 2212a, and described afflux district 2211 is positioned at outside this evaporating area 2212.
Refer to the first plate body cutaway view that the 4th figure is micro-equalizing plate structure second embodiment of the present invention, as shown in the figure, the present embodiment is identical with aforementioned first embodiment part-structure, therefore do not repeat them here, only the present embodiment and aforementioned first embodiment do not exist together for described condensing zone 213 has more first condensation part 2131 and second condensation part 2132 and the 3rd condensation part 2133, described second condensation part 2132 and the 3rd condensation part 2133 are located at this both sides, the first condensation part 2131 respectively, and this first, two, three condensation parts 2131, 2132, 2133 are defined jointly by plural convex body 214 respectively, these convex bodys 214 spacing 2131a to each other more aforementioned second in described first condensation part 2131, three condensation parts 2132, these convex bodys 214 spacing 2132a to each other of 2133, 2133a is intensive.
Refer to the first plate body cutaway view that the 5th figure is micro-equalizing plate structure the 3rd embodiment of the present invention, as shown in the figure, the present embodiment is identical with aforementioned first embodiment part-structure, therefore do not repeat them here, only the present embodiment and aforementioned first embodiment do not exist together for described condensing zone 213 has more at least one first condensation part 2131 and at least one the second condensation part 2132, described first, two condensation parts 2131, 2132 are made up of plural convex body 214, and this both sides, first condensation part 2131 are located in this second condensation part 2132, and the convex body 214 of this second condensation part 2132 height to this first condensation part 2131 decrescence, mean convex body 214 height of convex body 214 height lower than this second condensation part 2132 of described first condensation part 2131, and described convex body 214 is agglomerated powder opisthosoma.
Refer to the first plate body cutaway view that the 6th figure is micro-equalizing plate structure the 4th embodiment of the present invention, as shown in the figure, the present embodiment is identical with aforementioned first embodiment part-structure, therefore do not repeat them here, only not the existing together for described convex body 214 is a copper post of the present embodiment and aforementioned first embodiment, and this copper post outside has at least one groove 2141.
Refer to the first plate body cutaway view that the 7th figure is micro-equalizing plate structure the 5th embodiment of the present invention, as shown in the figure, the present embodiment is identical with aforementioned first embodiment part-structure, therefore do not repeat them here, only not the existing together for described convex body 214 is a copper post of the present embodiment and aforementioned first embodiment, and this copper post outside has a sintered powder ring body 215.
Refer to the first plate body cutaway view that the 8th figure is micro-equalizing plate structure the 6th embodiment of the present invention, as shown in the figure, the present embodiment is identical with aforementioned first embodiment part-structure, therefore do not repeat them here, only the present embodiment and aforementioned first embodiment do not exist together for described convex body 214 is a copper post, and this copper post outside has a sintered powder ring body 215, this sintered powder ring body 215 has at least one groove 2151.
Refer to the first plate body cutaway view that the 9th figure is micro-equalizing plate structure the 7th embodiment of the present invention, as shown in the figure, the present embodiment is identical with aforementioned third embodiment part-structure, therefore do not repeat them here, only not the existing together for described convex body 214 is sintered powder of the present embodiment and aforementioned third embodiment, and this sintered powder external body has at least one groove 2142.
Refer to the enforcement schematic diagram that the 10th figure is the micro-equalizing plate structure of the present invention, 4th side 222 of described second plate body 22 contacts with at least one thermal source 1 and absorbs the heat that this thermal source 1 produces, Evaporation Phenomenon is produced in this evaporating area 2212 after described working fluid 3 is heated, this working fluid 3 is converted to steam state by liquid state and conducts to this first plate body 21, this steam state working fluid 32 is converted to liquid state after condensing zone 213 condensation of this first plate body 21, and under effect because of the convex body 214 of this condensing zone 213, make this gaseous working fluid 31 converge in this convex body 214 place and to concentrate rapidly reflux to this evaporating area 2212, and then accelerate the steam-condensate circulating efficiency of this working fluid 3 in this micro-temperature-uniforming plate 2, significantly promote heat conducting effect.
Through the above description of the embodiments, those skilled in the art can be well understood to the mode that the present invention can add required general hardware platform by software and realize, and can certainly pass through hardware, but in a lot of situation, the former is better execution mode.Based on such understanding, technical scheme of the present invention can embody with the form of software product the part that prior art contributes in essence in other words, this computer software product is stored in a storage medium, comprising some instructions in order to make a computer equipment (can be personal computer, server, or the network equipment etc.) perform method described in each embodiment of the present invention.
