TWM539218U - Composite heat dissipation module with heat storage component - Google Patents

Description

Composite heat dissipation module with heat storage component

This creation is related to a heat dissipation technology, especially a composite heat dissipation module with a heat storage component.

The conventional heat dissipating device mainly comprises an aluminum extruded radiator and a fan, and the aluminum extruded radiator is attached to the heat source, and the fan is installed above or at the side of the aluminum extruded radiator, thereby The direct contact of the aluminum extruded heat sink and the heat source is used to transfer heat by heat conduction, and the forced air flow of the fan is used to dissipate heat from the aluminum extruded heat sink.

Because the fan has the problems of power consumption, high noise and easy failure, a fanless heat sink is born. This type of fanless heat sink is installed in a limited space (such as a chassis), which not only causes The already crowded space is more congested, and the heat is naturally dissipated by natural convection. It does not effectively solve the heat generated by the central processing unit or other heat sources, and the heat dissipation efficiency is far less than that of the aforementioned heat sink with a fan. The use of this fanless heat sink is greatly limited.

In order to effectively solve the above problem of the fanless heat sink, the industry has added a passive component such as a heat pipe or a Vapor Chamber with good thermal conductivity to the heat sink. In the design of the device, the uniformity of the passive components is utilized to improve the aforementioned natural convection, so as to further improve the heat dissipation performance of the natural convection of the heat sink of the type.

However, in the above heat dissipating device with passive components, the heat dissipation efficiency of the heat sink must be higher than the heat absorption efficiency of the heat pipe, so the design concept of the entire heat dissipating device is to be able to tolerate the highest limit heat of the heat source in the main body. Emitted efficiently. In order to achieve the above requirements, this type of heat sink inevitably increases the overall size of the heat sink because it must contain a heat sink inside, and the heat sink is a relatively large component for small electronic devices, ie It is this heat sink that will occupy most of the valuable space inside the small electronic device. In fact, because the faster the CPU operates, the more heat it generates, so the manufacturer faces a dilemma, that is, the size of the product is reduced as much as possible, and it takes up space. The heat sink is placed in the main unit and the maximum amount of heat generated by the internal heat source is dissipated in an efficient manner.

In view of this, the creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art, and has devoted himself to the application of the theory, that is, the goal of the creator's improvement.

One of the purposes of this creation is to provide a composite heat dissipation module with a heat storage component, which utilizes the arrangement of the heat storage component to enable natural convection heat dissipation and supplemented with new heat storage and heat dissipation in response to the heat source during operation. Function, replacing the forced convection cooling module with fan.

In order to achieve the above object, the present invention provides a composite heat dissipation module having a heat storage component, comprising a heat conducting base, a heat conducting rod and a heat storage component, the heat conducting rod being disposed on the base; the heat storage The assembly comprises a casing, a solid-liquid working medium and a plurality of thermal plates, the casing having a Each of the heat conducting sheets is sleeved on the heat conducting rod, and the solid solution working medium and each of the heat conducting sheets are received in the cavity.

The creation also has the following effects: it does not process heat according to the limit heat energy, even if it contains only a small heat sink, it can provide sufficient heat protection for the relevant heat source. The heat storage component of the present invention can temporarily store the heat in the heat storage component when the heat source generates excessive heat. When the heat source no longer generates excessive heat energy, the heat stored in the heat storage component is transmitted through the heat sink fin group. Dissipated.

10‧‧‧ Thermal base

11‧‧‧ board

111‧‧‧Upper surface

112‧‧‧ Groove

12‧‧‧Body

20‧‧‧heat beam

20a‧‧‧First thermal conduction section

20b‧‧‧second thermal conduction section

21‧‧‧Upper plane

22‧‧‧ Lower plane

30‧‧‧ Thermal storage components

31‧‧‧Shell

311‧‧‧Shell

3111‧‧‧ top board

3112, 3122‧‧‧ boards

3113‧‧‧Upper edge board

3114, 3124‧‧‧ front groove

3115, 3125‧‧‧ rear groove

3116, 3126‧‧‧ Filling and degassing half pipe

312‧‧‧ lower case

3121‧‧‧floor

3123‧‧‧Bottom edge board

32‧‧‧Solid change liquid working medium

33, 33A, 33B‧‧‧ Thermal sheet

331‧‧‧Perforation

332‧‧‧ Ring wall

333‧‧‧Open slot

A‧‧‧ cavity

40‧‧‧Fixing fin set

41‧‧‧Heat fins

Figure 1 is a schematic diagram showing the combination of the first embodiment of the present creation.

2 is an exploded perspective view of the heat storage assembly and the heat conducting rod of FIG. 1.

