JP3197578U - Flat plate heat tube structure - Google Patents

Flat plate heat tube structure Download PDF

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JP3197578U
JP3197578U JP2015000226U JP2015000226U JP3197578U JP 3197578 U JP3197578 U JP 3197578U JP 2015000226 U JP2015000226 U JP 2015000226U JP 2015000226 U JP2015000226 U JP 2015000226U JP 3197578 U JP3197578 U JP 3197578U
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flat plate
tube structure
heat tube
capillary
capillary structure
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國俊 謝
國俊 謝
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奇▲こう▼科技股▲ふん▼有限公司
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Sustainable Development (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

【課題】全体の気液循環効率を薄型化により低減させないようにした平板熱管構造を提供する。【解決手段】平板熱管構造は、本体１を含み、本体は、第１板体１１、第２板体１２、第１毛細構造１３及び作動流体を有し、第１、第２板体は、相互に重なり合い、第１毛細構造は、第１、第２板体の間に設置され、第１、第２板体と少なくとも１つの蒸気通路を定義することを特徴とする。【選択図】図１A flat plate heat tube structure is provided in which the overall gas-liquid circulation efficiency is not reduced by thinning. A flat plate heat tube structure includes a main body, and the main body includes a first plate body, a second plate body, a first capillary structure, and a working fluid. The first and second plate bodies include: The first capillary structures overlap each other and are disposed between the first and second plate bodies and define at least one vapor passage with the first and second plate bodies. [Selection] Figure 1

Description

本考案は、平板熱管構造に関し、特に、厚さが極薄な平板熱管構造に関する。   The present invention relates to a flat plate heat tube structure, and more particularly to a flat plate heat tube structure having a very thin thickness.

現行の電子モバイル装置は、軽薄へ趨勢し、新式の電子モバイル装置は、軽薄であるだけでなく、その演算性能も伴って上昇し、但し、演算性能の上昇及び全体厚さの減縮に伴ってその内部に電子素子を収容する空間も制限を受け、演算性能が上昇する時、相対して電子素子が演算する時に発生する熱量も増加し、故に各電子部材の放熱作業を補助する放熱部材が必要であり、また、該電子モバイル装置が薄型化する条件で、その内部空間が極めて狭く、ファン等の放熱部材を設置することが困難であるので、銅薄片又はアルミ薄片を設置し、放熱面積を増大させることに使用することのみが可能であるが、放熱性能の向上は、依然として不十分である。   Current electronic mobile devices tend to be light and thin, and new electronic mobile devices are not only light and thin, but also increase their computing performance, but with increasing computing performance and reducing overall thickness The space in which the electronic element is accommodated is also limited, and when the computing performance is increased, the amount of heat generated when the electronic element is operated is also increased. Therefore, a heat radiating member that assists the heat radiating work of each electronic member is provided. It is necessary, and under the condition that the electronic mobile device is thinned, its internal space is extremely narrow and it is difficult to install a heat radiating member such as a fan. However, the improvement of the heat dissipation performance is still insufficient.

従来技術において、熱管又は均温板を薄型化する時、全体を薄型化する為、薄型熱管を薄型化した後に粉末を充填して焼結することが困難であり、極薄型化の構造を実現することが困難であり、或いは、粉末を充填して焼結した後に扁平状構造にプレスする時、熱管内部の焼結粉末又はその他の毛細構造（メッシュ体又は繊維体）が押圧を受けて破壊され、失効する。   In the prior art, when thinning the heat pipe or temperature plate, it is difficult to fill and sinter the powder after thinning the thin heat pipe to make the whole thin. Or when pressed into a flat structure after filling and sintering the powder, the sintered powder inside the heat tube or other capillary structure (mesh or fiber) is pressed and destroyed. And expires.

また、従来の均温板は、更に、薄型化する為、内部の支持構造を省略し、均温板に吸気口を密閉させた後、内部のチャンバが変形し易く、故に従来の薄型化熱管及び均温板内部の蒸気通路は、容易に圧縮されて小さくなるか、更には、蒸気通路がなくなり、内部全体気液循環の効率に影響を及ぼし、故に、薄型化後の均温板及び熱管内部の気液循環構造を如何に改良するかは、現在の改善すべき目標となっている。   In addition, the conventional temperature equalizing plate is further thinned, so that the internal support structure is omitted, and the air inlet is sealed in the temperature equalizing plate, and then the internal chamber is easily deformed. And the steam passage inside the temperature equalizing plate is easily compressed and becomes smaller, or further, the steam passage is lost, which affects the efficiency of the entire gas-liquid circulation. How to improve the internal gas-liquid circulation structure is the current goal to be improved.

