CN212256234U - Heat pipe radiator for CPU heat radiation - Google Patents
Heat pipe radiator for CPU heat radiation Download PDFInfo
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- CN212256234U CN212256234U CN202021228946.0U CN202021228946U CN212256234U CN 212256234 U CN212256234 U CN 212256234U CN 202021228946 U CN202021228946 U CN 202021228946U CN 212256234 U CN212256234 U CN 212256234U
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Abstract
The utility model provides a be used for radiating heat pipe radiator of CPU, include: a heat-conducting copper plate (1) whose lower surface is in contact with the CPU; a first number of U-shaped heat pipes (31), the bottoms of which are in contact with the upper surface of the heat-conducting copper plate (1), and the projections of the upper parts of which in the width direction of the heat-conducting copper plate (1) fall within the length range of the heat-conducting copper plate (1); the bottoms of the second number of the special-shaped heat pipes (32) are in contact with the upper surface of the heat-conducting copper plate (1), and the projection of the upper parts of the second number of the special-shaped heat pipes in the width direction of the heat-conducting copper plate (1) falls outside the length range of the heat-conducting copper plate (1); and the distance between the radiating fan (5) and the U-shaped heat pipe (31) is less than that between the radiating fan and the special-shaped heat pipe (32). The utility model provides a heat pipe radiator can improve the radiating efficiency of radiator.
Description
Technical Field
The utility model relates to a CPU heat dissipation technical field, concretely relates to be used for radiating heat pipe radiator of CPU.
Background
With the development of electronic integration technology, computer CPU chips are always developing towards high power, which makes the heat flux density generated by the chips continuously increase. The CPU generates a large amount of heat when the desktop computer is running, causing the chip temperature to rise rapidly. Moreover, high temperature can be a significant hazard to the performance and reliability of the computer CPU, and in severe cases can cause the chip to fail. Therefore, the heat dissipation problem seriously restricts the improvement of the CPU chip dominant frequency. Therefore, the heat generated when the CPU chip operates must be dissipated to the environment in time, thereby ensuring that the desktop computer can work normally, safely, and efficiently.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
To the above problem, the utility model provides a be used for radiating heat pipe radiator of CPU for at least part of part solves technical problem such as traditional heat abstractor radiating efficiency is low.
(II) technical scheme
The utility model provides a be used for radiating heat pipe radiator of CPU, include: a heat-conducting copper plate 1, the lower surface of which is in contact with the CPU; a first number of U-shaped heat pipes 31, the bottoms of which are in contact with the upper surface of the heat-conducting copper plate 1, and the projections of the upper portions thereof in the width direction of the heat-conducting copper plate 1 falling within the length range of the heat-conducting copper plate 1; a second number of the heat pipes 32 having a shape with a bottom contacting the upper surface of the heat-conducting copper plate 1 and an upper projection in the width direction of the heat-conducting copper plate 1 falling outside the length range of the heat-conducting copper plate 1; and the distance between the heat radiation fan 5 and the U-shaped heat pipe 31 is smaller than that between the heat radiation fan and the special-shaped heat pipe 32.
Further, the heat pipe radiator for CPU heat radiation further includes: and a plurality of radiating fins 4 which are parallelly arranged on the upper part of the U-shaped heat pipe 31 and/or the special-shaped heat pipe 32.
Further, the surface of the heat dissipating fin 4 is provided with a plurality of through holes 41 at equal intervals.
Further, the U-shaped heat pipe 31 or the deformed heat pipe 32 includes: a wick 9; the waist plate 10 is arranged inside the liquid absorption core 9, and liquid is arranged in the waist plate 10; when one end of the heat pipe absorbs heat, the liquid in the liquid absorption core 9 is evaporated and vaporized, the vapor flows to the other end to release heat and is condensed into liquid, the liquid flows back to the liquid absorption core 9 along the waist plate 10, and the heat is transferred from one end of the heat pipe to the other end.
Further, the heat pipe radiator for CPU heat radiation further includes: and the heat sink 2 is arranged on the upper surface of the heat-conducting copper plate 1.
(III) advantageous effects
The embodiment of the utility model provides a pair of be used for radiating heat pipe radiator of CPU under the prerequisite that does not increase 1 area of heat conduction copper, increases the special-shaped heat pipe of second quantity, has increased heat pipe radiator's heat dissipation space from this, has improved heat pipe radiator's radiating efficiency.
Drawings
Fig. 1 schematically shows a structural diagram of a heat pipe radiator for CPU heat dissipation according to an embodiment of the present invention;
fig. 2 schematically shows a schematic diagram of a heat pipe arrangement of a heat pipe radiator for CPU heat dissipation according to an embodiment of the present invention;
fig. 3 schematically shows a schematic structural diagram of a heat pipe adopted by the heat pipe radiator for CPU heat dissipation according to an embodiment of the present invention;
fig. 4 schematically shows a top view of a heat pipe heat sink for CPU heat dissipation according to an embodiment of the present invention;
fig. 5 schematically illustrates a bottom view of a heat pipe heat sink for CPU heat dissipation according to an embodiment of the present invention;
fig. 6 schematically illustrates a side view of a heat pipe heat sink for CPU heat dissipation according to an embodiment of the present invention;
fig. 7 schematically shows a schematic view of a heat-conducting copper plate in contact with a CPU chip for a heat pipe radiator for CPU heat dissipation according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings.