3 is a transverse cross-sectional view of the heat storage assembly and the heat conducting rod of FIG.

4 is a longitudinal cross-sectional view of the heat storage assembly and the heat conducting rod of FIG. 1 combined.

Fig. 5 is a schematic view showing the combination of the second embodiment of the present creation.

Fig. 6 is a schematic view showing the combination of the third embodiment of the present creation.

Fig. 7 is a schematic diagram showing the combination of the fourth embodiment of the present creation.

Figure 8 is an external view of another embodiment of the thermally conductive sheet of the present invention.

Figure 9 is an external view of still another embodiment of the thermally conductive sheet of the present invention.

The detailed description and technical content of the present invention are described below with reference to the drawings, but the drawings are only for reference and explanation, and are not intended to limit the creation.

Referring to FIG. 1 and FIG. 4 , the present invention provides a composite heat dissipation module having a heat storage component, which mainly includes a heat conduction base 10 , a heat conduction rod 20 , and a heat storage assembly 30 .

The heat conductive base 10 can be made of a material having good thermal conductivity such as copper, aluminum or an alloy thereof. The heat conductive base 10 of the present embodiment has a plate body 11, but is not limited to this type. The plate body 11 has an upper surface 111, and a groove 112 is defined in an intermediate portion of the upper surface 111. Further, a plurality of arm bodies 12 are connected to the lower surface of the plate body 11 to provide the heat-conducting base 10 to be mounted thereon. A circuit board of a heat source (not shown).

The heat conducting rod 20 may be a rod made of a material having good thermal conductivity such as copper or an alloy thereof, or may be a liquid-changing phase change element such as a heat pipe, and the heat conducting rod 20 of the present embodiment is substantially It is in an L shape, but not limited to this type. The heat conducting rod 20 has a flat cross section and has an upper plane 21 and a lower plane 22 corresponding to the upper plane 21, and a partial area of the heat conducting rod 20 is embedded in the groove 112 of the base 10, and The upper surface 21 and the upper surface 111 of the plate body 11 are formed on the same plane.

The heat storage assembly 30 includes a casing 31, a solid-liquid working medium 32 and a plurality of heat-conducting sheets 33. The casing 31 includes an upper casing 311 and a lower casing 312. The upper casing 311 and the lower casing 312 can be a heat insulating material. The lower case 312 of the present embodiment has a rectangular bottom plate 3121, a vertical plate 3122 bent upward from the periphery of the bottom plate 3121, and a laterally curved periphery of the self-supporting plate 3121. The lower edge edge plate 3123 is folded, and a front groove 3124 and a rear groove 3125 are formed in the middle portion of the lower edge plate 3123. Further, a liquid filling is provided on the lower edge plate 3123 on the side of the rear groove 3125. Gas half tube 3126.

Similarly, the upper shell 311 has a shape similar to that of the lower shell 312. It also has a vertical plate 3112, a front recess 3114, a rear recess 3115, and a liquid-filling deaeration half-tube 3116, and also includes a top plate 3111 and an upper edge. Board 3113 and other structures. The lower case 312 is sealed to the upper case 311 so that a cavity A is formed between the upper case 311 and the lower case 312.

Each of the heat conducting sheets 33 is made of a material having good thermal conductivity such as copper, aluminum or an alloy thereof. A through hole 331 is defined in the middle portion of the heat conducting sheet 33, and the heat conducting sheets 33 are respectively sleeved on the heat conducting rod 20 with the through holes 331 thereof. And each of the heat conducting sheets 33 is arranged at intervals.

In combination, a portion of each of the heat conducting sheets 33 and the heat conducting rods 20 is received in the cavity A, and the heat conducting rods 20 are spanned between the foregoing front grooves 3114, 3124 and the respective rear grooves 3115, 3125. Then, the upper edge plate 3113 and the lower edge plate 3123 are sealed and combined by means of hot pressing, ultrasonic wave or high frequency.

The solid solution working medium 32 may be a substance which is solid at room temperature, such as paraffin, fatty acids, salt hydrates, etc., and the paraffin may be an alkane compound or a mixture thereof, and the solid solution working medium 32 passes through the foregoing. Each of the liquid-filling degassing half pipes 3116, 3126 is filled into the aforementioned cavity A.

Further, the composite heat dissipation module having the heat storage component of the present invention further includes a heat dissipation fin set 40, which includes a plurality of heat dissipation fins 41, and each of the heat dissipation fins 41 may be made of copper, aluminum or alloy thereof with good thermal conductivity. The material is made to be sleeved at one end of the heat conducting rod 20 away from the heat storage assembly 30.

