JP2018004108A - Heat radiation module and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin heat radiation module and a method for manufacturing the same which can suppress reduction of a maximum heat transport amount and can maintain the mechanical strength.SOLUTION: A vapor chamber 1 according to an embodiment of the invention includes: a container 2 having an evaporating part 4 for evaporating a working fluid, and a condensing part 5 for condensing the evaporated working fluid; and a wick 3 arranged in an inside of the container 2 and transferring the condensed working fluid from the condensing part 5 to the evaporating part 4 by capillary force. The wick 3 includes a net-like member 20 extending from the condensing part 5 to the evaporating part 4 while coming into contact with a first surface 14 receiving heat from a heat source 100 and a second surface 15 on the opposite side of the first surface 14, and powder 21 adhered to the net-like member 20 and enhancing the capillary force in the evaporating part 4 to be higher than the capillary force in the condensing part 5.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a heat dissipation module and a manufacturing method thereof.

  Patent Document 1 below discloses a heat pipe as one form of a heat dissipation module. A heat pipe basically contains a fluid that evaporates and condenses in a target temperature range, such as water or alcohol, as a working fluid inside a container (container) from which non-condensable gas such as air has been degassed. Further, a wick that generates a capillary force for refluxing the liquid-phase working fluid is provided inside the container. Therefore, in the heat pipe, the working fluid receives heat from the outside and evaporates, and the vapor flows toward a low pressure portion and then dissipates heat and condenses. As a result, the working fluid transports heat by its latent heat. The condensed working fluid penetrates into the wick. On the other hand, since the capillary force due to the wick is generated at the location where evaporation occurs, the working fluid that has permeated the wick is recirculated to the location where evaporation occurs due to the capillary force.

JP 2013-2640 A

Operating conditions for such heat dissipating module, a capillary force [Delta] P _C, [Delta] P the pressure loss of the vapor _V, as [Delta] P _L pressure loss of the liquid is expressed by the following equation (1).
ΔP _C ≧ ΔP _V + ΔP _L (1)
As can be seen from the calculation formula (1), in order to increase the maximum heat transport amount of the heat dissipation module, it is necessary to increase the capillary force and reduce the pressure loss of the vapor and the liquid.

  In recent years, mobile devices such as smartphones and tablet PCs have become extremely thin, and a thin heat dissipation module is required to dissipate heat from a CPU or the like mounted on the mobile device. In such a thin heat dissipation module, it is necessary to devise the suppression of the decrease in the maximum heat transport amount and the maintenance of the mechanical strength. That is, for a relatively large heat dissipation module, a large vapor space and liquid flow path can be ensured, so that the pressure loss of the vapor and liquid can be reduced. However, in a thin heat dissipation module, these can be ensured widely. difficult. Therefore, it is necessary to increase the capillary force. However, when a wick obtained by sintering metal powder is used as described in Patent Document 1, the pressure loss of the liquid also increases, resulting in a maximum heat transport amount. It will decrease. Moreover, in a thin heat dissipation module, the thickness of the container is also thin, and it is difficult to ensure its mechanical strength.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a thin heat dissipation module capable of suppressing the decrease in the maximum heat transport amount and maintaining its mechanical strength, and a method for manufacturing the same. .

  (1) A heat dissipation module according to an aspect of the present invention includes a container having an evaporation unit that encloses a working fluid and evaporates the enclosed working fluid, and a condensing unit that condenses the evaporated working fluid. A wick that is disposed inside the container and moves the condensed working fluid by capillary force from the condensing unit to the evaporating unit, and the container has a working fluid flow path in which the wick is arranged. The working fluid flow path includes a first surface that receives heat from a heat source, a second surface opposite to the first surface, and a connection surface that connects the first surface and the second surface. The wick is fixed to the mesh member and a mesh member extending from the condensation section to the evaporation section while being in contact with the first surface and the second surface. The capillary force in the evaporation section , Having a powder made higher than the capillary force in the condensing unit.

