KR102226988B1 - Copper alloy plate for heat dissipation parts, heat dissipation parts, and manufacturing method of heat dissipation parts - Google Patents

Abstract

Phosphorus containing one or two or more of Fe, Ni, Co is precipitated, has 0.2% proof strength of 100 MPa or more and excellent bending workability, 0.2% proof strength measured at 850°C is 10 MPa or more, and 30 minutes at 850°C After heating and water cooling, followed by aging treatment at 500℃ for 2 hours, 0.2% proof strength is 100 MPa or more, conductivity is 50% IACS or more, and a process of heating to 650℃ or more in part of the process of manufacturing heat dissipation parts and aging It is a copper alloy plate for heat dissipation parts characterized in that the treatment is included.

Description

Copper alloy plate for heat dissipation parts, heat dissipation parts, and manufacturing method of heat dissipation parts

The present disclosure relates to a copper alloy plate for heat dissipation parts used in the case of manufacturing a heat dissipation part such as a vapor chamber (flat plate heat pipe) by bonding a plurality of parts. In particular, it relates to a copper alloy plate for heat dissipation parts used when a process of heating at a temperature of 650°C or higher, such as diffusion bonding or brazing, is included.

High-speed and high-integration density of CPUs mounted on desk-type PCs, notebook PCs, tablet terminals, and mobile phones such as smartphones are rapidly advancing, and the amount of heat generated per unit area from these CPUs is further increasing. If the temperature of the CPU rises to a certain temperature or higher, it may cause malfunction, thermal runaway, or the like, and thus effective heat dissipation from a semiconductor device such as a CPU is an urgent problem.

A heat sink is used as a heat dissipation component that absorbs heat from a semiconductor device and dissipates it into the atmosphere. Since high thermal conductivity is required for the heat sink, copper, aluminum or the like having a high thermal conductivity is used as a material. In a desk-type PC, a method of transferring heat from the CPU to a heat dissipation fin or the like installed in a heat sink and removing heat with a small fan installed in the desk-type PC housing is used.

However, in notebook PCs and tablet terminals that do not have a space for installing a fan, a vapor chamber (flat heat pipe) has been used as a heat dissipation component having a higher heat transport capability in a limited area. The heat pipe exhibits high heat dissipation characteristics compared to a heat sink by cyclically evaporating the refrigerant enclosed therein (heat absorption from the CPU) and condensation (discharging the absorbed heat). Further, it has been proposed to solve the heat generation problem of a semiconductor device by combining a heat pipe with a heat dissipating component such as a heat sink or a fan.

The vapor chamber further improved the heat dissipation performance of the tubular heat pipe (refer to Patent Documents 1 to 4). As a vapor chamber, in order to efficiently perform condensation and evaporation of the refrigerant, similar to a tubular heat pipe, there have been proposed those in which fine pores are formed on the inner surface by roughening, grooving, and powder sintering.

Moreover, as a vapor chamber, it is proposed that it consists of an outer member (housing) and an inner member accommodated and fixed to the inside of the outer member. In order to promote condensation, evaporation, and transport of the refrigerant, the inner member is disposed one or more inside the outer member, and various shapes of pins, projections, holes, slits, etc. are processed. The vapor chamber of this type is manufactured by disposing the inner member inside the outer member, and then bonding and unifying the outer members and the outer member and the inner member by a method such as diffusion bonding or brazing. The vapor chamber is sealed by a method such as brazing after refrigerant is put therein.

When the heat of the electronic component becomes larger and exceeds the ability to remove heat from the vapor chamber, a heat dissipation component of the type that has the same internal structure as the vapor chamber and continuously supplies the refrigerant from the outside is used (it is necessary to make the inside low pressure. There is no). The member used for the housing of this type of heat dissipation component, and the manufacturing method of the housing are the same as in the vapor chamber (refer to Patent Document 5).

The material of the vapor chamber is made of oxygen-free copper (OFC) excellent in thermal conductivity, corrosion resistance, workability and etching properties, for example, a sheet material of a soft material (O by material) to a hard material (H by material) having a thickness of about 0.3 to 1.0 mm. (Including 條) is widely used. An example of the manufacturing process of the vapor chamber using the OFC plate will be described as follows.

First, on one surface of a rectangular plate member cut out from an OFC plate material, patterns such as a plurality of grooves and irregularities are formed by etching or pressing using a mold. Next, with the surface on which the pattern is formed as an inner side, two plate members are stacked up and down, and diffusion bonding is performed in that state (see Fig. 1B). Diffusion bonding is carried out in a ^{vacuum atmosphere higher than 10 -2} atm, in a state where a stress (pressing force) of about 2 to 6 MPa is applied to the bonding site, the temperature is raised to a high temperature of 800 to 900°C, and after reaching a predetermined temperature, it is about 10 to 120 minutes , It is carried out by holding it at the same temperature. On the other hand, a nozzle (a fine diameter tube) is sandwiched between the upper and lower plate members, and this nozzle is also joined.

After diffusion bonding, a working fluid (water, etc.) is put into the vapor chamber through the nozzle in a vacuum or reduced pressure atmosphere, and then the nozzle is sealed.

In the case of manufacturing the vapor chamber by brazing, a thin plate or foil such as silver copper lead or insulin lead in the shape of a junction is sandwiched between the plate members superimposed on the upper and lower sides, and in that state, it is continuously inserted into the heating furnace and heated. Brazing joints. The atmosphere of the brazing is ^{a vacuum atmosphere of about 10 -1} atmosphere, a reducing atmosphere, or an inert gas atmosphere, and the heating temperature is 650 to 900°C. In addition, in the brazing heating step, heating and brazing are performed in a state where a stress (pressing force) of about 2 to 5 MPa is applied to the bonded portion so as not to cause deviation in the bonded portion due to vibration or the like.

Japanese Patent Laid-Open No. 2004-238672 Japanese Patent Laid-Open No. 2007-315745 Japanese Patent Publication No. 2014-134347 Japanese Patent Laid-Open No. 2015-121355 International Publication No. 2014/171276

The pressing force in diffusion bonding or brazing generally does not exceed 0.2% proof strength of the material at the holding temperature of diffusion bonding or brazing (tensile strength when permanent elongation reaches 0.2% in a tensile test). A value as large as possible is selected for. As the pressing force increases, the holding time at the holding temperature can be shortened, and the reliability of the joined portion (no leakage, no unjoined locations, etc.) can be improved. On the other hand, in the case of diffusion bonding or brazing, when a pressing force exceeding 0.2% proof strength is applied, the reliability of the bonding portion can be further improved and the holding time can be further shortened, but plastic deformation occurs in the pressing portion, resulting in the desired shape. (Design shape) cannot be maintained.

In the diffusion bonding or brazing of the vapor chamber, even when the material is an OFC plate, the pressing force is determined within a range not exceeding 0.2% proof strength of the OFC plate at the holding temperature, and 0.2% proof strength is set to σ _0.2 , The pressing force is usually considered to be in the range of (0.5 to 0.8) x σ _0.2.

After holding at 700 to 900°C for 30 minutes, the 0.2% proof strength of the OFC plate measured at that temperature was as small as 8 MPa at 700°C, 6 MPa at 800°C, and 5 MPa at 900°C.

One side of the OFC plate having a plate thickness of 0.45 mm and a planar shape of 60 mm×60 mm was etched to a certain depth leaving the surrounding edge portion to produce a plate member 1 (see Fig. 1A) that mimics the housing of the vapor chamber. . In this plate member 1, the width of the edge portion 2 is 7 mm, and the thickness of the etched thin portion 3 is 0.2 mm. Subsequently, as shown in FIG. 1B, the two plate members 1 and 1 were overlapped with the etched surface inward, heated to 850° C., and a pressing force of 3 MPa (0.2% proof strength 50% The above) was applied and held for 30 minutes, and diffusion bonding was performed.

In the plate members 1 and 1 after diffusion bonding, slight depressions and swelling were observed in the vicinity of the central portion of the thin portion 3. The cause of such deformation is that in diffusion bonding, the plate member 1 is heated to a high temperature exceeding the recrystallization temperature, so that both the Young's modulus and the proof stress (yield stress) of the material are significantly reduced. It is presumed that this is because creep deformation occurred in the copper thin-walled portion 3 due to gravity acting in the vicinity of the central portion of ). In addition, it is thought that the edge portion 2 is deformed in the transverse direction due to the pressing force during diffusion bonding, thereby generating inward stress in the inner side of the edge portion 2 (the upper and lower thin portions 3). Stress is also presumed to be one of the causes of the deformation (depression and swelling).

