KR100902675B1 - Heat pipe typic cooling apparatus using multi-tubules - Google Patents

Abstract

A heat pipe type cooling device without a wick is provided to reduce the manufacturing process and to simplify the manufacturing process. A heat pipe type cooling device comprises: an evaporator(10), a condenser(20), a plurality of steam pipes(30a) and a plurality of liquid pipes(30b). The evaporator is contacted with a heating source(40) whose bottom plane is the heat source. The condenser is located in the same level of the evaporator and is made of a chamber. A plurality of steam pipes has one side connected to the evaporator and the other side connected to the condenser. A plurality of liquid pipes has one side connected to the condenser and the other side connected to the evaporator. A plurality of steam pipes and liquid pipes are consisting of multiple-tubules whose inner diameter is less than 5mm.

Description

Heat pipe typic cooling apparatus using multi-tubules

The present invention relates to a heat pipe type cooling apparatus using multiple tubules.

The heat sink is a cooling device used to efficiently remove heat from the heat generating portion. The heat sinks are classified into a forced convection type using heat and a natural convection type using air according to a method of use.

As the manufacturing method of the heat sink, press, extrusion, bonding, heat pipe, brazing, and the like, there is a difference in price and performance according to the material, weight, and method, and in recent years, a lot of special types of workpieces have been developed, but heat dissipation area and thermal conductivity Considering the air circulation, the brazing method is recognized as the most advanced technology. The current status of heat sinks is classified as follows.

 As shown in FIG. 1, the first generation heat sink is a cast product using mostly aluminum, and adopts natural convection in the low heat generation portion and forced convection in the high heat generation portion.

As shown in FIG. 2, the second-generation heat sink has excellent thermal conductivity on the bottom surface of the heat sink, which is a conventional aluminum casting product, in order to increase the contact thermal conductivity of the heat generating portion (heat generating portion), as compared to the first generation heat sink. I adopt).

In addition, in the second generation heat sink, aluminum is chopped as much as possible in a part (condenser) in contact with air, thereby making contact with air more excellent. In particular, a large amount of color-coated heat sinks coated with paints for increasing various thermal conductivity have been introduced.

As the 3rd generation heat sinks, the first and second generations have already been realized, and the limitations of the existing heat sinks have been realized (heat conductivity and noise, etc.), so that the heat sink has been improved in efficiency, and the heat pipes have been applied to the existing heat sinks. For example, high-efficiency heatsink products using water-cooled (see FIG. 3), refrigerant (see FIG. 4), and vapor champer (see FIG. 5) technologies are being produced.

The development of high-performance heat sinks is a problem that must be solved with the rapid development of electronic devices. However, in the existing products, the installation of auxiliary equipment (water coolant circulating device, refrigerant liquid circulating device), and manufacturing cost increase (skying, wick type) Heat pipes), steam chamber micro-processing technology limitations, the increase in weight due to the expansion of the air-side heat transfer area, there is a problem such as the limitation of the installation space.

In particular, in recent years, since small / large capacity is pursued in semiconductor application devices, development of high-performance heat dissipation device is required in terms of thermal inevitably generated.

In particular, the most widely used heat pipes in recent years, as shown in Figure 6, generally a cylindrical closed container heat evaporation unit, heat dissipation condensation unit and heat-insulation without heat in and out It consists of wealth.

A certain amount of liquid is sealed in the heat pipe as a working fluid. The working fluid is boiled and evaporated at the evaporation part as heat enters, and the generated steam moves through the core part of the heat pipe, moves to the condensation part, and radiates heat from the condensation part. Transfer from the evaporator to the condenser.

As a method for returning the liquid from the condensation unit to the evaporation unit, there are capillary force, gravity, centrifugal force, electric fluid force, penetration pressure, superfluid flow method, and the like. The most commonly used method is the use of capillary force, which generates the capillary force, which is a wick, which is installed along the pipe wall of the heat pipe, as shown in FIG. It is a structure to return.

However, since the wick generally has a large flow resistance, it is generally used to return liquid using gravity when used on the ground. In such a case, the wick is not installed.

Heat pipes having such a structure are called wickless heat pipes or thermosiphons.

These thermosiphons use gravity for liquid return, so the evaporator must be below the condensate, so it works only in the bottom heat mode, whereas the heat pipe using the wick is not limited by the type of heating. Is characteristic.