(2) In the heat dissipation module described in (1) above, the density of the powder may decrease as the distance from the first surface increases in the working fluid channel.
(3) In the heat dissipation module described in (1) or (2) above, the powder may not contact the second surface.
(4) The heat dissipation module described in the above (1) to (3), wherein the mesh member is disposed in a central portion in a width direction in which the connection surfaces face each other with a gap in the working fluid flow path. May be.

  (5) A method of manufacturing a heat dissipation module according to an aspect of the present invention includes: an evaporating unit that encloses a working fluid and evaporates the encapsulated working fluid; and a condensing unit that condenses the evaporated working fluid. And a wick that is disposed inside the container and moves the condensed working fluid by capillary force from the condensing unit to the evaporation unit, and the container has a working fluid flow in which the wick is disposed. The working fluid flow path has a first surface that receives heat from a heat source, a second surface opposite to the first surface, and a connection between the first surface and the second surface. A heat radiation module manufacturing method surrounded by a connection surface, wherein the powder is fixed to a mesh member, and the mesh member is brought into contact with the first surface and the second surface while the condensation member is Extended to reach the evaporation section Has a wick forming step of forming the wick the capillary force, it was higher than the capillary force in the condenser portion of the evaporator unit.

  (6) In the method of manufacturing a heat dissipation module described in (5) above, the wick forming step includes a first step of forming the powder into a layer, and after the first step, on the powder A second step of arranging a part of the mesh member in a stack, a third step of pressing the powder against the mesh member by a press after the second step, and baking the powder after the third step. You may have the 4th process fixed to the said mesh member by ligation, and the 5th process which processes the said mesh member into the shape along the said working fluid flow path after the said 4th process.

  According to the above aspect of the present invention, it is possible to provide a thin heat dissipation module capable of suppressing the decrease in the maximum heat transport amount and maintaining its mechanical strength, and a method for manufacturing the same.

It is a plane sectional view of the vapor chamber concerning one embodiment. It is arrow AA sectional drawing of the vapor chamber shown in FIG. It is arrow BB sectional drawing of the vapor chamber shown in FIG. It is explanatory drawing explaining the 1st process of the wick formation process which concerns on one Embodiment. It is explanatory drawing explaining the 2nd process and 3rd process of the wick formation process which concerns on one Embodiment. It is explanatory drawing explaining the 4th process and 5th process of the wick formation process which concerns on one Embodiment. It is a figure which shows the specification of the net-like member used at the wick formation process which concerns on one Embodiment. FIG. 7 is a cross-sectional view taken along the line CC of the mesh member and powder shown in FIG. It is a longitudinal cross-sectional view of the vapor chamber which concerns on the modification of one Embodiment.

  Hereinafter, a heat dissipation module and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to the drawings. In the drawings, for convenience of explanation, some parts are enlarged or omitted, but the dimensional ratios of the components shown in the drawings are not necessarily the same as the actual ones. In the following description, a thin vapor chamber is illustrated as an embodiment of the heat dissipation module.

FIG. 1 is a plan sectional view of a vapor chamber 1 according to an embodiment. 2 is a cross-sectional view of the vapor chamber 1 shown in FIG. FIG. 3 is a cross-sectional view of the vapor chamber 1 shown in FIG.
The vapor chamber 1 is a heat transport element that uses the latent heat of the working fluid. As shown in FIG. 1, the vapor chamber 1 includes a container 2 that encloses a working fluid therein, and a wick 3 that is disposed inside the container 2.

  The working fluid is a heat transport medium made of a known phase change material, and changes in phase between the liquid phase and the gas phase in the container 2. For example, water (pure water), alcohol, ammonia, or the like can be employed as the working fluid. The working fluid may be described by describing the case of liquid phase as “working fluid” and the case of gas phase as “vapor”. Further, when the liquid phase and the gas phase are not particularly distinguished, they may be described as working fluid. Furthermore, the working fluid is not shown. In the thin vapor chamber 1 as in this embodiment, it is preferable to employ water as the working fluid.