An embodiment of the present disclosure provides a heat pipe radiator for CPU heat dissipation, please refer to fig. 1, fig. 2 and fig. 7, including: a heat-conducting copper plate 1, the lower surface of which is in contact with the CPU; a first number of U-shaped heat pipes 31, the bottoms of which are in contact with the upper surface of the heat-conducting copper plate 1, and the projections of the upper portions thereof in the width direction of the heat-conducting copper plate 1 falling within the length range of the heat-conducting copper plate 1; a second number of the heat pipes 32 having a shape with a bottom contacting the upper surface of the heat-conducting copper plate 1 and an upper projection in the width direction of the heat-conducting copper plate 1 falling outside the length range of the heat-conducting copper plate 1; and the distance between the heat radiation fan 5 and the U-shaped heat pipe 31 is smaller than that between the heat radiation fan and the special-shaped heat pipe 32.
Here, the upper portion of the U-shaped heat pipe refers to a portion which is not in direct contact with the heat-conducting copper plate 1 and is perpendicular to the surface of the heat-conducting copper plate 1, see the portion denoted by 311 in fig. 2, and the bottom portion of the U-shaped heat pipe refers to the portion denoted by 312 in fig. 2; the upper portion of the heat pipe is a portion which is not in direct contact with the heat-conducting copper plate 1 and is perpendicular to the surface of the heat-conducting copper plate 1, see the portion denoted by 321 in fig. 2, the bottom portion of the heat pipe is denoted by 323 in fig. 2, and the bent portion 322 of the heat pipe connects the upper portion 321 and the bottom portion 323. The first number of U-shaped heat pipes 31 are closer to the heat dissipation fan 5 than the second number of heat pipes 32, so that the heat exchange effect is better, the first number of U-shaped heat pipes 31 can transfer the heat of the CPU to the heat dissipation fins 4 more efficiently, and the first number of U-shaped heat pipes 31 are the main heat dissipation part of the heat sink. The heat radiation fan 5 is a centrifugal fan, is installed on the side surface of the radiator, and can preferentially blow the cold air onto the first number of U-shaped heat pipes 31.
It should be noted that the first number and the second number may be the same number or different numbers, and the first number and the second number are not limited to be different numbers, and are only used to describe different heat pipe arrangements. Fig. 1 to 7 show that 4 heat pipes are U-shaped heat pipes and 5 heat pipes are profiled heat pipes, but the number of U-shaped heat pipes is not limited to 4 and the number of profiled heat pipes is not limited to 5. Here, the upper and lower surfaces of the heat-conducting copper plate 1 are not limited to the upper and lower surfaces of the spatial position, but only the CPU is described as being located on one surface of the heat-conducting copper plate 1, and the bottom of the heat pipe is described as being located on the other surface of the heat-conducting copper plate 1. Note that, in fig. 2, one side X direction of the heat-conducting copper plate 1 is a longitudinal direction, and the other side Y direction is a width direction, but the length of the heat-conducting copper plate in the longitudinal direction is not limited to being longer than the length in the width direction, and the longitudinal direction and the width direction are used for distinguishing different spatial orientations. The projection of the U-shaped heat pipe 31 in the width direction is an orthogonal projection of a projection line perpendicular to the Y direction, and the length of the obtained projection in the X direction is smaller than the length of the heat-conducting copper plate 1, that is, falls within the length range of the heat-conducting copper plate 1; the projection of the irregular-shaped heat pipe 32 in the width direction is an orthogonal projection of a projection line perpendicular to the Y direction, and the length of the obtained projection in the X direction is greater than the length of the heat-conducting copper plate 1, that is, falls outside the length range of the heat-conducting copper plate 1.
On the basis of the above embodiment, the method further includes: and a plurality of radiating fins 4 which are parallelly arranged on the upper part of the U-shaped heat pipe 31 and/or the special-shaped heat pipe 32.
The upper portion here also refers to the portion of the U-shaped heat pipe 31 and the shaped heat pipe 32 that is in direct contact with the heat-conducting copper plate 1 and is perpendicular to the surface of the heat-conducting copper plate 1. The cooling fan 5 blows cold air to the first number of U-shaped heat pipes 31 and the second number of heat pipes 32 in sequence, and the heat inside the heat pipes is further transmitted to the surrounding environment through the cooling fins 4. The heat dissipation fins 4 can be made of aluminum material to increase the heat conduction rate.
In addition to the above embodiments, the surface of the heat dissipating fin 4 is provided with a plurality of through holes 41 at equal intervals.
