JP6361723B2 - Microchannel heat exchanger - Google Patents

Description

  The present invention relates to a micro flow channel heat exchanger configured by stacking a plurality of heat transfer plates in which a flow channel of a working fluid for heat exchange is formed.

  The heat exchanger is used as an element of the refrigeration cycle and is an indispensable part for changing the temperature of the working fluid in the refrigeration cycle to the target temperature. There are various types of heat exchangers. Among them, the outstanding performance of the micro-channel heat exchanger is being recognized, and development is progressing toward practical use.

  Such microchannel heat exchangers include a stacked microchannel heat exchanger. This multi-layer micro-channel heat exchanger is configured, for example, by alternately stacking heat transfer plates with fine high-temperature channels formed on the surface and heat transfer plates with fine low-temperature channels formed on the surface. By stacking a pressure-resistant metal plate on the top and bottom surfaces of the laminated body and applying pressure and heating in a vacuum state, each heat transfer plate and each metal plate are diffusion-bonded to each other and integrated (for example, non- Patent Document 1).

  Structural features when the stacked micro-channel heat exchanger is compared with the plate-type heat exchanger include that more channels can be formed in each layer and that shorter channels can be formed. Thereby, the stacked micro-channel heat exchanger can be reduced in size as compared with the plate heat exchanger.

  In addition, the multilayer micro-channel heat exchanger has advantages over conventional heat exchangers in terms of heat transfer, reduced refrigerant charge, high pressure resistance, and heat resistance. For example, if the heat transfer rate between the working fluids via the heat transfer surface (plate) is high, the flow path shape loss is low, and the flow loss is the same as the plate heat exchanger, the flow area can be reduced, compressed The pressure loss of the working fluid can be reduced, the amount of working fluid charged in the refrigeration cycle can be reduced by reducing the volume of the entire heat exchanger, and so on.

  Temperature sensors are respectively provided at the entrances and exits of the working fluid of the stacked microchannel heat exchanger. The purpose of providing the temperature sensor is to calculate the amount of heat exchanged by the heat exchanger based on the temperature measured by the temperature sensor, or to control the working fluid flowing out to the target temperature.

To achieve this goal, the temperature sensor must be able to accurately measure the temperature of the working fluid. For example, when heat exchange is performed between two working fluids, the heat exchange capability (heat transfer amount) of the heat exchanger can be obtained by the following equation from the temperature difference between the working fluid flowing in and the working fluid flowing out.
Q ([J / s] = [W])
= Cp, l ([J / kgK]) x Gl ([kg / s]) x (TLow, out−TLow, in) ([K])
= Cp, h ([J / kgK]) x Gh ([kg / s]) x (THigh, in-THigh, out) ([K])
Q: Heat transfer [J / s] = [W]
cp, l: Specific heat of low-temperature working fluid [J / kgK]
cp, h: Specific heat of high temperature working fluid [J / kgK]
Gl: Mass flow rate of low-temperature working fluid [kg / s]
Gh: Mass flow rate of high temperature working fluid [kg / s]
(TLow, out−TLow, in): (Temperature difference between heat exchanger outlet temperature of low temperature working fluid and inlet temperature of low temperature working fluid [K])
(THigh, in-THigh, out): (Temperature difference [K] between heat exchanger inlet temperature of high temperature working fluid and outlet temperature of low temperature working fluid)

  In a water heater or the like, it is necessary to accurately measure the temperature of the working fluid flowing through the outlet of the micro-channel heat exchanger in order to check whether the working fluid has reached the target temperature. In addition, it is necessary to accurately measure the temperature of the working fluid flowing through the inlet of the micro-channel heat exchanger in order to confirm whether the working fluid that has flowed out of the hot water storage tank needs to be heated. It is also necessary to derive the amount of heat necessary to heat the to the target temperature.

  A temperature sensor such as a thermocouple is used to measure the temperature of the working fluid flowing through the inlet / outlet of the stacked micro-channel heat exchanger. The thermoelectromotive force measured by the sensing point of the temperature sensor is transmitted to the thermoelectromotive force-temperature conversion circuit via a thermocouple wire connected to the sensing point. In many cases, the temperature sensor is fixed by solder or the like to the outer surface of the pipe attached to the inlet and outlet of the working fluid of the heat exchanger. In this case, since the sensing point of the temperature sensor is not in direct contact with the working fluid, the accurate temperature of the working fluid cannot be measured.

  Therefore, the measured temperature includes an error 1 due to heat conduction of the metal forming the heat exchanger, an error 2 due to a temperature difference between the temperature at the position where the temperature sensor is attached and the temperature of the working fluid flowing through the actual inlet / outlet, Due to the temperature difference between the temperature of the working fluid flowing near the center of the tube and the temperature of the working fluid flowing near the wall of the tube due to the temperature boundary layer of the working fluid flowing in each inlet / outlet pipe connected to the inlet / outlet, Measurement error 4 of the measurement method is included.

