CN110267506B - High-efficient radiating display screen module - Google Patents
High-efficient radiating display screen module Download PDFInfo
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- CN110267506B CN110267506B CN201910656001.4A CN201910656001A CN110267506B CN 110267506 B CN110267506 B CN 110267506B CN 201910656001 A CN201910656001 A CN 201910656001A CN 110267506 B CN110267506 B CN 110267506B
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/02—Copolymers with acrylonitrile
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
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Abstract
The invention discloses a display screen module with high-efficiency heat dissipation, which comprises a display panel, a heat dissipation panel and a heat conduction frame, wherein the heat dissipation panel comprises a metal heat conduction layer and a graphite heat conduction layer, one side of the graphite heat conduction layer is bonded with the front side of the metal heat conduction layer, the other side of the graphite heat conduction layer is bonded with the back side of the display panel, the heat conduction frame is arranged in a shape, the display panel and the heat dissipation panel are inserted into the heat conduction frame, the side surfaces of the display panel and the heat dissipation panel are bonded with the heat conduction frame, the upper surface of the heat conduction frame is flush with the front side of the display panel, the heat conduction frame wraps the side surface and the lower bottom surface of the display panel, a graphene film is arranged on the back side of a flexible circuit board of the display panel, one side of the graphene film is bonded with the; the high-efficiency heat dissipation display screen module has excellent heat dissipation performance.
Description
Technical Field
The invention relates to a display screen module with high-efficiency heat dissipation.
Background
The periphery of the display screen module in the current mobile phone is provided with a light source, and the light of the light source is guided to the display layer of the display screen module by the light guide sheet so as to assist the display layer to display. However, the light source is easy to generate heat, so that the local temperature of the display screen module is high, and the display screen module is easy to damage.
Disclosure of Invention
The invention aims to provide a display screen module with excellent heat dissipation effect and high-efficiency heat dissipation.
In order to solve the problems, the invention adopts the following technical scheme:
the utility model provides a high-efficient radiating display screen module, includes display panel, heat dissipation panel and heat conduction frame, the heat dissipation panel includes metal heat-conducting layer and graphite heat-conducting layer, graphite heat-conducting layer one side bonds with the front of metal heat-conducting layer, graphite heat-conducting layer another side bonds with the back of display panel, the heat conduction frame is the type setting, display panel and heat dissipation panel all insert in the heat conduction frame, the side of display panel and heat dissipation panel all bonds with the heat conduction frame, the upper surface of heat conduction frame is equal with the front of display panel, the side and the lower bottom surface setting of display panel are wrapped to the heat conduction frame, the flexible circuit board back of display panel is provided with the graphite alkene membrane, graphite alkene membrane one side bonds with the flexible circuit board of display panel, the another side of graphite alkene membrane is hugged closely with the metal heat-conducting layer, the heat conduction frame is by nanometer silver 20-30 parts according to, 45-68 parts of aluminum nitride, 19-22 parts of tetrapod-like zinc oxide whiskers, 4-8 parts of calcium boride, 109-136 parts of red copper powder, 2-4 parts of calcium lignosulfonate, 2-4 parts of sodium benzene sulfinate, 1-3 parts of stannous chloride, 20-30 parts of phenolic resin powder, 30-42 parts of liquid nitrile rubber, 4-6 parts of ethylene bis stearamide, 4-7 parts of zinc stearate, 1-4 parts of diphenyl toluate phosphate and 2-4 parts of decabromodiphenyl ether.
Preferably, the method comprises the following steps: the inboard of heat conduction frame is provided with the insertion groove that mates with the cooling panel, the both sides and the lower bottom surface of cooling panel all insert in the insertion groove, cooling panel and insertion groove interference fit, heat conduction frame and cooling panel have adopted embedded structure, and stability is good to can guarantee to have great area of contact, be favorable to the heat transfer.
Preferably, the method comprises the following steps: still be provided with the aluminum alloy connecting strip on the heat conduction frame, the both ends of aluminum alloy connecting strip all are provided with the portion of inserting that pairs mutually with the insert groove, insert in the portion inserts the insertion groove, the aluminum alloy connecting strip passes through the portion of inserting and is connected with the insertion groove with the heat conduction frame, the aluminum alloy connecting strip is hugged closely with display panel's flexible circuit board, surrounds whole display panel through cooperation aluminum alloy connecting strip, not only can play good protecting effect, still is favorable to the heat transfer on the flexible circuit board to the external world simultaneously.
