JP6094510B2 - Microchannel heat exchanger - Google Patents

Description

  The present invention relates to a micro flow channel heat exchanger configured by stacking a plurality of heat transfer plates in which a flow channel for heat exchange fluid is formed.

  2. Description of the Related Art A plate heat exchanger having a structure in which two types of heat transfer plates each having a flow path formed by pressing a metal plate are alternately stacked and stacked is known. In this type of heat exchanger, among the flow paths provided between the heat transfer plates, as a working fluid, a high-temperature fluid such as high-temperature and high-pressure refrigerant gas compressed in one flow path, steam or hot water is circulated, By circulating a low temperature fluid such as water through the other channel, heat is transferred from the high temperature fluid to the low temperature fluid via the heat transfer plate, and heat exchange between the high temperature fluid and the low temperature fluid is performed (for example, Patent Document 1).

  Also known are micro-channel heat exchangers that are made by laminating them by producing heat transfer plates with channels by etching metal foil (foil) instead of pressing metal plates. (For example, refer to Patent Document 2).

Japanese Patent No. 4448377 JP 2010-286229 A

  Here, the flow path length per flow path of the conventional plate heat exchanger as shown in Patent Document 1 is 150 to 400 mm when used in a domestic air conditioner. On the other hand, when compared with equivalent heat exchange efficiency, the flow path length per flow path of the micro flow path heat exchanger as shown in Patent Document 2 is 10-60 mm. This is because the efficiency of heat exchange between the refrigerants is greatly different. Therefore, the temperature change rate of the fluid per distance that the fluid flows through the flow path in the micro flow path heat exchanger is much larger than that of the heat exchanger of the plate heat exchanger.

  Generally, when measuring the temperature of the refrigerant heat-exchanged by the heat exchanger, a temperature sensor is attached to the outlet pipe of the heat exchanger. However, a measurement error and a time lag occur due to the thermal resistance between the refrigerant and the pipe and the thermal resistance between the pipe and the temperature sensor. As described above, in the micro-channel heat exchanger, the rate of temperature change per distance through which the fluid flows is large. Therefore, it is required to minimize measurement errors and time lag due to thermal resistance. Therefore, it is necessary to directly measure the temperature of the refrigerant not in the outlet pipe of the heat exchanger but in the middle of the flow path or at the joining portion of the flow path.

  However, in the micro-channel heat exchanger as shown in Patent Document 2, a method for measuring the refrigerant temperature in the channel has not been devised.

  In view of the circumstances as described above, an object of the present invention is to provide a micro flow channel heat exchanger capable of accurately measuring the temperature of a refrigerant.

  In order to achieve the above object, a micro-channel heat exchanger according to an embodiment of the present invention includes a high-temperature channel layer provided with a plurality of high-temperature fluid channels and a low temperature provided with a plurality of low-temperature fluid channels. A flow path layer stacking section formed by alternately stacking flow path layers, and the flow path layer stacked on the flow path layer stacking section, and the flow path at least one of the high temperature flow path layer and the low temperature flow path layer And a sensor arrangement layer having a measurement space in which the fluid is introduced through a communication hole communicating in the stacking direction and the sensing point of the temperature sensor is exposed, and accurately measures the temperature at the entrance and exit of the heat exchanger. It is possible.

  Further, in the micro-channel heat exchanger according to the present invention, the high-temperature channel of the high-temperature channel layer, the low-temperature channel of the low-temperature channel layer, and the measurement space of the sensor arrangement layer are individual substrates. The high-temperature channel layer, the low-temperature channel layer, and the sensor arrangement layer are formed by stacking the substrates on which the grooves are provided, and the contact surfaces are diffused. It may be joined.

  According to the present invention, the temperature of the fluid in the heat exchanger can be accurately measured.

It is a perspective view which shows the microchannel heat exchanger which concerns on one Embodiment of this invention. FIG. 2 is a partially exploded perspective view of the microchannel heat exchanger of FIG. 1. It is a perspective view which shows the structure of a high temperature heat exchanger plate in the microchannel heat exchanger of FIG. It is a perspective view which shows the structure of a low-temperature heat exchanger plate in the microchannel heat exchanger of FIG. It is a perspective view for demonstrating the high temperature channel of a high temperature channel layer in the microchannel heat exchanger of FIG. It is a perspective view for demonstrating the low temperature channel of a low temperature channel layer in the microchannel heat exchanger of FIG. It is sectional drawing of the microchannel heat exchanger of FIG. It is sectional drawing which shows the structure of the microchannel heat exchanger of other embodiment which concerns on this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing a microchannel heat exchanger according to a first embodiment of the present invention, and FIG. 2 is a partially exploded perspective view showing the microchannel heat exchanger of FIG.