これに鑑み、上記の問題を効率的に解決する為、本考案の目的は、超薄構造を有する平板熱管構造を提供し、薄型化後に依然として蒸気通路を保有する平板熱管構造を提供することにある。   In view of this, in order to efficiently solve the above problem, an object of the present invention is to provide a flat plate heat tube structure having an ultra-thin structure, and to provide a flat plate heat tube structure that still has a steam passage after being thinned. is there.

上記目的の本考案が提供する平板熱管構造は、本体を含み、
前記本体は、第１板体、第２板体、第１毛細構造及び作動流体を有し、前記第１、第２板体は、相互に重なり合い、該第１毛細構造は、該第１、第２板体の間に設置され、該第１毛細構造は、該第１、第２板体と少なくとも１つの蒸気通路を定義する。 The flat plate heat tube structure provided by the present invention for the above purpose includes a main body,
The main body includes a first plate body, a second plate body, a first capillary structure, and a working fluid. The first and second plate bodies overlap each other, and the first capillary structure includes the first, Located between the second plates, the first capillary structure defines at least one vapor passage with the first and second plates.

本考案が提供する平板熱管構造は、薄型化後の平板熱管に依然として円滑な蒸気通路保有させ、薄型化した平板熱管内部の作動流体に依然として円滑に気液循環を行わせることができる。   The flat plate heat tube structure provided by the present invention allows the thin plate heat tube to have a smooth steam passage, and allows the working fluid inside the thin plate heat tube to smoothly perform gas-liquid circulation.

本考案の平板熱管構造の第１実施例の立体分解図である。It is a three-dimensional exploded view of the first embodiment of the flat plate heat tube structure of the present invention. 本考案の平板熱管構造の第１実施例の組み合わせ断面図である。It is combination sectional drawing of 1st Example of the flat plate heat tube structure of this invention. 本考案の平板熱管構造の第２実施例の組み合わせ断面図である。It is combination sectional drawing of 2nd Example of the flat plate heat tube structure of this invention. 本考案の平板熱管構造の第３実施例の組み合わせ断面図である。It is combination sectional drawing of 3rd Example of the flat plate heat tube structure of this invention. 本考案の平板熱管構造の第４実施例の組み合わせ断面図である。It is combination sectional drawing of 4th Example of the flat plate heat tube structure of this invention.

本考案の上記目的及びその構造と機能上の特性について、図面に基づく好適実施例を挙げ、以下に説明する。   The above object of the present invention and its structural and functional characteristics will be described below with reference to preferred embodiments based on the drawings.

図１、図２を参照し、それは、本考案の平板熱管構造の第１実施例の立体分解図及び組み合わせ断面図であり、図に示すように、本考案の平板熱管構造は、本体１を含み、
前記本体１は、第１板体１１、第２板体１２、第１毛細構造１３及び作動流体２を有し、前記第１、第２板体１１，１２は、相互に重なり合い、該第１毛細構造１３は、該第１、第２板体１１，１２の間に設置され、該第１毛細構造１３は、該第１、第２板体１１，１２と少なくとも１つの蒸気通路１４を定義する。 FIG. 1 and FIG. 2 are a three-dimensional exploded view and a sectional view of a first embodiment of a flat plate heat tube structure according to the present invention. As shown in FIG. Including
The main body 1 includes a first plate body 11, a second plate body 12, a first capillary structure 13, and a working fluid 2, and the first and second plate bodies 11 and 12 overlap each other, The capillary structure 13 is disposed between the first and second plate bodies 11 and 12, and the first capillary structure 13 defines at least one vapor passage 14 with the first and second plate bodies 11 and 12. To do.

前記第１毛細構造１３は、メッシュ体又は繊維体又は粉末焼結体又は線状編組体又は焼結粉末体の何れか１つであり、本実施例は、焼結粉末体により実施例を説明するが、これに限定するものではない。前記第１、第２板体の厚さは、０．０１〜０，１５ｍｍである。   The first capillary structure 13 is any one of a mesh body, a fiber body, a powder sintered body, a linear braided body, or a sintered powder body. However, the present invention is not limited to this. The thicknesses of the first and second plate bodies are 0.01 to 0.15 mm.

本実施例の前記第１毛細構造１３は、対をなして設置され、前記蒸気通路１４は、２つの第１毛細構造１３の間に形成される。   The first capillary structures 13 of the present embodiment are installed in pairs, and the vapor passage 14 is formed between the two first capillary structures 13.

