CN205609497U - Packaging structure with little heat pipe cooling frame - Google Patents
Packaging structure with little heat pipe cooling frame Download PDFInfo
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- CN205609497U CN205609497U CN201620254235.8U CN201620254235U CN205609497U CN 205609497 U CN205609497 U CN 205609497U CN 201620254235 U CN201620254235 U CN 201620254235U CN 205609497 U CN205609497 U CN 205609497U
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- heat pipe
- radiation rack
- micro heat
- heat radiation
- chip
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Abstract
The utility model relates to a packaging structure with little heat pipe cooling frame belongs to the semiconductor packaging technology field. It includes base plate (3), be provided with chip (4) on base plate (3), heat dissipation frame (1) has been put to chip (4) dustcoat, heat dissipation frame (1) electrical property couples to base plate earthing terminal (3.1), plastic envelope material (8) has been sealed in heat dissipation frame (1) and chip (4) peripheral region, heat dissipation frame (1) central zone is provided with little heat pipe cooling ware (6), little heat pipe cooling ware (6) upper surface exposes plastic envelope material (8) surface. The utility model relates to a packaging structure with little heat pipe cooling frame, it locates to make the micro heat pipe at heat dissipation frame central zone, the inside evacuation of micro heat pipe on the one hand of this structure, injection ethanol solution strengthens the thermal conductivity in the structure, the increase heat dissipation capacity, the packaging structure that on the other hand compared the surface mounting fin can reduce the product size, reaches miniaturized purpose.
Description
Technical field
This utility model relates to a kind of encapsulating structure with micro heat pipe heat radiation rack, especially heat radiation rack the encapsulating structure of grounding requirement, belongs to technical field of semiconductor encapsulation.
Background technology
Development along with electronic technology, chip integration is more and more higher and power consumption is increasing, chip area is more and more less, if the big heat that little area produces can not dissipate away in time and the chip even function of whole system, stability etc. will be caused the most serious impact.
Traditional heat-dissipating bridge joint ground encapsulating structure is as shown in Figure 1 at present, wherein a heat radiation rack part is encapsulated in plastic-sealed body, a part of exposed outside, the material of heat radiation rack is generally aluminum, the thermal conductivity ratio epoxy-plastic packaging material of aluminium material is high, compare without heat radiation rack encapsulating structure, it is possible to make heat be dispersed in air faster, but still the highest heat dissipation requirement can not be met.
Some products to the heat radiation rack ground connection encapsulating structure that heat radiation has higher requirements, in order to increase radiating effect, at heat radiation rack surface mount traditional heat-dissipating sheet, its structure is as shown in Figure 2, although increasing heat radiation area, improve radiating effect, but the size of product also increases virtually.
The traditional heat-dissipating modes such as free convection, air-cooled, water-cooled the most substantially can not meet the highest heat dissipation requirement, particularly temperature homogeneity is being required higher application scenario, and traditional heat-dissipating mode cannot be competent at especially.The development of microelectric technique, the development of integrated circuit technique, it is strongly required the appearance of novel cooling manner.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of encapsulating structure with micro heat pipe heat radiation rack for above-mentioned prior art, it makes micro heat pipe in heat radiation rack central area, the internal evacuation of this structure on the one hand micro heat pipe, inject ethanol solution, strengthen the thermal conductivity in structure, increasing heat dissipation capacity, the encapsulating structure on the other hand comparing surface mount fin can reduce product size, reaches the purpose of miniaturization.
The technical scheme in the invention for solving the above technical problem is: a kind of encapsulating structure with micro heat pipe heat radiation rack, it includes substrate, it is provided with chip on described substrate, described chip outer housing is equipped with heat radiation rack, described heat radiation rack is electrically attached to substrate ground end, described heat radiation rack and chip periphery region are encapsulated with plastic packaging material, and described heat radiation rack central area is provided with micro heat pipe radiator, and described micro heat pipe radiator upper surface exposes plastic packaging material surface.
Electrically interconnect between described chip front side and substrate front side.
Described substrate back is provided with metal ball.
Described micro heat pipe radiator includes aluminum planar substrates, offers micro heat pipe cavity, be provided with ethanol solution in described micro heat pipe cavity in described aluminum planar substrates.
Described micro heat pipe cavity bottom offers a plurality of triangular groove.
Described micro heat pipe radiator includes that evaporator section, adiabatic section and condensation segment, described chip center region are positioned at below evaporator section.