In particular, most of the cooling devices used in electronic equipment, except for the liquid circulation type, emits heat in most system spaces, so that efficient heat dissipation is difficult. However, in the case of liquid circulation type, a heat sink is installed in the heat generating part and a cooling part is installed outside of the system to treat heat generated inside the system from the outside of the system. However, auxiliary equipment such as a circulating pump, a pump and a liquid pipe is essential. In particular, in the case of a failure of the pump can be said to have the disadvantage that the cooling of the heating portion is not made at all.

The present invention is a heat pipe type that does not have a wick as a cooling device irrespective of the evaporator and the condenser so that a heat sink may be installed in a heat generating unit and a cooling unit outside the system of electronic equipment, like a liquid circulation cooling device. An object of the present invention is to provide a cooling device.

The present invention relates to a heat pipe type cooling device without a wick, comprising: an evaporation unit consisting of a chamber having a bottom surface in contact with a heat source as a heat generating source, a condensation unit consisting of a chamber located at a level higher than the evaporation unit, and one end of the evaporation unit A plurality of tubules connected to the evaporator so as to be circulated with the inner space of the evaporator through an upper side of the condenser, and the other end thereof is connected to the condensator so as to be able to communicate with an inner space of the condenser at the other end; The said subject can be solved by the cooling apparatus which becomes the tubule of 5 mm or less of internal diameters.

According to another aspect of the present invention, there is provided a cooling apparatus, comprising: an evaporator comprising a chamber in which a bottom surface is in contact with a heat source that is a heat source; A condenser formed at the same level as the evaporator and formed of a chamber; One end is connected to the evaporator so as to pass through the upper end side of the evaporator and flows into the inner space of the evaporator, and the other end is connected to the condenser to pass through the upper side of the condensate and to the inner space of the condensate. A plurality of steam pipes as the customs pipe; And one end penetrates through one lower end of the condenser and is connected to the condenser so as to be circulated with the inner space of the condenser, and the other end penetrates through one lower end of the evaporator and can communicate with the inner space of the evaporator. The said subject can be solved by the cooling apparatus which consists of a some liquid pipe as a connected tubule, and the said steam pipe and liquid pipe which are the said plurality of tubules become a tubule with a diameter of 5 mm or less.

The present invention provides a cooling device according to another embodiment, comprising: an evaporator comprising a chamber in which one side is in contact with a heat source that is a heat source; A condenser comprising a chamber positioned at a level lower than the level of the evaporator; One end of the tubular body connected to the condensation unit through the upper wall of the evaporation unit and circulating with the internal space of the evaporation unit, and the other end is connected to the condensation unit so as to circulate with the inner space of the condensation unit. A plurality of steam pipes as; And one end penetrates through the bottom wall of the condenser and is connected to the condenser so as to be circulated with the inner space of the condenser, and the other end penetrates through the bottom wall of the evaporator and communicates with the inner space of the evaporator. The said subject can be solved by the cooling apparatus which consists of a some liquid pipe as a connected tubule, and the said steam pipe and liquid pipe which are the said plurality of tubules become a tubule with a diameter of 5 mm or less.

This invention can make it possible to provide the cooling apparatus which can cool low cost, regardless of the attitude | position of an evaporator and a condenser by the above structures.

 In addition, the present invention makes it possible to transfer heat generated in the inner space to the outer space to release the heat, it is possible to suppress the temperature rise of the inner space, and the conventional wick structure because the use of the wick without the wick as a heat transport pipe Compared to the heat pipe, the manufacturing process is simpler, making the manufacturing cost cheaper, and the heat pipe heating mode can be lowered, horizontally heated, and upper heated, thereby making it easier to design a cooling device according to the application. Since customs can be used as the heat pipe, it is possible to manufacture a system suitable for a narrow space.

In addition, the present invention can be applied to chip cooling, such as IC, LSI, which requires local cooling.

Hereinafter, an embodiment according to the present invention will be described with reference to the accompanying drawings.

In Fig. 7, the first cooling device in the bottom heating mode is indicated by reference numeral 100 as the cooling device for cooling the heat generating source.

The first cooling device is a heat pipe type cooling device without a wick, which will be described in detail as follows.

As illustrated in FIG. 7, the first cooling device 100 has a level higher than that of the evaporator 10 and the evaporator 10, the evaporator 10 having a chamber in contact with a heat source 40 that is a heat source. Condensation unit 20 is formed in the chamber, one end is penetrated through the upper surface of the evaporation unit 10 is connected to the evaporation unit 10 so as to circulate with the internal space of the evaporation unit 10, the other end is It includes a plurality of tubules (30) connected to the condensation unit 20 so as to pass through the bottom surface of the condensation unit 20 and the internal space of the condensation unit 20.

