CN108550557A - Solid-liquid integral type chip radiator and its manufacturing process - Google Patents
Solid-liquid integral type chip radiator and its manufacturing process Download PDFInfo
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- CN108550557A CN108550557A CN201810226859.2A CN201810226859A CN108550557A CN 108550557 A CN108550557 A CN 108550557A CN 201810226859 A CN201810226859 A CN 201810226859A CN 108550557 A CN108550557 A CN 108550557A
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- Prior art keywords
- chip
- radiator
- solid
- liquid
- shell
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Abstract
The present invention proposes a kind of solid-liquid integral type chip radiator and its manufacturing process, belongs to heat dissipation and encapsulation technology field.The radiator is used for being set to silicon substrate or being packaged and radiated with the chip on substrate made of other materials；The radiator includes shell, shell includes upper and lower two parts, respectively shell upper and outer casing underpart, wherein shell upper forms multiple cooling fins, volatile liquid is accommodated in multiple cooling fins, outer casing underpart includes being sealed by glue with chip surrounding with the matched side wall of chip surrounding, inside sidewalls, separated by the partition that Heat Conduction Material is formed between shell upper and outer casing underpart, gallium is filled in the sealing space that the partition, chip and side wall are formed.The radiator will encapsulate and heat dissipation integrates, and by solid-liquid bilayer radiator structure heat radiation performance, and the brought product overall volume of the heat dissipating method of solving the problems, such as over is increased sharply, and can be integrated large-scale mass production.
Description
Technical field
The present invention relates to heat dissipation and encapsulation technology fields, more particularly to a kind of solid-liquid integral type chip radiator and its system
Make technique.
Background technology
The chip that cooling requirements are higher or calorific value is larger is generally used Metal Packaging.Metal Packaging is to utilize metal
Good heat conductivity can integrate the advantages of production, and one layer of metal is plated in chip exterior, play the effect of encapsulation, protection are with heat dissipation.
It,, will also be in PCB after to chip progress Metal Packaging in order to promote the efficiency for carrying out cooling to chip when practical application
Additional air-cooled or water-cooling on circuit board, this will cause practical electronic product overweight, excessive, be highly detrimental to consumption electricity
The application to product weight and volume-sensitive such as son.For example, the heat dissipation of the chip (such as CPU) of high temperature is generated when general work
Structure uses the radiating mode for being combined Metal Packaging with air-cooled or water cooling, is assembled in electronic product when by chips such as CPU
Afterwards, electronic product volume and weight can be substantially improved in this radiator structure, reduce the portability of electronic product.Although depositing at present
In the technology that some radiate to chip using liquid metal, but still the portable of heat dissipation performance and electronic product cannot be taken into account
Property.
Invention content
To overcome the above-mentioned problems in the prior art, the present invention provides a kind of solid-liquid integral type chip radiator and
Encapsulation is combined into one with radiator structure, electronic product is improved using solid-liquid integral type bilayer radiator structure by its manufacturing process
Heat dissipation performance and reduce its volume and weight.
In order to achieve the above object, the present invention proposes that a kind of solid-liquid integral type chip radiator, the radiator are used for core
Piece is packaged and radiates, and the chip is set on silicon substrate；The radiator includes shell, and the shell includes upper and lower two
Part, respectively shell upper and outer casing underpart, wherein shell upper form multiple cooling fins, in the multiple cooling fin content
Receiving has volatile liquid, and outer casing underpart includes passing through glue with chip surrounding with the matched side wall of chip surrounding, the inside sidewalls
Sealing is separated between shell upper and outer casing underpart by the partition that Heat Conduction Material is formed, in the partition, chip and side wall
Gallium is filled in the sealing space of formation.
According to an aspect of the present invention, the volatile liquid is methanol or ethyl alcohol.
According to an aspect of the present invention, the cooling fin is arc cooling fin.
According to an aspect of the present invention, it is laid with the water accepting layer made of water-absorbent material above the partition, and absorbed water
Layer extends the drainage set made of water-absorbent material to the top of each cooling fin.
According to an aspect of the present invention, the inside of the multiple cooling fin is connected together；Or the multiple heat dissipation
Each of piece is absolute construction and is not connected to inside cooling fin two-by-two.
The invention also provides a kind of manufacturing process of the above-mentioned solid-liquid integral type chip radiator of manufacture, including step 1,
The shell is made according to the size of the chip；Step 2 plates the gallium of suitable thickness in the partition, and outside
The inside sidewalls of shell lower part apply last layer glue；Step 3 on the chip by the shell and gallium lid, and passes through institute
State the encapsulation of glue realization and the chip.
