CN105466263B - Equalizing plate structure - Google Patents
Equalizing plate structure Download PDFInfo
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- CN105466263B CN105466263B CN201410444381.2A CN201410444381A CN105466263B CN 105466263 B CN105466263 B CN 105466263B CN 201410444381 A CN201410444381 A CN 201410444381A CN 105466263 B CN105466263 B CN 105466263B
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- plate
- connector
- structure according
- equalizing
- equalizing plate
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Abstract
A kind of equalizing plate structure, include: an ontology has a chamber, the chamber has one first side and a second side and a connector, the connector axial ends is separately connected first and second side, the connector radial outside periphery is equipped with one first capillary structure layer, there is working fluid, the connector setting through the present invention can prevent from ontology temperature distortion and reach to increase heat conduction efficiency effect in the chamber.
Description
[technical field]
A kind of equalizing plate structure, espespecially a kind of equalizing plate structure that can promote temperature-uniforming plate supporting degree and heat conduction efficiency.
[background technique]
Existing running gear, PC, servomechanism, communication machine box all internal calculation unit institutes due to operation efficiency is promoted
The heat of generation is also with promotion, then opposite to need heat-sink unit more to assist its heat dissipation, most dealers, which select, to be dissipated
The heat dissipation elements such as hot device, heat pipe, temperature-uniforming plate collocation fan carries out auxiliary heat dissipation, and needs large area to carry out heat dissipation Shi Zexuan when encountering
It is absorbed heat with temperature-uniforming plate and arranges in pairs or groups radiator and radiator fan carries out forced heat radiation, prevented due to needing to fit closely between each heat dissipation element
The generation of thermal chocking, and temperature-uniforming plate is a flat plate body, and internal setting one provides the hot biography of chamber progress of steam-condensate circulating
It leads, and generates expansion or deformation because of temperature-uniforming plate flat in order to prevent by pressure or after being heated, be then provided with plural number in chamber
Root support cylinder is used as the chamber of support temperature-uniforming plate.
Temperature-uniforming plate be a kind of face and face heat transfer, and in preceding description in order to prevent temperature-uniforming plate expanded by heating or by
External force flattening deformation is provided with plural support cylinder, but in then needing additionally to increase manufacturing man-hours and manufacturing cost (support on processing procedure
Cylinder), and if select and combine sintered ring outside plural copper post, copper post is only used as reflux cycle as supporting role, sintered ring,
The control of bottom plane degree is not easy, or uses more groove copper posts, and the copper post of more grooves is acted on as support and reflux cycle,
Also identical control is not easy bottom plane degree.
Though the problems such as original technology solves deformation but the manufacturing man-hours of increasing and cost and the control of bottom plane degree are not
The problems such as easy, therefore still deep beg for must be carried out for how to reduce this problem of manufacturing cost.
[summary of the invention]
Effectively to solve the problem above-mentioned, the main purpose of the present invention provides a kind of equalizing plate structure, includes: an ontology,
With a chamber, which has one first side and a second side and a plate connector, the plate connector axial ends point
First and second side is not connected, and the plate connector radial outside periphery is equipped with one first capillary structure layer, tool in the chamber
There is working fluid.
The ontology has more one first plate body and one second plate body, and the corresponding lid of first and second plate body amounts to same define
Aforementioned cavity.
The plate connector is a metal plate.
The plate connector is that a copper material or an aluminium material or thermally conductive good conductor are any.
First capillary structure layer is that a sintering body of powder or groove are any.
It is any that the geometries such as trapezoidal or round are in square or rectangular in the connector.
Recessed any in aforementioned first and second side with more a heat affected zone, it is heated that the plate connector is set to this
Area, first and second side is further provided with one second capillary structure layer, and the second capillary structure layer of the heat affected zone is unmanaged compared with other
The area thickness in area is thick.
The plate connector outer rim has more plural groove.
It is any that the geometries such as trapezoidal or round are in square or rectangular in first capillary structure layer.
First capillary structure layer has more an inclination angle.
Through equalizing plate structure of the present invention except can solve known temperature-uniforming plate expanded by heating deformation or be pressurized force compression deformation with
And supporter bottom plane degree it is not easy to control the problems such as outside, also have many advantages, such as to reach and save manufacturing man-hours and the hot transfer efficiency of promotion
Person.