In the vapor chamber in which such deformation has occurred, the shape and volume of the internal space of the chamber changes, and the flow method (flow path) and flow rate of the evaporated and condensed refrigerant change, so that the desired thermal performance cannot be exhibited. In addition, there is a gap between the vapor chamber and the heating unit (CPU, etc.), resulting in deterioration in heat transfer performance.

Moreover, secondary recrystallization occurs in the OFC plate by heating at a temperature of 600°C or higher, and crystal grains become coarse. For example, when heated to 800° C., even if the heating time is short, the average crystal grain size becomes coarse to about 100 μm to several 100 μm. At the grain boundaries of the coarse grains, the density of gases, impurity elements, and inclusions increases, so that the grain boundaries become brittle compared to the inside of the grains.

In a vapor chamber manufactured using an OFC plate having a thickness of 0.3 to 0.5 mm, the thickness of the etched or pressed portion is reduced to about 0.1 to 0.3 mm. When the average grain size is coarse to about 100 μm to several 100 μm, only about 1 to 3 crystal grains exist in such a thin portion in the rearward direction. In the vapor chamber, since the refrigerant repeats evaporation and condensation during use, the tensile and compressive stresses repeatedly act on the thin portion due to the pressure change at that time. When the average grain size is coarse, cracks propagating grain boundaries are liable to occur, and cracks penetrating the thin portion may occur. In that case, the refrigerant inside the chamber leaks through the grain boundary, and cannot be used as a vapor chamber. In addition, when the average crystal grain size becomes coarse, the surface roughness of the copper alloy plate (vaper chamber) increases, the gap with the heat generating portion (CPU, etc.) increases, and the heat transfer performance from the heat generating portion to the vapor chamber decreases.

The above-described problems of diffusion bonding (deformation of a thin portion, coarsening of crystal grains, etc.) also occur in the case of manufacturing a vapor chamber by brazing.

When a material with high strength at high temperature is used as the material of the vapor chamber, the holding time is shortened by increasing the pressing force at the time of diffusion bonding or brazing, improving the reliability of the joint, and furthermore, when using diffusion bonding or brazing. It is thought that deformation of the plate member 1 can be prevented. In addition, when a material that suppresses coarsening of crystal grains at high temperatures is used, a large number of crystal grains are present in the rearward direction in the thin portion of the plate member 1, so that leakage of the refrigerant in the vapor chamber can be prevented, and heat transfer performance It is thought that it can prevent the deterioration of. In addition, when such a material is used, it is considered that the same effect can be obtained also in other heat dissipating parts in which a process of heating at a high temperature is included in a part of the manufacturing process.

Accordingly, an embodiment of the present invention has a main object to provide a material (copper alloy plate) having a high strength (0.2% proof strength) at high temperature as a material for a heat dissipating component such as a vapor chamber. Another object of the embodiment of the present invention is to provide a material (copper alloy plate) in which coarsening of crystal grains at high temperatures is suppressed as a material for a heat dissipating component such as a vapor chamber.

The copper alloy plate for a heat dissipation component according to an embodiment of the present invention is used when a process of heating to 650° C. or higher and an aging treatment are included as part of a process of manufacturing a heat dissipation component, and 1 of Fe, Ni, and Co Phosphorus containing species or two or more is precipitated, has 0.2% proof strength of 100 MPa or more and excellent bending workability, 0.2% proof strength measured at 850° C. is 10 MPa or more, and water-cooled after heating at 850° C. for 30 minutes, and then It is characterized by having a 0.2% proof strength of 100 MPa or more and a conductivity of 50% IACS or more after aging treatment at 500° C. for 2 hours. It is preferable that the average crystal grain size of this copper alloy plate after heating at 850 degreeC for 30 minutes is 100 micrometers or less. On the other hand, the plate in the embodiment of the present invention includes a nail.

This copper alloy plate contains, for example, one or two or more of Fe, Co, and Ni and P: 0.01 to 0.2% by mass, and the total content of Fe, Co, and Ni [Fe+Co+Ni] is It is 0.2 to 2.3 mass%, and the balance consists of Cu and unavoidable impurities. This copper alloy further contains 0.01 to 0.3 mass% in total of one or two or more of Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, and Mn as necessary.

In addition, in the copper alloy plate for heat dissipation parts according to an embodiment of the present invention, silicides containing one or two types of Ni and Co are precipitated, and have 0.2% proof strength and excellent bending workability of 200 MPa or more, and at 850° C. It is characterized in that the measured 0.2% proof strength is 10 MPa or more, and the 0.2% proof strength after heating at 850° C. for 30 minutes and then water cooling, followed by aging treatment at 500° C. for 2 hours is 300 MPa or more, and the conductivity is 50% IACS or more. It is preferable that the average crystal grain size of this copper alloy plate after heating at 850 degreeC for 30 minutes is 100 micrometers or less.

This copper alloy plate contains, for example, one or two types of Ni and Co, and Si, the total content of Ni and Co [Ni+Co] is 1.6 to 3.5% by mass, and the total content of Ni and Co The ratio [Ni+Co]/[Si] of [Ni+Co] and the Si content [Si] is 3.5 to 5.5, and the balance consists of Cu and unavoidable impurities. This copper alloy further contains 0.01 to 0.3 mass% in total of one or two or more of Mg, Al, Cr, Ti, Zr, Zn, Sn, and Mn as necessary.

The copper alloy plate for a heat dissipation component according to an embodiment of the present invention is made of a precipitation hardening type copper alloy containing a phosphide or a silicide, and has higher strength at a high temperature than that of a conventional OFC. Therefore, by increasing the pressing force during diffusion bonding, it is possible to shorten the holding time, improve the reliability of the bonding portion, and prevent deformation of the plate member (e.g., the housing part of the vapor chamber) during diffusion bonding. I can.

In addition, when coarsening of crystal grains at a high temperature is suppressed, a large number of crystal grains are present in the rearward direction also in the thin portion of the plate member (for example, the housing of the vapor chamber), so that leakage of the refrigerant from the inside can be prevented. .

In addition, since the copper alloy plate for heat dissipation parts according to an embodiment of the present invention is of an age hardening type, strength and conductivity are improved by aging treatment after high temperature heating. Therefore, by performing an aging treatment after a process of heating to 650°C or higher (diffusion bonding, brazing, laser welding, etc.), it is possible to obtain a heat dissipating component having high strength and excellent heat dissipation performance.

1A is a perspective view of a patterned plate member for explaining diffusion bonding of a vapor chamber.
1B is a cross-sectional view illustrating diffusion bonding of a vapor chamber, in which two plate members (a housing part of a vapor chamber) are superimposed for bonding.
Fig. 2 is a diagram showing the shape and dimensions of a test piece used in a tensile test performed at 850°C.

Hereinafter, a copper alloy plate for heat dissipation components according to an embodiment of the present invention will be described in more detail.

[Alloy composition]

As a precipitation hardening type copper alloy that is applied to heat dissipation parts such as the housing of the vapor chamber, a known Cu-(Fe,Co,Ni)-P-based alloy, and a Cu-(Ni,Co)-Si-based alloy are exemplified. have.

(Cu-(Fe,Co,Ni)-P alloy)

The copper alloy of this system contains one or more of Fe, Ni, Co and P, and Fe, Ni, Co and P form a compound (phosphorus).

This copper alloy preferably has a total content of Fe, Co, and Ni [Fe+Co+Ni] of 0.2 to 2.3 mass%, a P content of 0.01 to 0.2 mass%, and the balance consists of Cu and unavoidable impurities.

This copper alloy further contains 0.01 to 0.3% by mass in total of one or two or more of Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, and Mn as necessary.

