JP6938960B2 - Micro flow path heat exchanger - Google Patents

Description

The present invention relates to a microchannel heat exchanger configured by stacking a plurality of heat transfer plates on which a flow path of a heat exchange fluid is formed.

A microchannel heat exchanger having a structure in which two types of heat transfer plates having microchannels formed on a metal plate such as stainless steel are alternately laminated is known. In this type of heat exchanger, among the microchannels provided between the heat transfer plates, a high-temperature fluid such as a high-temperature high-pressure refrigerant gas compressed in one of the microchannels is circulated as the working fluid, and the other. By passing a low-temperature fluid such as water through the microchannel, heat is transferred from the high-temperature fluid to the low-temperature fluid via a heat transfer plate, and heat exchange is performed between the high-temperature fluid and the low-temperature fluid (for example, patent). Reference 1).

JP-A-2015-190705

However, in the microchannel heat exchanger obtained by laminating the heat transfer plates as described above, the temperature of the microchannel heat exchanger is higher than the temperature of the air around the microchannel heat exchanger. At times, heat is transferred from the microchannel heat exchanger to the surrounding air. On the other hand, when the temperature of the microchannel heat exchanger is lower than the temperature of the air around the microchannel heat exchanger, heat is transferred from the surrounding air to the microchannel heat exchanger. Further, when the temperature of the microchannel heat exchanger is lower than the dew point temperature of the air around the microchannel heat exchanger, there is a problem that dew condensation (frost) occurs on the outer surface of the microchannel heat exchanger. was there.

In view of the above circumstances, an object of the present invention is to provide a microchannel heat exchanger capable of reducing heat transfer to and from surrounding air.

In order to achieve the above object, the microchannel heat exchanger according to one embodiment of the present invention has a plurality of high temperature channel layers provided with a high temperature fluid flow path and a plurality of low temperature flow path provided with a low temperature fluid flow path. In a microchannel heat exchanger provided with a channel layer laminate formed by alternately stacking channel layers and protective plates provided on both sides of the channel layer laminate in the stacking direction. At least one of the protective plates is provided with at least one space.

The space portion may be formed in a groove shape on the protective plate.

Further, the space portion may be formed in a region excluding the peripheral portion of the protective plate.

According to the present invention, it is possible to provide a microchannel heat exchanger capable of reducing heat transfer to and from surrounding air.

It is a perspective view which shows the microchannel heat exchanger which concerns on one Embodiment of this invention. It is a perspective view which shows the microchannel heat exchanger of FIG. 1 by being partially disassembled. It is a perspective view which shows the structure of the high temperature heat transfer plate in the micro flow path heat exchanger of FIG. It is a perspective view which shows the structure of the low temperature heat transfer plate in the micro flow path heat exchanger of FIG. It is a perspective view for demonstrating the high temperature flow path of the high temperature flow path layer in the micro flow path heat exchanger of FIG. It is a perspective view for demonstrating the low temperature flow path of the low temperature flow path layer in the micro flow path heat exchanger of FIG. It is sectional drawing of the micro flow path heat exchanger of FIG. It is a perspective sectional view which shows the 1st modification. It is a perspective sectional view which shows the 2nd modification. It is a perspective sectional view which shows the 3rd modification. It is a perspective sectional view which shows the 4th modification. It is a perspective view which shows the 5th modification.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing a microchannel heat exchanger according to the first embodiment of the present invention, and FIG. 2 is a perspective view showing a partially disassembled microchannel heat exchanger of FIG.

[Overall configuration]
As shown in these figures, the microchannel heat exchanger 1 is for a heat exchanger main body 2 which is a flow path layer laminate, a lower protective plate 3, an upper protective plate 4, and an inlet for a high-temperature fluid. The connection portion 5A, the connection portion 5B for the outlet of the high temperature fluid, the connection portion 5C for the inlet of the low temperature fluid, and the connection portion 5D for the outlet of the low temperature fluid are provided.

In the figure, the lower surface of each member such as the heat exchanger main body 2, the lower protective plate 3 and the upper protective plate 4 is referred to as a “lower surface”, and the upper surface of each member is referred to as an “upper surface”. .. A lower protective plate 3 is joined to the upper surface of the heat exchanger main body 2, and an upper protective plate 4 is joined to the lower surface of the heat exchanger main body 2. The connection portions 5A, 5B, 5C, and 5D are for attaching the high temperature inlet pipe 8A, the high temperature outlet pipe 8B, the low temperature inlet pipe 8C, and the low temperature outlet pipe 8D, which will be described later, to the heat exchanger main body 2, respectively.