[brief description of drawings]
Fig. 1 is the stereogram exploded view of the first embodiment of the equalizing plate structure of the present invention；
Fig. 2 is the constitutional diagram cross-sectional view of the first embodiment of the equalizing plate structure of the present invention；
Fig. 3 is the constitutional diagram cross-sectional view of the second embodiment of the equalizing plate structure of the present invention；
Fig. 4 is the constitutional diagram cross-sectional view of the 3rd embodiment of the equalizing plate structure of the present invention；
Fig. 5 is the constitutional diagram cross-sectional view of the fourth embodiment of the equalizing plate structure of the present invention；
Fig. 6 is the equalizing plate structure schematic diagram of the present invention.
The corresponding component name of each appended drawing reference in figure are as follows:
Ontology 1
First plate body 1a
Second plate body 1b
Chamber 11
First side 111
Second side 112
Plate connector 12
Groove 121
First capillary structure layer 13
Inclination angle 131
Heat affected zone 14
Second capillary structure layer 15
Working fluid 2
The working fluid 21 of steam state
The working fluid 22 of liquid
Heat source 3
[specific embodiment]
The above-mentioned purpose and its structure of the present invention and characteristic functionally, will give according to the preferred embodiment of institute's accompanying drawings
Explanation.
It as shown in Figure 1, 2, is the stereo decomposing and constitutional diagram cross-sectional view of the first embodiment of the equalizing plate structure of the present invention,
As shown, the equalizing plate structure, has an ontology 1；
The ontology 1 has a chamber 11, which there is one first side 111 and a second side 112 and a plate to connect
Junctor 12,12 axial ends of plate connector are separately connected first and second side 111,112, and the plate connector 12 is radial
Outboard peripheries are equipped with one first capillary structure layer 13, have working fluid 2, first capillary structure layer 13 in the chamber 11
For a sintering body of powder.
The ontology 1 is with more one first plate body 1a and the one second corresponding lid of plate body 1b, described first and second plate body 1a, 1b
It amounts to and defines aforementioned cavity 11 together.
The plate connector 12 is a metal plate, and the plate connector 12 be a copper material or an aluminium material or
Thermally conductive good conductor is any, and the present embodiment does not regard it as and is limited using copper material as illustrating embodiment.
It is any that the plate connector 12 is in square or rectangular the geometries such as trapezoidal or round, the present embodiment
Using square as illustrating embodiment, but does not regard it as and be limited.
As shown in figure 3, the constitutional diagram cross-sectional view of the second embodiment for the equalizing plate structure of the present invention, as shown, this
Embodiment part-structure is identical as aforementioned first embodiment, therefore will not be described in great detail herein, and only the present embodiment and aforementioned first is implemented
Not existing together for example is recessed in any, this implementation in aforementioned first and second side 111,112 with more a heat affected zone 14 for the ontology 1
The heat affected zone 14 of example is recessed in first side 111, and the plate connector 12 is set to the heat affected zone 14, first and second side
111,112 it is further provided with one second capillary structure layer 15, and the second capillary structure layer 15 of the heat affected zone 14 is compared with other unmanaged areas
14 area thickness is thick.
As shown in figure 4, the stereogram exploded view of the 3rd embodiment for the equalizing plate structure of the present invention, as shown, this reality
It is identical as aforementioned first embodiment to apply a part-structure, therefore will not be described in great detail herein, only the present embodiment and aforementioned second embodiment
Do not exist together and have more plural groove 121 for 12 outer rim of plate connector.
As shown in figure 5, the constitutional diagram cross-sectional view of the fourth embodiment for the equalizing plate structure of the present invention, as shown, this
Embodiment part-structure is identical as aforementioned first embodiment, therefore will not be described in great detail herein, the present embodiment and aforementioned first embodiment
Do not exist together for first capillary structure layer 13 with more an inclination angle 131, the working fluid for facilitating steam state is dissipated.
As shown in fig. 6, being the equalizing plate structure schematic diagram of the present invention, the ontology 1 is contacted with an at least heat source 3, and is selected
It selects and ontology 1 is provided with 12 place of plate connector as the position with 3 dominant touch of heat source, which is provided with plate
12 place of connector, the plate connector 12 are used as support to use, and mainly can avoid ontology 1 when the two fits closely and generate change
Shape.
Furthermore when the ontology 1 and heat source 3 carry out heat transfer, which is directly passed to the plate for heat
Connector 12 and be aided in chamber 11 working fluid 2 collocation generate steam-condensate circulating, major heat is by the plate connector 12
As transmitting, and the working fluid 21 of the steam state after being evaporated and the working fluid 22 of the liquid can be by first capillary structure layers
The heat dissipation effect for reaching splendid is used in 13 evapotranspirations and reflux.