Fe, Co, and Ni form a compound (phosphorus) with P, thereby improving the strength and conductivity of the copper alloy sheet after aging treatment, and suppressing coarsening of crystal grains during high temperature heating. Fe and Co, which do not form a phosphide, are precipitated as a single substance and have the same effect as that of the above-described phosphide, while Ni, which does not form a phosphide, is dissolved in Cu to improve the strength of the copper alloy sheet. However, when [Fe+Co+Ni] is less than 0.2 mass %, the 0.2% proof stress at 850 degreeC becomes less than 10 MPa. On the other hand, when [Fe+Co+Ni] exceeds 2.3 mass %, the electrical conductivity falls, and coarse compounds are crystallized in the melt casting process of an alloy, and bending workability, stamping workability, and corrosion resistance deteriorate. Therefore, [Fe+Co+Ni] is preferably within the range of 0.2 to 2.3 mass%. On the other hand, in this copper alloy, when the content of Ni is less than 0.1% by mass, the above effect is not sufficient, while when it exceeds 1% by mass, the above effect is saturated. Therefore, when Ni is included, the Ni content is in the range of 0.1 to 1.0% by mass. The preferred lower limit of [Fe+Co+Ni] is 0.25%, the preferred upper limit is 2.1%, and the preferred lower limit of Ni is 0.15%, and the preferred upper limit is 0.9%.

It is preferable that the said copper alloy contains 1 type or 2 types of Fe and Co among Fe, Co, and Ni, and the total content [Fe+Co] of Fe and Co is 0.2 to 2.3 mass %. In this case, 0.1 to 1.0% by mass of Ni may be contained as necessary. With this composition, the average crystal grain size after heating at 850° C. for 30 minutes can be suppressed to 100 μm or less.

P has an action of reducing the amount of oxygen contained in the copper alloy by a deoxidation action and preventing hydrogen embrittlement when the heat dissipating part is heated in a reducing atmosphere containing hydrogen. The P content necessary for preventing hydrogen embrittlement is 0.01% by mass or more. In addition, the solid solution P lowers the conductivity of the copper alloy, but forms Fe, Co, Ni and phosphides by heating to the precipitation temperature, thereby improving the strength, heat resistance, and conductivity of the copper alloy. However, when the P content exceeds 0.2% by mass, the amount of P to be dissolved increases and the electrical conductivity decreases. For this reason, the content of P is set to 0.01 to 0.2% by mass. In the case of improving the strength, heat resistance and conductivity mainly by the precipitation of the phosphide, the ratio [Fe+Co+Ni]/[P] between [Fe+Co+Ni] and the P content [P] is about 2-5. Is preferred. The preferable lower limit of P is 0.013%, the preferable upper limit is 0.17%, the more preferable lower limit of [Fe+Co+Ni]/[P] is 2.3, and the more preferable upper limit is 4.5.

Since Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, and Mn have an effect of improving the strength and heat resistance of the copper alloy, one or two or more of them are added as necessary. However, if the total content of one or two or more of these elements is less than 0.005 mass%, the effect is small, whereas if it exceeds 0.3 mass%, the electrical conductivity is lowered. Therefore, the total content of one or two or more of these elements is in the range of 0.005 to 0.3% by mass. The total content of one or more of these elements is preferably a lower limit of 0.01, more preferably a lower limit of 0.02 mass%, and preferably an upper limit of 0.25 mass%.

Among these, Si, Al, Mn, and Ti are preferably contained in a small amount to lower the electrical conductivity of the copper alloy, so that the upper limit of each element is preferably 0.1% by mass. Cr and Zr are elements that have a small solid solution in copper and are precipitated even in a relatively high temperature region, and thus have a large effect of suppressing coarsening of crystal grains when heated to a high temperature. For this reason, when it is desired to refine the crystal grains of the copper alloy sheet, it is sufficient to contain Cr and Zr in a total of one or two of 0.03 mass% or more, preferably 0.06 mass% or more. When Cr and Zr are contained in an amount of 0.03% by mass or more in one or two types, even if [Fe+Co] is less than 0.2% by mass (however, [Fe+Co+Ni] is 0.2% by mass or more), 850°C × The average crystal grain size after heating for 30 minutes can be suppressed to 100 μm or less. On the other hand, since Cr and Zr lower the conductivity, the total content of one or two of these elements is preferably 0.2% by mass or less.

In addition to the effect of improving the strength and stress relaxation resistance, Sn and Mg have the effect of improving the stress relaxation resistance. When the temperature or the use environment of the heat dissipation component reaches 80°C or higher, creep deformation occurs and the contact area with a heat source such as a CPU decreases, and heat dissipation decreases. However, this phenomenon can be suppressed by improving the stress relaxation resistance. I can. In order to obtain this effect, the Sn content is preferably 0.01% by mass or more and the Mg content is preferably 0.005% by mass or more. On the other hand, from the viewpoint of preventing a decrease in the electrical conductivity of the copper alloy sheet, the Sn content is preferably 0.2% by mass or less, and the Mg content is preferably 0.2% by mass or less.

Zn improves the thermal peeling resistance of the solder and the thermal peeling resistance of the Sn plating. In the vapor chamber, soldering is sometimes applied to an electronic component that is a heat dissipation part, and Sn plating is sometimes applied to the vapor chamber in order to improve corrosion resistance. In such a case, a copper alloy plate containing Zn is suitably used as a material for the housing of the vapor chamber. Zn has an effect of improving the thermal peeling resistance even if it is added in a small amount, but the effect is saturated even if it contains more than 0.3% by mass of Zn, so the content of Zn is preferably 0.3% or less. The lower limit of the Zn content is more preferably 0.005% by mass, further preferably 0.01% by mass.

(Cu-(Ni,Co)-Si alloy)

The copper alloy of this system contains one or two types of Ni and Co and Si, and Ni, Co and Si form a compound (silicide).

This copper alloy preferably has a total content of Ni and Co [Ni+Co] of 1.6 to 3.5 mass%, and a ratio of the total content of Ni and Co [Ni+Co] and the Si content [Si] [Ni+Co] ]/[Si] is 3.5 to 5.5, and the balance consists of Cu and unavoidable impurities.

This copper alloy further contains 0.01 to 0.3 mass% in total of one or two or more of Mg, Al, Cr, Ti, Zr, Zn, Sn, and Mn as necessary.

Ni and Co form a compound (silicide) with Si to improve the strength and conductivity of the copper alloy after the aging treatment, and have an effect of suppressing coarsening of crystal grains during high temperature heating. However, if [Ni+Co] is less than 1.6% by mass, the 0.2% proof strength at 850°C is less than 10 MPa, and the action of suppressing coarsening of crystal grains is small. On the other hand, when [Ni+Co] exceeds 3.5% by mass, the electrical conductivity is lowered, coarse compounds are created or precipitated, and hot workability is deteriorated. Therefore, [Ni+Co] is in the range of 1.6 to 3.5% by mass.

In addition, when [Ni+Co]/[Si] is less than 3.5, excess Si is solid solution, and when it exceeds 5.5, excess Ni or Co is solid solution, and electrical conductivity is lowered. Therefore, [Ni+Co]/[Si] is in the range of 3.5 to 5.5.

In order to suppress the average crystal grain size after heating at 850°C for 30 minutes to 100 μm or less, [Ni+Co] is preferably set to 2.4% by mass or more.

Since Mg, Al, Cr, Ti, Zr, Zn, Sn, and Mn have an effect of increasing the strength of the copper alloy, one or two or more of them are added as necessary. However, if the total content of one or two or more of these elements is less than 0.005 mass%, the effect is small, whereas if it exceeds 0.3 mass%, the electrical conductivity is lowered. Therefore, the total content of one or two or more of these elements is in the range of 0.005 to 0.3% by mass. The total content of one or two or more of these elements has a lower limit of preferably 0.01 mass%, more preferably a lower limit of 0.02 mass%, and preferably an upper limit of 0.25 mass%.

Of these, even if a small amount of Al, Mn, and Ti is contained, the electrical conductivity of the copper alloy is lowered. Therefore, it is preferable to set the upper limit to 0.1% by mass, respectively. Cr and Zr are elements that have a large effect of suppressing coarsening of crystal grains when heated at a high temperature, and in the case of wanting to refine crystal grains, the sum of one or two of Cr and Zr is 0.03% or more, preferably 0.06 You just need to contain it in mass% or more. When one or two types of Cr and Zr are contained in a total of 0.03% or more, even if [Ni+Co] is less than 2.4% by mass (1.6% by mass or more), the average crystal grain size after heating at 850°C x 30 minutes is 100 μm or less Can be suppressed with. However, since Cr and Zr lower the electrical conductivity, the total content of one or two of these elements is preferably 0.2% by mass or less.