The heat exchanger main body 2 is configured by alternately stacking a plurality of two types of heat transfer plates 2A and 2B. The two types of heat transfer plates 2A and 2B constituting the heat exchanger main body 2 are made of, for example, thin metal plates (foil) of the same type, and for example, a thin plate made of stainless steel is used. These metal plates are laminated and then joined to each other by diffusion bonding to form a substantially rectangular parallelepiped laminated body. In the figure, each layer of the laminated body is drawn, but in reality, each layer has a conditioned structure by diffusion bonding. That is, each layer is integrated and the interface disappears.
The materials that make up the heat exchanger are not limited to the same type. More specifically, stainless steel, titanium and the like are used. There are also examples of stainless steel and ceramics.
The shape after stacking is not limited to a substantially rectangular parallelepiped. More specifically, if round plates are laminated, it becomes cylindrical.

The lower protective plate 3 is composed of one metal plate (foil) having high thermal conductivity or a plurality of thin metal plates (foil) laminated by diffusion bonding. As the metal plate (foil), a thin stainless steel plate is used. The lower protective plate 3 is provided with at least one space portion that forms a heat insulating structure.

The upper protective plate 4 is configured in the same manner as the lower protective plate 3. That is, the upper protective plate 4 is composed of one metal plate (foil) having high thermal conductivity or a plurality of thin metal plates (foil) laminated by diffusion bonding. More specifically, stainless steel or the like is used as the metal plate. The upper protective plate 4 is provided with at least one space portion that forms a heat insulating structure.

Hereinafter, as necessary for explanation, both upper and lower surfaces orthogonal to the Z axis of the microchannel heat exchanger 1 will be referred to as "main surfaces" based on the X-axis, Y-axis, and Z-axis in the drawing. The four surfaces other than the main surface that are orthogonal to the X-axis and Y-axis are referred to as "side surfaces".

As shown in FIG. 2, on each side surface of the micro flow path heat exchanger 1, a high temperature fluid inlet 21 for flowing a high temperature fluid into the high temperature flow path in the heat exchanger main body 2 and a heat exchanger main body 2 are provided. High temperature fluid outlet 22 for flowing out high temperature fluid from the high temperature flow path, low temperature fluid inlet 23 for flowing low temperature fluid into the low temperature flow path in the heat exchanger main body 2, and low temperature from the low temperature flow path in the heat exchanger main body 2. A low temperature fluid outlet 24 is formed to allow the fluid to flow out.

As shown in FIG. 1, a connecting portion 5A is joined to the high temperature fluid inlet 21 by welding or the like. A high temperature inlet pipe 8A for inflow of high temperature fluid is detachably connected to the connection portion 5A. A connecting portion 5B is joined to the high temperature fluid outlet 22 by welding or the like. A high temperature outlet pipe 8B for outflow of high temperature fluid is detachably connected to the connection portion 5B. A connecting portion 5C is joined to the low temperature fluid inlet 23 by welding or the like. A low temperature inlet pipe 8C for inflow of low temperature fluid is detachably connected to the connection portion 5C. A connecting portion 5D is joined to the low temperature fluid outlet 24 by welding or the like. A low temperature outlet pipe 8D for the outflow of low temperature fluid is detachably connected to the connection portion 5D.

[Structure of heat exchanger body 2]
Next, the configuration of the heat exchanger main body 2 will be described.
As described above, the heat exchanger main body 2 is configured by alternately stacking a plurality of two types of first heat transfer plates 2A and second heat transfer plates 2B. Grooves and notches are formed in these heat transfer plates 2A and 2B by etching. The first heat transfer plate 2A and the second heat transfer plate 2B have different patterns of grooves and notches.

3 and 4 are perspective views showing two types of heat transfer plates 2A and 2B. Here, the first heat transfer plate 2A shown in FIG. 3 is a “high temperature heat transfer plate 2A”, and the second heat transfer plate 2B shown in FIG. 4 is a “low temperature heat transfer plate 2B”.