2013 Japan Society of Mechanical Engineers Award

  The plate type heat exchanger has an outer dimension of, for example, 95 (width) x 325 (length) x 81.96 (height) (mm), and has the same heat exchange capacity as this plate type heat exchanger. Since the external dimensions of the channel heat exchanger are larger than 80 (width) x 106 (length) x 43.2 (height) (mm), the surface area in contact with the surrounding air is large, and the heat in the air is plate heat exchange. It is easy to be disturbed by moving into the chamber or heat in the plate heat exchanger moving into the air. For this reason, there is a limit to measuring the actual temperature of the working fluid that is not affected by other influences such as disturbances.

  On the other hand, the stacked micro-channel heat exchanger has a small surface area in contact with the surrounding air, and heat in the air moves into the heat exchanger body, or heat in the heat exchanger body moves into the air. Therefore, it is easier to measure the actual temperature of the working fluid than a plate heat exchanger. If the actual temperature of the working fluid can be measured, it is based on measurement errors when adjusting the indoor air temperature etc. to the set temperature in the stacked micro-channel heat exchanger used for air conditioners and floor heating. Useless energy for temperature adjustment is not consumed.

However, in stacked micro-channel heat exchangers used for actual air conditioners and floor heating, heat exchange is not performed as described above, instead of directly measuring the temperature of the working fluid flowing through the inlet / outlet of the heat exchanger body. The surface temperature of the pipe connected to the inlet / outlet of the main body is measured. For example, in the case of a micro-channel heat exchanger used for floor heating, the temperature of the working fluid flowing through the inlet (for example, water) is low, but the surface temperature of the piping through which the working fluid connected to the inlet flows is In some cases, heat is transferred from the air into the pipe due to heat conduction on the metal surface, and the temperature is measured higher than the actual working fluid temperature. The temperature of the working fluid flowing through the outlet is high, but the surface temperature of the piping through which the working fluid connected to the outlet flows is the actual temperature of the working fluid due to heat transfer to the air due to heat conduction on the metal surface. May be measured lower. These are errors due to the installation position of the temperature sensor (the above-mentioned errors 1 to 3).
In addition, since the stacked micro-channel heat exchanger is small, heat is transferred between the outlet pipe and the inlet pipe due to heat conduction in the heat exchanger body, and the outlet pipe or inlet pipe with the lower temperature is used. May be measured at higher temperatures, while higher temperatures may be measured at lower temperatures.

  As described above, in the method of measuring the temperature of the working fluid using the temperature sensor installed on the surface of the pipe connected to the inlet / outlet of the stacked micro-channel heat exchanger, the actual temperature of the working fluid cannot be measured. .

  Therefore, in order to measure the actual temperature of the working fluid flowing through the inlet / outlet of the heat exchanger body, a temperature sensor sensing point (thermocouple hot junction) is inserted into the inlet / outlet pipe of the heat exchanger body, A method of directly measuring the temperature of the working fluid flowing through the inlet / outlet of the heat exchanger body by directly contacting the sensing point of the temperature sensor with the flowing working fluid has been studied.

  However, the detection signal of the temperature sensor is provided separately from the heat exchanger, and in order to transmit the signal detected by the sensor to a printed circuit board that is a control board for processing, a print signal is printed with each of the temperature sensors. It is necessary to connect the substrate individually with lead wires, and it takes time to connect these lead wires.

  In view of the circumstances as described above, an object of the present invention is to provide a heat exchanger that can easily connect a temperature sensor that directly measures the temperature of a working fluid by touching the working fluid and a control board with lead wires. Is to provide.

In order to achieve the above object, a heat exchanger according to an aspect of the present invention includes a plurality of high-temperature channel layers provided with high-temperature fluid channels and a plurality of low-temperature channel layers provided with low-temperature fluid channels. And a heat exchanger body having an inlet and an outlet for the high temperature fluid, an inlet and an outlet for the low temperature fluid, and the high temperature flow of the heat exchanger body. A high-temperature inlet pipe connected to the inlet of the passage to allow the high-temperature fluid to flow into the high-temperature flow path from the outside; and a high-temperature fluid connected to the outlet of the high-temperature flow path of the heat exchanger body from the high-temperature flow path to the outside. A high-temperature outlet pipe that flows out; a low-temperature inlet pipe that is connected to an inlet of the low-temperature flow path of the heat exchanger main body and allows the low-temperature fluid to flow into the low-temperature flow path from outside; and the low-temperature flow path of the heat exchanger main body Connected to the outlet of the low-temperature flow path to the outside from the low-temperature flow path Contact with the hot inlet and outlet pipes to flow out the body, is secured in the stacking direction of the heat exchanger body, the high temperature inlet pipe and the hot outlet pipe and the cold inlet tube and at least one tube of fluid out of said cold outlet tube And a control board on which at least a temperature sensor inserted in the stacking direction of the heat exchanger main body is mounted so that a sensing point is arranged.

  ADVANTAGE OF THE INVENTION According to this invention, the operation | work which connects the temperature sensor which directly measures the temperature of a working fluid in contact with a working fluid, and a control board can be facilitated.