In addition to the effect of improving the strength and stress relaxation resistance, Sn and Mg have the effect of improving the stress relaxation resistance. When the temperature or the use environment of the heat dissipation component reaches 80°C or higher, creep deformation occurs and the contact area with a heat source such as a CPU decreases, and heat dissipation decreases. However, this phenomenon can be suppressed by improving the stress relaxation resistance. I can. In order to obtain this effect, the Sn content is preferably 0.01% by mass or more and the Mg content is preferably 0.005% by mass or more. On the other hand, from the viewpoint of preventing a decrease in the electrical conductivity of the copper alloy sheet, the Sn content is preferably 0.2% by mass or less, and the Mg content is preferably 0.2% by mass or less.

Zn improves the thermal peeling resistance of the solder and the thermal peeling resistance of the Sn plating. In the vapor chamber, soldering is sometimes applied to an electronic component that is a heat dissipation part, and Sn plating is sometimes applied to the vapor chamber in order to improve corrosion resistance. In such a case, a copper alloy plate containing Zn is suitably used as a material for the housing of the vapor chamber. Zn has an effect of improving the thermal peeling resistance even if it is added in a small amount, but the effect is saturated even if it contains more than 0.3% by mass of Zn, so the content of Zn is preferably 0.3% or less. The lower limit of the Zn content is more preferably 0.005% by mass, further preferably 0.01% by mass.

[Method of manufacturing copper alloy plate]

In the copper alloy sheet according to the embodiment of the present invention, after the ingot is subjected to a cracking treatment, (1) hot rolling-cold rolling-annealing, (2) hot rolling-cold rolling-annealing-cold rolling, (3) hot rolling-cold rolling Rolling-annealing-cold rolling-low temperature annealing, etc. can be produced. In the above (1) to (3), the cold rolling-annealing process may be performed a plurality of times.

The annealing includes softening annealing, recrystallization annealing, or precipitation annealing (aging treatment). In the case of softening annealing or recrystallization annealing, the heating temperature may be selected from the range of 600 to 950°C, and the heating time may be selected from the range of 5 seconds to 1 hour. When softening annealing or recrystallization annealing serves as a solution treatment, continuous annealing may be performed by heating at 650 to 950°C for 5 seconds to 3 minutes. In the case of precipitation annealing, it may be carried out under conditions of maintaining the temperature range of about 350 to 600°C for 0.5 to 10 hours. When softening annealing or recrystallization annealing also serves as a solution treatment, precipitation annealing can be performed in a subsequent step.

The final cold rolling may be selected from the range of 5 to 80% of the working rate according to the target 0.2% yield strength and bending workability.

Low-temperature annealing is to soften the copper alloy sheet without recrystallization in order to recover the ductility of the copper alloy sheet. In the case of continuous annealing, it may be determined to be maintained in an atmosphere of 300 to 650°C for about 1 second to 5 minutes. In the case of batch annealing, the actual temperature of the copper alloy sheet may be set to be maintained at 250°C to 400°C for about 5 minutes to 1 hour.

In the case of a Cu-(Fe,Co,Ni)-P-based alloy, a copper alloy sheet having a 0.2% yield strength of 100 MPa or more and excellent bending workability can be manufactured by the above manufacturing method. This copper alloy sheet has a 0.2% proof strength measured at 850°C (measured after holding at 850°C for 30 minutes) and is 10 MPa or more, heated at 850°C for 30 minutes, water cooled, and then heated at 500°C for 2 hours. When used, it has a 0.2% proof strength of 100 MPa or more and a conductivity of 50% IACS or more.

In the case of a Cu-(Ni,Co)-Si-based alloy, a copper alloy sheet having a 0.2% yield strength of 200 MPa or more and excellent bending workability can be manufactured by the above manufacturing method. This copper alloy sheet has a 0.2% proof strength measured at 850°C (measured after holding at 850°C for 30 minutes) and is 10 MPa or more, heated at 850°C for 30 minutes, water cooled, and then heated at 500°C for 2 hours. When used, it has a 0.2% proof strength of 300 MPa or more and a conductivity of 50% IACS or more.

In the bending process, it is required that no cracks occur in the bent portion. Moreover, it is preferable that surface roughness does not occur in the bend line and the vicinity thereof. Even in the case of the copper alloy plate of the same material, the ease of occurrence of cracks and surface roughness due to bending depends on the ratio R/t of the bending radius R and the plate thickness t. In the case of manufacturing heat dissipation parts such as vapor chambers using a copper alloy plate, as the bending workability of the copper alloy plate, in general, cracks will not occur when bending of R/t ≤ 2 is performed in both the rolling parallel direction and the right angle direction. Is required. As the bending workability of the copper alloy sheet, it is preferable that no cracking occurs in the bending of R/t≦1.5, and it is more preferable that no cracking occurs in the bending of R/t≦1.0. The bending workability of the copper alloy sheet is generally tested with a test piece having a plate width of 10 mm (refer to the bending workability test in Examples to be described later). In the case of bending a copper alloy sheet, the larger the bending width, the more likely cracking to occur. Therefore, especially when the bending width is large, cracking occurs at a bending of R/t = 1.0 when tested with a test piece with a plate width of 10 mm. It is preferable not to do this, and it is more preferable that no cracking occurs at the bending of R/t=0.5. In addition, in order not to generate surface roughness in the bend line and its vicinity, the average crystal grain size (cutting method) measured in the plate width direction on the surface of the copper alloy plate is preferably 20 μm or less, and more preferably 15 μm or less.

In the case of manufacturing heat dissipation parts such as vapor chambers, the copper alloy plate is processed into a predetermined shape by press molding, punching, cutting, etching, bending, etc., before being heated to a temperature of 650°C or higher, and heated at high temperature (de After gas, bonding (brazing, diffusion bonding, welding (TIG, MIG, laser, etc.), heating for sintering, etc.), it is processed into a heat dissipating component, etc. A copper alloy plate according to an embodiment of the present invention has the above properties. As a result, it is not easily deformed in conveyance and handling during the processing, and there is no problem in performing the processing. In addition, the 0.2% proof strength measured at high temperature (850° C.) is 10 MPa or more, so that the diffusion By increasing the pressing force during bonding or brazing, it is possible to shorten the holding time, improve the reliability of the bonded portion, and further prevent the copper alloy plate from being deformed during diffusion bonding or brazing. After the heating process, by performing an aging treatment, a heat dissipating component having a high 0.2% proof strength and electrical conductivity can be obtained.

In the heat dissipation component manufactured using the copper alloy plate according to the embodiment of the present invention, after the above process of heating to 650°C or higher, if necessary, for the purpose of improving corrosion resistance and solderability, at least part of the outer surface is Sn A coating layer is formed. The Sn coating layer includes electroplating, electroless plating, or those formed by heating to below the melting point or above the melting point of Sn after these platings. The Sn coating layer contains a Sn metal and a Sn alloy, and examples of the Sn alloy include those containing 5% by mass or less in total of at least one of Bi, Ag, Cu, Ni, In, and Zn as alloying elements other than Sn. .

Under the Sn coating layer, a base plating such as Ni, Co, or Fe can be formed. These base platings have a function as a barrier for preventing diffusion of Cu and alloy elements from the base material, and a function of preventing scratches by increasing the surface hardness of the heat dissipating part. A Cu-Sn alloy layer was formed by plating Cu on the base plating, further plating Sn, and then heating to the melting point or higher of Sn to form a Cu-Sn alloy layer. It can also be made into a three-layer structure. The Cu-Sn alloy layer has a function as a barrier for preventing diffusion of Cu and alloy elements from the base material, and a function of preventing scratches by increasing the surface hardness of the heat dissipating component.

Further, in the heat dissipating component manufactured using the copper alloy plate according to the embodiment of the present invention, after the above process of heating to 650°C or higher, a Ni coating layer is formed on at least a part of the outer surface as necessary. The Ni coating layer has a barrier that prevents diffusion of Cu and alloying elements from the base material, and has a function of preventing scratches by increasing the surface hardness of the heat dissipating component, and improving corrosion resistance.