(Structure of high temperature heat transfer plate 2A)
As shown in FIG. 3, the high-temperature heat transfer plate 2A is provided with grooves 25A, 30A, 31A and notches 26A, 27A, 28A, 29A, respectively, which form a flow path for the high-temperature fluid. The grooves 25A, 30A and 31A are provided only on one surface of the high temperature heat transfer plate 2A. The depths of the grooves 25A, 30A and 31A may be uniform. The cutout portions 26A, 27A, 28A, and 29A are formed by removing predetermined portions at the edge portions corresponding to the four sides of the base material of the high temperature heat transfer plate 2A by the thickness of the base material.

Hereinafter, as necessary for explanation, the notches 26A, 27A, 28A, and 29A of the high-temperature heat transfer plate 2A are each of the first notch 26A, the second notch 27A, and the third notch. It is referred to as a portion 28A and a fourth notched portion 29A.

In the high-temperature heat transfer plate 2A, in the region between the first notch 26A and the second notch 27A provided so as to face each other in the Y-axis direction in the drawing, these first notches 26A and the first notch 26A A plurality of grooves 25A, 30A, 31A communicating with the second notch 27A are formed. Although the number of grooves 25A is three in FIG. 3, it is possible to form a number of grooves less than three or more than three.

The above-mentioned grooves 25A, 30A, 31A in the high-temperature heat transfer plate 2A are a plurality of grooves 25A formed along the X-axis direction and two grooves 30A, 30A, 31A formed along the Y-axis direction. .. One of the two grooves 30A and 31A formed along the Y-axis direction communicates with the first notch 26A at one end, and the other groove 31A has a second notch 27A at one end. Communicate with. The plurality of grooves 25A formed along the X-axis direction communicate with each other between the two grooves 30A and 31A, respectively. As a result, the high-temperature fluid inlet 21 and the high-temperature fluid outlet 22 of the high-temperature heat transfer plate 2A are located on the side surfaces of the heat exchanger body 2 orthogonal to the X-axis, and the low-temperature fluid inlet 23 and the low-temperature fluid outlet 24 of the low-temperature heat transfer plate 2B, which will be described later. Is located on the side surface of the heat exchanger body 2 orthogonal to the Y axis.

(Structure of low temperature heat transfer plate 2B)
As shown in FIG. 4, the low-temperature heat transfer plate 2B is provided with a groove 25B and notches 26B, 27B, 28B, and 29B, respectively, which form a flow path for the low-temperature fluid. The groove 25B is provided only on one surface of the low temperature heat transfer plate 2B. The depth of the groove 25B may be uniform everywhere. The cutout portions 26B, 27B, 28B, and 29B are formed by removing predetermined portions at the edge portions corresponding to the four sides of the base material of the low temperature heat transfer plate 2B by the thickness of the base material.

Hereinafter, as necessary for explanation, the notches 26B, 27B, 28B, and 29B of the low temperature heat transfer plate 2B are respectively, and the fifth notch 26B, the sixth notch 27B, and the seventh notch are provided. It is referred to as a portion 28B and an eighth notched portion 29B.

In the low temperature heat transfer plate 2B, between the seventh notch 28B and the eighth notch 29B provided so as to face each other in the X-axis direction in the drawing, the seventh notch 28B and the eighth are A plurality of grooves 25B communicating with the notch portion 29B of the above are formed. These plurality of grooves 25B are formed at the same positions in the Y-axis direction as the plurality of grooves 25A formed in the high temperature heat transfer plate 2A. Although the number of grooves 25B is three in FIG. 4, it is possible to form a number of grooves less than three or more than three.

(Laminate structure of high temperature heat transfer plate 2A and low temperature heat transfer plate 2B)
As shown in FIGS. 5 and 6, a plurality of high-temperature heat transfer plates 2A and low-temperature heat transfer plates 2B having the above-described configuration have the same orientation of the surfaces provided with both grooves 25A and 25B. The high temperature heat transfer plate 2A and the low temperature heat transfer plate 2B are alternately overlapped and laminated. In this way, the heat exchanger main body 2 is formed.

In the heat exchanger main body 2, the first notch 26A of the high temperature heat transfer plate 2A and the fifth notch 26B of the low temperature heat transfer plate 2B have the high temperature heat transfer plate 2A and the low temperature heat transfer plate 2B. The high temperature fluid inlet 21 is formed by alternately stacking a plurality of layers.

The second notch 27A of the high temperature heat transfer plate 2A and the sixth notch 27B of the low temperature heat transfer plate 2B are formed by alternately stacking a plurality of high temperature heat transfer plates 2A and low temperature heat transfer plates 2B. , The high temperature fluid outlet 22 is formed.