It is a perspective view which shows the microchannel heat exchanger which concerns on one Embodiment of this invention. FIG. 2 is a partially exploded perspective view of the microchannel heat exchanger of FIG. 1. It is a perspective view which shows the structure of a high temperature heat exchanger plate in the microchannel heat exchanger of FIG. It is a perspective view which shows the structure of a low-temperature heat exchanger plate in the microchannel heat exchanger of FIG. It is a perspective view for demonstrating the high temperature channel of a high temperature channel layer in the microchannel heat exchanger of FIG. It is a perspective view for demonstrating the low temperature channel of a low temperature channel layer in the microchannel heat exchanger of FIG. It is AA sectional drawing in FIG. It is BB sectional drawing in FIG. It is CC sectional drawing in FIG. It is a figure which shows the velocity distribution of the working fluid in the upstream area and downstream area of a rectification ring about the microchannel heat exchanger of FIG. It is a block diagram which shows the structure containing the electrical connection relation of each electronic component mounted in the printed circuit board of the microchannel heat exchanger of FIG. It is a figure which shows the display form of the temperature data in the microchannel heat exchanger of FIG. It is a partially exploded perspective view which shows the structure of the principal part of the 2nd microchannel heat exchanger of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing a microchannel heat exchanger according to a first embodiment of the present invention with a printed circuit board as a control board removed, and FIG. 2 shows the microchannel heat exchanger of FIG. It is a perspective view which partially decomposes and shows a heat exchanger main part.

[Overall configuration]
As shown in these drawings, the micro-channel heat exchanger 1 includes a heat exchanger body 2, which is a channel layer laminate, a high-temperature side outer shell plate 3A, a low-temperature side outer shell plate 3B, and a high-temperature fluid. 5A, a high temperature outlet pipe 5B for flowing out the high temperature fluid, a low temperature inlet pipe 5C for flowing in the low temperature fluid, a low temperature outlet pipe 5D for flowing out the low temperature fluid, and the printed circuit board 4. In the following description, the high temperature inlet pipe 5A, the high temperature outlet pipe 5B, the low temperature inlet pipe 5C, and the low temperature outlet pipe 5D are collectively referred to as an inlet / outlet pipe.

  In the figure, the surface in the direction opposite to the direction of the Z-axis arrow of the heat exchanger body 2 is the “high-temperature side surface” or “lower surface”, and the surface of each member in the direction of the Z-axis arrow is “low-temperature side” "Surface" or "upper surface". A high temperature side shell plate 3A is joined to the high temperature side surface of the heat exchanger body 2, and a low temperature side shell plate 3B is joined to the low temperature side surface of the heat exchanger body 2.

  The heat exchanger body 2 is configured by laminating a plurality of two types of heat transfer plates 2A and 2B alternately. The configuration of the two types of heat transfer plates will be described later.

  The two types of heat transfer plates 2A and 2B, the high temperature side outer shell plate 3A, and the low temperature side outer shell plate 3B constituting the heat exchanger body 2 are made of the same type of metal plate having a high thermal conductivity, for example. More specifically, stainless steel or the like is used. After these metal plates are laminated, they are joined to each other by diffusion bonding to form a substantially rectangular parallelepiped laminate. The plate thickness of the heat transfer plates 2A and 2B may be any thickness as long as a high-temperature channel or a low-temperature channel can be formed and diffusion bonding can be performed.

  Hereinafter, the plane perpendicular to the Z-axis of the micro-channel heat exchanger 1 is referred to as “main surface” and the four surfaces perpendicular to the X-axis and Y-axis other than the main surface are referred to as “side surfaces” as necessary for explanation. ".

  As shown in FIG. 2, on each side surface of the micro-channel heat exchanger 1, a high-temperature inlet header 21 that allows a high-temperature fluid, which is one of the working fluids, to flow into a high-temperature channel in the heat exchanger body 2, respectively. , A high temperature outlet header 22 for flowing a high temperature fluid from a high temperature flow path in the heat exchanger body 2, and a low temperature inlet for flowing a low temperature fluid as another working fluid into the low temperature flow path in the heat exchanger body 2 A header 23 and a low-temperature outlet header 24 for allowing a low-temperature fluid to flow out from a low-temperature flow path in the heat exchanger body 2 are formed.

  As shown in FIG. 1, a high temperature inlet pipe 5A is inserted into the high temperature inlet header 21 from the outside, and is joined to the heat exchanger body 2 by welding or the like. An external pipe (not shown) for allowing the high-temperature fluid to flow in is detachably connected to the outer end of the high-temperature inlet pipe 5A. A high temperature outlet pipe 5B is inserted into the high temperature outlet header 22 from the outside, and is joined to the heat exchanger body 2 by welding or the like. An external pipe (not shown) for allowing the high temperature fluid to flow out is detachably connected to the high temperature outlet pipe 5B. A cold inlet pipe 5C is inserted from the outside into the cold inlet header 23 and joined to the heat exchanger body 2 by welding or the like. An external pipe (not shown) for allowing a low-temperature fluid to flow in is detachably connected to the low-temperature inlet pipe 5C. A low temperature outlet pipe 5D is inserted into the low temperature outlet header 24 from the outside, and is joined to the heat exchanger body 2 by welding or the like. The low temperature outlet pipe 5D is detachably connected to an external pipe (not shown) for allowing the low temperature fluid to flow out.