  The container 2 is a sealed hollow container, and is formed in a flat shape in which the dimension in the plane direction (up, down, left and right direction in FIG. 1) is larger than that in the thickness direction (perpendicular direction in FIG. 1). The thickness of the container 2 is, for example, about 1 mm to 3 mm. The container 2 has a substantially rectangular shape in plan view. The container 2 is provided with an evaporating unit 4 for evaporating the enclosed working fluid and a condensing unit 5 for condensing the evaporated working fluid. In the present embodiment, the evaporating unit 4 is set on the upper side and the left side in FIG.

  The evaporating unit 4 is a region that receives heat from the heat source 100 and is set in a region that is slightly larger than the outer shape (mounting area) of the heat source 100. That is, the container 2 may receive heat not only from the same region as the outer shape of the heat source 100 but also from a region that is slightly larger than the outer shape. On the other hand, the condensation unit 5 is a region set around the evaporation unit 4 and is a region other than the evaporation unit 4. The heat source 100 includes an electronic component of an electronic device, such as a CPU.

  As illustrated in FIG. 2, the container 2 has a three-layer structure including a container body 10, a top plate 11, and a bottom plate 12. The container body 10 is formed to be thicker than the top plate 11 and the bottom plate 12. The container body 10 can be formed of a material having high thermal conductivity, for example, copper, copper alloy, aluminum, aluminum alloy or the like. The top plate 11 and the bottom plate 12 are made of, for example, copper, copper alloy, aluminum, aluminum alloy, iron, stainless steel, a composite material of copper and stainless steel (Cu-SUS), or a composite material in which stainless steel is sandwiched between copper (Cu-SUS). SUS-Cu), a composite material of nickel and stainless steel (Ni-SUS), a composite material in which stainless steel is sandwiched between nickel (Ni-SUS-Ni), and the like.

In this embodiment, since it is the structure which obtains high heat dissipation performance using water for a working fluid, it is preferable that the container 2 does not react chemically with water or cause corrosion. Moreover, it is preferable that the top plate 11 and the bottom plate 12 are materials having high hardness in order to prevent the deformation of the container 2. For this reason, the container body 10 is preferably made of, for example, copper, and the top plate 11 and the bottom plate 12 are, for example, a composite material of copper and stainless steel (Cu-SUS), or a composite in which stainless steel is sandwiched between copper. It is preferably formed from a material (Cu-SUS-Cu), a composite material of nickel and stainless steel (Ni-SUS), or a composite material in which stainless steel is sandwiched between nickel (Ni-SUS-Ni).
The top plate 11 and the bottom plate 12 may be formed from the same material or different materials. Moreover, the top plate 11 and the bottom plate 12 may have the same thickness or different thicknesses. For example, the top plate 11 may be formed thicker than the bottom plate 12.

  As shown in FIG. 1, the container body 10 includes a frame portion 10 a that forms the outer shape of the container 2, and a plurality of column portions 10 b that are arranged in a region surrounded by the frame portion 10 a. The plurality of column portions 10 b are arranged at a certain interval in the short direction of the container 2, and extend parallel to the longitudinal direction of the container 2. A gap is formed between the frame portion 10a and the column portion 10b and between the adjacent column portions 10b, and the working fluid flow path 13 is formed in the gap. The working fluid flow path 13 of the present embodiment is composed of a plurality of (in this embodiment, five) channels 13a.

  As shown in FIG. 2, the working fluid flow path 13 is sealed by joining a top plate 11 and a bottom plate 12 to the container body 10. The working fluid flow path 13 has a first surface 14 that receives heat from the heat source 100, a second surface 15 opposite to the first surface 14, and a connection that connects the first surface 14 and the second surface 15. And is surrounded by a surface 16. The container 2 of the present embodiment is configured to receive heat from the heat source 100 from the bottom plate 12 side (see FIG. 3), for example, and the upper surface of the bottom plate 12 is the first surface 14 and the lower surface of the top plate 11 is The second surface 15 is formed, and the side surface of the column portion 10 b (or the inner surface of the frame portion 10 a) is the connection surface 16.