Preferably, the method comprises the following steps: the outer surface of the aluminum alloy connecting strip is coated with a heat conduction coating layer.
Preferably, the method comprises the following steps: the heat conducting frame is composed of 20 parts of nano-silver, 45 parts of aluminum nitride, 19 parts of tetrapod-like zinc oxide whiskers, 4 parts of calcium boride, 109 parts of red copper powder, 2 parts of calcium lignosulfonate, 2 parts of sodium benzene sulfinate, 1 part of stannous chloride, 20 parts of phenolic resin powder, 30 parts of liquid nitrile rubber, 4 parts of ethylene bis stearamide, 4 parts of zinc stearate, 1 part of diphenyl cresyl phosphate and 2 parts of decabromodiphenyl ether according to the weight parts.
Preferably, the method comprises the following steps: the heat conducting frame is composed of 30 parts of nano-silver, 68 parts of aluminum nitride, 22 parts of tetrapod-like zinc oxide whiskers, 8 parts of calcium boride, 136 parts of red copper powder, 4 parts of calcium lignosulfonate, 4 parts of sodium benzene sulfinate, 3 parts of stannous chloride, 30 parts of phenolic resin powder, 42 parts of liquid nitrile rubber, 6 parts of ethylene bis stearamide, 7 parts of zinc stearate, 4 parts of diphenyl toluate phosphate and 4 parts of decabromodiphenyl ether according to parts by weight.
Preferably, the method comprises the following steps: the heat conducting frame is composed of 25 parts of nano silver, 66 parts of aluminum nitride, 21 parts of tetrapod-like zinc oxide whiskers, 6 parts of calcium boride, 120 parts of red copper powder, 3 parts of calcium lignosulfonate, 3 parts of sodium benzene sulfinate, 2 parts of stannous chloride, 25 parts of phenolic resin powder, 36 parts of liquid nitrile rubber, 5 parts of ethylene bis stearamide, 5 parts of zinc stearate, 3 parts of diphenyl toluate phosphate and 3 parts of decabromodiphenyl ether according to parts by weight.
The invention also provides a terminal, which is characterized by comprising the display screen module with high heat dissipation efficiency as recited in any one of claims 1-7.
Preferably, the heat conduction frame of the high-efficiency heat dissipation display screen module is bonded with the shell of the terminal.
The invention also provides a preparation method of the heat conduction frame, which is characterized by comprising the following steps:
1) pouring 20-30 parts of phenolic resin powder, 30-42 parts of liquid nitrile rubber, 1-3 parts of stannous chloride and 4-7 parts of zinc stearate into a reaction kettle together, and carrying out heating and stirring treatment, wherein the heating temperature is 55-75 ℃, the stirring speed is 30-50r/min, and the heating and stirring time is 1-2 hours, so as to prepare a mixed solution for later use;
2) 20-30 parts of nano silver, 45-68 parts of aluminum nitride, 19-22 parts of tetrapod-like zinc oxide whiskers, 4-8 parts of calcium boride and 109-136 parts of red copper powder are poured into a mixer together for mixing treatment, so that the materials are uniformly mixed to prepare a mixed material for later use;
3) mixing the mixed solution prepared in the step 1). Pouring the mixed material prepared in the step 2), 2-4 parts of calcium lignosulphonate, 2-4 parts of sodium benzene sulfinate, 4-6 parts of ethylene bis stearamide, 1-4 parts of diphenyl cresyl phosphate and 2-4 parts of decabromodiphenyl ether into an injection molding machine, extruding the materials into a mold by adopting an injection molding process, cooling and demolding to obtain the heat conducting frame.
The characteristics or the effects of the raw materials of the heat conducting frame are as follows:
nano silver: the particle size is mostly about 25 nanometers, and the bactericidal composition has strong inhibiting and killing effects on dozens of pathogenic microorganisms such as escherichia coli, gonococcus, chlamydia trachomatis and the like, and can not generate drug resistance. Has excellent heat-conducting property.
Aluminum nitride: the strength at room temperature is high, and the strength is slowly reduced along with the increase of the temperature. The material has good thermal conductivity and small thermal expansion coefficient, and is a good thermal shock resistant material.