[Configuration of Heat Exchanger Body 2]
Next, the configuration of the heat exchanger body 2 will be described.
As described above, the heat exchanger body 2 is configured by alternately stacking two types of heat transfer plates 2A and 2B. Grooves and notches are formed in these heat transfer plates 2A and 2B by etching. In the heat transfer plates 2A and 2B, since the working fluids flowing in the respective grooves are different, the groove patterns are different, but the notch portions are formed so as to be the respective header portions after the heat transfer plates 2A and 2B are stacked. Therefore, the shape of the notch is the same. The process for forming grooves and notches in the heat transfer plates 2A and 2B is not limited to the etching process, and may be, for example, laser processing, precision press processing, cutting processing, or the like. Further, the edge of the groove may be formed by using additive manufacturing technology such as a 3D printer.

  3 and 4 are perspective views showing two types of heat transfer plates 2A and 2B. Here, the heat transfer plate 2A shown in FIG. 3 is a “high temperature heat transfer plate 2A”, and the heat transfer plate 2B shown in FIG. 4 is a “low temperature heat transfer plate 2B”.

(Configuration of high-temperature heat transfer plate 2A)
As shown in FIG. 3, the high-temperature heat transfer plate 2A is provided with grooves 25A, 30A, 31A and notches 26A, 27A, 28A, 29A that form flow paths for high-temperature fluid, respectively. The grooves 25A, 30A, 31A are provided only on one surface of the high temperature heat transfer plate 2A. The depths of the grooves 25A, 30A, 31A may be uniform everywhere. The notches 26A, 27A, 28A, and 29A are formed by removing predetermined portions corresponding to the four sides of the base material of the high-temperature heat transfer plate 2A by the thickness of the base material.

  Thereafter, according to the necessity of explanation, each of the cutout portions 26A, 27A, 28A, 29A of the high temperature heat transfer plate 2A is replaced with a first cutout portion 26A (high temperature distribution portion) and a second cutout portion 27A ( High temperature confluence portion), the third cutout portion 28A, and the fourth cutout portion 29A.

  In the high-temperature heat transfer plate 2A, the first notch 26A is provided in a region between the first notch 26A and the second notch 27A provided at both ends in the Y-axis direction in the drawing. A plurality of grooves 25 </ b> A, 30 </ b> A, and 31 </ b> A are formed to communicate with the second notch 27 </ b> A. In FIG. 3, the number of the grooves 25A is three, but many grooves having a smaller width may be formed.

  Each of the grooves 25A, 30A, 31A in the high-temperature heat transfer plate 2A includes a plurality of grooves 25A formed along the X-axis direction and two grooves 30A, 31A formed along the Y-axis direction. Is done. One groove 30A of the two grooves 30A, 31A formed along the Y-axis direction communicates with one end of the first cutout portion 26A, and the other groove 31A has one end of the second cutout portion 27A. Communicate with. A plurality of grooves 25A formed along the X-axis direction communicate between the two grooves 30A and 31A. Thereby, the positional relationship between the high temperature inlet header 21 and the high temperature outlet header 22 of the high temperature heat transfer plate 2A formed as described later and the low temperature inlet header 23 and the low temperature outlet header 24 of the low temperature heat transfer plate 2B is 90 degrees with respect to each other. To be different.

(Configuration of low temperature heat transfer plate 2B)
As shown in FIG. 4, the low-temperature heat transfer plate 2B is provided with grooves 25B and notches 26B, 27B, 28B, and 29B that form low-temperature fluid flow paths. The groove 25B is provided only on one surface of the low-temperature heat transfer plate 2B. The depth of the groove 25B may be uniform everywhere. The notches 26B, 27B, 28B, and 29B are formed by removing predetermined portions corresponding to the four sides of the base material of the low-temperature heat transfer plate 2B by the thickness of the base material.

  Thereafter, as required for the description, the notches 26B, 27B, 28B, 29B of the low-temperature heat transfer plate 2B are replaced with the fifth notch 26B, the sixth notch 27B, and the seventh notch. This is referred to as a section 28B (low temperature distribution section) and an eighth cutout section 29B (low temperature junction section).

  In the low temperature heat transfer plate 2B, between the seventh notch portion 28B and the eighth notch portion 29B provided at both ends in the X-axis direction in the figure, the seventh notch portion 28B and the eighth notch portion 28B A plurality of grooves 25B communicating with the eight cutout portions 29B are formed. The plurality of grooves 25B are formed at the same position in the Y-axis direction as the plurality of grooves 25A formed in the high-temperature heat transfer plate 2A.

(Laminated structure of high temperature heat transfer plate 2A and low temperature heat transfer plate 2B)
As shown in FIG. 5 and FIG. 6, the high temperature heat transfer plate 2A and the low temperature heat transfer plate 2B having the above-described configuration have the same orientation of the surfaces provided with the grooves 25A, 25B, 30A, 31A. Thus, a plurality of layers are alternately stacked. In this way, the heat exchanger body 2 is configured.

  In the heat exchanger main body 2, the first cutout portion 26A of the high temperature heat transfer plate 2A and the fifth cutout portion 26B of the low temperature heat transfer plate 2B include the high temperature heat transfer plate 2A and the low temperature heat transfer plate 2B. The high temperature inlet header 21 is formed by alternately laminating a plurality of layers.