The third notch 28A of the high temperature heat transfer plate 2A and the seventh notch 28B of the low temperature heat transfer plate 2B are formed by alternately stacking a plurality of high temperature heat transfer plates 2A and low temperature heat transfer plates 2B. , The low temperature fluid inlet 23 is formed.

The fourth notch 29A of the high temperature heat transfer plate 2A and the eighth notch 29B of the low temperature heat transfer plate 2B are formed by alternately stacking a plurality of high temperature heat transfer plates 2A and low temperature heat transfer plates 2B. , The low temperature fluid outlet 24 is formed.

(About high temperature flow path and low temperature flow path)
FIG. 5 is a perspective view showing a high temperature flow path in the heat exchanger main body 2.
The high temperature flow path is formed between the grooves 25A, 30A, 31A of the high temperature heat transfer plate 2A and the lower surface of the low temperature heat transfer plate 2B. The high temperature fluid flows in from the high temperature fluid inlet 21 and is distributed to the plurality of grooves 25A through the groove 30A. The high-temperature fluids that have passed through the plurality of grooves 25A merge at the grooves 31A and flow out from the high-temperature fluid outlet 22. Such a flow of high temperature fluid occurs in the high temperature flow path layer corresponding to each high temperature heat transfer plate 2A.

FIG. 6 is a perspective view showing a low temperature flow path in the heat exchanger main body 2.
The low temperature flow path is formed between the groove 25B of the low temperature heat transfer plate 2B and the lower surface of the high temperature heat transfer plate 2A or the lower surface of the upper protective plate 4. The cold fluid flows in from the cold fluid inlet 23, passes through the plurality of grooves 25B, and flows out from the cold fluid outlet 24. Such a flow of low temperature fluid occurs in the low temperature flow path layer corresponding to each low temperature heat transfer plate 2B.

Since the high temperature flow path layers and the low temperature flow path layers are alternately laminated in the heat exchanger main body 2, heat exchange is performed between the high temperature fluid and the low temperature fluid.
Further, the high temperature fluid flowing through the groove 25A of the high temperature heat transfer plate 2A and the low temperature fluid flowing through the groove 25B of the low temperature heat transfer plate 2B are countercurrent.
The high-temperature fluid flowing through the groove 25A of the high-temperature heat transfer plate 2A and the low-temperature fluid flowing through the groove 25B of the low-temperature heat transfer plate 2B are not limited to countercurrent, and may be parallel flow or orthogonal flow.

[Insulation structure of lower protective plate 3 and upper protective plate 4]
In the microchannel heat exchanger 1 of this embodiment, in order to reduce the heat transfer to the heat exchanger main body 2 caused by the temperature difference between the heat exchanger main body 2 and the air around the heat exchanger main body 2, the lower part is used. At least one space for forming a heat insulating structure is provided in each of the side protective plate 3 and the upper protective plate 4. In the present embodiment, spaces are formed in both the lower protective plate 3 and the upper protective plate 4, but the present invention is not limited to this, and the lower protective plate 3 or the upper protective plate 4 is not limited to this. A space portion may be formed in only one of them.

FIG. 7 is a YY cross-sectional view of the microchannel heat exchanger 1 of the present embodiment.
As shown in FIG. 7, a lower protective plate 3 and an upper protective plate 4 are joined to the upper and lower surfaces of the heat exchanger main body 2, respectively.

In this example, the lower protective plate 3 is composed of a laminate of six metal plates 3-1, 3-2, 3-3, 3-4, 3-5, and 3-6. Multiple grooves on the upper surface 3T of each metal plate 3-1, 3-2, 3-3, 3-4, 3-5, 3-6 facing the lower surface of the heat exchanger body 2. S3 is provided. Each of the plurality of grooves S3 is arranged parallel to each other in the X-axis direction, for example.

The width and depth of the plurality of grooves S3 may be uniform in all metal plates 3-1, 3-2, 3-3, 3-4, 3-5, 3-6. Further, the positions of the plurality of grooves S3 on the XY plane may be common among all the metal plates 3-1, 3-2, 3-3, 3-4, 3-5, and 3-6. In this way, a plurality of metal plates 3-1, 3-2, 3-3, 3-4, 3-5, 3 provided with a plurality of grooves S3 on the side facing the lower surface of the heat exchanger main body 2. By superimposing and joining −6 to each other, a space 33 is formed inside the lower protective plate 3 by the inner wall 34 of the groove S3 and the lower surface 32 of the metal plate in contact with the upper side, and the heat exchanger main body. A lower protective plate 3 having a heat insulating structure is obtained between the lower surface 2U of 2 and the surrounding air.

