JP6176433B2 - Vapor chamber - Google Patents

Description

  The present invention relates to a flat heat pipe called a vapor chamber, and in particular, a gas phase space is secured between a pair of surface layer members having a liquid phase space, and the gas phase space and the surface layer member are provided. The present invention relates to a vapor chamber that performs heat transport by circulating a refrigerant between the liquid phase space.

  An example of this type of vapor chamber is described in Patent Document 1. This vapor chamber is formed by laminating a plurality of flat plate-like members to form a refrigerant circulation passage. Specifically, a liquid phase space and a communication hole are provided by providing a gas phase space and a communication passage in a flat plate member called an intermediate plate, and forming a lattice-shaped recess on the inner surfaces of the pair of flat plate members. Are laminated with their inner surfaces facing the intermediate plate. Accordingly, the liquid phase space of the flat plate member communicates with the gas phase space through the communication hole, and the liquid phase space of the flat plate member communicates with each other through the communication passage.

  In the vapor chamber configured as described above, when a high-temperature object to be cooled is brought into contact with one flat plate member, the refrigerant that has become a gas phase in the liquid phase space of the flat plate member passes through the communication hole and the vapor phase space. And diffuses along the spatial direction of the gas phase space. When the diffused gas-phase refrigerant comes into contact with the flat plate member having a relatively low temperature, the heat is taken away and liquefies to reach the liquid phase space of the flat plate member. The refrigerant that has reached the liquid phase space of one flat plate member spreads in the surface direction by the capillary force, and again contacts the object to be cooled and evaporates. On the other hand, the refrigerant that has reached the liquid phase space of the other flat plate member spreads in the plane direction by the capillary force, and further passes through the communication path and returns to the liquid phase space of the flat plate member that is in contact with the object to be cooled. Become. By repeating these operations, the heat of the object to be cooled is carried to the surrounding low temperature portion, and the object to be cooled can be cooled.

  Patent Document 2 discloses a vapor having a structure in which a refrigerant reflux space is formed on each of the upper and lower surfaces of the heat transport unit, and a vapor diffusion space is formed between the refrigerant reflux spaces formed on the upper and lower surfaces. A chamber is described.

Japanese Patent No. 4112602 JP2011-145044

  Here, in the vapor chamber described in Patent Document 1, a refrigerant circulation passage can be configured by stacking a plurality of flat plate-like members, so that the manufacturing operation can be easily performed. However, the intermediate plate must be provided with a large number of openings to form a gas phase space and a communication passage, and the strength is remarkably reduced. For example, when an external force is applied to the vapor chamber, the surface is easily There is a risk of deformation in the outward direction. When the vapor chamber is deformed in the out-of-plane direction, the functions of the gas phase space and the communication passage may be impaired, leading to a decrease in heat transport efficiency. In particular, the communication passage is often formed finely in order to use the capillary force of the refrigerant, and is easily affected when the vapor chamber is deformed.

  In addition, the flow direction of the refrigerant in the liquid phase space is determined by the shape of the gas phase space. Therefore, in order to maintain optimum performance, an individual design is required depending on the position of the object to be cooled. become. For example, when the object to be cooled is at the center, it is necessary to form the liquid phase space so as to expand radially from the center. However, when the object to be cooled is moved to the end, the gas-phase refrigerant is not cooled. By simply moving to the center through the gas phase space closest to the body, the other gas phase spaces cannot contribute to the transport of the gas phase refrigerant generated by the object to be cooled. As a result, the heat transport amount of the vapor chamber decreases, and the entire space cannot be used effectively for heat transport.

  On the other hand, in the configuration described in Patent Document 2, an interference prevention plate having pores is disposed between the refrigerant reflux space and the vapor diffusion space, and the refrigerant condensed in the vapor diffusion space through the pores is disposed. It is only moved to the refrigerant recirculation space. Therefore, since the refrigerant is not directly exchanged in the liquid phase space between the two surface layer members, the refrigerant is depleted in the surface layer member in contact with the heating element, and the cooling function may be stopped.