Tetrapod-like zinc oxide whiskers: the three-dimensional crystal structure is dispersed in the matrix to play a role of a framework, the unique three-dimensional space structure enables the gripping force of the matrix to be larger, the reinforcing effect to be more obvious, the tensile strength to be obviously increased, the transverse and longitudinal tensile strength values are basically the same, the mechanical property of the matrix material is isotropically reinforced, the matrix strength and the processing property are obviously improved, and the problem of poor hardness of the red copper can be effectively solved.
Calcium boride: a boron-containing additive for resisting corrosion and improving the hot strength. The composite material can play a synergistic role in combination with red copper, so that the conductivity of the red copper is improved, and static electricity on a screen can be better released onto a heat conducting frame.
Red copper powder: the conductivity and plasticity are good, but the strength and hardness are poor. The red copper has excellent thermal conductivity, ductility and corrosion resistance.
Calcium lignosulfonate: used as dispersant and adhesive.
Sodium benzene sulfinate: the adhesive is used for plasticizing and modifying polyamide, epoxy resin and phenolic resin and polymerizing an adhesion reinforcing agent.
Stannous chloride: and the vulcanization of the nitrile rubber by the phenolic resin is promoted. In the curing process, rubber molecules penetrate through a phenolic resin network to form a typical interpenetrating network structure, so that good toughness is obtained, the hardness and toughness of a finished product can be greatly improved with the tetrapod-like zinc oxide whiskers, and the mechanical property of the finished product in terminal use can be met even if red copper is used as a main heat-conducting filler.
Phenolic resin powder: has good acid resistance, mechanical property and heat resistance.
Liquid nitrile rubber: the phenolic resin has the advantages of excellent oil resistance, higher wear resistance, better heat resistance and strong bonding force, can play a role in modifying the phenolic resin, and can improve the impact strength, the thermal stability and the toughness.
Ethylene bis stearamide: the lubricating oil has good external lubricating effect and good internal lubricating effect, so that the fluidity and the demolding property of melt-isolation plastic are improved in plastic molding and processing, the yield of plastic processing is improved, the energy consumption is reduced, and the product has extremely high surface smoothness and smoothness; the zinc stearate is used together, and has very obvious synergistic effect. Improving dispersibility of other fillers.
Zinc stearate: lubricants and mold release agents. And also as a vulcanization activator.
Toluene diphenyl phosphate: and (3) a plasticizer.
Decabromodiphenyl ether: is a high-efficiency additive flame retardant.
The invention has the beneficial effects that: through being provided with heat dissipation panel at the display panel back, can make on heat that display panel produced can transmit heat dissipation panel, prevent that the heat from piling up, still dispose the heat conduction frame simultaneously for the heat can be further transmit on the heat conduction frame, however the upper surface of heat conduction frame is equal mutually with display panel's front, and installation back heat conduction frame and external contact can be with heat transfer external, prevent that the heat from piling up in inside, can play outstanding radiating effect.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic view of an overall structure of a display screen module with high heat dissipation efficiency according to the present invention.
Fig. 2 is a rear view of a display screen module with high heat dissipation efficiency according to the present invention.
Fig. 3 is a schematic view of a partial structure of a display screen module with high heat dissipation efficiency according to the present invention.
Fig. 4 is a schematic connection diagram of a heat conduction frame and an aluminum alloy connection strip of a display screen module with high heat dissipation efficiency according to the present invention.
Fig. 5 is a partial cross-sectional view of a display screen module with high heat dissipation efficiency according to the present invention.
In the figure:
1. a display panel; 3. A heat conducting frame; 4. a metal heat conducting layer; 5. a graphite heat conducting layer; 6. a graphene film; 7. inserting the groove; 8. an aluminum alloy connecting strip; 9. an insertion portion.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the embodiments, it should be understood that the terms "middle", "upper", "lower", "top", "right", "left", "above", "back", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the present embodiment, if the connection or fixing manner between the components is not specifically described, the connection or fixing manner may be a conventional manner such as bolt fixing, pin shaft connecting, adhesive fixing, or rivet fixing, which is commonly used in the prior art, and therefore, the detailed description thereof will not be provided in the examples.