Compared with prior art, the utility model has the advantage of:
1, at present for the encapsulating structure of surface mount fin, fin structure is single, fin thickness commonly reaches more than 1mm, and this utility model simple in construction, micro heat pipe flat plate array structure is combined with traditional heat yielding frame structure, thickness can be down to 300um, beneficially small integrated encapsulation；
2, the cooling technology of micro heat pipe flat plate array structure uses the evaporation break-in type of cooling, and the maximum power dissipation-heat flow density of unit heat transfer area is up to 5000W/cm2, the natural convection air used much larger than the heat radiation of common fin and the cooling technology of radiation；
3, the feature that micro heat pipe flat plate array structure has samming, transmission is efficient and reliability is high, compares with tradition fin radiator, has obvious booster action to radiating effect.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of traditional heat-dissipating bridge joint ground encapsulating structure.
Fig. 2 is the schematic diagram of conventional belt gelled heat radiation rack ground connection encapsulating structure.
Fig. 3 is the schematic diagram of a kind of encapsulating structure with micro heat pipe heat radiation rack of this utility model.
Fig. 4 is the structural representation of micro heat pipe radiator in Fig. 3.
Fig. 5 is the A-A sectional view of Fig. 4.
Fig. 6 ~ Fig. 9 is the fabrication processing figure of the heat radiation rack with warm tube radiator.
Figure 10 is the top view of Fig. 9.
Figure 11 is the fundamental diagram of micro heat pipe radiator in Fig. 3.
Wherein:
Heat radiation rack 1
Fin 2
Substrate 3
Earth terminal 3.1
Chip 4
Metal wire 5
Micro heat pipe radiator 6
Aluminum planar substrates 6.1
Micro heat pipe cavity 6.2
Triangular groove 6.3
Ethanol solution 6.4
Metal ball 7
Plastic packaging material 8.
Detailed description of the invention
Below in conjunction with accompanying drawing embodiment, this utility model is described in further detail.
As shown in Figure 3, a kind of encapsulating structure with micro heat pipe heat radiation rack in the present embodiment, it includes substrate 3, it is provided with chip 4 on described substrate 3, described chip 4 outer housing is equipped with heat radiation rack 1, and described heat radiation rack 1 is electrically attached to substrate ground end 3.1, described heat radiation rack 1 and chip 4 outer peripheral areas and is encapsulated with plastic packaging material 8, described heat radiation rack 1 central area is provided with micro heat pipe radiator 6, and described micro heat pipe radiator 6 upper surface exposes plastic packaging material 8 surface.
Electrically interconnect between described chip 4 front and substrate 3 front.
Described substrate 3 back side is provided with metal ball 7.
Described micro heat pipe radiator 6 includes aluminum planar substrates 6.1, offers micro heat pipe cavity 6.2, be provided with ethanol solution 6.4 in described micro heat pipe cavity 6.2 in described aluminum planar substrates 6.1.
A plurality of triangular groove 6.3 is offered bottom described micro heat pipe cavity 6.2.
Described micro heat pipe radiator 6 includes that evaporator section, adiabatic section and condensation segment, described chip 4 central area are positioned at below evaporator section.
Following steps are specifically included with the heat radiation rack processing technology of micro heat pipe radiator:
Step one, take the aluminium substrate material of about an about 300um, as shown in Figure 6；
Step 2, aluminium substrate is carried out pre-punching, as shown in Figure 7；
Making micro heat pipe in step 2, aluminium substrate after pre-punching, first aluminium substrate carries out machining, perforate, bosom part carves triangular groove, forms cavity, as shown in Figure 8；
Step 3, carry out evacuation process；
Step 4, inject appropriate ethanol solution；
Step 5, by hole close；
Step 6, finally by this structure punch forming, as shown in Figure 9, Figure 10.
Encapsulating structure with micro heat pipe heat radiation rack can effectively increase distributing of encapsulating products heat, it is primarily due to: micro heat pipe is the backflow being completed working medium by raceway groove wedge angle region, as shown in figure 11, during micro heat pipe steady operation, micro heat pipe evaporator section is heated by the external world, heat is delivered to vapour-liquid separating surface by thermotube wall and liquid refrigerant, makes to evaporate on hydraulic fluid vapour-liquid separating surface in evaporator section.Owing to liquid evaporates, produce pressure reduction in vapor chamber, and steam is flowed to condense on condensation segment the vapour-liquid separating surface in condensation segment by evaporator section just under the effect of this pressure reduction, discharges heat.Heat passes to low-temperature receiver by liquid refrigerant and tube wall, finally makes condensed hydraulic fluid be back to evaporator section due to the capillarity of heat pipe inner chamber corner region.
Owing to the design of chip internal is different, thus forming power consumption area distribution, caloric value is also subregion distribution, and in general chip center region is heating maximum area section, and this is exactly the evaporator section of micro heat pipe；Other regions are exactly condensation segment, and structure of based on micro heat pipe, evaporator section and condensation segment can exchange, owing to conventional package chip operating temperature is higher than the evaporating point 76 DEG C of ethanol solution in vacuum, can vaporize so meeting evaporator section by the liquid in micro heat pipe, condensation segment can make the gas liquefaction in micro heat pipe.