The copper alloy sheet according to the embodiment of the present invention is preferably produced by a step of cracking an ingot and hot rolling, then cold rolling, recrystallization with solutionization, cold rolling, and aging treatment. After the recrystallization treatment accompanied by solution treatment, an aging treatment may be performed without cold rolling, and then cold rolling may be performed.

Melting and casting can be performed by conventional methods such as continuous casting and semi-continuous casting. On the other hand, it is preferable to use a material having a small content of S, Pb, Bi, Se, and As as the copper melting raw material. In addition, it is desirable to reduce O and H by paying attention to the redness of the charcoal coated on the molten copper alloy (removal of moisture), the raw material for scrap, the drying of the casting barrel and the mold, and the deoxidation of the molten metal. .

The homogenization treatment is preferably maintained for 30 minutes or longer after the temperature inside the ingot reaches a temperature of 800°C or higher. The holding time of the homogenization treatment is more preferably 1 hour or more, and more preferably 2 hours or more.

After the homogenization treatment, hot rolling is started at a temperature of 800°C or higher. To prevent formation of coarse (Fe,Ni,Co)-P precipitates or (Ni,Co)-Si precipitates on the hot-rolled material, hot rolling is terminated at a temperature of 650°C or higher, and water cooling is used from that temperature. It is preferable to rapidly cool by. When the rapid cooling start temperature after hot rolling is lower than 650°C, coarse (Fe,Ni,Co)-P precipitates or (Ni,Co)-Si precipitates are formed, and the structure is liable to become uneven, and the copper alloy plate ( The strength of the product plate) decreases. It is preferable that it is a temperature of 700 degreeC or more, and, as for the end temperature (quick cooling start temperature) of hot rolling, it is more preferable that it is 750 degreeC or more. On the other hand, the structure of the hot-rolled material quenched after hot rolling becomes a recrystallized structure. The recrystallization treatment accompanying solutionization described later can also serve as rapid cooling after hot rolling.

By applying a certain strain to the copper alloy sheet by cold rolling after hot rolling, a copper alloy sheet having a desired recrystallization structure (fine recrystallization structure) is obtained after the subsequent recrystallization treatment.

The recrystallization treatment accompanying solutionization is performed under conditions of holding at 650 to 950°C, preferably 670 to 900°C for 3 minutes or less. When the content of the alloying element in the copper alloy is small, recrystallization treatment is preferably performed in a lower temperature region within the temperature range, and when the content of the element is large, recrystallization treatment is performed in a higher temperature region within the temperature range. By this recrystallization treatment, it is possible to form a recrystallized structure (a crystal grain size of 1 to 20 μm) in which the alloying element is dissolved in the copper alloy base material, and the bending workability is improved. If the temperature of this recrystallization treatment is lower than 650°C, the solid solution amount of Ni, Fe, Co, P or Ni, Co, Si becomes small, and the strength decreases. On the other hand, when the temperature of the recrystallization treatment exceeds 950°C or the treatment time exceeds 3 minutes, the recrystallization grains become coarse.

After recrystallization treatment with solution treatment, (a) cold rolling-aging treatment, (b) cold rolling-aging treatment-cold rolling, (c) cold rolling-aging treatment-cold rolling-low temperature annealing, (d) aging Any one of treatment-cold rolling, (e) aging treatment-cold rolling-low temperature annealing can be selected.

The aging treatment (precipitation annealing) is performed under the condition of maintaining a heating temperature of about 300 to 600°C for 0.5 to 10 hours. When this heating temperature is less than 300°C, the amount of precipitation is small, and when it exceeds 600°C, the precipitate is liable to coarsen. The lower limit of the heating temperature is preferably 350°C, and the upper limit is preferably 580°C, more preferably 560°C. The holding time of the aging treatment is appropriately selected according to the heating temperature, and is performed within the range of 0.5 to 10 hours. If this holding time is less than 0.5 hours, the precipitation becomes insufficient, and even if it exceeds 10 hours, the amount of precipitation is saturated, resulting in a decrease in productivity. The lower limit of the holding time is preferably 1 hour, more preferably 2 hours.

In the case of a Cu-(Fe,Co,Ni)-P-based alloy, the copper alloy sheet produced in the above preferable processes and conditions has a 0.2% proof strength of 300 MPa or more, and has excellent bending workability.

Also in the case of a Cu-(Ni,Co)-Si-based alloy, the copper alloy sheet produced in the above preferable steps and conditions has a 0.2% proof strength of 300 MPa or more, and has excellent bending workability.

In addition, in order to enable good bonding (no bonding defects, high bonding strength, etc.) by diffusion bonding and brazing at a temperature of 650°C or higher, the surface roughness of the copper alloy plate (product) is the arithmetic mean roughness Ra It is preferable that it is 0.3 μm or less, and the maximum height roughness Rz is 1.5 μm or less, and the internal oxidation depth is 0.5 μm or less, preferably 0.3 μm or less.

In order to make the surface roughness of the copper alloy sheet (product) Ra: 0.3 μm, Rz: 1.5 μm or less, the surface roughness in the roll axis direction of the rolling roll used for final cold rolling is, for example, Ra: 0.15 μm, Rz: 1.0 μm. In the following, or the copper alloy sheet after the final cold rolling may be subjected to polishing such as buff polishing or electrolytic polishing. In addition, in order to reduce the internal oxidation depth of the copper alloy sheet (product) to 0.5 μm or less, the annealing atmosphere is reduced and the dew point is -5°C or less, or the copper alloy sheet after annealing is mechanically polished (buff, brush). Etc.) or by electrolytic polishing, the resulting internal oxide layer may be removed or thinned.

[Method of manufacturing heat dissipating parts]

The copper alloy plate according to an embodiment of the present invention is used, for example, as a material for a housing of a vapor chamber. The manufacturing process of the vapor chamber is the same as that using a conventional OFC plate material, and two plate members having patterns such as grooves and irregularities are joined by diffusion bonding or brazing to form the housing of the vapor chamber. The copper alloy sheet is heated at a high temperature to 650°C or higher in this bonding step.

Since the copper alloy plate according to the embodiment of the present invention has a 0.2% proof strength of 10 MPa or more even at 850° C., the pressing force during diffusion bonding or brazing can be increased compared to the case of using a conventional OFC plate material. For this reason, the reliability of the diffusion bonding portion or the brazing portion can be improved, and the holding time of the diffusion bonding or brazing portion can be shortened. Further, since the 0.2% proof strength at high temperature is large, it is possible to prevent deformation such as dents and swelling in the plate member during the heating process during diffusion bonding or brazing, for example. The 0.2% proof stress at 850°C is preferably 12 MPa or more, and this value can be achieved in the copper alloy sheet according to the embodiment of the present invention.

In the copper alloy plate according to the embodiment of the present invention, when the average crystal grain diameter after high temperature heating (850° C.×30 minutes) is suppressed to 100 μm or less, the occurrence of cracks penetrating the thin portion of a heat dissipating component such as a vapor chamber, and Refrigerant leakage can be prevented. In addition, it is possible to prevent an increase in the surface roughness of the heat dissipating component, thereby preventing an increase in the gap between the heat generating unit (CPU, etc.) and a decrease in heat transfer performance accompanying this.

Although the heat dissipation part after high temperature heating (heating at least 650°C) is softened, since the copper alloy according to the embodiment of the present invention is a precipitation hardening type, aging treatment is continued under the conditions shown above (300 to 600°C x 0.5 to 10 hours). By doing it, the strength can be improved. In addition, this aging treatment restores the electrical conductivity that has been lowered by high-temperature heating. On the other hand, with respect to the copper alloy sheet according to the embodiment of the present invention, after heating at 850°C for 30 minutes (corresponding to the diffusion bonding condition), when the aging treatment was performed under the above conditions, Cu-(Fe,Co,Ni)-P In the case of an alloy based on 100 MPa or more, a 0.2% proof strength of not less than 300 MPa is shown in the case of a Cu-(Ni,Co)-Si based alloy. Further, by this aging treatment, the electrical conductivity of the copper alloy sheet according to the embodiment of the present invention becomes 50% IACS or more in either alloy system. The copper alloy sheet according to the embodiment of the present invention has a lower electrical conductivity than OFC after aging treatment, but has high strength, so it can be thinner than OFC, thereby compensating for a relatively low electrical conductivity.