  As shown in FIG. 1, the wick 3 is disposed in the working fluid flow path 13. In the wick 3, the working liquid evaporates in the evaporating unit 4 to become vapor, and in the condensing unit 5, the vapor is condensed into the working liquid, and is moved from the condensing unit 5 to the evaporating unit 4 by capillary force ( Reflux). The wick 3 of the present embodiment includes a plurality of branch portions 3a arranged in each channel 13a of the working fluid flow path 13, and a trunk portion 3b that connects root portions of the plurality of branch portions 3a to each other. The plurality of branch portions 3a are inserted into the respective channels 13a from the trunk portion 3b, extend from the respective channels 13a to the mounting area of the heat source 100, and the respective distal end portions thereof are inserted into the evaporation portion 4 independently.

  The wick 3 includes a mesh member 20 and a powder 21. The mesh member 20 is a base material of the wick 3 and extends from the condensing unit 5 to the evaporation unit 4. That is, the mesh member 20 includes a plurality of branch portions 3a and a trunk portion 3b. Note that the widths of the branch portions 3a and the trunk portion 3b are formed to be the same. The mesh member 20 is formed of a mesh in which a plurality of fine lines are knitted in a lattice shape. For example, a copper material having a high thermal conductivity can be suitably used as the thin wire forming the mesh member 20. For example, the fine wire is formed to have a diameter of several tens of μm to one hundred and several tens of μm.

  As shown in FIG. 2, the mesh member 20 is in contact with the first surface 14 and the second surface 15 in the working fluid flow path 13. Further, the mesh member 20 is disposed in the central portion of the working fluid flow path 13 in the width direction (left and right in FIG. 2) where the connection surfaces 16 face each other with a gap. That is, the mesh member 20 is arranged at a certain distance from the connection surface 16, is not in contact with the connection surface 16, and is in contact only with the first surface 14 and the second surface 15. The space between the mesh member 20 and the connection surface 16 becomes a steam space. That is, a steam space is formed on both sides of the wick 3.

  As shown in FIG. 1, the powder 21 is a sintered body partially fixed to the mesh member 20, and by adjusting the aperture ratio (void ratio) of the mesh member 20, the capillary force in the evaporation unit 4 is It is higher than the capillary force in the condensing part 5. In the wick 3 of the present embodiment, the powder 21 is provided only at the tip of the branch part 3 a in the evaporation unit 4, and the powder 21 is not provided in the condensing unit 5. Therefore, in the condensing unit 5, the wick 3 is configured only by the mesh member 20. That is, in the condensing part 5, only the mesh member 20 is in contact with the first surface 14 and the second surface 15 of the working fluid flow path 13 as shown in FIG. 2. A gap formed at the interface between the mesh member 20 and the first surface 14 and the second surface 15 serves as a liquid flow path (reflux flow path) through which the hydraulic fluid flows, and the hydraulic fluid is returned from the condensing unit 5 to the evaporation unit 4. Let

  As shown in FIG. 3, the density of the powder 21 fixed to the mesh member 20 decreases as the working fluid channel 13 moves away from the first surface 14. That is, the powder 21 is formed with a dense portion 21a and a rough portion 21b having a density lower than that of the dense portion 21a. The dense portion 21 a is formed in a layer shape so that the lower surface is in contact with the first surface 14. The rough portion 21b is disposed inside the mesh member 20 so as to be stacked on the dense portion 21a. As shown in FIG. 3, the powder 21 is conceptually divided into a dense portion 21a and a coarse portion 21b, but the density gradually changes, and the boundary is not clearly formed. .

  The powder 21 does not contact the second surface 15. That is, the powder 21 is fixed to the side that contacts the first surface 14 of the mesh member 20, but is not fixed to the side that contacts the second surface 15 of the mesh member 20. Therefore, in the evaporation part 4, only the mesh member 20 is in contact with the second surface 15. The gap formed at the interface between the mesh member 20 and the second surface 15 serves as the liquid channel (reflux channel) described above.

Next, a method for manufacturing the vapor chamber 1 having the above configuration will be described. The manufacturing process described here is a wick formation process for forming the wick 3 described above. The container 2 can be formed by, for example, a known press process, etching process, cutting process, or the like.
Drawing 4 is an explanatory view explaining the 1st process of the wick formation process concerning one embodiment. Drawing 5 is an explanatory view explaining the 2nd process and the 3rd process of the wick formation process concerning one embodiment. FIG. 6 is an explanatory diagram for explaining the fourth and fifth steps of the wick forming step according to the embodiment.