[Overall configuration]
As shown in these drawings, the micro-channel heat exchanger 1 includes a heat exchanger main body 2 that is a channel layer laminate, a high-temperature detection plate 3A that constitutes a sensor arrangement layer, and a sensor arrangement layer. A low-temperature detection plate 3B, a high-temperature protection plate 4A, a low-temperature protection plate 4B, and connection fittings 5A, 5B, 5C, and 5D for inlet and outlet of each of the high-temperature fluid and the low-temperature fluid.

  In the figure, the lower surface of each member such as the heat exchanger main body 2, the high temperature detection plate 3A and the low temperature detection plate 3B is referred to as a "high temperature side surface", and the upper surface of each member is referred to as a "low temperature side surface". . A high temperature detection plate 3A is bonded to the high temperature side surface of the heat exchanger main body 2, and a low temperature detection plate 3B is bonded to the low temperature side surface of the heat exchanger main body 2. A high temperature protection plate 4A is bonded to the high temperature side surface of the high temperature detection plate 3A, and a low temperature protection plate 4B is bonded to the low temperature side surface of the low temperature detection plate 3B.

  The heat exchanger body 2 is configured by alternately stacking two types of heat transfer plates 2A and 2B. The configuration of the two types of heat transfer plates will be described later.

  The two types of heat transfer plates 2A and 2B, the high temperature detection plate 3A, the low temperature detection plate 3B, the high temperature protection plate 4A, and the low temperature protection plate 4B constituting the heat exchanger body 2 have, for example, high thermal conductivity. It consists of the same kind of metal plate (foil). More specifically, stainless steel or the like is used. After these metal plates are laminated, they are joined to each other by diffusion bonding to form a substantially rectangular parallelepiped laminate.

  Hereinafter, four surfaces other than the high-temperature side surface and the low-temperature side surface of each of the two types of heat transfer plates 2A and 2B constituting the heat exchanger body 2 are referred to as “side surfaces” as necessary for explanation. And

  As shown in FIG. 2, on each side surface of the micro-channel heat exchanger 1, a high-temperature fluid inlet 21 for allowing a high-temperature fluid to flow into a high-temperature channel in the heat exchanger main body 2, and in the heat exchanger main body 2, respectively. A high-temperature fluid outlet 22 through which the high-temperature fluid flows out from the high-temperature flow path, a low-temperature fluid inlet 23 through which the low-temperature fluid flows into the low-temperature flow path in the heat exchanger body 2, and a low temperature from the low-temperature flow path in the heat exchanger body 2. A cryogenic fluid outlet 24 is formed through which fluid flows out.

  As shown in FIG. 1, the connection fitting 5A is joined to the high temperature fluid inlet 21 by welding or the like. A pipe 8A for inflow of high-temperature fluid is detachably connected to the connection fitting 5A. The connection fitting 5B is joined to the high temperature fluid outlet 22 by welding or the like. A pipe 8B for outflow of high-temperature fluid is detachably connected to the connection fitting 5B. The connection fitting 5C is joined to the low temperature fluid inlet 23 by welding or the like. A pipe 8C for inflow of a low temperature fluid is detachably connected to the connection fitting 5C. A connection fitting 5D is joined to the low temperature fluid outlet 24 by welding or the like. A pipe 8D for flowing out the low temperature fluid is detachably connected to the connection fitting 5D.

[Configuration of Heat Exchanger Body 2]
Next, the configuration of the heat exchanger body 2 will be described.
As described above, the heat exchanger body 2 is configured by alternately stacking two types of heat transfer plates 2A and 2B. These heat transfer plates 2A and 2B are formed with grooves and notches by etching. The heat transfer plates 2A and 2B have different patterns of grooves and notches.

  3 and 4 are perspective views showing two types of heat transfer plates 2A and 2B. Here, the heat transfer plate 2A shown in FIG. 3 is a “high temperature heat transfer plate 2A”, and the heat transfer plate 2B shown in FIG. 4 is a “low temperature heat transfer plate 2B”.