The aging treatment after high-temperature heating (after the bonding step), that is, heated to 650°C or higher and bonding, can be performed, for example, as follows.

(1) After cooling the heat dissipation component after high-temperature heating to a temperature of 300° C. or less, it is reheated to the above temperature range, maintained within the range for a certain period of time, and precipitated and hardened. In this case, it is preferable to rapidly cool the heat dissipation component after high temperature heating by water cooling or the like while the heat dissipation component after high temperature heating is still high, or to rapidly cool the heat dissipation component after high temperature heating to a solution temperature and then to make the copper alloy a solution in advance.

(2) The heat dissipation component after high-temperature heating is maintained within the above temperature range for a certain period of time during cooling from the high temperature, and precipitation-hardened. Even if the heat dissipation component is maintained at a constant temperature within the precipitation temperature range, cooling may be continued within the precipitation temperature range.

(3) After the step of the above (2), the reheating of the above (1) is further performed, and the precipitation hardening-type copper alloy is precipitation-hardened.

In the embodiment of the present invention, after the bonding step, an aging treatment is performed without plastic working. If plastic working is applied to the bonding material after high temperature heating (after the bonding process) before the aging treatment, the internal structure and dimensions of the heat dissipation component change, so the shape and dimensions of the refrigerant flow path do not conform to the design values. As a result, the heat dissipation component As a result, the target heat transfer performance cannot be exhibited.

In general, in the precipitation-type alloy, the degree of improvement in strength and conductivity increases when aging treatment is performed after plastic working, but in the CuFeP-based and CuNiSi-based alloys according to the embodiment of the present invention, aging treatment is performed without plastic working. Even in the case, it is possible to achieve the same degree of improvement in strength and electrical conductivity as in the case of plastic working.

Example 1

Copper alloys of the compositions shown in Tables 1 and 2 were dissolved in a charcoal-coated atmosphere (No. 1 to 16, 18 to 29) or a vacuum atmosphere (No. 17), and cast in a graphite book mold at a molten metal temperature of 1200°C. Thus, an ingot having a thickness of 50 mm, a width of 200 mm and a length of 70 mm was produced. Each ingot is heated to 950°C (No. 1 to 16, 18 to 29) or 800°C (No. 17), maintained for 1 hour, hot-rolled to a thickness of 16 mm, and immediately water-cooled after the hot rolling is completed, with a thickness of 16 mm. , To obtain a hot-rolled material having a width of 200 mm and a length of 215 mm. No. About the hot-rolled material of 1-16 and 18-29, it heated at 850 degreeC, and after reaching 850 degreeC, holding for 30 minutes, it water-quenched. On the other hand, the composition analyzed by each hot-rolled material having a plate thickness of 16 mm was also the same as the values in Tables 1 and 2. In addition, for any hot-rolled material, the surface roughness is Ra: 0.08 to 0.15 μm, Rz: 0.8 to 1.2 μm, and the internal oxidation measured by a scanning electron microscope (observation magnification 15000 times) by grinding the plate thickness cross section. The depth was 0.1 μm or less.

No. of Table 1 1 to 16 are Cu-(Fe,Co,Ni)-P series, No. 17 is OFC, No. 18 to 29 are Cu-(Ni,Co)-Si-based copper alloys.

No. The hot-rolled materials of 1 to 16 and 18 to 29 were faceted on both sides by 1 mm, cold-rolled to a thickness of 1.25 mm (width 200 mm, length 2400 mm), and cut into a material A having a length of 1900 mm and a material B having a length of 500 mm.

The material A was cold-rolled to a thickness of 0.75 mm, an aging treatment was performed by heating at 500°C for 2 hours, and further cold-rolled to a thickness of 0.3 mm (processing rate: 60%), and a cornerstone furnace. ), the strain relief annealing was performed by heating at 350°C for 30 seconds. Using the obtained copper alloy plate as a test material, 0.2% proof strength and elongation at room temperature (20°C), and bending workability were measured. In addition, using each test material, the average crystal grain size after heating at 850°C for 30 minutes, and 0.2% proof strength and conductivity after further aging treatment were measured in the following manner. The results are shown in Tables 3 and 4.

The material B was subjected to an aging treatment of heating at 500°C for 2 hours, then cold-rolled to a thickness of 0.5 mm (working rate: 60%), and annealing to remove deformation by heating at 350°C for 30 seconds in a cornerstone furnace. . Using the obtained copper alloy plate as a test material, 0.2% proof strength at 850°C was measured in the following manner. The results are shown in Tables 3 and 4.

No. The hot-rolled material of 17 was chamfered on both sides by 1 mm, cold-rolled to a thickness of 0.71 mm (width 200 mm, length 4200 mm), and cut into a C material having a length of 3700 mm and a material D having a length of 500 mm.

The C material was cold-rolled to a thickness of 0.43 mm, annealing by heating at 350° C. for 2 hours, and cold-rolled to a thickness of 0.3 mm (processing rate: 30%), and then at 350° C. in a cornerstone furnace. Deformation annealing by heating for 30 seconds was performed. Using the obtained copper plate as a test material, 0.2% proof strength and elongation at room temperature (20°C), and bending workability were measured. In addition, using each test material, the average crystal grain size after heating at 850°C for 30 minutes, and 0.2% proof strength and conductivity after further aging treatment were measured in the following manner. The results are shown in Table 3.

The D material was subjected to annealing by heating at 350°C for 2 hours, then cold-rolled to a thickness of 0.5 mm (working rate: 30%), and subjected to strain relief annealing by heating at 350°C for 30 seconds in a cornerstone furnace. Using the obtained copper plate as a test material, 0.2% proof stress at 850°C was measured in the following manner. The results are shown in Table 3.

(0.2% strength and elongation (room temperature))

From each test material (material A and material C), a JIS No. 5 tensile test piece was cut out so that the longitudinal direction became the rolling parallel direction, and an accreditation test was performed in accordance with JIS-Z2241, and the proof strength and elongation were measured. Proof strength is a tensile strength equivalent to 0.2% permanent elongation.

(Bending workability (room temperature))

The measurement of the bending workability was performed according to the W bending test method specified in the Shindong Association standard JBMA-T307. A test piece with a width of 10 mm and a length of 30 mm is cut from each test material (material A and material C), and using a jig with R/t = 0.5, GW (Good Way (Bending axis perpendicular to the rolling direction)) and BW Bending of (Bad Way (bending axis parallel to the rolling direction)) was performed. Next, the presence or absence of cracks in the bend is visually observed with an optical microscope of 100 times, and the occurrence of cracks in both GW and BW is determined by either P (P: Pass, Pass), GW or BW, or The occurrence of cracks in both was evaluated as F (F: Fail, fail).

(Average crystal grain size (after heating at 850℃×30 minutes))

From each test material (material A and material C), three test pieces (width 10 mm, length 250 mm) were cut out so that the long direction became the rolling parallel direction. Each test piece was put in a vacuum furnace, and the average temperature rising rate from room temperature was set at about 90°C/min, heated to 850°C, and after reaching 850°C, it was held at the same temperature for 30 minutes. Subsequently, the test piece was taken out from the furnace while maintaining the vacuum atmosphere, cooled to 250° C. for 240 seconds, and then taken out from the vacuum atmosphere and cooled with water. Three samples having a length of 20 mm were taken from each test piece, and the average crystal grain size was measured by a cutting method in a cross section parallel to the rolling direction of each sample (measurement direction was a rolling parallel direction). For each test material, the average value of the data of 9 samples (3×3) was taken as the average crystal grain size.

(0.2% proof strength and conductivity (850℃×30 minutes after heating and aging treatment))

From each test material (material A and material C), a JIS No. 5 tensile test piece and a conductivity test piece (width 10 mm, length 250 mm) were cut out so that the long direction became the rolling parallel direction. Each test piece was put in a vacuum furnace, and the average temperature rising rate from room temperature was set at about 90°C/min, heated to 850°C, and after reaching 850°C, it was held at the same temperature for 30 minutes. Subsequently, the test piece was taken out from the furnace while maintaining the vacuum atmosphere, cooled to 250° C. for 240 seconds, and then taken out from the vacuum atmosphere and cooled with water. Subsequently, each test piece was heated to 500°C, maintained at the same temperature for 2 hours, and then cooled to room temperature over 90 minutes.