Example 1
As shown in fig. 1-5, a display screen module with high heat dissipation efficiency comprises a display panel 1, a heat dissipation panel (not shown) and a heat conduction frame 3, wherein the heat dissipation panel comprises a metal heat conduction layer 4 and a graphite heat conduction layer 5, one side of the graphite heat conduction layer 5 is bonded with the front side of the metal heat conduction layer 4, the other side of the graphite heat conduction layer 5 is bonded with the back side of the display panel 1, the heat conduction frame 3 is in a shape, the display panel 1 and the heat dissipation panel are both inserted into the heat conduction frame 3, the side surfaces of the display panel 1 and the heat dissipation panel are both bonded with the heat conduction frame 3, the upper surface of the heat conduction frame 3 is flush with the front side of the display panel 1, the heat conduction frame 3 wraps the side surface and the lower bottom surface of the display panel 1, a graphene film 6 is arranged on the back side of a flexible circuit board of the display panel 1, one side, the other side of the graphene film is attached to a metal heat conduction layer 4, and the heat conduction frame is composed of 20 parts of nano-silver, 45 parts of aluminum nitride, 19 parts of tetrapod-shaped zinc oxide whiskers, 4 parts of calcium boride, 109 parts of red copper powder, 2 parts of calcium lignosulfonate, 2 parts of sodium benzene sulfinate, 1 part of stannous chloride, 20 parts of phenolic resin powder, 30 parts of liquid nitrile rubber, 4 parts of ethylene bis stearamide, 4 parts of zinc stearate, 1 part of diphenyl toluate phosphate and 2 parts of decabromodiphenyl ether in parts by weight.
In this embodiment, the inner side of the heat conducting frame 3 is provided with an insertion groove 7 matched with the heat dissipating panel, two sides and the lower bottom surface of the heat dissipating panel are inserted into the insertion groove 7, and the heat dissipating panel is in interference fit with the insertion groove 7.
In this embodiment, still be provided with aluminum alloy connecting strip 8 on the heat conduction frame 3, the both ends of aluminum alloy connecting strip 8 all are provided with the portion of inserting 9 that pairs mutually with insertion groove 7, insertion portion 9 inserts in the insertion groove 7, aluminum alloy connecting strip 8 is connected through portion of inserting 9 and insertion groove 7 with heat conduction frame 3, aluminum alloy connecting strip 8 is hugged closely with display panel 1's flexible circuit board.
In this embodiment, the aluminum alloy connecting strip 8 is coated with a heat conducting paint layer (not shown) on the outer surface.
In this embodiment, the heat conducting frame is composed of, by weight, 20 parts of nano silver, 45 parts of aluminum nitride, 19 parts of tetrapod-like zinc oxide whiskers, 4 parts of calcium boride, 109 parts of red copper powder, 2 parts of calcium lignosulfonate, 2 parts of sodium benzene sulfinate, 1 part of stannous chloride, 20 parts of phenolic resin powder, 30 parts of liquid nitrile rubber, 4 parts of ethylene bis stearamide, 4 parts of zinc stearate, 1 part of diphenyl toluate phosphate, and 2 parts of decabromodiphenyl ether.
The invention also provides a preparation method of the heat conduction frame, which is characterized by comprising the following steps:
1) pouring 20 parts of phenolic resin powder, 30 parts of liquid nitrile rubber, 1 part of stannous chloride and 4 parts of zinc stearate into a reaction kettle together, and carrying out heating and stirring treatment, wherein the heating temperature is 55 ℃, the stirring speed is 30r/min, and the heating and stirring time is 1h to prepare a mixed solution for later use;
2) pouring 20 parts of nano silver, 45 parts of aluminum nitride, 19 parts of tetrapod-like zinc oxide whiskers, 4 parts of calcium boride and 109 parts of red copper powder into a mixer together for mixing treatment, so that the materials are uniformly mixed to prepare a mixed material for later use;
3) mixing the mixed solution prepared in the step 1). Pouring the mixed material prepared in the step 2), 2 parts of calcium lignosulphonate, 2 parts of sodium benzene sulfinate, 4 parts of ethylene bis stearamide, 1 part of diphenyl cresyl phosphate and 2 parts of decabromodiphenyl ether into an injection molding machine, extruding the materials into a mold by adopting an injection molding process, cooling and demolding to obtain the heat conducting frame.