The plurality of tubules 30 are tubules having an inner diameter of 5 mm or less for transporting heat. As described above, in the tubule 30, the working fluid in the evaporator 10 is vaporized and evaporated by the heat source 40, which is a heat source, to condense along the core of the tubule 30 due to the pressure difference. In the condensation part 20, the condensation part 20 is in a liquid state after being heat-exchanged with the outside air, and a liquid working fluid passes through the capillary 30 to form an inner wall of the capillary 30 by capillary force. Accordingly, in the liquid return to the evaporator 10, it is to use the capillary force.

Therefore, the existing heat pipe is installed inside the wick for the liquid return, but in the present invention, because the heat pipe structure does not install the wick because of the use of customs can be said to be very advantageous in terms of manufacturing and cost.

In particular, since the heating mode of the heat pipe cooling apparatus of the present invention enables smooth liquid return by capillary force of the capillary tube, as well as the bottom heating mode as described above, it will be described as a separate embodiment below. Horizontal heat mode and top heat mode are possible, but in the case of the thermosiphon without the wick mentioned above in the prior art, it is possible to use only in the bottom heating mode.

The reason is that due to the volume expansion of bubbles generated by nuclear boiling in the hot part (evaporation part) and the pressure difference and capillary force between the evaporator and the condenser caused by the condensation of the bubbles in the cold part (condensation part), As a natural circulation structure, heat transfer is performed by the latent heat of the working fluid, and thus heat dissipation is much faster than that by heat conduction.

In the bottom heating mode, the working fluid evaporated and vaporized by absorbing heat from the heat source in the lower part flows into the condensation part through the core part of the tubule, and in the condensing part, the working fluid becomes liquid by exchanging heat with the outside air . It flows down the inner wall of the customs and supplies continuous liquid to the evaporator.

In general, heat pipes with no wicks, also known as thermosiphons, do not operate as heat pipes in horizontal heating mode. However, in the second cooling device 200 according to the second embodiment, as shown in Figure 8, the high temperature vapor evaporated in the evaporator flows to the upper tube of the multi-tube, the case of the lower tube In the condensation unit is a structure in which the low-temperature liquid flows in the form of a natural circulation flow. In particular, the fact that the steam pipe and the liquid pipe are separated from each other has a different feature from the above-mentioned first cooling device (100).

As shown in FIG. 8, the second cooling device 200 includes an evaporator 10 formed of a chamber in which a bottom surface thereof is in contact with a heat source 40 that is a heating source; A condenser 20 formed at the same level as the level of the evaporator 10 and formed of a chamber; One end penetrates through one upper end of the evaporator 10 and is connected to the evaporator 10 so as to be distributed with the internal space of the evaporator 10, and the other end penetrates through one upper end of the condenser 20. A plurality of steam pipes (30a) as fine pipes connected to the condensation unit (20) so as to be circulated with the internal space of the condensation unit (20); And one end penetrates through one lower end side of the condensation unit 20 and is connected to the condensation unit 20 so that the inner space of the condensation unit 20 can flow, and the other end is connected to the lower end side of the evaporator 10. A plurality of liquid pipes 30b serving as tubules connected to the evaporator 10 so as to flow through the internal space of the evaporator 10 are included.

The plurality of tubules, the steam tube and the liquid tube 30a, 30b, are arranged in parallel to each other and are tubules having an inner diameter of 5 mm or less for transporting heat. As described above, in the steam pipe 30a, the working fluid in the vaporized and evaporated working state of the working fluid in the evaporator 10 receives heat by the heat source 40, which is a heat generating source, along the steam pipe 30a due to the pressure difference. 20), and after being heat-exchanged with the outside air in the condenser 20, the liquid state, the liquid working fluid is evaporated along the inner wall of the liquid pipe (30b) by capillary force via the liquid pipe (30b) This is to use the capillary force in returning the liquid to the part (10).

 In addition, in the third cooling device 300 according to the third embodiment of the present invention, it is possible to circulate the working fluid in the upper heating mode as shown in FIG.