In view of the above circumstances, the present invention provides a highly versatile vapor chamber that does not hinder the diffusion and movement of the gas-phase refrigerant and does not cause a difference in performance even if the object to be cooled is attached at an arbitrary position. For the purpose.
It is another object of the present invention to provide a vapor chamber that can prevent a situation where a refrigerant is exhausted in a surface layer member in contact with a heating element.
Furthermore, it is an object of the present invention to provide a vapor chamber capable of facilitating the manufacturing operation while suppressing a situation where the strength is lowered.

  In order to achieve the above object, a vapor chamber according to the present invention includes a pair of surface layer members arranged to face each other in a state where a refrigerant is sealed in a gas phase space secured between them, and each surface layer member The liquid phase space for flowing the liquid phase refrigerant along the plane direction is formed, and the gas phase space between the pair of surface layer members communicates with the liquid phase spaces of the respective surface layer members. A passage is provided for diffusing the gas phase refrigerant in the liquid phase space provided in one surface layer member through the gas phase space, and the liquid phase refrigerant in the liquid phase space provided in the other surface layer member is communicated with the communication passage. And a plurality of columnar members interposed between the pair of surface layer members, and a plurality of communication passages are provided inside each columnar member. To each surface layer member Forming a communication hole communicating between said liquid phase space and the vapor space, the communication passage is characterized by being located in a position that communicates with the communication hole.

  In this case, it is preferable that each communication passage is disposed at a position overlapping the communication hole in the stacking direction of the pair of surface layer members.

  Each surface layer member includes an outer layer plate having a flat plate shape, and an inner layer plate having a flat plate shape and having a through-hole formed therein, and one surface of the outer layer plate or one of the inner layer plates. A plurality of convex portions are formed on the surface, and the outer layer plate and the inner layer are laminated by laminating the outer layer plate and the inner layer plate with one surface of the inner layer plate facing one surface of the outer layer plate. The top of the convex portion formed on one of the plates is landed on the other of the outer layer plate and the inner layer plate to form the liquid phase space around it, and the through hole is used as the communication hole It may be configured to function. In this case, the plurality of convex portions may be formed in the inner layer plate, and the through hole may be formed adjacent to each convex portion in the inner layer plate.

  Furthermore, it is good also as what formed the connection part which connects between each other between the surrounding surfaces of an adjacent columnar member, and the said connection part formed the dimension along the axial direction small with respect to the said columnar member.

  Furthermore, the communication passage formed in the columnar member may have a cross-sectional shape in which a plurality of small-diameter holes or polygons are combined.

  According to the present invention, since the surface layer member is formed with a communication hole that communicates between the liquid phase space and the gas phase space, the gas phase space penetrates and is released over the entire vapor chamber. The diffusion and movement of the gas-phase refrigerant is not hindered, and it is possible to prevent a difference in performance depending on the attachment position of the cooled object. In addition, since each communication passage of each columnar member is arranged at a position communicating with the communication hole of the surface layer member, the liquid phase refrigerant can be efficiently and smoothly moved between the liquid phase spaces. It is possible to prevent the refrigerant from being exhausted in the surface layer member in contact with the heating element. Furthermore, by interposing a columnar member between a pair of surface layer members having a liquid phase space, a gas phase space can be reliably ensured between the surface layer members, and the liquid phase space of the surface layer member can be secured. Thus, a communication path for connecting the gas phase refrigerant and the liquid phase refrigerant can be formed, and a refrigerant loop circuit for separating the flow of the gas phase refrigerant and the liquid phase refrigerant can be formed, and a reduction in the amount of heat transport can be prevented. In addition, since the columnar member is arranged over the entire gas phase space, it is advantageous in terms of strength, and it is possible to suppress a decrease in performance even when bending is performed, and a plurality of communication passages are provided in the columnar member. Therefore, the communication passage and the liquid phase space can be reliably communicated without positioning with high accuracy, and the manufacturing operation can be facilitated.