FIG. 7 is a diagram illustrating the specifications of the mesh member 20 used in the wick formation process according to an embodiment.
As shown in FIG. 7, the mesh member 20 used in this example has a mesh M of 100, the linear d is 0.11 mm, the mesh opening A is 0.144 mm, and the aperture ratio ε is 32.1%. It has become. In addition, the mesh opening A is calculated | required with the calculation formula of A = (25.4 / M) -d. Further, the aperture ratio ε is obtained by a calculation formula of ε = (A / (A + d)) ² × 100.

  In the wick forming step, as shown in FIG. 4, first, the powder 21 is formed into a layer (first step). Specifically, the powder 21 is placed on the tray 30 as shown in FIG. The powder 21 used in this example is C1020 (oxygen-free copper) and has a particle size of 10 μm to 100 μm. That is, the particle size of the powder 21 is about 10% to 70% of the mesh opening A of the mesh member 20.

  Next, as shown in FIG. 4B, the squeegee 31 is moved along the tray 30 to form the powder 21 into a layer having a predetermined thickness. The thickness of the powder 21 is defined by the length of the leg portion 31 a of the squeegee 31. In this embodiment, the thickness of the powder 21 is formed to 0.2 mm. The thickness of 0.2 mm is slightly smaller than the thickness (0.11 + 0.11 = 0.22 mm) at the intersection of the fine lines of the mesh member 20.

  Next, as shown in FIG. 5A, a part of the mesh member 20 is placed on the powder 21 so as to overlap (second step). Specifically, the net member 20 brings the powder 21 into contact with the portion facing the evaporation unit 4. At this time, only one surface side of the mesh member 20 is in contact with the powder 21.

  Next, as shown in FIG.5 (b), the upper board 32 is mounted on the tray 30 which has arrange | positioned the mesh member 20, and the powder 21 is crimped | bonded to the mesh member 20 with a press (3rd process). Thereby, the powder 21 that has been in contact with one surface side of the mesh member 20 is compressed, and a part of the powder 21 is pushed into the mesh member 20.

  Next, as shown in FIG. 6A, the powder 21 is fixed to the mesh member 20 by sintering (fourth step). As shown in FIG. 5B, the powder 21 is sintered in a sintering furnace with the upper plate 32 placed on the tray 30.

  Finally, as shown in FIG. 6B, the mesh member 20 is processed into a shape along the working fluid flow path 13 (fifth step). Specifically, the branch part 3a and the trunk part 3b are formed using a cutter or a die cutter. By doing in this way, the wick 3 of the complicated shape which the powder 21 adhered to the mesh member 20 can be formed. In addition, since the powder 21 is fixed to the mesh member 20 even after cutting, the powder 21 is less likely to fall off when incorporated into the container 2 and can be easily handled.

FIG. 8 is a cross-sectional view taken along the line CC of the mesh member 20 and the powder 21 shown in FIG.
According to the above-described wick forming step, the mesh member 20 is stacked on the powder 21, the powder 21 is pressed onto one surface of the mesh member 20 by pressing, and then the powder 21 is fixed to the mesh member 20 by sintering. Therefore, a cross section as shown in FIG. 8 is obtained. That is, the powder 21 is fixed to the side (one surface side) in contact with the first surface 14 of the mesh member 20, and the density thereof decreases as the distance from the first surface 14 increases.

  On one surface side of the mesh member 20, a dense portion 21a of the powder 21 is formed in layers. And the coarse part 21b whose density is smaller than the dense part 21a is formed when the powder 21 is pushed into the hollow where the thin line of the mesh member 20 intersects. Further, the powder 21 is not exposed to the side (the other surface side) that contacts the second surface 15 of the mesh member 20 and does not contact the second surface 15. Thus, according to the above-described wick forming step, the wick 3 having the cross-sectional structure shown in FIG. 3 can be formed.