On the other hand, the upper protective plate 4 is composed of a laminated body of seven metal plates 4-1, 4-2, 4-3, 4-4, 4-5, 4-6, 4-7 in this example. .. Of these metal plates, all metal plates 4-1, 4-2, 4-3, 4-4, 4 except the metal plate 4-7 located on the outermost side (farthest from the heat exchanger body 2). A plurality of grooves S4 are provided on the upper surface 4T on the same side as the upper surface of the heat exchanger main body 2 of −5 and 4-6.

The width and depth of the plurality of grooves S4 may be uniform in the metal plates 4-1, 4-2, 4-3, 4-4, 4-5, 4-6. Further, the positions of the plurality of grooves S4 on the XY plane may be common among the metal plates 4-1, 4-2, 4-3, 4-4, 4-5, and 4-6. In this way, a plurality of metal plates 4-1, 4-2, 4-3, 4-4, 4-5, 4-providing a plurality of grooves S4 on the side facing the upper surface of the heat exchanger main body 2 By superimposing and joining 6 and the outermost metal plate 4-7 to each other, the space 43 is formed inside the upper protective plate 4 by the inner wall 41 of the groove S4 and the lower surface 42 of the metal plate in contact with the upper side. Is formed, and an upper protective plate 4 having a heat insulating structure is obtained between the upper surface 2T of the heat exchanger main body 2 and the surrounding air.

The space 33 of the lower protective plate 3 and the space 43 of the upper protective plate 4 may be in a state where heat insulation can be ensured, such as in a vacuum state or a state filled with a substance having heat insulation.

As described above, the microchannel heat exchanger 1 is formed by insulating the space between the upper surface 2T and the lower surface 2U of the heat exchanger main body 2 and the surrounding air with the lower protective plate 3 and the upper protective plate 4 having a heat insulating structure. A microchannel heat exchanger 1 that is less affected by the ambient temperature can be obtained without covering the surface with a heat insulating material.

<Modification example 1>
Hereinafter, a modified example of the configuration of the lower protective plate 3 and the upper protective plate 4 having a heat insulating structure in the microchannel heat exchanger 1 of the above embodiment will be described.
FIG. 8 is a perspective sectional view showing a first modification of the configuration of the upper protective plate 4 having a heat insulating structure.

In this first modification, the directions of the grooves S4 of the metal plates 4-1 to 4-6 constituting the upper protective plate 4 are orthogonal to each other between the metal plates adjacent to each other in the layer direction. Further, a metal plate 4-7 is arranged on the outermost side of the heat exchanger.
As a result, the number of places where the grooves S4 are connected to the upper protective plate 4 in the stacking direction is reduced, and the upper protective plate 4 having a heat insulating structure strengthened against the pressure applied in the stacking direction can be obtained, so that diffusion bonding becomes easy.
Although not shown, the same heat insulating structure can be adopted for the lower protective plate 3.

<Modification 2>
FIG. 9 is a perspective cross-sectional view showing a second modification of the configuration of the upper protective plate 4 having a heat insulating structure in consideration of pressure resistance performance as in the first modification.
In the second modification, the positions of the grooves S4 of the metal plates 4-1 to 4-6 constituting the upper protective plate 4 are shifted from each other at least between the vertically adjacent metal plates. As a result, the number of places where the grooves S4 are formed in the same stacking direction is reduced in the upper protective plate 4, and the upper protective plate 4 having a heat insulating structure strengthened against the pressure in the stacking direction can be obtained.
Although not shown, the same heat insulating structure can be adopted for the lower protective plate 3.

<Modification example 3>
FIG. 10 is a perspective sectional view showing a third modified example of the configuration of the upper protective plate 4 provided with a wider space layer in order to improve the heat insulating performance.
It is possible to improve the heat insulating performance by providing a wider space layer inside the upper protective plate 4, but if the space layer is widened, the pressure resistance performance of the upper protective plate 4 is lowered.