FIG. 1 is an exploded perspective view of a vapor chamber according to an embodiment of the present invention. FIG. 2 is a cross-sectional perspective view showing a main part of the vapor chamber shown in FIG. FIG. 3 is a longitudinal sectional view of the vapor chamber shown in FIG. FIG. 4 is an enlarged view showing a convex portion and its peripheral portion of the inner layer plate shown in FIG. FIG. 5 is an enlarged plan view showing the columnar member of the vapor chamber shown in FIG. 1 and one inner layer plate and one outer layer plate. 6 is an enlarged view of a communication passage provided in a columnar member applied to the vapor chamber shown in FIG. FIG. 7 is a diagram showing a refrigerant circulation path in the vapor chamber shown in FIG. 1. 8A and 8B show a modification of the columnar member. FIG. 8A is an enlarged end view of the first modification, and FIG. 8B is an enlarged end view of the second modification. FIG. 9 is an enlarged view of a communication passage according to a modification.

  Hereinafter, preferred embodiments of a vapor chamber according to the present invention will be described in detail with reference to the accompanying drawings.

  1 to 3 show a vapor chamber 1 according to an embodiment of the present invention. The vapor chamber 1 illustrated here includes a pair of surface layer members 10 each composed of an outer layer plate 110 and an inner layer plate 120, and a plurality of columnar members 20 interposed between the surface layer members 10. It is.

  The pair of surface layer members 10 are configured by laminating an outer layer plate 110 and an inner layer plate 120, respectively.

  The outer layer plate 110 is a flat plate-shaped metal thin plate member, and at least a surface (inner surface) on the inner layer plate 120 side is formed flat. In the present embodiment, the outer layer plate is formed as a flat surface on both sides. A plate 110 is used. That is, the outer layer plate 110 is a flat plate having no irregularities on both sides. In the present embodiment, a metal plate (metal flat plate) made of copper and having a thickness of 0.2 mm is applied as the outer layer plate 110.

  Similar to the outer layer plate 110, the inner layer plate 120 is a thin plate-like member that is a metal flat plate. The inner layer plate 120 has a flat surface (inner surface) on the columnar member 20 side, and a plurality of convex portions 122 are provided on the outer layer plate 110 side (outer surface) (see also FIG. 4). Each convex part 122 is a quadrangular prism shape having a rectangular shape in plan view, and is formed at equal intervals in the front-rear and left-right directions on one surface of the inner layer plate 120 to form a mesh shape. In the inner layer plate 120, a communication hole 124, which is a through-hole penetrating the inner layer plate 120 in the plate thickness direction, is formed in a portion surrounded by predetermined four convex portions 122 adjacent to each other. By being surrounded by four convex portions 122 arranged at equal intervals, the communication hole 124 is formed in a cross shape in plan view. In the present embodiment, a copper metal plate having a thickness of 0.2 mm is applied as the inner layer plate 120, and a convex portion 122 having a height of, for example, 0.1 mm is projected on one surface thereof. The convex part 122 is good also as a column shape.

  These outer layer plate 110 and inner layer plate 120 are such that the surface (outer surface) of the inner layer plate 120 on which the convex portion 122 is formed is opposed to the flat surface (inner surface) of the outer layer plate 110, and the top portion (top) of the convex portion 122. The surface layer member 10 is configured by landing and bonding the surface) to the flat surface of the outer layer plate 110. Further, a pair of surface layer members 10 are arranged opposite to each other in a state where the flat surfaces (inner surfaces) on the back side of the convex portion 122 side of the inner layer plate 120 face each other and the gas phase space A is secured between them. 1 outline is constructed. On the other hand, a space (liquid phase space B) corresponding to the height of the convex portion 122 is provided between the surface on the convex portion 122 side of the laminated inner layer plate 120 and the one surface of the outer layer plate 110. The The gas phase space A and the liquid phase space B are separated from each other by the inner layer plate 120 and communicate with each other through the communication hole 124. As shown in FIG. 3, the outer layer plate 110, the inner layer plate 120, and the gas phase space A of the surface layer member 10 are sealed as a frame F by joining the outer peripheral edge portions of the respective layers as they are. The phase space A and the liquid phase space B are sealed from the outside, and a coolant such as water can be sealed therein.