図３を参照し、それは、本考案の平板熱管構造の第２実施例の組み合わせ断面図であり、図に示すように、本実施例の一部の構造の技術特徴は、前記第１実施例と同一であるので、ここでは再度記載しないが、本実施例と前記第１実施例の差異は、以下にある。前記本体１は、更に第２毛細構造１５、吸熱部１６及び放熱部１７を有し、該第２毛細構造１５は、複数の溝１５１又は編組網のうち何れか１つであることができ、前記第２毛細構造１５は、該吸熱部１６に設置され、該溝１５１は、横方向及び縦方向の交錯を呈し、前記第２毛細構造１５は、該第２板体１２の該第１毛細構造１３に相対する一側に設置され、該溝１５１は、横方向及び縦方向に相互に交錯し、故に液体の作動流体を該本体１の径方向Ｙに沿って同様に該吸熱部１６まで回流させることができる。   Referring to FIG. 3, it is a combined sectional view of a second embodiment of the flat plate heat tube structure of the present invention. As shown in FIG. Although not described again here, the difference between the present embodiment and the first embodiment is as follows. The main body 1 further includes a second capillary structure 15, a heat absorbing portion 16, and a heat radiating portion 17, and the second capillary structure 15 may be any one of a plurality of grooves 151 or a braided net, The second capillary structure 15 is installed in the heat absorbing portion 16, the groove 151 has a crossing in the horizontal direction and the vertical direction, and the second capillary structure 15 is the first capillary of the second plate 12. Installed on one side opposite to the structure 13, the grooves 151 cross each other in the transverse and longitudinal directions, so that the liquid working fluid can be moved along the radial direction Y of the main body 1 to the heat absorbing portion 16 in the same manner. Can be circulated.

図４を参照し、それは、本考案の平板熱管構造の第３実施例の組み合わせ断面図であり、図に示すように、本実施例の一部の構造の技術特徴は、前記第１実施例と同一であるので、ここでは再度記載しないが、本実施例と前記第１実施例の差異は、以下にある。該第１毛細構造１３が該本体１の軸方向Ｘに沿って該本体１の中央箇所に延伸設置され、前記蒸気通路１４は、該第１毛細構造１３の両側に設置される。   Referring to FIG. 4, it is a sectional view of the third embodiment of the flat plate heat tube structure according to the present invention. As shown in FIG. Although not described again here, the difference between the present embodiment and the first embodiment is as follows. The first capillary structure 13 is extended and installed at the central portion of the main body 1 along the axial direction X of the main body 1, and the vapor passages 14 are installed on both sides of the first capillary structure 13.

図５を参照し、それは、本考案の平板熱管構造の第４実施例の組み合わせ断面図であり、図に示すように、本実施例の一部の構造の技術特徴は、前記第１実施例と同一であるので、ここでは再度記載しないが、本実施例と前記第１実施例の差異は、以下にある。本実施例の第１毛細構造１３は、総合型毛細構造であり、そのうち、該本体１は、湾曲部１８を有し、該吸熱部１６及び該放熱部１７は、該湾曲部１８に接続し、前記吸熱部１６及び該放熱部１７に設置される第１毛細構造１３は、粉末焼結体１３１を選択し、該湾曲部に設置される第１毛細構造１３は、メッシュ体１３２を選択し、該本体１の第１板体１１、第２板体１２及び該第１毛細構造１３の製造時は、積層方式で組み合わせた後、その開放状を呈する側辺を更に密閉し、故に該第１、第２板体１１，１２を先に湾曲状に形成した後にそのうち何れか１つの板体上に該第１毛細構造１３を設置し、従来技術の熱管成形後に湾曲加工を受けて熱管内部の毛細構造を破壊する欠陥を回避する。   Referring to FIG. 5, it is a combined sectional view of a fourth embodiment of the flat plate heat tube structure according to the present invention. Although not described again here, the difference between the present embodiment and the first embodiment is as follows. The first capillary structure 13 of the present embodiment is an integrated capillary structure, in which the main body 1 has a curved portion 18, and the heat absorbing portion 16 and the heat radiating portion 17 are connected to the curved portion 18. The first capillary structure 13 installed in the heat absorption part 16 and the heat dissipation part 17 selects the powder sintered body 131, and the first capillary structure 13 installed in the curved part selects the mesh body 132. When the first plate body 11, the second plate body 12, and the first capillary structure 13 of the main body 1 are manufactured, the side edges that are open are further sealed after being combined in a stacked manner. 1. After the second plate bodies 11 and 12 are first formed into a curved shape, the first capillary structure 13 is installed on any one of the plates, and the heat tube is subjected to a bending process after forming the heat tube according to the prior art. Avoid flaws that destroy the capillary structure.

