1308047 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，尤係指一種用於電子 元件散熱之散熱裝置。 、％ 【先前技術】 中央處理器等電子元件在運行過程中產生大量 熱’若不及時排出，將會影響電子元件運行穩定性^ 至造成其被燒毀之嚴重後果。因此，爲確保電子 正常運行，業界通常在電子元件上安 輔助散熱。 成…即進仃 =情況下，該散熱器包括一底座及設置於底座 ^之複數散熱鰭片，該底座吸收電子^件產生之執 里，再通過散熱鰭片不斷將熱散發到環境中。 “、、 然而，電子①件工作過程中産生之熱量並非一直 产-二當二到功率突增，電子元件工作運行速度加快， S:T最大，電子元件溫度隨之升高。此時 之熱量若不能快速有效轉移或散發，將有使 子：件溫度超出正常工作範圍之危險， 子兀件工作效率且縮短其 、如曰電 壞。 、便用可命，更爲嚴重時將損 【發明内容】 有鑒於此，有必要提供— 收^ 種施在短時間内快速吸 收且錯存大置熱之散熱裝置。 本發明散熱裝置包括_明勒w f 7及熱。卩和一與該吸熱部接 1308047 括一與該吸熱部接合之儲熱體，該 轉2液:相:化物在常溫下爲固態加熱後可由固態 之基座，；二：熱部爲一直接與發熱電子元件接觸 ,. 放…、σ卩為设置於吸熱部上之散埶片铤，1 包括沿該基座斜内μ α & 、， 月文…片、、且其 ig Q 中之一導熱部及由每一導埶ip 相對兩側延伸之複數散熱片。 ¥熱4 内之月散熱裝置中通過設置儲熱體，通過儲敎體 元件在正當工hi 速吸熱，保證發熱電子 牡止吊工作溫度下工作。 【實施方式】 安穿二：第圖至第三圖，本發明散熱裝置10用來 ==之中央處理器(圖未示)等發熱ΐ 熱部、盘兮吸ϋί散熱。該散熱裝置10包括一吸 :、該及熱部接合之散熱部及一儲熱體20。 上之散:片熱=一基座12,散熱部爲設置於該基座12 C 該基座12下表面與發熱電子元件 片組U延展二二散熱 熱片組14你其成7 0 A °槽16將散 巾备 土座中央分成相互對稱之兩部分，1 分包括由基座12斜向上延伸之導熱部⑽，、 ⑽-側且平行於基座12延伸之第〜散敎片 沿導熱部140相對另一側且垂 之第二散熱片144。 土及12延伸 1308047 该儲熱體20爲一由導熱性能好之材料（如鋁）掣 :f之方形密閉容器，其内填充有熔點低、常溫下爲固 〜 態加熱可由固態轉化爲液態之相變化物質，如石臘。 ，變化物質也可爲液態，如水、乙醇等。其中由固 .，轉化爲液態之相變化物質之最大優點於於其吸收大 .I熱量之後，所伴隨之體積改變不會改變劇烈。 ^該容器包括一方形盒體22、容納於盒體22内之相 變化物f 24及與盒體22密封爲一體之蓋體％。儲熱 體20设置於凹槽16底部，其下表面貼設於凹槽w底 面，並可通過導熱膠钻接或錫膏焊接等方式固定於該 凹槽16内。爲使儲熱體2〇内儲存之熱量快速向外散 發’可於儲熱體2G之週邊加設複數散熱鰭片以便提高 其散熱效率。 _請參閱第三圖，中央處理器工作時，該發熱電子 ?件30産生之熱量先由基座12吸收，其中一部分熱 罝直接由基座12傳遞至散熱片組14，而由導埶部14〇 相對兩側之第-、第二散熱片142、144將熱量沿平行、 垂直於基座12之*同方向傳遞，達到多方位均句快速 散熱；同時，另-部分熱量經基座12中央處迅速傳遞 至儲熱體20之下表面，由儲熱體2〇 0之相變化物質 24吸收而儲存於儲熱體2Q β。當中央處理器功率突 增，發熱電子元件30溫度报高時，儲熱體2〇内之相 ^化物質24於高溫下發生由固態向液態轉化（或由液 態轉化爲氣態）之相變化，同時於相變化過程中吸收 9 •1308047 大里熱，並儲存於該儲熱體2〇内，避免大量熱量集中 於發熱電子元件30,保證發熱電子元件3G於正常工作 恤度下工作；當中央處理器功率恢復正常，發熱電子 兀件30溫度降低時’該相變化物質24再由液態向固 態轉化（或由氣態轉化爲液態）㈣放熱 片組14散發到空氣中。 政…、 、而上所述，本發明確已符合發明專利之要 :::出專利申請。惟，以上所述者僅為本發 =例’自不能以此限制本案之申請專 凡熟悉本案技藝之人士援依本發明之精神所舉 修飾或變化，皆應涵蓋於以下申請專利範等效 【圖式簡單說明】 ° f-圖係本發明散熱裳置之立體組合圖。 第二圖係第一圖之立體分解圖。 〇 第三圖係第一圖之倒置圖與—發熱電子元 【主要元件符號說明】 10 基座 14 儲熱體 140 第一散熱片 144 凹槽 22 相變化物質 26 發熱電子元件 12 20 142 16 24 散熱器 散熱片組 導熱部 第一散熱片 盒體 蓋體 30 101308047 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat of an electronic component. % [Prior Art] Electronic components such as the central processing unit generate a large amount of heat during operation. If not discharged in time, it will affect the operational stability of the electronic components to the serious consequences of burning them. Therefore, in order to ensure the normal operation of the electronics, the industry usually assists in heat dissipation on electronic components. In the case of the case, the heat sink includes a base and a plurality of heat-dissipating fins disposed on the base. The base absorbs the heat generated by the electronic components and then continuously dissipates heat to the environment through the heat-dissipating fins. ",, However, the heat generated during the operation of the electronic one is not always produced - the power is suddenly increased, the power of the electronic components is running faster, the S: T is the largest, and the temperature of the electronic components is increased. If it cannot be transferred or dissipated quickly and effectively, there will be a danger that the temperature of the piece will exceed the normal working range, and the efficiency of the sub-piece will be shortened, such as smashing the electricity. If it is used, it will be damaged. In view of this, it is necessary to provide a heat sink that is quickly absorbed and stored in a short period of time. The heat sink of the present invention includes _Mingle wf 7 and heat, and a heat sink. The junction 1308047 includes a heat storage body that is coupled to the heat absorbing portion, and the phase 2: the compound is a solid base after being heated in a solid state at a normal temperature; and the heat portion is a direct contact with the heat generating electronic component. Let ..., σ 卩 be the enthalpy sheet set on the heat absorbing portion, 1 includes a heat conduction portion between the λ and the ig Q along the pedestal A plurality of heat sinks extending from opposite sides of the guide ip. ¥热4 In the monthly heat sink, the heat storage body is installed, and the heat storage body absorbs heat through the storage body component to ensure the working temperature of the heating electronic stagnation crane. [Embodiment] An wearing two: Figure to the first In the three-figure, the heat dissipating device 10 of the present invention is used for a heat treatment, such as a central processing unit (not shown), for heat dissipation, heat dissipation, and heat dissipation. The heat dissipating device 10 includes a heat sink: the heat sink portion of the hot