Next, a heat transport cycle by the vapor chamber 1 having the above configuration will be described.
When the vapor chamber 1 is operated, the evaporation unit 4 receives the heat generated by the heat source 100, whereby the working fluid in the evaporation unit 4 is evaporated. In the evaporating unit 4, the working fluid that permeates the mesh member 20 and the powder 21 evaporates.

As shown in FIGS. 1 and 3, the powder 21 is fixed only to the periphery (evaporation part 4) of the part in contact with the heat source 100, and the other part (condensation part 5) has only the mesh member 20. With such a structure, a high capillary force (ΔP _C ) can be obtained in the evaporation section 4 where dryout is likely to occur due to the limit of the capillary force.

  The vapor generated in the evaporation unit 4 flows in the working fluid flow path 13 toward the condensing unit 5 having a lower pressure and temperature than the evaporation unit 4. As shown in FIG. 2, since the wick 3 is disposed with a gap from the connection surface 16, the steam can flow through the steam spaces on both sides of the wick 3.

In the condensing part 5, the vapor | steam which reached the condensing part 5 is cooled and condensed. The hydraulic fluid generated in the condensing unit 5 penetrates the mesh member 20 and is refluxed from the condensing unit 5 to the evaporation unit 4. The mesh member 20 is in contact with the first surface 14 and the second surface 15 of the working fluid channel 13 from the condensing unit 5 to the evaporating unit 4 as shown in FIG. 2 (more specifically, FIG. 8). The working fluid is refluxed from the condensing unit 5 to the evaporating unit 4 by a liquid flow path formed at the interface between the mesh member 20 and the first surface 14 and the second surface 15. In the condensing part 5, since the powder 21 is not fixed to the mesh member 20, the pressure loss (ΔP _L ) of the liquid can be suppressed.

The working fluid recirculated to the evaporation unit 4 flows from the mesh member 20 to the powder 21. As shown in FIG. 3, since the density of the powder 21 decreases as the distance from the first surface 14 in the working fluid flow path 13, the capillary force (pumping force) acting on the working fluid is reduced on the second surface. The capillary force acting on the first surface 14 side is greater than the capillary force acting on the 15 side. Therefore, in the wick 3, the pumping force is increased by the powder 21, and the hydraulic fluid penetrating the powder 21 is evaporated again by the heat of the heat source 100, and the above-described heat transport cycle is repeated. In addition, since the powder 21 is not in contact with the second surface 15, a liquid flow path including only the mesh member 20 is partially formed also in the evaporation unit 4, and the pressure loss (ΔP _L ) of the liquid can be suppressed. .

As described above, according to the wick 3 of the present embodiment, in the liquid flow path, the pressure loss of the liquid in the condensing unit 5 is smaller than the pressure loss of the liquid in the evaporating unit 4, and the capillary force in the evaporating unit 4 is It becomes larger than the capillary force in the condensing part 5. That is, as described above, the operating condition of the heat dissipation module can be expressed by the following calculation formula (1), where the capillary force ΔP _C is the vapor pressure loss ΔP _V and the liquid pressure loss is ΔP _L. In this calculation formula (1), since the capillary force (ΔP _C ) can be increased and the pressure loss (ΔP _L ) of the liquid can be reduced, the reduction in the maximum heat transport amount of the vapor chamber 1 due to the thinning is suppressed. can do.
ΔP _C ≧ ΔP _V + ΔP _L (1)

  In addition, by forming the wick 3 by sintering the powder 21 to the mesh member 20, the mesh member 20 is a reinforcing member compared to the case where the powder 21 is sintered to form the wick 3 as in the prior art. Therefore, high mechanical strength can be obtained. As shown in FIG. 2, the wick 3 is disposed between the pillar portion 10 b and the pillar portion 10 b and is brought into contact with the first surface 14 and the second surface 15, so that the wick 3 itself also supports the container 2. The mechanical strength of the thin vapor chamber 1 can be ensured. Further, by increasing the mechanical strength of the wick 3, it is possible to stably maintain the aperture ratio (void ratio) of the portion to which the powder 21 is fixed. Further, by appropriately selecting the wire diameter and thickness of the mesh member 20, the amount of the powder 21 to be sintered can be easily managed, and the performance of the vapor chamber 1 when finally incorporated in the container 2 is achieved. Can be stabilized.