１ 本体
１１ 第１板体
１２ 第２板体
１３ 第１毛細構造
１４ 蒸気通路１４
１５ 第２毛細構造
１５１ 溝
１６ 吸熱部
１７ 放熱部
２ 作動流体
Ｙ 径方向
Ｘ 軸方向 DESCRIPTION OF SYMBOLS 1 Main body 11 1st board body 12 2nd board body 13 1st capillary structure 14 Steam passage 14
15 Second capillary structure 151 Groove 16 Heat absorption part 17 Heat radiation part 2 Working fluid Y Radial direction X Axial direction

Claims (9)

第１板体、第２板体、第１毛細構造及び作動流体を有し、前記第１、第２板体は、相互に重なり合い、該第１毛細構造は、該第１、第２板体の間に設置され、該第１毛細構造は、該第１、第２板体と少なくとも１つの蒸気通路を有する本体を含む平板熱管構造。   A first plate body, a second plate body, a first capillary structure, and a working fluid, wherein the first and second plate bodies overlap each other, and the first capillary structure includes the first and second plate bodies; A flat plate heat tube structure, wherein the first capillary structure includes a main body having the first and second plate bodies and at least one steam passage. 前記第１毛細構造は、メッシュ体又は繊維体又は粉末焼結体又は線状編組体又は焼結粉末体のうちの何れか１つである請求項１に記載の平板熱管構造。   2. The flat plate heat tube structure according to claim 1, wherein the first capillary structure is any one of a mesh body, a fiber body, a powder sintered body, a linear braided body, and a sintered powder body. 更に、第２毛細構造を有し、該第２毛細構造は、複数の溝又は編組網のうちの何れか１つである請求項１に記載の平板熱管構造。   The flat plate heat tube structure according to claim 1, further comprising a second capillary structure, wherein the second capillary structure is any one of a plurality of grooves or a braided net. 前記溝間は、横方向及び縦方向に交錯する請求項３に記載の平板熱管構造。   The flat plate heat tube structure according to claim 3, wherein the gaps intersect each other in the horizontal direction and the vertical direction. 前記本体は、更に、吸熱部及び放熱部を有し、前記第２毛細構造は、該吸熱部に設置される請求項３に記載の平板熱管構造。   The flat plate heat tube structure according to claim 3, wherein the main body further includes a heat absorbing portion and a heat radiating portion, and the second capillary structure is installed in the heat absorbing portion. 前記第１毛細構造は、該本体の軸方向に沿って該本体中央箇所に延伸し、前記蒸気通路は、該第１毛細構造の両側に設置される請求項１に記載の平板熱管構造。   2. The flat plate heat tube structure according to claim 1, wherein the first capillary structure extends to a central portion of the main body along an axial direction of the main body, and the steam passage is installed on both sides of the first capillary structure. 前記第１毛細構造は、対をなして設置され、前記蒸気通路は、２つの第１毛細構造の間に形成される請求項１に記載の平板熱管構造。   2. The flat plate heat tube structure according to claim 1, wherein the first capillary structures are installed in pairs, and the steam passage is formed between two first capillary structures. 前記第１、第２板体の厚さは、０．０１〜０．１５ｍｍである請求項１に記載の平板熱管構造。   2. The flat plate heat tube structure according to claim 1, wherein a thickness of each of the first and second plate bodies is 0.01 to 0.15 mm. 前記本体は、更に、吸熱部、放熱部及び湾曲部を有し、前記吸熱部及び該放熱部は、該湾曲部に接続し、該吸熱部及び該放熱部の第１毛細構造に設置される請求項１に記載の平板熱管構造。   The main body further includes a heat absorbing portion, a heat radiating portion, and a curved portion, and the heat absorbing portion and the heat radiating portion are connected to the curved portion and installed in the first capillary structure of the heat absorbing portion and the heat radiating portion. The flat plate heat tube structure according to claim 1.
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CN111059946A (en) * 2019-12-30 2020-04-24 深圳兴奇宏科技有限公司 Temperature equalizing plate structure
CN115060101A (en) * 2022-06-29 2022-09-16 广州大学 Capillary valve-based one-way heat pipe with fluid diode structure and processing method thereof

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CN105841531A (en) * 2015-01-12 2016-08-10 奇鋐科技股份有限公司 Flat heat pipe structure
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CN108332593A (en) * 2018-03-27 2018-07-27 中山伟强科技有限公司 A kind of multichannel loop type temperature-uniforming plate

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Publication number Priority date Publication date Assignee Title
CN111059946A (en) * 2019-12-30 2020-04-24 深圳兴奇宏科技有限公司 Temperature equalizing plate structure
CN115060101A (en) * 2022-06-29 2022-09-16 广州大学 Capillary valve-based one-way heat pipe with fluid diode structure and processing method thereof
CN115060101B (en) * 2022-06-29 2023-07-11 广州大学 Unidirectional heat pipe of fluid diode structure based on capillary valve and processing method thereof

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