According to an aspect of the present invention, the gallium for plating suitable thickness in the step 2 in the partition is specific
For：Heating gallium is filled when being liquid to the partition, and is cooled to solid-state.
Solid-liquid integrated radiator proposed by the present invention and its manufacturing process utilize turn of different temperatures metal solid-state, liquid
It changes, encapsulation is combined into one with radiator structure, the heat dissipation that can solve miniaturized application especially low-power chip (such as CPU) is asked
Topic, and also two kinds of radiating modes of solid and liquid are integrated in same radiator, use Dual-layer structure that this is dissipated
Hot utensil has higher heat-sinking capability.Effective solution of the present invention the brought product overall volume surge of heat dissipating method in the past
Problem, and can be integrated large-scale mass production.
Description of the drawings
Fig. 1 is the sectional view according to the solid-liquid integral type chip radiator of one embodiment；
Fig. 2 shows the radiating principles of solid-liquid integral type chip radiator；
Fig. 3 and 4 respectively illustrates the effect of arc cooling fin and water-absorbent material played in radiation processes；
Fig. 5 is the manufacturing process flow diagram of the radiator.
Specific implementation mode
As described below is presently preferred embodiments of the present invention, is not intended to limit the scope of the present invention.
Fig. 1 shows the sectional view of solid-liquid integral type chip radiator proposed by the present invention.As shown in Figure 1, chip 106 is set
It is placed on substrate 107, chip 106 is packaged by chip radiator proposed by the present invention, and is radiated to chip 106.Institute
It includes shell 101 to state chip radiator, and the shell 101 includes upper and lower two parts, and shell upper forms multiple cooling fins, in institute
It states and accommodates volatile liquid 102 in multiple cooling fins, outer casing underpart includes and the matched side wall 105 of chip surrounding, the side
105 inside of wall is sealed with chip surrounding by glue, the partition 108 formed by Heat Conduction Material between shell upper and outer casing underpart
Separate, gallium (Ga) 104 is filled in the sealing space that the partition 108, chip 106 and side wall 105 are formed.According to
One embodiment of the present of invention, the substrate 107 is for silicon substrate or with substrate made of other materials.
The operation principle of the radiator is as follows：The heat that chip 106 generates when working can be conducted first to gallium 104
Part, it is liquid that such Solid Gallium, which heats up thawing,.Since because of the temperature difference convection current can occur for liquid local heating, in liquid
Metal inside just will produce the liquid circulation similar to ocean current, and heat is diffused to rapidly to the low place of temperature, and (i.e. heat is by pasting
The position of nearly chip is diffused to close to the position of cooling fin, as Fig. 2 be located in gallium 104 to shown in upward arrow).
The convection current of liquid metals includes left and right convection current and upper and lower convection current, and left and right convection current can make 106 temperature of entire chip equal
It is even, chip will not be damaged because local temperature is excessively high；Upper and lower convection current enables to heat to conduct rapidly upward, and by it is described every
Stealpass is directed at the volatile liquid 102 inside cooling fin, so that supernatant liquid 102 is volatilized and takes away heat, and the gas of volatilization reaches
It is condensed at the top of cooling fin and heat sheds, the liquid condensed participates in next round downstream to bottom naturally and recycles (such as positions Fig. 2
Shown in arrow inside the cooling fin).
It can be seen that solid-liquid integral type chip radiator lower layer of the present invention uses with the gold compared with low melting point
Belong to, the solid-liquid state of the metal can be converted according to the heat that chip is distributed, and all be held in multiple cooling fins on upper layer
Effumability liquid is contain, when the heat that lower metal transmits reaches upper layer by the partition that Heat Conduction Material is formed, can be made
At the top of effumability liquid gasification to the lower cooling fin of temperature, and heat is distributed by cooling fin outward, it is good to reach
Heat dissipation effect.
In addition, the structure together can also easily be encapsulated chip, this is because as described above, the present invention carries
Realize that the metal of solid-liquid conversion has selected gallium Ga in the radiator gone out, and gallium has following essential characteristic:
1. fusing point is 29.8 DEG C, it is solid under room temperature, is convenient for integrated production；The chip of high temperature is generated when work (such as
Temperature is generally 50-80 DEG C when CPU) working, it is sufficient to so that solid Ga is molten into liquid, be conducive to heat dissipation；2204 DEG C of higher boiling, will not
Gasification；It can implement encapsulation when gallium is in solid-state in this way, heat dissipation is realized when being in a liquid state；
2. steam pressure is low；
3. temperature difference is very big between fusing point and boiling point；
4. there is good mobility；
5. various physicochemical properties are close to solid-state, and separate gaseous state；
6. having good heat conductivility.