Referring to fig. 4, a plurality of through holes 41 are provided at equal intervals to generate turbulence in the flow of the air blown by the fan, thereby enhancing heat dissipation.
On the basis of the above embodiment, the U-shaped heat pipe 31 or the deformed heat pipe 32 includes: a wick 9; the waist plate 10 is arranged inside the liquid absorption core 9, and liquid is arranged in the waist plate 10; when one end of the heat pipe absorbs heat, the liquid in the liquid absorption core 9 is evaporated and vaporized, the vapor flows to the other end to release heat and is condensed into liquid, the liquid flows back to the liquid absorption core 9 along the waist plate 10, and the heat is transferred from one end of the heat pipe to the other end.
Referring to fig. 3, the U-shaped heat pipe 31 or the special-shaped heat pipe 32 further includes a pipe shell 7 and an end cap (end enclosure) 8, and a layer of wick 9 with a porous capillary structure is disposed on the inner wall of the sealed high-vacuum pipe shell 7 and is soaked with a liquid-phase working medium. When one end of the heat pipe absorbs heat, the liquid in the liquid absorption core 9 is evaporated and vaporized, the vapor flows to the condensation section for condensation, and the released latent heat of vaporization is sent to the outside. The condensed liquid is retracted into the liquid absorption core 9 and flows back to the evaporation section under the action of capillary pressure, and the automatic circulation of the working medium is completed.
On the basis of the above embodiment, the heat pipe radiator for CPU heat dissipation further includes: and the heat sink 2 is arranged on the upper surface of the heat-conducting copper plate 1.
The heat sink 2 is an aluminum finned heat dissipation structure, and the cooling effect of the radiator can be enhanced.
Referring to fig. 4-7, fig. 4-7 are a top view, a bottom view and a side view of a heatpipe heat sink for CPU heat dissipation, respectively, where the main directions of heat transfer in the heatpipe heat sink are: the heat is transmitted to the heat conducting copper plate 1 at the bottom of the radiator by the CPU chip, then the heat conducting copper plate 1 disperses the heat to the part of the U-shaped heat pipe (31) and/or the special-shaped heat pipe (32) which is directly contacted with the heat conducting copper plate 1, the heat pipe transmits the heat of the CPU chip to the upper part of the heat pipe and the cold end, and then the air cooling heat dissipation is carried out by the fan arranged on the radiator, so that the purpose of rapid and efficient heat dissipation is achieved.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A heat pipe heat sink for dissipating heat from a CPU, comprising:
a heat-conducting copper plate (1) whose lower surface is in contact with the CPU;
a first number of U-shaped heat pipes (31), the bottoms of which are in contact with the upper surface of the heat-conducting copper plate (1), and the projections of the upper parts of which in the width direction of the heat-conducting copper plate (1) fall within the length range of the heat-conducting copper plate (1);
the bottoms of the second number of the special-shaped heat pipes (32) are in contact with the upper surface of the heat-conducting copper plate (1), and the projection of the upper parts of the second number of the special-shaped heat pipes in the width direction of the heat-conducting copper plate (1) falls outside the length range of the heat-conducting copper plate (1);
and the distance between the radiating fan (5) and the U-shaped heat pipe (31) is less than that between the radiating fan and the special-shaped heat pipe (32).
2. A heat pipe radiator as claimed in claim 1, further comprising:
and a plurality of radiating fins (4) which are parallelly arranged on the upper parts of the U-shaped heat pipes (31) and/or the special-shaped heat pipes (32).
3. A heat pipe radiator according to claim 2, wherein the surface of the radiating fin (4) is provided with a plurality of equally spaced through holes (41).
4. A heat pipe radiator according to claim 1, wherein said U-shaped heat pipe (31) or profiled heat pipe (32) comprises:
a wick (9);
the waist plate (10) is arranged inside the liquid absorption core (9), and liquid is arranged in the waist plate (10);
when one end of the heat pipe absorbs heat, the liquid in the liquid absorption core (9) is evaporated and vaporized, the vapor flows to the other end to release heat and is condensed into liquid, the liquid flows back to the liquid absorption core (9) along the waist plate (10), and the heat is transferred from one end of the heat pipe to the other end.
5. A heat pipe radiator as claimed in claim 1, further comprising:
and the heat sink (2) is arranged on the upper surface of the heat-conducting copper plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021228946.0U CN212256234U (en) | 2020-06-29 | 2020-06-29 | Heat pipe radiator for CPU heat radiation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021228946.0U CN212256234U (en) | 2020-06-29 | 2020-06-29 | Heat pipe radiator for CPU heat radiation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212256234U true CN212256234U (en) | 2020-12-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021228946.0U Active CN212256234U (en) | 2020-06-29 | 2020-06-29 | Heat pipe radiator for CPU heat radiation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212256234U (en) |
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2020
- 2020-06-29 CN CN202021228946.0U patent/CN212256234U/en active Active
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