Further, the heat conducting base 10 of the embodiment is located in the middle of the heat conducting rod 20, and the heat storage assembly 30 and the heat dissipating fin set 40 are respectively located at the two end positions of the heat conducting rod 20.

In use, the upper surface 111 of the heat-conducting base 10 and the upper surface 21 of the heat-conducting rod 20 are attached to a heat source (not shown), and the upper surface 21 receives the heat generated from the heat source, respectively The heat storage assembly 30 and the heat dissipation fin group 40 are directionally guided. When a part of the heat passes through the heat conduction rod 20 to reach the heat storage assembly 30, the solid solution liquid working medium 32 contacts the heat conduction rod 20 and the heat conduction sheets 33 to be solidified. After being heated, the liquid working medium 32 will change from a solid state to a liquid state and absorb a large amount of latent heat, and the heat values are temporarily stored in the casing 31, and then passed through the heat dissipation fin group when the system is shut down or operated at a lower speed. 40 is dissipated into the internal space of the system and then dissipated into the external space; at the same time, another part of the heat passes through the heat-conducting rod 20 to the heat-dissipating fin set 40, and is dissipated through the heat-dissipating fins 41 to the internal space of the system and then dissipated to the outside. In space.

Referring to FIG. 5, the difference between the embodiment and the above embodiment is that the heat storage component 30 of the embodiment is located in the middle of the heat conducting rod 20, and the heat conducting base 10 and the heat dissipating fin set 40 are respectively located in the heat conduction. The two end positions of the rod 20. Since the heat transfer rate of the heat storage component 30 is fast and close to the heat source, when the temperature of the heat source rises sharply, as long as the temperature in the heat storage component 30 exceeds the melting point of the solid solution working medium, the temperature can be set at the melting point. Absorb a large amount of latent heat to achieve the purpose of adjusting the temperature of the heat source so as not to exceed the upper limit of the temperature specification.

Referring to FIG. 6 , the difference between this embodiment and the above embodiments is that the hot fin set 40 of the embodiment is located in the middle of the heat conducting rod 20 , and the heat conducting base 10 and the heat storage component 30 are respectively located at The two end positions of the heat conducting rod 20. The composite heat dissipation module can first dissipate heat through the heat fin group 40, and exceeds a part of the heat of the natural convection heat dissipation limit of the heat fin group 40, and then passes through the heat conduction rod 20 to be continuously conducted by the heat storage assembly 30. The solid solution working medium 32 and the heat conducting sheets 33 are absorbed, thereby achieving the purpose of optimizing the natural convection heat dissipation limit of the composite heat dissipating module.

Referring to FIG. 7 , the difference between the embodiment and the foregoing embodiments is that the upper surface 111 of the heat conducting base 10 defines two recesses 112 , and the heat conducting rod 20 includes a first heat conducting portion 20 a and the first heat conducting portion. A second heat conducting portion 20b is disposed 20a apart, wherein one end of the first heat conducting portion 20a is embedded in the groove 112 of one of the foregoing, and the other end of the first heat conducting portion 20a is connected to the heat fin group 40. One end of the second heat conduction portion 20b is buried in the remaining groove 112, and the other end of the second heat conduction portion 20b is connected to the heat storage assembly 30. In this way, the heat-conducting base 10 can be accelerated to transmit heat to the heat storage assembly 30 and the heat fin group 40, respectively, after being heated.

Referring to FIG. 8 and FIG. 9, the heat conductive sheet in the present invention may be the same as the foregoing embodiment, wherein FIG. 8 is a ring wall 332 extending toward one side of the periphery of the through hole 331 of each of the heat conducting sheets 33A, and is in the ring wall 332. An opening groove 333 is formed in the side of the through hole 331. The inner wall surface of the ring wall 332 and the outer circumferential surface of the heat conducting rod 20 are closely adhered to each other, thereby increasing the contact area between the two to improve the heat conduction performance. 9 is a ring wall 332 extending toward one side of the perforation 331 of each of the heat conducting sheets 33B, and an opening groove 333 is provided above the ring wall 332 and the through hole 331, and one end of the heat conducting rod 20 is worn. After the perforations 331 of the respective heat transfer sheets 33B are inserted, the positions of the opening grooves 333 are punched and joined by a press press (not shown).

In summary, the composite heat-dissipating module with the heat storage component of the present invention can achieve the intended use purpose, and solve the lack of the conventional, and because of the novelty and the progressiveness, fully meets the requirements of the new patent application. To file an application in accordance with the Patent Law, please check and grant the patent in this case to protect the rights of the creator.