Example 2
As shown in fig. 1-5, a display screen module with high heat dissipation efficiency comprises a display panel 1, a heat dissipation panel and a heat conduction frame 3, wherein the heat dissipation panel comprises a metal heat conduction layer 4 and a graphite heat conduction layer 5, one side of the graphite heat conduction layer 5 is bonded with the front side of the metal heat conduction layer 4, the other side of the graphite heat conduction layer 5 is bonded with the back side of the display panel 1, the heat conduction frame 3 is in a shape, the display panel 1 and the heat dissipation panel are both inserted into the heat conduction frame 3, the side surfaces of the display panel 1 and the heat dissipation panel are both bonded with the heat conduction frame 3, the upper surface of the heat conduction frame 3 is flush with the front side of the display panel 1, the heat conduction frame 3 wraps the side surface and the lower bottom surface of the display panel 1, a graphene film 6 is arranged on the back side of a flexible circuit board of the display panel 1, and one, the other side of the graphene film is attached to a metal heat conduction layer 4, and the heat conduction frame is composed of 30 parts of nano-silver, 68 parts of aluminum nitride, 22 parts of tetrapod-shaped zinc oxide whiskers, 8 parts of calcium boride, 136 parts of red copper powder, 4 parts of calcium lignosulfonate, 4 parts of sodium benzene sulfinate, 3 parts of stannous chloride, 30 parts of phenolic resin powder, 42 parts of liquid nitrile rubber, 6 parts of ethylene bis stearamide, 7 parts of zinc stearate, 4 parts of diphenyl toluene phosphate and 4 parts of decabromodiphenyl ether in parts by weight.
In this embodiment, the inner side of the heat conducting frame 3 is provided with an insertion groove 7 matched with the heat dissipating panel, two sides and the lower bottom surface of the heat dissipating panel are inserted into the insertion groove 7, and the heat dissipating panel is in interference fit with the insertion groove 7.
In this embodiment, still be provided with aluminum alloy connecting strip 8 on the heat conduction frame 3, the both ends of aluminum alloy connecting strip 8 all are provided with the portion of inserting 9 that pairs mutually with insertion groove 7, insertion portion 9 inserts in the insertion groove 7, aluminum alloy connecting strip 8 is connected through portion of inserting 9 and insertion groove 7 with heat conduction frame 3, aluminum alloy connecting strip 8 is hugged closely with display panel 1's flexible circuit board.
In this embodiment, the aluminum alloy connecting strip 8 is coated with a heat conducting paint layer (not shown) on the outer surface.
In this embodiment, the heat conducting frame is composed of, by weight, 30 parts of nano silver, 68 parts of aluminum nitride, 22 parts of tetrapod-like zinc oxide whiskers, 8 parts of calcium boride, 136 parts of red copper powder, 4 parts of calcium lignosulfonate, 4 parts of sodium benzene sulfinate, 3 parts of stannous chloride, 30 parts of phenolic resin powder, 42 parts of liquid nitrile rubber, 6 parts of ethylene bis stearamide, 7 parts of zinc stearate, 4 parts of diphenyl toluene phosphate, and 4 parts of decabromodiphenyl ether.
The invention also provides a preparation method of the heat conduction frame, which is characterized by comprising the following steps:
1) pouring 30 parts of phenolic resin powder, 42 parts of liquid nitrile rubber, 3 parts of stannous chloride and 7 parts of zinc stearate into a reaction kettle, and carrying out heating and stirring treatment, wherein the heating temperature is 75 ℃, the stirring speed is 50r/min, and the heating and stirring time is 2 hours, so as to prepare a mixed solution for later use;
2) 30 parts of nano silver, 68 parts of aluminum nitride, 22 parts of tetrapod-like zinc oxide whiskers, 8 parts of calcium boride and 136 parts of red copper powder are poured into a mixer together for mixing treatment, so that the materials are uniformly mixed to prepare a mixed material for later use;
3) mixing the mixed solution prepared in the step 1). Pouring the mixed material prepared in the step 2), 4 parts of calcium lignosulphonate, 4 parts of sodium benzene sulfinate, 6 parts of ethylene bis stearamide, 4 parts of diphenyl cresyl phosphate and 4 parts of decabromodiphenyl ether into an injection molding machine, extruding the materials into a mold by adopting an injection molding process, cooling and demolding to obtain the heat conducting frame.