(Configuration of high-temperature heat transfer plate 2A)
As shown in FIG. 3, the high-temperature heat transfer plate 2A is provided with grooves 25A, 30A, 31A and notches 26A, 27A, 28A, 29A that form flow paths for high-temperature fluid, respectively. The grooves 25A, 30A, 31A are provided only on one surface of the high temperature heat transfer plate 2A. The depths of the grooves 25A, 30A, 31A may be uniform everywhere. The notches 26A, 27A, 28A, 29A are formed by removing predetermined portions of the edge portions corresponding to the four sides of the base material of the high-temperature heat transfer plate 2A by the thickness of the base material.

  Thereafter, as required for the description, the notches 26A, 27A, 28A, 29A of the high-temperature heat transfer plate 2A are replaced with the first notch 26A, the second notch 27A, and the third notch. This is referred to as a portion 28A and a fourth cutout portion 29A.

  In the high-temperature heat transfer plate 2A, in the region between the first notch portion 26A and the second notch portion 27B that are provided to face each other in the Y-axis direction in the drawing, the first notch portion 26A and A plurality of grooves 25A, 30A, 31A communicating with the second cutout portion 27B are formed. In FIG. 3, the number of the grooves 25A is three, but many grooves having a smaller width may be formed.

  Each of the grooves 25B, 30A, 31A in the high-temperature heat transfer plate 2A includes a plurality of grooves 25A formed along the X-axis direction and two grooves 30A, 31A formed along the Y-axis direction. Is done. One groove 30A of the two grooves 30A, 31A formed along the Y-axis direction communicates with one end of the first cutout portion 26A, and the other groove 31A has one end of the second cutout portion 27A. Communicate with. A plurality of grooves 25A formed along the X-axis direction communicate between the two grooves 30A and 31A. As a result, the positional relationship between the high temperature fluid inlet 21 and the high temperature fluid outlet 22 of the high temperature heat transfer plate 2A and the low temperature fluid inlet 23 and the low temperature fluid outlet 24 of the low temperature heat transfer plate 2B are different from each other by 90 degrees.

(Configuration of low temperature heat transfer plate 2B)
As shown in FIG. 4, the low-temperature heat transfer plate 2B is provided with grooves 25B and notches 26B, 27B, 28B, and 29B that form low-temperature fluid flow paths. The groove 25B is provided only on one surface of the low-temperature heat transfer plate 2B. The depth of the groove 25B may be uniform everywhere. The notches 26B, 27B, 28B, and 29B are formed by removing predetermined portions of the edge portions corresponding to the four sides of the base material of the low-temperature heat transfer plate 2B by the thickness of the base material.

  Thereafter, as required for the description, the notches 26B, 27B, 28B, 29B of the low-temperature heat transfer plate 2B are replaced with the fifth notch 26B, the sixth notch 27B, and the seventh notch. These are referred to as a portion 28B and an eighth cutout portion 29B.

  In the low-temperature heat transfer plate 2B, the third cutout portion 28B and the fourth cutout portion 29B are provided between the third cutout portion 28B and the fourth cutout portion 29B provided to face each other in the X-axis direction in the drawing. A plurality of grooves 25B communicating with the notches 29B are formed. The plurality of grooves 25B are formed at the same position in the Y-axis direction as the plurality of grooves 25A formed in the high-temperature heat transfer plate 2A.

(Laminated structure of high temperature heat transfer plate 2A and low temperature heat transfer plate 2B)
As shown in FIG. 5 and FIG. 6, the high temperature heat transfer plate 2A and the low temperature heat transfer plate 2B having the above-described configuration have the same orientation of the surfaces provided with the grooves 25A, 25B, 30A, 31A. Thus, a plurality of layers are alternately stacked. In this way, the heat exchanger body 2 is configured.

  In the heat exchanger main body 2, the first cutout portion 26A of the high temperature heat transfer plate 2A and the fifth cutout portion 26B of the low temperature heat transfer plate 2B include the high temperature heat transfer plate 2A and the low temperature heat transfer plate 2B. A plurality of layers are alternately stacked to form the high temperature fluid inlet 21.

  The second cutout portion 27A of the high temperature heat transfer plate 2A and the sixth cutout portion 27B of the low temperature heat transfer plate 2B are formed by alternately stacking a plurality of high temperature heat transfer plates 2A and low temperature heat transfer plates 2B. Forming a hot fluid outlet 22.

  The third cutout portion 28A of the high temperature heat transfer plate 2A and the seventh cutout portion 28B of the low temperature heat transfer plate 2B are formed by alternately stacking a plurality of high temperature heat transfer plates 2A and low temperature heat transfer plates 2B. Forming a cold fluid inlet 23.