10‧‧‧ Thermal base

11‧‧‧ board

11‧‧‧ upper surface

112‧‧‧ Groove

12‧‧‧Body

20‧‧‧heat beam

21‧‧‧Upper plane

22‧‧‧ Lower plane

30‧‧‧ Thermal storage components

31‧‧‧Shell

40‧‧‧Fixing fin set

41‧‧‧Heat fins

Claims (18)

A composite heat dissipation module having a heat storage component, comprising: a base; a heat conducting rod disposed on the base; and a heat storage component comprising a casing, a solid solution working medium and a plurality of heat conducting sheets The housing has a cavity, and the heat conducting sheets are respectively sleeved on the heat conducting rod, and the solid solution working medium and each of the heat conducting sheets are received in the cavity. The composite heat dissipation module with a heat storage component according to claim 1, further comprising a heat dissipation fin set, the heat dissipation fin set being sleeved on the heat conduction rod. The composite heat dissipation module with a heat storage component according to claim 2, wherein the base is located in an intermediate portion of the heat conductive rod, and the heat storage component and the heat dissipation fin set are respectively located at two ends of the heat conduction rod . The composite heat dissipating module with a heat storage component according to claim 2, wherein the heat storage component is located in an intermediate portion of the heat conducting rod, and the base and the heat dissipating fin set are respectively located on the heat conducting rod end. The composite heat dissipating module with a heat storage component according to claim 2, wherein the heat dissipating fin group is located in an intermediate portion of the heat conducting rod, and the base and the heat storage component are respectively located on the heat conducting rod end. The composite heat dissipation module with a heat storage component according to claim 2, wherein the base is provided with two grooves, the heat conduction rod includes a first heat conduction portion and a second portion separately from the first heat conduction portion. a heat conducting section, one end of the first heat conducting section is buried in one of the recesses and the other end is provided for the heat sink fin The chip group is connected, and one end of the second heat conducting segment is buried in the other of the grooves and the other end is connected to the heat storage component. The composite heat dissipating module having a heat storage component according to claim 2, wherein the housing comprises an upper casing and a lower casing, wherein the lower casing is closely sealed to the upper casing, so that the upper casing and the upper casing The cavity is formed between the lower shells. A heat dissipation module having a heat storage component according to claim 7, wherein the upper case and the lower case are both made of a heat insulating material. The composite heat dissipation module with a heat storage component according to claim 7, wherein the lower casing has a bottom plate, a vertical plate extending from the bottom plate, and a lower edge plate extending from the vertical plate. The upper casing has a top plate, a vertical plate extending from the top plate, and an upper edge plate extending from the vertical plate. The upper edge plate and the lower edge plate are closely sealed. The composite heat dissipation module with a heat storage component according to claim 9, wherein the lower edge plate is formed with a front groove and a rear groove, and the upper edge plate is also formed with a front groove and a rear groove. The front groove of the lower edge plate corresponds to the front groove arrangement of the upper edge plate, and the rear groove of the lower edge plate corresponds to the rear groove arrangement of the upper edge plate, the heat conduction rod is straddled Between each of the front grooves and each of the rear grooves. The composite heat dissipation module with a heat storage component according to claim 10, wherein a liquid filling and deaeration half pipe is disposed on a side of the rear groove of the lower edge plate, and the rear groove of the upper edge plate A liquid-filling deaeration half pipe is disposed on one side, and the liquid-filling degassing half pipe of the lower edge plate is corresponding to the liquid-filling and degassing half pipe arrangement of the upper edge plate. The composite heat dissipating module with a heat storage component according to claim 1, wherein the heat conducting sheet has a through hole, and the heat conducting sheet is sleeved on the heat conducting rod, and the heat conducting sheets are arranged at intervals . The composite heat dissipating module with a heat storage component according to claim 1, wherein the heat conducting sheet has a through hole, and a ring wall extends from a periphery of the through hole, and an inner wall surface of the ring wall and an outer peripheral surface of the heat conducting rod are mutually Close stickers. The composite heat dissipating module with a heat storage component according to claim 1, wherein the heat conducting sheet has a through hole, and a ring wall extends from a periphery of the through hole, and an open slot is formed in the ring wall and the through hole. . The composite heat dissipation module with a heat storage component according to claim 1, wherein the base has a plate body, the plate body has an upper surface, and a groove is formed in the upper surface, the heat conduction rod has a In the upper plane, the heat conducting rod is embedded in the groove, and the upper plane and the upper surface are formed on the same plane. A composite heat dissipation module having a heat storage component according to claim 15, wherein a plurality of arm bodies are connected to the plate body. The composite heat dissipation module with a heat storage component according to claim 1, wherein the heat conduction rod is a copper rod or a heat pipe. The composite heat dissipation module with a heat storage component according to claim 1, wherein the solid solution working medium is paraffin wax, fatty acid or salt.