Using a tensile test piece, a tensile test was performed in accordance with JIS-Z2241, and 0.2% proof strength and elongation were measured.

Using a conductivity test piece, the conductivity was measured by a four-terminal method using a double bridge in accordance with the non-ferrous metal material conductivity measurement method specified in JIS-H0505.

(0.2% proof strength (850℃))

From each test material (material B and material D), three tensile test pieces having the shape and dimensions (unit: mm) shown in FIG. 2 were produced. The tensile test piece had a 13B test piece specified in JIS Z2241 (2011) as a basic shape, and a protrusion (1.2 mm in height) for attaching an extensometer was formed at locations corresponding to both ends of the gage distance. Tensile test specimens are biaxially symmetrical in plan view, and the gauge distance (the distance between the vertices of the protrusions) is 50 mm, the length of the parallel part is 70 mm, the width of the protrusions in the parallel part is 12.5 mm, and the width of both sides of the protrusions in the parallel part is 12.8 mm. And the apex of the protrusion is finished with a radius of 0.1 mm. The longitudinal direction of the test piece was made parallel to the rolling direction.

Using a precision universal testing machine (manufactured by Shimadzu Corporation, AG100kNG/XR type), each test piece was heated to 850°C in an Ar atmosphere and held for 30 minutes after reaching 850°C, followed by a tensile test. The temperature increase rate of the test piece was 30°C/min at the actual temperature, the tensile rate was 1.0 mm/min until 0.2% proof strength measurement, and 5.0 mm/min thereafter. For each test material, the minimum value among the measured values of 0.2% proof strength by each of the three test pieces was taken as 0.2% proof strength of each test material.

In the tensile test at 850°C, the minimum testable plate thickness is about 0.5 mm. Materials A and B have a slightly different working rate in cold rolling before aging treatment (material C and material D before annealing), but the conditions of the subsequent aging treatment (annealing material C and material D), work rate and deformation of cold rolling Since the conditions of removal annealing are the same, it is considered that the characteristics of the material A and the material B (material C and material D) are substantially the same. In addition, by heating at 850°C for 30 minutes, the influence of the processing history up to that time is almost eliminated. Therefore, since it is considered that the 0.2% proof strength of material A and material B (material C and material D) at 850°C is almost the same, in this example, the measurement of 0.2% proof strength at 850°C is performed with a thickness of 0.5 mm. It was carried out with the B material and D material.

Looking at Tables 1 to 4, the conventional example, OFC, No. In 17, the 0.2% proof stress at 850°C corresponding to the heating temperature in the bonding step of the vapor chamber is only 5.4 MPa. In addition, the average crystal grain diameter after heating at 850°C for 30 minutes is 125 μm, the crystal grains are coarse, and it is possible to estimate the possibility that a grain boundary penetrating the thickness of the plate is formed. Moreover, the yield strength after heating at 850°C for 30 minutes and heating at 350°C for 2 hours is as low as 40 MPa.

In comparison, No. In 1 to 12 and 18 to 26, the 0.2% proof strength at room temperature is 300 MPa or more, the bending workability is excellent, and the 0.2% proof strength at 850°C is 10 MPa or more.

Proof strength after heating at 850°C for 30 minutes and aging treatment at 500°C for 2 hours is No. 1 to 12 are 100 MPa or more, No. 18 to 26 are 300 MPa or more, and both have a conductivity of 50% IACS or more.

No. Among 1 to 12, No. 2, wherein the total content [Fe+Co] of Fe and Co is 0.2 to 2.3% by mass. No. 1, 3 to 9, 11, 12 and Cr and Zr containing 0.09% by mass in total. In 10, the average crystal grain size after heating at 850°C for 30 minutes is 100 μm or less. Also, No. Among 18 to 26, No. 2, wherein the total content of Ni and Co [Ni+Co] is 2.4 to 3.5% by mass. No. 19 to 22, 24, containing 0.04 mass% of Cr and Zr in total. 23, and No. 26 has an average crystal grain size of 100 μm or less after heating at 850°C for 30 minutes.

Meanwhile, No. 13 and 14 lack [Fe+Co+Ni], and No. Since 27 lacks [Ni+Co], the 0.2% proof stress at 850°C is less than 10 MPa. Also, No. 15 is an excess of [Fe+Co+Ni], and No. 28 is an excess of [Ni+Co], and No. Since the other elements are excessive in 16 and 29, the proof-strength conductivity after heating at 850°C for 30 minutes and aging treatment at 500°C for 2 hours is less than 50% IACS.

The disclosure of the present specification includes the following aspects.

Sun 1:

Phosphorus containing one or two or more of Fe, Ni, Co is precipitated, has 0.2% proof strength of 100 MPa or more and excellent bending workability, 0.2% proof strength measured at 850°C is 10 MPa or more, and 30 minutes at 850°C After heating and water cooling, followed by aging treatment at 500℃ for 2 hours, 0.2% proof strength is 100 MPa or more, conductivity is 50% IACS or more, and a process of heating to 650℃ or more in part of the process of manufacturing heat dissipation parts and aging A copper alloy plate for heat dissipation parts, characterized in that the treatment is included.

Sun 2:

Silicide containing one or two types of Ni and Co is precipitated, has 0.2% proof strength of 200 MPa or more and excellent bending workability, 0.2% proof strength measured at 850°C is 10 MPa or more, and water cooling after heating at 850°C for 30 minutes Then, after 2 hours of aging treatment at 500°C, the 0.2% proof strength is 300 MPa or more, and the conductivity is 50% IACS or more, and part of the process of manufacturing heat dissipation parts includes a process of heating to 650°C or more and aging treatment. A copper alloy plate for heat dissipation parts, characterized in that.

Sun 3:

One or two types of Fe and Co and P: contain 0.01 to 0.2 mass%, the total content of Fe and Co [Fe+Co] is 0.2 to 2.3 mass%, and the balance consists of Cu and unavoidable impurities. The copper alloy plate for heat dissipation parts according to the first aspect.

Sun 4:

The copper alloy plate for heat dissipation parts according to Aspect 3, further comprising Ni: 0.1 to 1.0 mass%, and containing Fe, Co, and Ni content [Fe+Co+Ni] of 0.2 to 2.3 mass%.

Sun 5:

A copper alloy plate for heat dissipation parts according to aspect 3 or 4, comprising 0.01 to 0.3 mass% in total of one or two or more of Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, and Mn. .

Sun 6:

One or two types of Ni and Co and Si are included, the total content of Ni and Co [Ni+Co] is 1.6 to 3.5% by mass, and the total content of Ni and Co [Ni+Co] and Si content [Si ] Ratio [Ni+Co]/[Si] is 3.5 to 5.5, and the balance consists of Cu and unavoidable impurities.

Sun 7:

The copper alloy plate for heat dissipation parts according to Aspect 6, comprising 0.01 to 0.3 mass% in total of one or two or more of Mg, Al, Cr, Ti, Zr, Zn, Sn, and Mn.

Sun 8:

The copper alloy plate for heat dissipation parts according to any one of Aspects 1 and 3 to 5, wherein the average crystal grain size after heating at 850°C for 30 minutes is 100 μm or less.

Sun 9:

The copper alloy plate for heat dissipation parts according to any one of Aspects 2, 6 and 7, wherein the average crystal grain size after heating at 850°C for 30 minutes is 100 μm or less.

Sun 10:

A heat dissipation component comprising a plurality of copper alloy plates for heat dissipation components according to any one of Aspects 1, 3 to 5, and 8 bonded to each other by diffusion bonding or brazing.

Sun 11:

A heat dissipation component comprising a plurality of copper alloy plates for heat dissipation components according to any one of aspects 2, 6, 7 and 9 bonded to each other by diffusion bonding or brazing.

Sun 12:

The heat dissipation component according to Aspect 10 or 11, wherein the Sn coating layer is formed on at least a part of the outer surface.

Sun 13:

The heat dissipation component according to Aspect 10 or 11, wherein a Ni coating layer is formed on at least a part of the outer surface.