  The second cutout portion 27A of the high temperature heat transfer plate 2A and the sixth cutout portion 27B of the low temperature heat transfer plate 2B are formed by alternately stacking a plurality of high temperature heat transfer plates 2A and low temperature heat transfer plates 2B. The high temperature outlet header 22 is formed.

  The third cutout portion 28A of the high temperature heat transfer plate 2A and the seventh cutout portion 28B of the low temperature heat transfer plate 2B are formed by alternately stacking a plurality of high temperature heat transfer plates 2A and low temperature heat transfer plates 2B. The cold inlet header 23 is formed.

  The fourth cutout portion 29A of the high temperature heat transfer plate 2A and the eighth cutout portion 29B of the low temperature heat transfer plate 2B are formed by alternately laminating a plurality of high temperature heat transfer plates 2A and low temperature heat transfer plates 2B. The low temperature outlet header 24 is formed.

(About high temperature flow path and low temperature flow path)
FIG. 5 is a perspective view showing a high-temperature channel in the heat exchanger body 2.
The high temperature flow path is formed between the grooves 25A, 30A, 31A of the high temperature heat transfer plate 2A and the lower surface of the low temperature heat transfer plate 2B. The hot fluid flows from the hot inlet header 21 and is distributed to the plurality of grooves 25A through the grooves 30A. The high temperature fluid that has passed through the plurality of grooves 25 </ b> A merges in the groove 31 </ b> A and flows out from the high temperature outlet header 22. Such a flow of the high-temperature fluid is generated in the high-temperature channel layer corresponding to each high-temperature heat transfer plate 2A. The high-temperature channel layer is formed by the grooves 25A, 30A, 31A of the high-temperature heat transfer plate 2A, the first notch portion 26A, and the second notch portion 27A.

FIG. 6 is a perspective view showing a low-temperature flow path in the heat exchanger body 2.
The low temperature flow path is formed between the groove 25B of the low temperature heat transfer plate 2B, the lower surface of the low temperature side outer shell plate 3B, and the lower surface of the high temperature heat transfer plate 2A. The cryogenic fluid flows in from the cold inlet header 23 and out of the cold outlet header 24 through the plurality of grooves 25B. Such a low-temperature fluid flow is generated in the low-temperature flow path layer corresponding to each low-temperature heat transfer plate 2B. The low-temperature channel layer is formed by the grooves 25B of the low-temperature heat transfer plate 2B, the seventh cutout portion 28B, and the eighth cutout portion 29B.

  Since the high-temperature channel layer and the low-temperature channel layer are alternately laminated in the heat exchanger body 2, heat exchange between the high-temperature fluid and the low-temperature fluid is performed via the high-temperature heat transfer plate 2A and the low-temperature heat transfer plate 2B. Is done.

[Configuration of Printed Circuit Board 4]
As shown in FIG. 1, an upper surface 4a (hereinafter referred to as “main surface”) of the printed circuit board 4 includes various integrated circuits 41, connectors 42 for connection to external wiring, and a transmission device. A wireless module 43, a display 44, and a group of electronic components such as a plurality of temperature sensors 45A, 45B, 45C, 45D are mounted. Further, on the main surface 4a of the printed circuit board 4, each of the electronic components including the connection between the plurality of temperature sensors 45A, 45B, 45C and 45D and the electromotive force processing circuit 411 (see FIG. 11) in the integrated circuit 41 is provided. A wiring pattern 46 for electrically connecting the two is provided.

  The printed circuit board 4 is fixed with a plurality of fixing screws 47 with a spacer 52 interposed between the printed circuit board 4 and the heat exchanger body 2. That is, the printed circuit board 4 is provided with a screw through hole 47a through which the fixing screw 47 is passed, and the heat exchanger body 2 is provided with a screw hole 51 for receiving the fixing screw 47 through the screw through hole 47a.

  The temperature sensors 45A, 45B, 45C, 45D are respectively the temperatures of the hot fluid flowing through the hot inlet pipe 5A, the hot fluid flowing through the hot outlet pipe 5B, the cold fluid flowing through the cold inlet pipe 5C, and the cold fluid flowing through the cold outlet pipe 5D. It is for measuring.

[Temperature sensor mounting structure]
7 and 8 are cross-sectional views showing a mounting structure of the first temperature sensor 45A obtained by cutting the heat exchanger body 2 along the cutting lines AA and BB shown in FIG. FIG. 7 is an XZ cross-sectional view when the temperature sensor 45A mounting structure is viewed in the axial direction (fluid flow direction) in the high-temperature inlet pipe 5A, and FIG. 8 is a YZ cross-sectional view thereof. Since the other temperature sensors 45B, 45C, and 45D have the same mounting structure, only the mounting structure of the first temperature sensor 45A will be described here. As shown in FIG. 1, the printed circuit board 4 to which the temperature sensors 45 </ b> A, 45 </ b> B, 45 </ b> C, 45 </ b> D are attached is attached to the upper surface of the heat exchanger body 2 with fixing screws 47.