That is, as shown in FIG. 9, the third cooling device 300 of the third embodiment includes an evaporator 10 formed of a chamber in which one side is in contact with a heat source 40 that is a heating source; A condenser 20 positioned at a level lower than that of the evaporator 10 and configured as a chamber; One end penetrates through an upper wall of the evaporator 10 and is connected to the evaporator 10 so as to be circulated with the internal space of the evaporator 10, and the other end penetrates through an upper wall of the condenser 20. A plurality of steam pipes (30a) as fine pipes connected to the condensation unit (20) so as to be able to flow through the internal space of the condensation unit (20); And one end penetrates through the bottom wall of the condenser 20 and is connected to the condenser 20 so as to be circulated with the internal space of the condenser 20, and the other end of the bottom wall of the evaporator 10. A plurality of liquid pipes 30b serving as tubules connected to the evaporator 10 so as to flow through the internal space of the evaporator 10 are included.

The plurality of tubules, the steam tube and the liquid tube 30a, 30b, are arranged in parallel to each other and are tubules having an inner diameter of 5 mm or less for transporting heat. As described above, in the steam pipe 30a, the working fluid in the vaporized and evaporated working state of the working fluid in the evaporator 10 receives heat by the heat source 40, which is a heat generating source, along the steam pipe 30a due to the pressure difference. 20), and after being heat-exchanged with the outside air in the condenser 20, the liquid state, the liquid working fluid is evaporated along the inner wall of the liquid pipe (30b) by capillary force via the liquid pipe (30b) This is to use the capillary force in returning the liquid to the part (10).

In particular, the condensation unit presented in the present embodiment may be developed and used in various structures in terms of maximizing heat exchange efficiency. As an example, as shown in FIG. 10, a plurality of heat dissipation fins 20a are provided on the top wall of the condensation unit 20 as a chamber. ) And an air-cooled fin 20b may be arranged to protrude and attach the air to blow the outside air to the plurality of heating fins 20a.

1 is a view showing an example of a conventional heat sink,

2 is a diagram showing an example of another conventional heat sink;

3 is a view showing another example of a conventional heat sink,

4 shows another example of a conventional heat sink;

5 is a view showing an example of another conventional heat sink,

6 is a view showing an example of a conventional heat pipe,

7 shows a first embodiment of the present invention;

8 is a view showing a second embodiment of the present invention;

9 shows a third embodiment of the present invention;

10 is a view showing a heat generating structure for the condensation unit provided in the embodiments of the present invention.

Claims (4)

delete Wickless heat pipe type chiller, An evaporator 10 formed of a chamber whose bottom surface is in contact with a heat source 40 that is a heat source; A condenser 20 formed at the same level as the level of the evaporator 10 and formed of a chamber; One end penetrates through one upper end of the evaporator 10 and is connected to the evaporator 10 so as to be distributed with the internal space of the evaporator 10, and the other end penetrates through one upper end of the condenser 20. A plurality of steam pipes (30a) as fine pipes connected to the condensation unit (20) so as to be circulated with the internal space of the condensation unit (20); And One end penetrates one lower end side of the condenser 20 and is connected to the condensation unit 20 so as to be able to pass through the inner space of the condensation unit 20, and the other end penetrates one lower end side of the evaporator 10. And a plurality of liquid pipes 30b serving as tubules connected to the evaporator 10 so as to be able to pass through the internal space of the evaporator 10. The plurality of steam pipes and the liquid pipes (30a, 30b) is a heat pipe type cooling apparatus using multiple tubing, characterized in that the tubing having an inner diameter of 5mm or less. Wickless heat pipe type chiller, An evaporator 10 formed of a chamber in which one side is in contact with a heat source 40 that is a heat source; A condenser 20 positioned at a level lower than that of the evaporator 10 and configured as a chamber; One end penetrates through an upper wall of the evaporator 10 and is connected to the evaporator 10 so as to be circulated with the internal space of the evaporator 10, and the other end penetrates through an upper wall of the condenser 20. A plurality of steam pipes (30a) as fine pipes connected to the condensation unit (20) so as to be able to flow through the internal space of the condensation unit (20); And One end penetrates the bottom wall of the condenser 20 and is connected to the condenser 20 so as to be able to pass through the inner space of the condenser 20, and the other end penetrates the bottom wall of the evaporator 10. And a plurality of liquid pipes 30b serving as tubules connected to the evaporator 10 so as to be able to pass through the internal space of the evaporator 10. The plurality of steam pipes and the liquid pipes (30a, 30b) is a heat pipe type cooling apparatus using multiple tubing, characterized in that the tubing having an inner diameter of 5mm or less. The method of claim 2 or 3, A plurality of heat dissipation fins 20a protrude and attach to one side wall of the condensation unit 20, and an air-cooled fin 20b is disposed to blow external air to the plurality of heat generating fins 20a. Heat pipe type cooling device using multiple tubing.

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