  The fourth cutout portion 29A of the high temperature heat transfer plate 2A and the eighth cutout portion 29B of the low temperature heat transfer plate 2B are formed by alternately laminating a plurality of high temperature heat transfer plates 2A and low temperature heat transfer plates 2B. Forming a cryogenic fluid outlet 24;

(About high temperature flow path and low temperature flow path)
FIG. 5 is a perspective view showing a high-temperature channel in the heat exchanger body 2.
The high temperature flow path is formed between the grooves 25A, 30A, 31A of the high temperature heat transfer plate 2A and the lower surface of the low temperature heat transfer plate 2B. The hot fluid flows from the hot fluid inlet 21 and is distributed to the plurality of grooves 25A through the grooves 30A. The high temperature fluid that has passed through the plurality of grooves 25 </ b> A merges in the groove 31 </ b> A and flows out from the high temperature fluid outlet 22. Such a flow of the high-temperature fluid is generated in the high-temperature channel layer corresponding to each high-temperature heat transfer plate 2A.

FIG. 6 is a perspective view showing a low-temperature flow path in the heat exchanger body 2.
The low temperature flow path is formed between the groove 25B of the low temperature heat transfer plate 2B and the lower surface of the high temperature heat transfer plate 2A or the lower surface of the low temperature detection plate 3B. The cryogenic fluid flows in from the cryogenic fluid inlet 23 and flows out of the cryogenic fluid outlet 24 through the plurality of grooves 25B. Such a low-temperature fluid flow is generated in the low-temperature flow path layer corresponding to each low-temperature heat transfer plate 2B.

  Since the high-temperature flow path layer and the low-temperature flow path layer are alternately laminated in the heat exchanger body 2, heat between the high-temperature fluid and the low-temperature fluid is caused by the heat conduction of the high-temperature heat transfer plate 2A and the low-temperature heat transfer plate 2B. Exchange is performed. Further, the high-temperature fluid flowing through the groove 25A of the high-temperature heat transfer plate 2A and the low-temperature fluid flowing through the groove 25B of the low-temperature heat transfer plate 2B are opposed to each other.

[Fluid temperature detection function at heat exchanger body 2]
In the microchannel heat exchanger 1 of this embodiment, the following configuration is adopted in order to directly measure the temperatures of the high-temperature fluid and the low-temperature fluid flowing in the heat exchanger body 2. .

FIG. 7 is a YZ sectional view of the micro-channel heat exchanger 1 of the present embodiment.
As shown in FIGS. 7 and 2, a high temperature detection plate 3 </ b> A and a low temperature detection plate 3 </ b> B for constituting a sensor arrangement layer are joined to the upper and lower surfaces of the heat exchanger body 2, respectively. Sensor housing grooves 35A and 35B are formed in the high temperature detection plate 3A and the low temperature detection plate 3B, for example, by etching. One ends of the sensor receiving grooves 35A and 35B reach the ends of the high temperature detection plate 3A and the low temperature detection plate 3B (see FIG. 2).

  The high temperature detection plate 3A and the low temperature detection plate 3B are respectively oriented in the direction of the surface on which the sensor housing grooves 35A and 35B are formed, and the surface on which the grooves 25A, 25B, 30A, and 31A are formed on the high temperature detection plate 3A and the low temperature detection plate 3B. Laminated to match the direction of As a result, the sensor receiving groove 35A of the high temperature detection plate 3A is closed by the high temperature side surface of the heat exchanger body 2 (the high temperature side surface of the high temperature heat transfer plate 2A), and the temperature of the sheath thermocouple or the like. It is formed as a space for accommodating the sensor 41A. On the other hand, a similar space is also formed between the sensor receiving groove 35B of the low temperature detection plate 3B and the low temperature protection plate 4B.

  One end of each of the sensor receiving grooves 35A and 35B of the high temperature detection plate 3A and the low temperature detection plate 3B is formed to the end of the high temperature detection plate 3A and the low temperature detection plate 3B. Openings 33A and 33B (see FIG. 2) are formed. The temperature sensors 41A and 41B can be inserted into the spaces of the sensor receiving grooves 35A and 35B from the openings 33A and 33B.

  The gaps in the spaces where the temperature sensors 41A and 41B are inserted are filled with the fillers 42A and 42B except at least the portions where the temperature sensing points 43A and 43B of the temperature sensors 41A and 41B are located. As a result, the temperature sensing points 43A and 43B of the temperature sensors 41A and 41B are exposed in a space communicating with the sensor housing grooves 35A and 35B. Spaces where the temperature sensing points 43A and 43B of the temperature sensors 41A and 41B are exposed become measurement spaces 34A and 34B for measuring the temperature of the fluid.