  Thus, according to the above-described embodiment, the container having the working fluid enclosed therein, the evaporation unit 4 for evaporating the enclosed working fluid, and the condensing unit 5 for condensing the evaporated working fluid. 2 and a wick 3 that is disposed inside the container 2 and moves the working fluid condensed by the capillary force from the condensing unit 5 to the evaporation unit 4, and the container 2 has a working fluid flow path in which the wick 3 is disposed. 13, the working fluid flow path 13 includes a first surface 14 that receives heat from the heat source 100, a second surface 15 opposite to the first surface 14, and a first surface 14 and a second surface 15. And the wick 3 extends from the condensing part 5 to the evaporation part 4 while being in contact with the first surface 14 and the second surface 15. And a capillary tube fixed to the mesh member 20 and in the evaporation section 4 Is a thin vapor chamber that can suppress the decrease in the maximum heat transport amount and maintain its mechanical strength by adopting the configuration of having the powder 21 that enhances the capillary force in the condensing unit 5. 1 is obtained.

  Although preferred embodiments of the present invention have been described and described above, it should be understood that these are exemplary of the present invention and should not be considered as limiting. Additions, omissions, substitutions, and other changes can be made without departing from the scope of the invention. Accordingly, the invention is not to be seen as limited by the foregoing description, but is limited by the scope of the claims.

  For example, in the above-described embodiment, the sintering position of the powder 21 is set to one place. However, for example, when there are a plurality of evaporation units 4, the sintering position of the powder 21 is set to a plurality of places. Good. Also, the sintering position of the powder 21 may be set not only at the tip of the wick 3 but also at, for example, the center of the wick 3 or both ends of the wick 3. Thus, since the sintering position of the powder 21 can be arbitrarily set according to the position and the number of the evaporation parts 4, it is possible to cope with various heat sources 100.

Further, for example, in the above-described embodiment, the configuration in which the density of the powder 21 decreases as the distance from the first surface 14 is adopted, but the configuration in which the density of the powder 21 is uniform in the thickness direction of the wick 3 is employed. May be.
For example, in the said embodiment, although the structure which the powder 21 does not contact the 2nd surface 15 was employ | adopted, the powder 21 may be contacting the 2nd surface 15. FIG.

Further, for example, in the above-described embodiment, the container 2 has a three-layer structure including the container body 10, the top plate 11, and the bottom plate 12. However, for example, the container 2 is illustrated in FIG. As shown, a two-layer structure of a top plate 11A and a bottom plate 12A may be used.
FIG. 9 is a longitudinal sectional view of the vapor chamber 1 according to a modification of the embodiment. FIG. 9 is a view corresponding to FIG. 2 described above (a cross-sectional view taken along the line AA of the vapor chamber 1 shown in FIG. 1). In FIG. 9, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  The container 2 shown in FIG. 9 is formed by joining a top plate 11A and a bottom plate 12A. The top plate 11A has a bent shape in which a plurality of recesses 11A1 are formed. The recess 11A1 is formed in a substantially trapezoidal shape in a sectional view. The recess 11A1 forms the second surface 15 and the connection surface 16 of the working fluid flow path 13. Specifically, the upper bottom of the recess 11 </ b> A <b> 1 forms the second surface 15, and the legs of the recess 11 </ b> A <b> 1 form the connection surface 16. The upper bottom (second surface 15) of the recess 11 </ b> A <b> 1 is wider than the wick 3. In addition, the legs (connection surface 16) of the recess 11A1 are formed to have the same angle with respect to the upper base (isosceles trapezoidal shape).