Be only several specific embodiment of the present invention above, but the present invention is not limited thereto, the changes that any person skilled in the art can think of all should fall into protection scope of the present invention.
Claims (9)
1. a micro-equalizing plate structure, establish with at least one thermal source collocation group, it is characterized in that, comprise:
First plate body, have first side and second side, this first side has at least one condensing zone, and this condensing zone has plural convex body;
Second plate body, has the 3rd side and the 4th side, and the 3rd side system is corresponding with aforementioned first side to be covered, and the 3rd side has plural afflux district and at least one evaporating area, and the 4th side and aforementioned thermal source are sticked;
Described condensing zone has more first condensation part and at least one the second condensation part, first and second condensation part described is made up of plural convex body, this both sides, the first condensation part are located in described second condensation part, and the convex body height of this second condensation part is cumulative to the first condensation part.
2. micro-equalizing plate structure as claimed in claim 1, is characterized in that, described convex body is a copper post.
3. micro-equalizing plate structure as claimed in claim 1, is characterized in that, described convex body is a copper post, and this copper post outside has at least one groove.
4. micro-equalizing plate structure as claimed in claim 1, is characterized in that, described convex body is a copper post, and this copper post outside has a sintered powder ring body.
5. micro-equalizing plate structure as claimed in claim 1, is characterized in that, described convex body is a copper post, and this copper post outside has a sintered powder ring body, and this sintered powder ring body has at least one groove.
6. micro-equalizing plate structure as claimed in claim 1, is characterized in that, described convex body is agglomerated powder opisthosoma.
7. micro-equalizing plate structure as claimed in claim 1, is characterized in that, described convex body is agglomerated powder opisthosoma, and this sintered powder external body has at least one groove.
8. micro-equalizing plate structure as claimed in claim 1, is characterized in that, described afflux district and evaporating area have plural runner, and described afflux district is positioned at outside this evaporating area.
9. micro-equalizing plate structure as claimed in claim 1, it is characterized in that, described condensing zone replaces to structure: have more at least one first condensation part and at least one the second condensation part, first and second condensation part described is made up of plural convex body, and this both sides, the first condensation part are located in this second condensation part, and the convex body height of this second condensation part to this first condensation part decrescence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110029124.9A CN102623421B (en) | 2011-01-26 | 2011-01-26 | Micro temperature-uniforming plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110029124.9A CN102623421B (en) | 2011-01-26 | 2011-01-26 | Micro temperature-uniforming plate structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102623421A CN102623421A (en) | 2012-08-01 |
| CN102623421B true CN102623421B (en) | 2015-02-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110029124.9A Active CN102623421B (en) | 2011-01-26 | 2011-01-26 | Micro temperature-uniforming plate structure |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105333759A (en) * | 2014-08-06 | 2016-02-17 | 双鸿科技股份有限公司 | Etching temperature uniformization board |
| CN112996346B (en) * | 2020-01-14 | 2022-08-02 | 荣耀终端有限公司 | Vapor chamber and mobile terminal |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6550531B1 (en) * | 2000-05-16 | 2003-04-22 | Intel Corporation | Vapor chamber active heat sink |
| CN1784137A (en) * | 2004-11-29 | 2006-06-07 | 迈萪科技股份有限公司 | Winding carved heat equalizing plate with metal net micro structure and its producing method |
| TWM394682U (en) * | 2010-04-26 | 2010-12-11 | Asia Vital Components Co Ltd | Miniature heat spreader structure |
| CN201994283U (en) * | 2011-01-26 | 2011-09-28 | 奇鋐科技股份有限公司 | Structure improvement for micro temperature equalization board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7246655B2 (en) * | 2004-12-17 | 2007-07-24 | Fujikura Ltd. | Heat transfer device |
| US20090025910A1 (en) * | 2007-07-27 | 2009-01-29 | Paul Hoffman | Vapor chamber structure with improved wick and method for manufacturing the same |
-
2011
- 2011-01-26 CN CN201110029124.9A patent/CN102623421B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6550531B1 (en) * | 2000-05-16 | 2003-04-22 | Intel Corporation | Vapor chamber active heat sink |
| CN1784137A (en) * | 2004-11-29 | 2006-06-07 | 迈萪科技股份有限公司 | Winding carved heat equalizing plate with metal net micro structure and its producing method |
| TWM394682U (en) * | 2010-04-26 | 2010-12-11 | Asia Vital Components Co Ltd | Miniature heat spreader structure |
| CN201994283U (en) * | 2011-01-26 | 2011-09-28 | 奇鋐科技股份有限公司 | Structure improvement for micro temperature equalization board |
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| CN102623421A (en) | 2012-08-01 |
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