Claims (10)
1. a kind of equalizing plate structure, includes: an ontology has a chamber, which has one first side and second side and one
Plate connector, the plate connector axial ends are separately connected first and second side, the plate connector radial outside periphery
Equipped with one first capillary structure layer, there is working fluid in the chamber, which is the plate in the middle part of the chamber
Body simultaneously selects to be provided with ontology in place of plate connector as the position with heat source dominant touch, which is characterized in that has more
One heat affected zone is recessed any in aforementioned first and second side, and the plate connector is set to the heat affected zone, and described first and second
Side is further provided with one second capillary structure layer, and the second capillary structure layer of the heat affected zone is compared with the area thickness in other unmanaged areas
It is thick.
2. equalizing plate structure according to claim 1, which is characterized in that the ontology is with more one first plate body and one the
Two plate bodys, the first and second plate body correspondence lid, which amounts to, defines together aforementioned cavity.
3. equalizing plate structure according to claim 1, which is characterized in that the plate connector is a metal plate.
4. equalizing plate structure according to claim 3, which is characterized in that the plate connector is any thermally conductive good leads
Body.
5. equalizing plate structure according to claim 4, which is characterized in that the plate connector is a copper material or an aluminium
Material.
6. equalizing plate structure according to claim 1, which is characterized in that first capillary structure layer is a sintering powder
Body or groove are any.
7. equalizing plate structure according to claim 1, which is characterized in that the connector is in square or rectangular or trapezoidal
Or circular geometry is any.
8. equalizing plate structure according to claim 1, wherein the plate connector outer rim has more plural groove.
9. equalizing plate structure according to claim 1, which is characterized in that first capillary structure layer is square or square
Shape or trapezoidal or circular geometry are any.
10. equalizing plate structure according to claim 1, which is characterized in that first capillary structure layer is inclined with more one
Angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410444381.2A CN105466263B (en) | 2014-09-03 | 2014-09-03 | Equalizing plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410444381.2A CN105466263B (en) | 2014-09-03 | 2014-09-03 | Equalizing plate structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105466263A CN105466263A (en) | 2016-04-06 |
| CN105466263B true CN105466263B (en) | 2019-08-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410444381.2A Active CN105466263B (en) | 2014-09-03 | 2014-09-03 | Equalizing plate structure |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020255513A1 (en) * | 2019-06-21 | 2020-12-24 | 株式会社村田製作所 | Vapor chamber |
| CN111595187A (en) * | 2020-05-11 | 2020-08-28 | 奇鋐科技股份有限公司 | Composite capillary structure of vapor chamber |
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| CN103196242A (en) * | 2013-03-27 | 2013-07-10 | 中国石油大学(华东) | Glass-cover-free tubular solar thermal collector |
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| CN100554853C (en) * | 2006-01-21 | 2009-10-28 | 富准精密工业(深圳)有限公司 | Plate shaped heat pipe |
| CN101927426A (en) * | 2009-06-24 | 2010-12-29 | 富准精密工业(深圳)有限公司 | Uniform-temperature panel and manufacturing method thereof |
| US20140138057A1 (en) * | 2012-11-18 | 2014-05-22 | Chin-Hsing Horng | Structure of low-profile heat pipe |
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2014
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|---|---|---|---|---|
| CN201229543Y (en) * | 2008-06-27 | 2009-04-29 | 索士亚科技股份有限公司 | Temperature equalizing board and support construction thereof |
| CN101754656A (en) * | 2008-12-10 | 2010-06-23 | 富准精密工业(深圳)有限公司 | Uniform temperature plate |
| CN102878844A (en) * | 2011-07-15 | 2013-01-16 | 奇鋐科技股份有限公司 | Temperature-uniformizing plate structure and manufacturing method for temperature-uniformizing plate |
| CN102956583A (en) * | 2011-08-29 | 2013-03-06 | 奇鋐科技股份有限公司 | Temperature equalization plate structure and manufacturing method thereof |
| CN202307864U (en) * | 2011-09-21 | 2012-07-04 | 奇鋐科技股份有限公司 | Uniform temperature plate structure |
| CN202511667U (en) * | 2012-02-07 | 2012-10-31 | 深圳市万景华科技有限公司 | Temperature homogenizing plate |
| CN103929924A (en) * | 2013-01-11 | 2014-07-16 | 奇鋐科技股份有限公司 | Uniform temperature plate structure |
| CN103196242A (en) * | 2013-03-27 | 2013-07-10 | 中国石油大学(华东) | Glass-cover-free tubular solar thermal collector |
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| Publication number | Publication date |
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| CN105466263A (en) | 2016-04-06 |
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