Example 3
As shown in fig. 1-5, a display screen module with high heat dissipation efficiency comprises a display panel 1, a heat dissipation panel and a heat conduction frame 3, wherein the heat dissipation panel comprises a metal heat conduction layer 4 and a graphite heat conduction layer 5, one side of the graphite heat conduction layer 5 is bonded with the front side of the metal heat conduction layer 4, the other side of the graphite heat conduction layer 5 is bonded with the back side of the display panel 1, the heat conduction frame 3 is in a shape, the display panel 1 and the heat dissipation panel are both inserted into the heat conduction frame 3, the side surfaces of the display panel 1 and the heat dissipation panel are both bonded with the heat conduction frame 3, the upper surface of the heat conduction frame 3 is flush with the front side of the display panel 1, the heat conduction frame 3 wraps the side surface and the lower bottom surface of the display panel 1, a graphene film 6 is arranged on the back side of a flexible circuit board of the display panel 1, and one, the other side of the graphene film is attached to a metal heat conduction layer 4, and the heat conduction frame is composed of 25 parts of nano-silver, 66 parts of aluminum nitride, 21 parts of tetrapod-shaped zinc oxide whiskers, 6 parts of calcium boride, 120 parts of red copper powder, 3 parts of calcium lignosulfonate, 3 parts of sodium benzene sulfinate, 2 parts of stannous chloride, 25 parts of phenolic resin powder, 36 parts of liquid nitrile rubber, 5 parts of ethylene bis stearamide, 5 parts of zinc stearate, 3 parts of diphenyl toluene phosphate and 3 parts of decabromodiphenyl ether in parts by weight.
In this embodiment, the inner side of the heat conducting frame 3 is provided with an insertion groove 7 matched with the heat dissipating panel, two sides and the lower bottom surface of the heat dissipating panel are inserted into the insertion groove 7, and the heat dissipating panel is in interference fit with the insertion groove 7.
In this embodiment, still be provided with aluminum alloy connecting strip 8 on the heat conduction frame 3, the both ends of aluminum alloy connecting strip 8 all are provided with the portion of inserting 9 that pairs mutually with insertion groove 7, insertion portion 9 inserts in the insertion groove 7, aluminum alloy connecting strip 8 is connected through portion of inserting 9 and insertion groove 7 with heat conduction frame 3, aluminum alloy connecting strip 8 is hugged closely with display panel 1's flexible circuit board.
In this embodiment, the aluminum alloy connecting strip 8 is coated with a heat conducting paint layer (not shown) on the outer surface.
In this embodiment, the heat conducting frame is composed of, by weight, 25 parts of nano silver, 66 parts of aluminum nitride, 21 parts of tetrapod-like zinc oxide whiskers, 6 parts of calcium boride, 120 parts of red copper powder, 3 parts of calcium lignosulfonate, 3 parts of sodium benzene sulfinate, 2 parts of stannous chloride, 25 parts of phenolic resin powder, 36 parts of liquid nitrile rubber, 5 parts of ethylene bis stearamide, 5 parts of zinc stearate, 3 parts of diphenyl toluate phosphate, and 3 parts of decabromodiphenyl ether.
The invention also provides a preparation method of the heat conduction frame, which is characterized by comprising the following steps:
1) pouring 25 parts of phenolic resin powder, 36 parts of liquid nitrile rubber, 2 parts of stannous chloride and 5 parts of zinc stearate into a reaction kettle, and heating and stirring at the temperature of 70 ℃ at the stirring speed of 40r/min for 1h to prepare a mixed solution for later use;
2) pouring 25 parts of nano silver, 66 parts of aluminum nitride, 21 parts of tetrapod-like zinc oxide whiskers, 6 parts of calcium boride and 120 parts of red copper powder into a mixer together for mixing treatment, so that the materials are uniformly mixed to prepare a mixed material for later use;
3) mixing the mixed solution prepared in the step 1). Pouring the mixed material prepared in the step 2), 3 parts of calcium lignosulphonate, 3 parts of sodium benzene sulfinate, 5 parts of ethylene bis stearamide, 3 parts of diphenyl cresyl phosphate and 3 parts of decabromodiphenyl ether into an injection molding machine, extruding the materials into a mold by adopting an injection molding process, cooling and demolding to obtain the heat conducting frame.
The invention also provides a terminal which is characterized by comprising the display screen module with high-efficiency heat dissipation.
And the heat conduction frame of the high-efficiency heat dissipation display screen module is bonded with the shell of the terminal.