  Convex portions 11A2 are formed on both sides of the concave portion 11A1. That is, the recesses 11A1 and the protrusions 11A2 are alternately formed on the top plate 11A. The convex portion 11A2 is also formed in a substantially trapezoidal shape in a sectional view shown in FIG. The top (upper bottom) of the convex portion 11A2 is joined to the bottom plate 12A. The upper bottom of the convex portion 11A2 is smaller in width than the upper bottom of the concave portion 11A1. That is, the formation width of the working fluid flow path 13 is larger than the joining width of the top plate 11A. The top plate 11A can be formed, for example, by performing grooved processing by press molding.

The bottom plate 12A is formed in a flat plate shape. The thickness of the bottom plate 12A is preferably larger than the thickness of the top plate 11A. By forming the bottom plate 12A thick, the strength of the container 2 can be maintained, and the top plate 11A can be made relatively thin to facilitate press molding. An upper surface of the bottom plate 12A forms a first surface 14.
According to the above configuration, the working fluid flow path 13 can be formed with a two-layer structure of the top plate 11A and the bottom plate 12A.
In the example shown in FIG. 9, the working fluid flow path 13 is formed by bending the top plate 11A, but the working fluid flow path 13 may be formed by bending the bottom plate 12A. That is, the bottom plate 12 </ b> A may form the first surface 14 and the connection surface 16, and the top plate 11 </ b> A may form the second surface 15.

  For example, in the said embodiment, although the vapor chamber 1 was illustrated as a thermal radiation module, you may apply the said structure to the heat pipe which is another form of a thermal radiation module.

DESCRIPTION OF SYMBOLS 1 ... Vapor chamber (heat dissipation module), 2 ... Container, 3 ... Wick, 4 ... Evaporation part, 5 ... Condensing part, 13 ... Working fluid flow path, 14 ... First surface, 15 ... Second surface, 16 ... Connection surface 20 ... Mesh member, 21 ... Powder, 100 ... Heat source

Claims (6)

A container having an evaporating part that encloses the working fluid and evaporates the enclosed working fluid, and a condensing part that condenses the evaporated working fluid;
A wick that is arranged inside the container and moves the condensed working fluid by capillary force from the condensing unit to the evaporating unit,
The container has a working fluid flow path in which the wick is disposed;
The working fluid flow path includes a first surface that receives heat from a heat source, a second surface opposite to the first surface, a connection surface that connects the first surface and the second surface, Surrounded by
The wick is
A net-like member extending from the condensing part to the evaporation part while contacting the first surface and the second surface;
A heat-dissipating module comprising: a powder fixed to the mesh member and increasing the capillary force in the evaporation unit to be higher than the capillary force in the condensing unit.   2. The heat dissipation module according to claim 1, wherein the density of the powder decreases as the distance from the first surface increases in the working fluid flow path.   The heat dissipation module according to claim 1, wherein the powder does not contact the second surface.   The said mesh member is arrange | positioned in the said hydraulic fluid flow path, and the said connection surface is arrange | positioned in the center part of the width direction which opposes with a clearance gap, The Claim 1 characterized by the above-mentioned. Heat dissipation module. A container having an evaporating part that encloses the working fluid and evaporates the enclosed working fluid, and a condensing part that condenses the evaporated working fluid;
A wick that is arranged inside the container and moves the condensed working fluid by capillary force from the condensing unit to the evaporating unit,
The container has a working fluid flow path in which the wick is disposed;
The working fluid flow path includes a first surface that receives heat from a heat source, a second surface opposite to the first surface, a connection surface that connects the first surface and the second surface, A method of manufacturing a heat dissipation module surrounded by
While fixing the powder to the mesh member, contacting the mesh member with the first surface and the second surface, extending from the condensation unit to the evaporation unit, the capillary force in the evaporation unit, The manufacturing method of the thermal radiation module characterized by having the wick formation process which forms the said wick higher than the said capillary force in the said condensation part. The wick forming step includes
A first step of forming the powder into layers;
After the first step, a second step of arranging a part of the mesh member on the powder,
After the second step, a third step of pressing the powder onto the mesh member by pressing,
After the third step, a fourth step of fixing the powder to the mesh member by sintering;
The method of manufacturing a heat dissipation module according to claim 5, further comprising a fifth step of processing the mesh member into a shape along the working fluid flow path after the fourth step.

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