Can be seen that minitype flat plate hot pipe except having the characteristic of common fin, the superiority of its uniqueness is also embodied in: the vapor space interconnects structure can effectively reduce interface friction force produced by steam and liquid reverse flow in heat pipe, makes heat transfer property significantly improve；Area of dissipation is big, and radiating effect is more preferable；Good startability and uniform temperature；Easily fabricated go out flat smooth, outer surface that geometric compliance is good, directly can fit with electronic device.
In addition to the implementation, this utility model also includes the technical scheme that other embodiments, all employing equivalents or equivalence substitute mode are formed, within all should falling into this utility model scope of the claims.
Claims (6)
1. the encapsulating structure with micro heat pipe heat radiation rack, it is characterized in that: it includes substrate (3), chip (4) it is provided with on described substrate (3), described chip (4) outer housing is equipped with heat radiation rack (1), described heat radiation rack (1) is electrically attached to substrate ground end (3.1), described heat radiation rack (1) and chip (4) outer peripheral areas are encapsulated with plastic packaging material (8), described heat radiation rack (1) central area is provided with micro heat pipe radiator (6), and described micro heat pipe radiator (6) upper surface exposes plastic packaging material (8) surface.
A kind of encapsulating structure with micro heat pipe heat radiation rack the most according to claim 1, it is characterised in that: electrically interconnect between described chip (4) front and substrate (3) front.
A kind of encapsulating structure with micro heat pipe heat radiation rack the most according to claim 1, it is characterised in that: described substrate (3) back side is provided with metal ball (7).
A kind of encapsulating structure with micro heat pipe heat radiation rack the most according to claim 1, it is characterized in that: described micro heat pipe radiator (6) includes aluminum planar substrates (6.1), offer micro heat pipe cavity (6.2) in described aluminum planar substrates (6.1), in described micro heat pipe cavity (6.2), be provided with ethanol solution (6.4).
A kind of encapsulating structure with micro heat pipe heat radiation rack the most according to claim 4, it is characterised in that: described micro heat pipe cavity (6.2) bottom offers a plurality of triangular groove (6.3).
A kind of encapsulating structure with micro heat pipe heat radiation rack the most according to claim 1, it is characterised in that: described micro heat pipe radiator (6) includes that evaporator section, adiabatic section and condensation segment, described chip (4) central area are positioned at below evaporator section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620254235.8U CN205609497U (en) | 2016-03-30 | 2016-03-30 | Packaging structure with little heat pipe cooling frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620254235.8U CN205609497U (en) | 2016-03-30 | 2016-03-30 | Packaging structure with little heat pipe cooling frame |
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| Publication Number | Publication Date |
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| CN205609497U true CN205609497U (en) | 2016-09-28 |
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| CN201620254235.8U Active CN205609497U (en) | 2016-03-30 | 2016-03-30 | Packaging structure with little heat pipe cooling frame |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107403762A (en) * | 2017-06-22 | 2017-11-28 | 江苏长电科技股份有限公司 | A kind of encapsulating structure and its process |
| CN109065511A (en) * | 2018-08-15 | 2018-12-21 | 王晓勇 | A kind of semiconductor package part and heat dissipating method with radiator structure |
| CN113544844A (en) * | 2020-12-28 | 2021-10-22 | 英诺赛科(苏州)科技有限公司 | Semiconductor package and method of manufacturing the same |
-
2016
- 2016-03-30 CN CN201620254235.8U patent/CN205609497U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107403762A (en) * | 2017-06-22 | 2017-11-28 | 江苏长电科技股份有限公司 | A kind of encapsulating structure and its process |
| CN109065511A (en) * | 2018-08-15 | 2018-12-21 | 王晓勇 | A kind of semiconductor package part and heat dissipating method with radiator structure |
| CN109065511B (en) * | 2018-08-15 | 2020-09-18 | 陈群 | Semiconductor packaging part with heat dissipation structure and heat dissipation method |
| CN113544844A (en) * | 2020-12-28 | 2021-10-22 | 英诺赛科(苏州)科技有限公司 | Semiconductor package and method of manufacturing the same |
| WO2022140958A1 (en) * | 2020-12-28 | 2022-07-07 | Innoscience (Suzhou) Technology Co., Ltd. | Semiconductor package and method for manufacturing |
| US11830786B2 (en) | 2020-12-28 | 2023-11-28 | Innoscience (Suzhou) Technology Co., Ltd. | Semiconductor package and method for manufacturing the same |
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