  The printed circuit board 4 is provided with a hole 48 for inserting a thermocouple as the first temperature sensor 45A. The low temperature side outer shell plate 3 </ b> B of the heat exchanger body 2 is provided with a hole portion 32 that communicates with the hole portion 48 of the printed circuit board 4. Further, a hole 33 communicating with the hole 32 of the low temperature side shell plate 3B is provided in a portion on the low temperature side shell plate 3B side of the high temperature inlet pipe 5A inserted into the inlet of the heat exchanger main body 2.

  A metal protective tube 34 made of, for example, stainless steel is disposed in each of the holes 48 and 32 of the printed circuit board 4 and the low temperature side outer shell plate 3B. The thermocouple wires 35, 35 of the first temperature sensor 45 </ b> A in the metal protective tube 34 are covered with an insulating / heat insulating member 36. As the thermocouple wires 35, 35 of the first temperature sensor 45A, for example, those having a diameter of about 0.5 mm to 1 mm can be used, and it is desirable that the durability is enhanced by a ceramic thin film or the like. A hot junction 37 (sensing point of the temperature sensor) provided at the tip of the thermocouple wires 35, 35 of the first temperature sensor 45A is arranged so as to be directly in contact with the fluid flowing through the high temperature inlet pipe 5A. . The hot junction 37 is preferably a sphere having a diameter of, for example, about 0.5 mm or 1 mm so as not to receive pressure from the fluid as much as possible.

  A gap between the hole 48 of the printed circuit board 4 and the metal protective tube 34 is closed by a sealing material 61. Further, the hole 32 of the low temperature side shell 3 </ b> B is closed by the sealing material 62 from the lower side.

  The mounting structure of the first temperature sensor 45A has been described above, but the mounting structure of the second temperature sensor 45B, the third temperature sensor 45C, and the fourth temperature sensor 45D is the same.

  In this way, the hot contact point 37 of the first temperature sensor 45A directly touches the hot fluid flowing through the hot inlet pipe 5A at the inlet of the heat exchanger body 2, thereby flowing the hot fluid flowing into the heat exchanger body 2. Can be measured directly. Similarly, the temperature of each of the high-temperature fluid flowing out from the heat exchanger body 2, the low-temperature fluid flowing into the heat exchanger body 2, and the low-temperature fluid flowing out from the heat exchanger body 2 is set to the second temperature sensor 31B, the third temperature sensor 31B, and the third temperature sensor 31B. It can be directly measured by the temperature sensor 31C and the fourth temperature sensor 31D.

  However, the working fluid flowing in each of the inlet / outlet pipes 5A, 5B, 5C, 5D is decelerated in the vicinity of the inner wall of each of the inlet / outlet pipes 5A, 5B, 5C, 5D, thereby forming a non-uniform temperature distribution. For this reason, even if the temperature of the working fluid is directly measured, an accurate temperature cannot always be measured.

  Therefore, a rectifying ring for forming a core region in which the speed and temperature of the working fluid are substantially constant is disposed in each of the inlet / outlet pipes 5A, 5B, 5C, and 5D of the heat exchanger body 2. A hot junction of the temperature sensor was arranged in the core region formed in the downstream region of the rectifying ring.

  As shown in FIGS. 7 and 8, a rectifying ring 71 is disposed in the high temperature inlet pipe 5A. The rectifying ring 71 has an opening 71a coaxially with the high temperature inlet pipe 5A. The diameter D on the inlet side of the opening 71a is equal to the inner diameter of the high temperature inlet pipe 5A, and the diameter d on the outlet side 71c is equal to that on the inlet side. It is about two thirds of the diameter D. And from the entrance side of the opening part 71a to the exit side 71c, it becomes a mortar-shaped taper surface. This structure is the same for the low-temperature inlet pipe 5C connected to the inlet of the heat exchanger body 2 through which the low-temperature fluid flows.

FIG. 9 is a YZ sectional view showing the high-temperature outlet pipe 5B and the rectifying ring 71 connected to the outlet from which the high-temperature fluid flows out of the heat exchanger body 2 cut along the cutting line CC shown in FIG.
As shown in the figure, a rectifying ring 71 is similarly disposed in the high temperature outlet pipe 5B connected to the outlet from which the high temperature fluid of the heat exchanger body 2 flows out.
This structure is the same for the low temperature outlet pipe 5D connected to the outlet of the heat exchanger body 2 through which the low temperature fluid flows out.