It can be seen that due to the present invention will realize will encapsulation and heat-radiating integrated, being easy to encapsulate and have using gallium
The features described above of excellent heat dispersion performance, is encapsulated on chip and the heat that chip generation is distributed by solid-liquid conversion is supreme
Layer cooling fin.Therefore, the present invention can realize encapsulation and heat dissipation simultaneously, and it is very good to be capable of providing without using air-cooled
Heat dissipation performance, to reduce the weight and volume of electronic device.
In addition, according to a specific embodiment, volatile liquid that the present invention selects in cooling fin and the reason for this is that：
Temperature when generating chip (such as CPU) work of high temperature when work is generally 50 to 80 degree, and highest is not above 90
Degree.Which limits the boiling points of selected liquid to need at 60 degree to 70 degree or so.It considers further that and easily prepares and exclude to be more toxic
Liquid, ethyl alcohol and methanol are proper selection.Ethyl alcohol boiling point is 78.3 DEG C, and methanol boiling point is 64.5 DEG C.
As the present invention more preferably embodiment, as shown in Fig. 1,3,4, the cooling fin is arc cooling fin, i.e.,
The section shape of each cooling fin is parabola.Although stereochemical structure is not shown, those skilled in the art can obtain, from outer
Apparently, the multiple cooling fin stands on the top of radiator in multiple small hill shapes in portion.On the one hand it can be increased using arcuate structure
On the other hand heat dissipation area can ensure that when chip side is put, condensed fluid still can flow back to bottom along cooling fin inner wall
(as shown by the arrow in Figure 3).
According to the another preferred embodiment of the present invention, as shown in Fig. 1,3,4,108 top of the partition is laid with by absorbing water
Water accepting layer 103 made of material, and water accepting layer 103 stretches out the drain made of water-absorbent material to the top of each cooling fin and fills
Set 109.The shape of the drainage set 109 can be draining plate or drain column etc..The reason of water accepting layer is arranged is to make
Volatile liquid more uniformly spreading above partition, this is because volatile liquid can be to lower stream when chip tilts
It is dynamic, and water accepting layer can absorb partially liq to make the radiator portion missing volatile liquid positioned at eminence；Setting is led
The reason of liquid device, is that when chip upside down, volatile liquid can be reached by the drainage set made of water-absorbent material close to gold
Belong to the heated part of gallium Ga (as shown in the upward arrow of Fig. 4).
In addition, although the inside of the present invention multiple cooling fins as shown in the figure is connected together, according to another implementation
Example, each cooling fin can be independent, i.e., be not connected to (being not shown) between cooling fin two-by-two.Heat dissipation each in this way
The volatile liquid of piece inner containment will not be flow in other cooling fin to cause the situation of liquid unevenness, when chip tilts
Being not in subregion internal cause when placement does not have volatile liquid to the discounted phenomenon of heat dissipation effect.Certainly, it at this moment inhales
Water layer is also self-existent for each cooling fin.
Fig. 5 show by the present invention solid-liquid integrated radiator manufacturing process, the manufacturing process include manufacture with
Encapsulation integration.
First, according to chip size make shell, such as superposed figure in Fig. 5 it is found that shell as described in making it is same
When, volatile liquid, water accepting layer, drainage set etc. are integrated in interior；
Secondly, the gallium Ga of suitable thickness is plated shown in the figure at middle part in partition as Fig. 5 is located at, and under shell
The inside sidewalls in portion apply last layer glue；The gallium can be heated to be filled in liquid, and be cooled to solid-state；
Finally, shell and gallium are covered on chip, and the encapsulation with chip is realized by the glue.
By above description it is found that the present invention is used for semiconductor manufacturing encapsulation field, large-scale integrated production can be applied to
Chip cooling design.Radiator proposed by the present invention has the following advantages：
It is combined into one and (is converted using metal solid-liquid) with radiator structure 1. heat spreader structures will be encapsulated, can solve small-sized
Change the heat dissipation problem of application especially low power consumption CPU or other chips.
2. using the double-deck solid-liquid integrated radiating structure, there is good heat dissipation performance while convenient for encapsulation.
3. the problem of effective solution brought product overall volume surge of heat dissipating method in the past, and can be collected
At change large-scale mass production.