portion. And a heat storage body 20. The upper part of the heat: sheet heat = a pedestal 12, the heat dissipating portion is disposed on the pedestal 12 C, the lower surface of the susceptor 12 and the heat-generating electronic component chip group U extend the second heat-dissipating heat-sink group 14 Your 70°° slot 16 divides the center of the soil preparation base into two parts that are symmetrical to each other. The 1 part includes a heat conducting portion (10) extending obliquely upward from the base 12, and the (10)-side extends parallel to the base 12. The second heat sink 140 is perpendicular to the other side of the heat transfer portion 140 and is suspended from the second heat sink 144. The soil and the 12 extend 1308047 The heat storage body 20 is made of a material having good thermal conductivity (such as aluminum): a square seal of f a container filled with a phase change which is low in melting point and solid at room temperature to convert from solid to liquid Chemical substances, such as paraffin. Changeable substances can also be liquid, such as water, ethanol, etc. Among them, the biggest advantage of the phase change material converted from solid to liquid is that it absorbs large I. The container does not change violently. ^ The container comprises a square box 22, a phase change f 24 accommodated in the casing 22, and a cover % sealed integrally with the casing 22. The heat storage body 20 is disposed at the bottom of the recess 16 The lower surface is attached to the bottom surface of the groove w, and can be fixed in the groove 16 by means of thermal conductive glue or solder paste welding, so that the heat stored in the heat storage body 2 can be quickly radiated outwards. A plurality of heat dissipating fins are added around the heat storage body 2G to improve the heat dissipation efficiency. _Please refer to the third figure. When the central processing unit is in operation, the heat generated by the heat generating electronic component 30 is first absorbed by the susceptor 12, and a part of the enthalpy is directly transmitted from the susceptor 12 to the heat sink group 14, and the guiding portion is guided by the guiding portion. The first and second heat sinks 142 and 144 on opposite sides of the heat transfer heat in parallel and perpendicular to the same direction of the base 12 to achieve rapid heat dissipation in a multi-directional uniform sentence; at the same time, another part of the heat passes through the base 12 The central portion is rapidly transferred to the lower surface of the heat storage body 20, and is absorbed by the phase change substance 24 of the heat storage body 2〇 and stored in the heat storage body 2Q β. When the power of the central processing unit is suddenly increased and the temperature of the heat-generating electronic component 30 is high, the phase change substance 24 in the heat storage body 2 undergoes a phase change from a solid state to a liquid state (or a liquid state to a gas state) at a high temperature. At the same time, it absorbs 9 •1308047 large heat in the phase change process and stores it in the heat storage body 2,, avoiding a large amount of heat concentrated on the heat-generating electronic component 30, ensuring that the heat-generating electronic component 3G works under the normal working condition; When the temperature of the heating electronic component 30 is lowered, the phase change substance 24 is further converted from a liquid state to a solid state (or converted from a gaseous state to a liquid state). (4) The heat release sheet group 14 is emitted into the air. According to the above, the present invention has indeed met the requirements of the invention patent ::: patent application. However, the above is only for the present invention. The following examples are intended to cover the application of the present invention. Those who are familiar with the art of the present invention should be modified or changed according to the spirit of the present invention. [Simple description of the diagram] ° f-picture is a three-dimensional combination diagram of the heat dissipation skirt of the present invention. The second figure is an exploded perspective view of the first figure. 〇The third figure is the inverted view of the first figure and the heating element [Frequent component symbol description] 10 pedestal 14 heat storage body 140 first heat sink 144 groove 22 phase change substance 26 heat-generating electronic component 12 20 142 16 24 Radiator fin group heat transfer portion first fin case cover 30 10