  As shown in FIGS. 1 to 5, the columnar member 20 has a metal columnar shape and includes a plurality of communication passages 21. Each of the communication passages 21 is a through-hole that extends along the axis of the columnar member 20 and opens at both end surfaces of the columnar member 20. In the present embodiment, four communication paths 21 are provided in a lattice shape at equal intervals. . As shown in FIG. 6 in an enlarged manner, each communication passage 21 is formed in an irregular cross-sectional shape in which five small-diameter circular holes (small-diameter holes) 21a are coupled. The communication passage 21 having this irregular cross-sectional shape can set the space width smaller and obtain a larger capillary force when compared with a communication passage having the same cross-sectional area that is simply formed in a circular shape. It becomes possible. In the present embodiment, a shape in which the five small-diameter circular holes 21a are coupled as the communication passage 21 is illustrated. However, the communication passage may of course have a shape other than the circular shape, for example, a small triangular hole 21a ′. It is good also as the connection channel | path 23 etc. which have the cross-sectional shape of the shape which couple | bonded three (refer FIG. 9), and of course it is good also as what combined polygon holes other than a triangular hole.

  A connecting portion 22 is provided between the columnar members 20. The connecting portion 22 connects the peripheral surfaces of the adjacent columnar members 20, and is integrally formed at a position that is flush or substantially flush with one end surface (upper end surface in FIG. 1) of the columnar member 20. It is. The connecting portion 22 is formed to have a small dimension along the axial direction with respect to the columnar member 20, and does not divide the gas phase space A. Further, the connecting portion 22 extends from the columnar member 20 along one direction, and is provided at a position passing between adjacent communication holes 124, and does not block the communication holes 124. One of the connecting portions 22 projecting left and right from one columnar member 20 is provided at a position flush with the other end surface (the lower other surface in FIG. 1), and the planar position of each connecting portion 22 of each columnar member 20 is You may comprise so that it may become alternate. In the present embodiment, columnar members 20 having an outer diameter of 3 mm are applied and arranged at equal intervals in the front-rear and left-right directions. The dimension along the axial direction of the columnar member 20 is 0.4 mm, and the dimension in the same direction of the connecting portion 22 is 0.1 mm.

  As shown in FIG. 5, in the vapor chamber 1, each columnar member 20 has a position where each communication passage 21 coincides with the communication hole 124 of the surface layer member 10, specifically, the axial centers of both are coaxial. Has been placed. Thereby, the liquid phase spaces B of the pair of surface layer members 10 are communicated in a straight line via the communication holes 124 and the communication passages 21, and the liquid in each liquid phase space B can be circulated. The communication passage 21 does not necessarily need to be concentrically aligned with the communication hole 124, and can be constructed as a single flow path as long as at least a part of the communication passages 21 are in communication with each other even if they are slightly shifted from each other. That is, the columnar member 20 may be arranged so that at least a part of the communication passage 21 and the communication hole 124 overlap in the stacking direction (vertical direction) of the pair of surface layer members 10. In the present embodiment, the pitch of the communication passages 21 is set to be the same as the pitch of the communication holes 124 in order to make the communication passages 21 and the communication holes 124 concentric with each other.

  When the vapor chamber 1 is configured by applying the pair of surface layer members 10 and the columnar members 20, the surface layer member 10 is previously formed by the outer layer plate 110 and the inner layer plate 120, and then the columnar member 20 is interposed between them. Alternatively, the outer layer plate 110, the inner layer plate 120, the columnar member 20, the inner layer plate 120, and the outer layer plate 110 may be sequentially stacked, and from this state, for example, diffusion bonding may be used to temporarily bond each other. May be. At this time, since the plurality of communication passages 21 are provided in the columnar member 20, the communication passage 21 and the communication hole 124 (liquid phase space B) can be reliably communicated without positioning with high accuracy. It becomes possible to facilitate manufacturing work. Of course, the communication passage 21 and the communication hole 124 may be positioned using a positioning means (not shown) such as a positioning pin.