Therefore, in the third modification, a relatively wide space portion 51 is provided in the upper protective plate 4 in multiple stages in the stacking direction, and in order to improve the pressure resistance performance of the upper protective plate 4, a plurality of relatively wide space portions 51 are provided in the space portion 51 of each stage. The support column 52 is erected so that the support column 52 receives the pressure from the stacking direction. Here, the relatively wide space 51 in the upper protective plate 4 is the recess S5 provided in the region excluding the peripheral edge of the metal plates 4-1 to 4-6, and the lower side of the metal plate in contact with the upper side. It is formed by the surface 53. The support column 52 is provided so as to project from the bottom surface of the recess S5. Although the cross-sectional shape of the support column 52 is circular in FIG. 10, it may be rectangular.
Although not shown, the same heat insulating structure can be adopted for the lower protective plate 3.

<Modification example 4>
In FIG. 11, a recess S6 is provided in a region excluding the peripheral edge portion of the outermost metal plate 4-7 of the upper protective plate 4, and a space portion 61 is provided only in the outer portion of the upper protective plate 4. In this case, the recess S6 of the outermost metal plate 4-7 is provided on the lower surface of the metal plate 4-7. According to this configuration, the pressure resistance performance is ensured in the laminated portion of the metal plates 4-1 to 4-6 other than the outermost metal plate 4-7 of the upper protective plate 4. Therefore, the space portion 61 does not need a support column as in the third modification.
Although not shown, the same heat insulating structure can be adopted for the lower protective plate 3.

<Modification 5>
FIG. 12 shows a slit 72 for a heat insulating effect provided on the outer peripheral portion 2R of the flow path forming region 71 of the heat exchanger main body 2. The slit 72 is formed so as to penetrate the plurality of heat transfer plates 2A and 2B constituting the heat exchanger main body 2 in the stacking direction. In this way, by providing the slit 72 for the heat insulating effect on the outer peripheral portion of the flow path forming region 71 of the heat exchanger main body 2, the influence of the ambient temperature from the side surface can be reduced. By combining with the lower protective plate 3 and the upper protective plate 4 having the above heat insulating structure, heat transfer to and from the surrounding air can be reduced.

1 ... Micro flow path heat exchanger 2 ... Heat exchanger main body 3 ... Lower protective plate 4 ... Upper protective plate 33, 43, 51, 61 ... Space 52 ... Support 71 ... Flow path forming area 72 ... Slit S3, S4 …groove

Claims (4)

A flow path layer laminate formed by alternately laminating a plurality of high temperature flow path layers provided with high temperature fluid flow paths and a plurality of low temperature flow path layers provided with low temperature fluid flow paths.
Protective plates provided on both sides of the flow path layer laminate in the stacking direction, and
In a microchannel heat exchanger provided with at least one space in at least one of the protective plates.
The protective plate includes a plurality of first metal plates having a plurality of first grooves extending in a first direction orthogonal to the stacking direction and forming the space portion, and the stacking direction and the first direction. A microchannel heat exchanger formed by alternately stacking a plurality of second metal plates having a plurality of second grooves extending in a second direction orthogonal to each other to form the space portion. A flow path layer laminate formed by alternately laminating a plurality of high temperature flow path layers provided with high temperature fluid flow paths and a plurality of low temperature flow path layers provided with low temperature fluid flow paths.
Protective plates provided on both sides of the flow path layer laminate in the stacking direction, and
In a microchannel heat exchanger provided with at least one space in at least one of the protective plates.
The protective plate includes a plurality of first metal plates having a plurality of first grooves extending in a direction orthogonal to the stacking direction and forming the space portion, and the plurality of first grooves forming the space portion. A plurality of second metal plates having a plurality of second grooves parallel to the above are alternately laminated and formed.
A microchannel heat exchanger in which the plurality of first grooves and the plurality of second grooves are provided at positions where they do not overlap each other when viewed from the stacking direction. A flow path layer laminate formed by alternately laminating a plurality of high temperature flow path layers provided with high temperature fluid flow paths and a plurality of low temperature flow path layers provided with low temperature fluid flow paths.
Protective plates provided on both sides of the flow path layer laminate in the stacking direction, and
In a microchannel heat exchanger provided with at least one space in at least one of the protective plates.
The protective plate is formed by laminating a plurality of metal plates.
The plurality of metal plates are provided in a region excluding the peripheral edge portion of the plurality of metal plates to form the space portion, and are provided on the bottom surface of the recess and project in the stacking direction to apply pressure from the stacking direction. A microchannel heat exchanger with multiple columns to receive. The microchannel heat exchanger according to any one of claims 1 to 3.
A micro flow path heat exchanger in which a slit is provided in the outer peripheral portion of the flow path forming region of the flow path layer laminate.

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