FIG. 10 is a diagram illustrating the velocity distribution of the working fluid in the upstream region and the downstream region of the rectifying ring 71. When the rectifying ring 71 is provided in the inlet pipe, the outlet side 71 c of the opening 71 a becomes the boundary 72 with the inlet of the heat exchanger body 2.
The working fluid that has flowed into the respective inlet / outlet pipes 5A, 5B, 5C, and 5D from the outside or the heat exchanger body 2 is decelerated near the inner wall of each of the inlet / outlet pipes 5A, 5B, 5C, and 5D in the upstream region of the rectifying ring 71. Thus, a non-uniform velocity distribution is shown in which the velocity decreases as the distance from the central axis of each of the inlet / outlet pipes 5A, 5B, 5C, and 5D increases. The working fluid that has flowed in the vicinity of the inner wall of each of the inlet / outlet pipes 5A, 5B, 5C, and 5D in the upstream region of the rectifying ring 71 is caused by the tapered surface 71b of the opening 71a of the rectifying ring 71. The flow is guided in the direction toward the central axis of the rectifying ring 71 and is mixed with other flows passing near the center of the opening 71 a of the rectifying ring 71. As a result, the speed of the working fluid is higher than the average speed of the working fluid in each of the inlet / outlet pipes 5A, 5B, 5C, and 5D in the upstream area of the rectifying ring 71 in the downstream area immediately after the opening 71a of the rectifying ring 71. Thus, a substantially constant core region C is generated. As an example, when the diameter of the inlet side of the rectifying ring 71 is D and the diameter of the outlet side 71c is 2 / 3D, the distance from the outlet side 71c of the opening 71a of the rectifying ring 71 to a position 6D downstream. A core region C is formed (a large temperature distribution region that is substantially uniform in both the radial and axial directions can be formed large, making it easier to install a thermocouple and to accurately measure the temperature of the fluid). Outside the core region C is a velocity boundary layer and a temperature boundary layer. In the core region C, the speed of the working fluid is substantially constant, and the temperature distribution is also substantially uniform. Therefore, by arranging the hot junction 37 of the temperature sensor in the core region C, the velocity boundary layer and the temperature boundary layer The temperature of the working fluid can be accurately measured without being affected.

  In this embodiment, as shown in FIGS. 8 and 9, the temperature sensors 45 </ b> A and 45 </ b> B are arranged such that the hot junction 37 is positioned at a distance of 2D downstream from the position of the outlet side 71 c of the opening 71 a of the rectifying ring 71. Arranged. Thereby, the temperature of the working fluid flowing into or out of the inlet or outlet of the heat exchanger body 2 can be accurately measured without being affected by the velocity boundary layer and the temperature boundary layer. Thereby, calculation of the amount of heat exchange heat, control to the target temperature of the working fluid which flows out, etc. can be performed more correctly.

  Regarding the shape of the opening 71a of the rectifying ring 71, the tapered surface 71b of the opening 71a may be a constant inclined surface in the cross section, but the present invention is not limited to this, and the area of the opening 71a is reduced. What is necessary is just to make it narrow gradually, and a sine wave front, a parabolic curved surface, or a hyperbolic surface may be sufficient.

[Functional configuration of various electronic components mounted on printed circuit board 4]
FIG. 11 is a functional block diagram showing a configuration including an electrical connection relationship of each electronic component mounted on the printed circuit board 4.
As shown in the figure, the printed circuit board 4 includes the four temperature sensors 45A, 45B, 45C, and 45D, an electromotive force processing circuit 411, a statistical processing circuit 412, an output processing circuit 413, and a display processing circuit. 414, an external connection connector 42, a wireless module 43, and a display 44. Here, the electromotive force processing circuit 411, the statistical processing circuit 412, the output processing circuit 413, and the display processing circuit 414 are configured by one or more integrated circuits 41. Alternatively, each may be constituted by a separate integrated circuit 41.

  The electromotive force processing circuit 411 generates temperature data corresponding to the output voltage between the thermocouple wires 35 and 35 of the temperature sensors 45A, 45B, 45C, and 45D, and supplies the temperature data to the statistical processing circuit 412.

  The statistical processing circuit 412 performs various statistical processes on the temperature data for each temperature sensor supplied from the electromotive force processing circuit 411. The statistical processing circuit 412 calculates, for example, an average value, a maximum value, a minimum value, etc. of temperature data for each measurement time. Alternatively, the statistical processing circuit 412 calculates an average value, a maximum value, a minimum value, etc. with conditions such as a specific time zone such as morning. The statistical processing circuit 412 has a memory element and can store the calculation result.

  The output processing circuit 413 can output the result of statistical processing obtained from the statistical processing circuit 412 to an external device through the external output connector 42, or can transmit the result to an external device using the wireless module 43.

  The display processing circuit 414 generates display data from the result of the statistical processing obtained from the statistical processing circuit 412 and outputs the display data to the display unit 44.

  The display 44 is composed of, for example, a liquid crystal display panel and includes a display screen along the main surface 4 a of the printed circuit board 4. The display 44 displays the display data supplied from the display processing circuit 414 on the display screen.

  FIG. 12 is a display screen of the display 44 showing the temperature of each working fluid at the high temperature fluid inlet, the high temperature fluid outlet, the low temperature fluid inlet, and the low temperature fluid outlet of the heat exchanger body 2 calculated at the same time. It is an example at the time of making it display on. Thus, each temperature can be visually confirmed through the display screen of the indicator 44 attached to the printed circuit board 4 of the microchannel heat exchanger 1.

  As described above, according to the present embodiment, the printed circuit board 4 on which the plurality of temperature sensors 45A, 45B, 45C, and 45D are mounted in advance is attached to the upper surface of the heat exchanger body 2, whereby the heat exchanger body A plurality of temperature sensors 45A, 45B, 45C, and 45D can be simultaneously installed in 2, and the temperature sensor can be easily attached. In addition, by mounting the integrated circuit 41 including a circuit for processing data measured by the temperature sensors 45A, 45B, 45C, and 45D on the printed circuit board 4, the temperature sensors 45A, 45B, 45C, and 45D and the integrated circuit 41 are connected to the printed circuit board. 4 can be easily connected by the wiring pattern formed on the wiring 4. Furthermore, since the display 44 for displaying the temperature data measured by the temperature sensors 45A, 45B, 45C, and 45D is also mounted on the printed circuit board 4, it is necessary to connect an external monitor for visually checking the temperature data. Disappear. Furthermore, the external connection connector 42 and the wireless module 43 are also mounted on the printed circuit board 4, so that temperature data can be transmitted to an external device as needed.