Certainly, if using volume as primary concern, the heat dissipation design that the application is proposed can be only used, as in mobile phone；
If wanting to further increase heat-sinking capability, still air-cooled, water cooling can further it radiate in combined outside certainly, as in computer.
It should be noted that specific implementation mode and application field proposed by the invention merely for the purpose of illustration, is not intended as pair
The limitation of the scope of the present invention, those skilled in the art can to the present invention a variety of specific implementation modes be optionally combined,
It changes and is applied in different practical applications.
Claims (8)
1. a kind of solid-liquid integral type chip radiator, for chip to be packaged and radiated, the chip is set the radiator
It is placed on substrate, it is characterised in that：
The radiator includes shell, and the shell includes upper and lower two parts, respectively shell upper and outer casing underpart, China and foreign countries
Multiple cooling fins are formed at shell top, and volatile liquid is accommodated in the multiple cooling fin, and outer casing underpart includes and chip four
All matched side walls, the inside sidewalls are sealed with chip surrounding by glue, pass through heat conduction between shell upper and outer casing underpart
The partition that material is formed separates, and gallium is filled in the sealing space that the partition, chip and side wall are formed.
2. solid-liquid integral type chip radiator as described in claim 1, it is characterised in that：
The volatile liquid is methanol or ethyl alcohol.
3. solid-liquid integral type chip radiator as described in claim 1, it is characterised in that：
The cooling fin is arc cooling fin.
4. the solid-liquid integral type chip radiator as described in claim 1-3 any claims, it is characterised in that：
Be laid with the water accepting layer made of water-absorbent material above the partition, and water accepting layer to the top of each cooling fin stretch out by
Drainage set made of water-absorbent material.
5. the solid-liquid integral type chip radiator as described in claim 1-3 any claims, it is characterised in that：
The inside of the multiple cooling fin is connected together；Or
Each of the multiple cooling fin is absolute construction and is not connected to inside cooling fin two-by-two.
6. the solid-liquid integral type chip radiator as described in claim 1-3 any claims, it is characterised in that：
The substrate is for silicon substrate or with substrate made of other materials.
7. a kind of method for manufacturing the solid-liquid integral type chip radiator as described in claim 1-6 any claims,
It is characterized in that, the method includes：
Step 1 makes the shell according to the size of the chip；
Step 2 plates the gallium of suitable thickness in the partition, and applies and glue in the inside sidewalls of outer casing underpart；
Step 3 on the chip by the shell and gallium lid, and passes through the glue and realizes envelope with the chip
Dress.
8. the method for claim 7, it is characterised in that：
In the step 2 the thickness of the gallium plated in the partition be so that heat gallium be liquid when fill to
The partition, and it is cooled to solid-state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810226859.2A CN108550557B (en) | 2018-03-19 | 2018-03-19 | Solid-liquid integrated chip radiator and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810226859.2A CN108550557B (en) | 2018-03-19 | 2018-03-19 | Solid-liquid integrated chip radiator and manufacturing process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108550557A true CN108550557A (en) | 2018-09-18 |
| CN108550557B CN108550557B (en) | 2020-06-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810226859.2A Active CN108550557B (en) | 2018-03-19 | 2018-03-19 | Solid-liquid integrated chip radiator and manufacturing process thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113097245A (en) * | 2021-03-11 | 2021-07-09 | 长江先进存储产业创新中心有限责任公司 | Semiconductor chip forming method and semiconductor chip |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100383959C (en) * | 2003-02-24 | 2008-04-23 | 富士通株式会社 | Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member |
| CN102506600A (en) * | 2011-09-20 | 2012-06-20 | 华北电力大学 | Condensation end extension type integrated flat heat pipe |
| CN206196236U (en) * | 2016-11-28 | 2017-05-24 | 东莞市明骏智能科技有限公司 | Electronic component |
-
2018
- 2018-03-19 CN CN201810226859.2A patent/CN108550557B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100383959C (en) * | 2003-02-24 | 2008-04-23 | 富士通株式会社 | Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member |
| CN102506600A (en) * | 2011-09-20 | 2012-06-20 | 华北电力大学 | Condensation end extension type integrated flat heat pipe |
| CN206196236U (en) * | 2016-11-28 | 2017-05-24 | 东莞市明骏智能科技有限公司 | Electronic component |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113097245A (en) * | 2021-03-11 | 2021-07-09 | 长江先进存储产业创新中心有限责任公司 | Semiconductor chip forming method and semiconductor chip |
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| CN108550557B (en) | 2020-06-09 |
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