Sun 14:

After processing the copper alloy plate for heat dissipation parts according to any one of Aspects 1, 3 to 5, and 8 into a predetermined shape, heating at 650°C or higher and bonding are performed, followed by aging treatment without plastic working To obtain a heat radiation component having a 0.2% proof strength of 100 MPa or more and a conductivity of 50% IACS or more.

Sun 15:

After processing the copper alloy plate for heat dissipation parts according to any one of aspects 2, 6, 7 and 9 into a predetermined shape, heating at 650°C or higher and bonding are performed, followed by aging treatment without plastic working To obtain a heat radiation component having a 0.2% proof strength of 300 MPa or more and a conductivity of 50% IACS or more.

Sun 16:

After the process of heating to 650° C. or higher, a Sn coating layer is formed on at least a part of the outer surface of the heat-radiating component.

Sun 17:

After the process of heating to 650°C or higher, a Ni coating layer is formed on at least a part of the outer surface of the heat dissipating component.

The present application is accompanied by a claim of priority based on the Japanese Patent Application, Japanese Patent Application No. 2016-196884, whose filing date is October 5, 2016, as a basic application. Japanese Patent Application No. 2016-196884 is incorporated herein by reference.

1 plate absent

Claims (34)

delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete After processing the copper alloy plate for heat dissipation parts into a predetermined shape, heating at 650° C. or higher and a process of bonding are performed, followed by aging treatment without plastic working, and 0.2% proof strength of 100 MPa or more and 50% IACS or more. As a method of manufacturing a heat dissipating component to obtain a heat dissipating component having a conductivity,
The copper alloy plate for heat dissipation parts deposits prints containing one or two or more of Fe, Ni, and Co, has a 0.2% proof strength of 100 MPa or more, and excellent bending workability, and a 0.2% proof strength measured at 850° C. is 10 MPa. The average crystal grain size is 100 μm or less after heating at 850°C for 30 minutes, water cooling after heating at 850°C for 30 minutes, followed by aging treatment at 500°C for 2 hours, and 0.2% yield strength is 100 MPa or more, and conductivity is 50 % IACS or higher,
The method of manufacturing a heat dissipation part, characterized in that the alloy composition of the copper alloy plate for heat dissipation parts satisfies any one of the following (1) to (5):
(1) one or more of Fe, Ni, Co and P: 0.01 to 0.2 mass%, and the total content of Fe, Co, and Ni [Fe+Co+Ni] is 0.2 to 2.3 mass%, The balance consists of Cu and unavoidable impurities.
(2) one or more of Fe, Ni, Co and P: 0.01 to 0.2 mass%, and the total content of Fe, Co, and Ni [Fe+Co+Ni] is 0.2 to 2.3 mass%, The total content of Fe and Co [Fe+Co] is 0.2 to 2.3 mass%, and the balance consists of Cu and unavoidable impurities.
(3) one or more of Fe, Ni, Co and P: 0.01 to 0.2 mass%, and the total content of Fe, Co, and Ni [Fe+Co+Ni] is 0.2 to 2.3 mass%, The total content [Fe+Co] of Fe and Co is 0.2 to 2.3 mass%, Ni: 0.1 to 1.0 mass%, and the balance consists of Cu and unavoidable impurities.
(4) one or more of Fe, Ni, Co and P: 0.01 to 0.2 mass%, and the total content of Fe, Co, and Ni [Fe+Co+Ni] is 0.2 to 2.3 mass%, The total content of Fe and Co [Fe+Co] is 0.2 to 2.3 mass%, and one or two or more of Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, Mn is 0.01 to 0.3 mass in total. %, and the balance consists of Cu and unavoidable impurities.
(5) one or more of Fe, Ni, Co and P: 0.01 to 0.2 mass%, and the total content of Fe, Co, and Ni [Fe+Co+Ni] is 0.2 to 2.3 mass%, The total content of Fe and Co [Fe+Co] is 0.2 to 2.3 mass%, Ni: 0.1 to 1.0 mass%, and one of Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, and Mn Or 0.01 to 0.3 mass% in total of two or more, and the balance consists of Cu and unavoidable impurities. delete After the copper alloy plate for heat dissipation parts is processed into a predetermined shape, the process of heating and bonding is performed at 650°C or higher, followed by aging treatment without plastic working, and 0.2% proof strength of 300 MPa or more and 50% IACS or more. As a method of manufacturing a heat dissipating component to obtain a heat dissipating component having a conductivity,
The copper alloy plate for heat dissipation parts has a silicide containing one or two types of Ni and Co precipitated, has a 0.2% proof strength of 200 MPa or more and excellent bending workability, and a 0.2% proof strength measured at 850° C. is 10 MPa or more, After heating at 850° C. for 30 minutes, water cooling, followed by aging treatment at 500° C. for 2 hours, 0.2% proof strength is 300 MPa or more, conductivity is 50% IACS or more,
The method of manufacturing a heat dissipating part, characterized in that the alloy composition of the copper alloy plate for heat dissipating parts satisfies the following (1) or (2):
(1) One or two types of Ni and Co and Si are included, and the total content of Ni and Co [Ni+Co] is 1.6 to 3.5% by mass, and the total content of Ni and Co [Ni+Co] and Si The ratio [Ni+Co]/[Si] of the content [Si] is 3.5 to 5.5, and the balance consists of Cu and unavoidable impurities.
(2) One or two types of Ni and Co and Si are included, the total content of Ni and Co [Ni+Co] is 1.6 to 3.5% by mass, and the total content of Ni and Co [Ni+Co] and Si Content [Si] ratio [Ni+Co]/[Si] is 3.5 to 5.5, and one or two or more of Mg, Al, Cr, Ti, Zr, Zn, Sn, Mn is 0.01 to 0.3 mass in total %, and the balance consists of Cu and unavoidable impurities. After the copper alloy plate for heat dissipation parts is processed into a predetermined shape, the process of heating and bonding is performed at 650°C or higher, followed by aging treatment without plastic working, and 0.2% proof strength of 300 MPa or more and 50% IACS or more. As a method of manufacturing a heat dissipating component to obtain a heat dissipating component having a conductivity,
The copper alloy plate for heat dissipation parts has a silicide containing one or two types of Ni and Co precipitated, has a 0.2% proof strength of 200 MPa or more and excellent bending workability, and a 0.2% proof strength measured at 850° C. is 10 MPa or more, The average crystal grain size after heating at 850°C for 30 minutes is 100 μm or less, and after heating at 850°C for 30 minutes and water cooling, followed by aging treatment at 500°C for 2 hours, 0.2% proof strength is 300 MPa or more, conductivity is 50% IACS or more ego,
The method of manufacturing a heat dissipating part, characterized in that the alloy composition of the copper alloy plate for heat dissipating parts satisfies the following (1) or (2):
(1) One or two types of Ni and Co and Si are included, and the total content of Ni and Co [Ni+Co] is 1.6 to 3.5% by mass, and the total content of Ni and Co [Ni+Co] and Si The ratio [Ni+Co]/[Si] of the content [Si] is 3.5 to 5.5, and the balance consists of Cu and unavoidable impurities.
(2) One or two types of Ni and Co and Si are included, the total content of Ni and Co [Ni+Co] is 1.6 to 3.5% by mass, and the total content of Ni and Co [Ni+Co] and Si Content [Si] ratio [Ni+Co]/[Si] is 3.5 to 5.5, and one or two or more of Mg, Al, Cr, Ti, Zr, Zn, Sn, Mn is 0.01 to 0.3 mass in total %, and the balance consists of Cu and unavoidable impurities. The method of claim 23,
After the process of heating to 650°C or higher, an Sn coating layer is formed on at least a part of the outer surface of the heat-radiating component. delete The method of claim 25,
After the process of heating to 650°C or higher, an Sn coating layer is formed on at least a part of the outer surface of the heat-radiating component. The method of claim 26,
After the process of heating to 650°C or higher, an Sn coating layer is formed on at least a part of the outer surface of the heat-radiating component. The method of claim 23,
After the process of heating to 650°C or higher, a Ni coating layer is formed on at least a part of the outer surface of the heat-radiating component. delete The method of claim 25,
After the process of heating to 650°C or higher, a Ni coating layer is formed on at least a part of the outer surface of the heat-radiating component. The method of claim 26,
After the process of heating to 650°C or higher, a Ni coating layer is formed on at least a part of the outer surface of the heat-radiating component.

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