  In the vapor chamber 1 configured as described above, when there is no temperature difference in the surface layer member 10, the liquid phase between the outer layer plate 110 and the inner layer plate 120 stacked via the convex portion 122 of the surface layer member 10. The liquid phase state refrigerant exists in the space B in a state of being spread over the entire surface by the capillary force formed by the convex portions 122, and also in the communication passage 21 of the columnar member 20 that communicates between the pair of liquid phase spaces B. Liquid phase refrigerant is present. In the gas phase space A secured between the surface layer members 10 by the columnar members 20, the gas phase refrigerant exists in a state of spreading over the whole.

  From this state, for example, as shown in FIG. 7, when the heating element H is brought into contact with the outer surface of the lower surface layer member 10, the refrigerant present in the liquid phase space B near this evaporates, and the communication hole 124 is opened. Then, it diffuses in the gas phase space A along the surface direction sequentially (arrow X in FIG. 7). At this time, according to the vapor chamber 1 according to the present embodiment, the connecting portion 22 that connects the columnar members 20 provided in the gas phase space A is reduced in size along the axial direction with respect to the columnar members 20. Since the formed portion is applied and the connecting portion 22 is provided at a position that does not block the communication hole 124, diffusion of the gas-phase refrigerant is hindered, or the diffusion direction of the gas-phase refrigerant is biased in one direction. Such a situation is not invited. Therefore, even if a to-be-cooled body is attached to arbitrary positions, heat can be favorably transported without causing a difference in heat transport performance.

  When the gas-phase refrigerant that has reached the position separated from the heating element H comes into contact with the surface layer member 10 having a low temperature, the vapor phase refrigerant is deprived of heat and condensed to return to the liquid phase space B of the surface layer member 10 ( Arrow Y in FIG. Since the liquid-phase refrigerant that has returned to the liquid-phase space B spreads over the entire surface due to the capillary force, it returns to the heat-generating range of the heating element H (arrow Z in FIG. 7) and evaporates there. The liquid refrigerant returned to the liquid phase space B of the upper surface layer member 10 that is not in contact with the heating element H penetrates downward due to the capillary force of the communication passage 21 when spreading over the entire surface by the capillary force. Then, it returns to the liquid phase space B of the lower surface layer member 10 in contact with the heating element H through the communication passage 21 (arrow V in FIG. 7). At this time, since the communication passage 21 of the columnar member 20 has an irregular cross-sectional shape, the liquid phase refrigerant is efficiently used in the liquid phase space B of the surface layer member 10 by a larger capillary force. It can be moved well. Thereafter, by repeating the above operation, the heat of the heating element H is carried to the low temperature part by the refrigerant, and the heating element H can be efficiently cooled.

  As described above, according to the vapor chamber 1 according to the present embodiment, the vapor chamber 1 includes a pair of surface layer members 10 disposed so as to face each other in a state in which the refrigerant is sealed in the gas phase space A secured between them. Each surface layer member 10 is formed with a liquid phase space B through which the liquid phase refrigerant flows along the surface direction, and each gas phase space A between the pair of surface layer members 10 includes each surface layer member. The communication passage 21 that connects the ten liquid phase spaces B to each other is provided, the vapor phase refrigerant in the liquid phase space B provided in one surface layer member 10 is diffused through the gas phase space A, and the other surface layer member In the configuration in which the liquid phase refrigerant in the liquid phase space B provided in 10 is moved from the communication passage 21 to the liquid phase space B of one surface layer member 10, a plurality of columnar members are interposed between the pair of surface layer members 10. 20 is interposed and connected to the inside of each columnar member 20. A plurality of passages 21 are provided, and each surface layer member 10 is formed with a communication hole 124 that communicates between the liquid phase space B and the gas phase space A, and each communication passage 21 is a position that communicates with the communication hole 124. Placed in.