  Note that the measurement spaces 34A and 34B are wide spaces so as to ensure a sufficient amount of contact between the temperature sensing points 43A and 43B of the temperature sensors 41A and 41B and the fluid (see FIG. 2).

  The microchannel heat exchanger 1 of the present embodiment is provided with communication holes 32A and 32B in order to introduce the fluid flowing through the heat exchanger body 2 into the measurement spaces 34A and 34B.

  The communication hole 32A provided corresponding to the high temperature detection plate 3A has one end opened to the bottom surface of the groove 25A in the high temperature heat transfer plate 2A joined to the high temperature detection plate 3A, and the other end is a measurement space 34A of the high temperature detection plate 3A. The high-temperature heat transfer plate 2A is provided as a hole penetrating in the stacking direction.

  The communication hole 32B provided corresponding to the low temperature detection plate 3B has a groove 25B in the low temperature heat transfer plate 2B having one end opened at the bottom of the measurement space 34B in the low temperature detection plate 3B and the other end joined to the low temperature detection plate 3B. Is provided as a hole penetrating the low temperature detection plate 3B in the stacking direction.

  By adopting such a configuration, the temperature sensors 41A and 41B do not protrude into the flow path, so that a large flow resistance is not created in the flow path in the heat exchanger body 2, and the heat exchanger main body 2 The temperature of the fluid can be measured directly.

  In the microchannel heat exchanger 1 of the present embodiment, the performance of the heat exchanger can be specified by directly measuring the temperatures of the high temperature fluid and the low temperature fluid. For this reason, the performance of the heat exchanger can be maximized by adjusting the temperature, pressure and flow rate of the high-temperature and high-pressure gas.

  The temperature of the fluid may be measured at the entrance / exit of the flow path. Accordingly, the temperature sensor 41A, 41B can measure the temperature of the fluid at the inlet / outlet position of the flow path, for example, the temperature sensor 41A, 41B of the high temperature detection plate 3A and the low temperature detection plate 3B. What is necessary is just to determine a position, the position of 32 A of communicating holes, and 32B.

  In the microchannel heat exchanger 1 of the above embodiment, the high temperature detection plate 3A and the low temperature detection plate 3B are disposed at both ends of the heat exchanger body 2 in the heat transfer plate stacking direction, but the present invention is not limited thereto. It is not limited.

  For example, as shown in FIG. 8, a high temperature detection plate 3 </ b> A and a low temperature detection plate 3 </ b> B may be provided in the middle of the heat exchanger body 2. In this case, either one of the high temperature detection plate 3A and the low temperature detection plate 3B may be provided.

  In the etching process described above, a recess is formed to form a flow path, but a protrusion is formed on the surface of the metal foil, for example, a process of applying metal particles to the surface of the metal foil together with an adhesive (binder) (printing process) is performed. There is also a method of creating a flow path.

DESCRIPTION OF SYMBOLS 1 ... Microchannel heat exchanger 2 ... Heat exchanger main body 2A ... High temperature heat transfer plate 2B ... Low temperature heat transfer plate 3A ... High temperature detection plate 3B ... Low temperature detection plate 4A ... High temperature protection plate 4B ... Low temperature protection plate 25A, 25B, 30A, 30B ... Groove 32A, 32B ... Communication hole 34A, 34B ... Measurement space 35A, 35B ... Sensor housing groove 41A, 41B ... Temperature sensor 43A, 43B ... Temperature sensing point

Claims (2)

A flow path layer laminate formed by alternately laminating a plurality of high temperature flow path layers provided with high temperature fluid flow paths and a plurality of low temperature flow path layers provided with low temperature fluid flow paths;
The fluid is introduced through a communication hole that is stacked on the flow path layer laminate and communicates with at least one of the high temperature flow path layer and the low temperature flow path layer in the stacking direction, and a temperature sensor. A microchannel heat exchanger comprising: a sensor arrangement layer having a measurement space in which a sensing point of the sensor is exposed. The microchannel heat exchanger according to claim 1,
The high-temperature flow paths of the plurality of high-temperature flow path layers, the low-temperature flow paths of the plurality of low-temperature flow path layers, and the measurement space of the sensor arrangement layer are each provided with a groove by an etching process, A micro-channel heat exchanger that is formed by superimposing the base materials and diffusion bonding the contact surfaces.

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