  In this embodiment, the temperature sensors 45A, 45B, 45C, and 45D are mounted on the printed circuit board 4 in advance. However, the present technology is not limited to this, and the temperature sensors 45A, 45B, 45C, and 45D are heat-exchanged. After being attached to the main body 2, the printed circuit board 4 may be attached to the heat exchanger main body 2 and the temperature sensors 45 </ b> A, 45 </ b> B, 45 </ b> C, 45 </ b> D may be mounted on the printed circuit board 4. Further, the technique of attaching the printed circuit board 4 to the heat exchanger body 2 as in the present technology is a micro flow channel heat exchanger in which the distance between the temperature sensors 45A, 45B, 45C, and 45D is short and the printed circuit board 4 can be miniaturized. This is advantageous for a small heat exchanger.

  In this embodiment, the printed circuit board 4 is fixed with a spacer 52 between the heat exchanger body 2 and a heat insulating sheet or an elastic cushion material instead of the spacer 52. Good. If not necessary, the printed circuit board 4 may be directly fixed to the heat exchanger body 2.

[Other Embodiments]
Next, a second embodiment will be described. In addition, since the microchannel heat exchanger of the present embodiment has the same configuration as the microchannel heat exchanger of the first embodiment, description of each configuration is omitted.

When hot water is generated by exchanging heat between water and refrigerant in the micro-channel heat exchanger during hot water supply operation, the outdoor heat exchanger is frosted. A reverse defrosting operation is performed to melt this frost. In the reverse defrosting operation, the refrigerant flow in the refrigeration cycle is opposite to that in the hot water supply operation.
Therefore, the refrigerant flowing into the micro-channel heat exchanger during the defrosting operation is low temperature. As a result, the water that has flowed into the micro-channel heat exchanger is cooled by the low-temperature refrigerant, becomes ice, and the water channel may be destroyed.

  Therefore, as shown in FIG. 13, in the micro-channel heat exchanger 1A of the present embodiment, a heater 81 connected to the printed circuit board 4 is provided in the vicinity of the water channel 25B in the same manner as the temperature sensor. Arranged in the hole 82. Since the temperature sensors 45C and 45D are provided in the water flow path (the groove 25B forming the flow path of the low-temperature fluid), the temperature (zero degree) at which the water in the flow path 25B becomes ice can be detected. Therefore, when the values of the temperature sensors 45C and 45D become zero degrees or less (the temperature at which water becomes ice), the water flowing in the flow path 25B can be warmed to prevent freezing by operating the heater 81. .

  In addition, the present technology is not limited to the above-described embodiment, and various changes can be made without departing from the scope of the present technology.

DESCRIPTION OF SYMBOLS 1 ... Microchannel heat exchanger 2 ... Heat exchanger main body 2A ... High temperature heat transfer plate 2B ... Low temperature heat transfer plate 3A ... High temperature side outer shell plate 3B ... Low temperature side outer shell plate 4 ... Printed circuit board 21 ... High temperature inlet header 22 ... high temperature outlet header 23 ... low temperature inlet header 24 ... low temperature outlet header 41 ... integrated circuit 42 ... external output connector 43 ... wireless module 44 ... indicator 45A ... first temperature sensor 45B ... second temperature sensor 45C ... third Temperature sensor 45D ... Fourth temperature sensor 46 ... Wiring pattern

Claims (1)

A flow path layer laminate formed by alternately laminating a plurality of high temperature flow path layers provided with high temperature fluid flow paths and a plurality of low temperature flow path layers provided with low temperature fluid flow paths; A heat exchanger body having an inlet and an outlet for fluid, an inlet and an outlet for the cold fluid, and an inlet of the hot channel of the heat exchanger body, and the hot fluid flows into the hot channel from the outside A high-temperature inlet pipe, a high-temperature outlet pipe connected to the outlet of the high-temperature flow path of the heat exchanger body and allowing the high-temperature fluid to flow out of the high-temperature flow path to the outside, and an inlet of the low-temperature flow path of the heat exchanger body A low-temperature inlet pipe that allows the low-temperature fluid to flow into the low-temperature flow path from the outside, and a low-temperature that is connected to the outlet of the low-temperature flow path of the heat exchanger body and causes the low-temperature fluid to flow out from the low-temperature flow path The stacking direction of the outlet pipe and the heat exchanger body Fixed, in the stacking direction of the heat exchanger body so as sensing points in contact with the fluid of at least one pipe of said high temperature the inlet pipe and the hot outlet pipe cold inlet pipe and the low-temperature outlet pipe is arranged A microchannel heat exchanger comprising: a control board on which at least a temperature sensor to be inserted is mounted.

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