  As described above, in the vapor chamber 1, each surface layer member 10 is formed with a communication hole 124 that communicates between the liquid phase space B and the gas phase space A, and the gas phase space A penetrates the entire vapor chamber 1. Therefore, the diffusion and movement of the gas-phase refrigerant is not hindered, and it is possible to prevent a difference in performance depending on the mounting position of the cooled object. In addition, since each communication passage 21 of each columnar member 20 is disposed at a position communicating with the communication hole 124 of the surface layer member 10, the movement of the liquid phase refrigerant between the liquid phase spaces B is efficiently performed. In addition, it is possible to prevent the refrigerant from being exhausted in the surface layer member 10 in contact with the heating element H. Furthermore, by interposing the columnar member 20 between the pair of surface layer members 10 having the liquid phase space B, the gas phase space A can be reliably ensured between the surface layer members 10 and the surface layer. The communication passage 21 that connects the liquid phase space B of the member 10 can be formed, and a refrigerant loop circuit that separates the flow of the gas phase refrigerant and the liquid phase refrigerant can be formed, thereby preventing a reduction in heat transport amount. it can. In addition, since the columnar member 20 is arranged over the entire gas phase space A, it is advantageous in terms of strength, and it is possible to suppress a decrease in performance even if bending is performed, and a plurality of communication passages 21 are connected to the columnar member 20. Therefore, the communication passage 21 and the liquid phase space B can be reliably communicated with each other without positioning with high accuracy, and the manufacturing operation can be facilitated.

  Further, according to the vapor chamber 1 of the present embodiment, a flat plate-like outer layer plate 110 and a flat plate shape are formed, and a plurality of convex portions 122 are formed on one surface and adjacent to each convex portion 122. The inner layer plate 120 having the through holes 124 that are through-holes is opened, and the outer layer plate 110 and the inner layer plate 120 are laminated with one surface of the inner layer plate 120 facing one surface of the outer layer plate 110. As a result, the top portion of the convex portion 122 is landed on the flat surface of the outer layer plate 110 to form the liquid phase space B around the top surface. Thereby, even if the outer layer plate 110 which is one plate constituting the surface layer member 10 is formed by a flat plate member having both sides flat, the liquid phase space B having a high transport capacity of the liquid phase refrigerant can be configured. With a simple configuration, high heat transport capacity can be ensured, and costs can be reduced.

  It should be noted that the present invention is not limited to the above-described embodiments, and can be freely changed without departing from the gist of the present invention.

  For example, one surface (inner surface) of the outer layer plate 110 is not necessarily formed flat, and a groove portion 112 having a V-shaped section or a U-shaped section as indicated by a broken line in FIG. Specifically, it may be formed in a portion where the columnar member 20 is not provided so as to extend in the front-rear and left-right directions, and the groove portion 112 may be configured to adjust / promote the flow of the refrigerant liquid.

  Moreover, although the structure which provided the convex part 122 in the inner layer board 120 was illustrated in embodiment mentioned above, for example, the convex part 122 and one surface (inner surface) arrange | positioned facing the inner layer board 120 of the outer layer board 110 are provided. Convex portions (not shown) having the same shape or the like are provided, and the inner layer plate 120 is penetrated through a communication hole (not shown) having the same shape as the communication hole 124 at a position adjacent to the convex portion of the outer layer plate 110. It is good also as a structure which makes the formed structure and makes the said convex part of the outer-layer board 110 land on the flat surface of the inner-layer board 120, and forms the liquid phase space B in the circumference | surroundings. In other words, the outer layer plate 110 has a flat plate shape and a plurality of convex portions (for example, the same shape as the convex portion 122) formed on one surface, and the outer layer plate 110 has a flat plate shape. An inner layer plate 120 having a through hole 124 that is a through-hole is provided at a position adjacent to the convex portion, and one surface of the inner layer plate 120 is opposed to one surface of the outer layer plate 110, and the outer layer plate 110 and the inner layer plate By stacking 120, the top of the convex portion may be landed on the flat surface of the inner layer plate 120, and the liquid phase space B may be formed around it. In the case of this configuration, the groove 112 is preferably formed on the inner layer plate 120 side.

  In the embodiment described above, the communication passage 21 has been illustrated as opening only inside the columnar member 20, but for example, as shown in the first modified example of FIG. The communication passage 21 may be configured to include only the communication passage 21 that opens to the outer periphery of the columnar member 20 ′. According to the vapor chamber 1 to which the first modification is applied, the cross-sectional area of the communication passages 21, 21 ′, that is, the passage region of the liquid-phase refrigerant can be ensured without reducing the volume of the gas phase space A. As a result, the cooling efficiency can be improved.

  In the above-described embodiment, the columnar member 20 has a circular cross section, but it is not necessarily circular, and the cross section is polygonal, for example, as shown in FIG. A hexagonal columnar member 20 ″ may be applied. In this case as well, as in the first modified example, the communication passage 21 in which the columnar member 20 ″ opens only inside, and the communication passage 21 opens in the outer peripheral surface. ”, The cooling efficiency can be improved.

DESCRIPTION OF SYMBOLS 1 Vapor chamber 10 Surface layer member 20,20 ', 20 "Columnar member 21,21', 21" Communication path 22 Connection part 110 Outer layer board 120 Inner layer board 122 Convex part 124 Communication hole A Gas phase space B Liquid phase space

Claims (6)

A pair of surface layer members disposed opposite each other in a state in which a refrigerant is sealed in a gas phase space secured between each other;
In each surface layer member, a liquid phase space through which the liquid refrigerant flows in the plane direction is formed, and in the gas phase space between the pair of surface layer members, the liquid phase space of each surface layer member is formed. A communication passage to communicate with each other,
The vapor phase refrigerant in the liquid phase space provided in one surface layer member is diffused through the gas phase space, and the liquid phase refrigerant in the liquid phase space provided in the other surface layer member is transferred from the communication passage to the one surface. In the vapor chamber adapted to move to the liquid phase space of the layer member,
A plurality of columnar members extending so as to contact both of the pair of surface layer members are interposed between the pair of surface layer members, and extend along the axis of the columnar member inside each columnar member. In addition, a plurality of communication passages that are through-holes opened on both end faces of the columnar member on the pair of surface layer members are provided, and each surface layer member communicates between the liquid phase space and the gas phase space. A communication hole is formed,
Each communication passage is disposed at a position communicating with the communication hole ,
Each surface layer member
A flat outer plate,
An inner layer plate that is located between the outer layer plate and the columnar member, has a flat plate shape, and has a through-hole that is opened in the plate thickness direction; and
With
Vapor chamber, characterized in Rukoto to function the through hole formed in the inner plate as the communication hole. The vapor chamber of claim 1.
A vapor chamber, wherein each communication passage is disposed at a position overlapping the communication hole in the stacking direction of the pair of surface layer members. The vapor chamber according to claim 1 or 2,
On one surface or one surface of the inner layer plate before Kigaiso plate, a plurality of convex portions are formed,
A convex portion formed on one of the outer layer plate and the inner layer plate by laminating the outer layer plate and the inner layer plate with one surface of the inner layer plate facing one surface of the outer layer plate. the top, the outer plate and vapor chamber, wherein the benzalkonium to form the liquid phase space around by landing to the other of the inner plate. The vapor chamber of claim 3.
The plurality of convex portions are formed in the inner layer plate, and the inner layer plate has the through hole formed adjacent to each convex portion. The vapor chamber according to any one of claims 1 to 4,
Between the peripheral surfaces of the adjacent columnar members, a connecting portion that connects each other is provided,
The vapor chamber is characterized in that the connecting portion is formed with a smaller dimension along the axial direction than the columnar member. In base Pachanba according to any one of claims 1 to 5,
The vapor passage characterized in that the communication passage formed in the columnar member has a cross-sectional shape in which a plurality of small diameter holes or polygons are combined.

Images