The invention has the beneficial effects that: through being provided with heat dissipation panel at the display panel back, can make on heat that display panel produced can transmit heat dissipation panel, prevent that the heat from piling up, still dispose the heat conduction frame simultaneously for the heat can be further transmit on the heat conduction frame, however the upper surface of heat conduction frame is equal mutually with display panel's front, and installation back heat conduction frame and external contact can be with heat transfer external, prevent that the heat from piling up in inside, can play outstanding radiating effect.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention.
Claims (7)
1. The utility model provides a high-efficient radiating display screen module which characterized in that: the heat dissipation panel comprises a display panel, a heat dissipation panel and a heat conduction frame, wherein the heat dissipation panel comprises a metal heat conduction layer and a graphite heat conduction layer, one side of the graphite heat conduction layer is bonded with the front side of the metal heat conduction layer, the other side of the graphite heat conduction layer is bonded with the back side of the display panel, the heat conduction frame is in a type setting, the display panel and the heat dissipation panel are inserted into the heat conduction frame, the side surfaces of the display panel and the heat dissipation panel are bonded with the heat conduction frame, the upper surface of the heat conduction frame is flush with the front side of the display panel, the heat conduction frame wraps the side surface and the lower bottom surface of the display panel, a graphene film is arranged on the back side of a flexible circuit board of the display panel, one side of the graphene film is bonded with the flexible circuit board of the display panel, the other side of the graphene, 45-68 parts of aluminum nitride, 19-22 parts of tetrapod-like zinc oxide whiskers, 4-8 parts of calcium boride, 109-136 parts of red copper powder, 2-4 parts of calcium lignosulfonate, 2-4 parts of sodium benzene sulfinate, 1-3 parts of stannous chloride, 20-30 parts of phenolic resin powder, 30-42 parts of liquid nitrile rubber, 4-6 parts of ethylene bis stearamide, 4-7 parts of zinc stearate, 1-4 parts of diphenyl toluate phosphate and 2-4 parts of decabromodiphenyl ether.
2. The display screen module with high heat dissipation efficiency as recited in claim 1, wherein: the inboard of heat conduction frame is provided with the insertion groove that matees with the cooling panel, the both sides and the lower bottom surface of cooling panel all insert in the insertion groove, cooling panel and insertion groove interference fit.
3. The efficient heat dissipation display screen module according to claim 2, wherein: still be provided with the aluminum alloy connecting strip on the heat conduction frame, the both ends of aluminum alloy connecting strip all are provided with the portion of inserting that pairs mutually with the inserting groove, the portion of inserting inserts in the inserting groove, the aluminum alloy connecting strip passes through the portion of inserting and the inserting groove is connected with the heat conduction frame, the aluminum alloy connecting strip is hugged closely with display panel's flexible circuit board.
4. The display screen module with high heat dissipation efficiency as set forth in claim 3, wherein: the outer surface of the aluminum alloy connecting strip is coated with a heat conduction coating layer.
5. The display screen module with high heat dissipation efficiency as recited in claim 4, wherein: the heat conducting frame is composed of 20 parts of nano-silver, 45 parts of aluminum nitride, 19 parts of tetrapod-like zinc oxide whiskers, 4 parts of calcium boride, 109 parts of red copper powder, 2 parts of calcium lignosulfonate, 2 parts of sodium benzene sulfinate, 1 part of stannous chloride, 20 parts of phenolic resin powder, 30 parts of liquid nitrile rubber, 4 parts of ethylene bis stearamide, 4 parts of zinc stearate, 1 part of diphenyl cresyl phosphate and 2 parts of decabromodiphenyl ether according to the weight parts.
6. A terminal, characterized in that, it comprises the display screen module with high heat dissipation efficiency as claimed in any one of claims 1-5.
7. A terminal according to claim 6, characterized in that: and the heat conduction frame of the high-efficiency heat dissipation display screen module is bonded with the shell of the terminal.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN207070536U (en) * | 2016-10-31 | 2018-03-02 | 深圳众思科技有限公司 | Assembling structure and terminal |
| CN109790597A (en) * | 2016-10-05 | 2019-05-21 | 株式会社神户制钢所 | The manufacturing method of heat dissipation element copper alloy plate, heat dissipation element and heat dissipation element |
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| CN100530747C (en) * | 2004-04-08 | 2009-08-19 | 友达光电股份有限公司 | Organic emitting display |
| CN202601606U (en) * | 2012-05-29 | 2012-12-12 | 昆山汉品电子有限公司 | Combined heat-conducting fin |
| CN104894435A (en) * | 2015-04-29 | 2015-09-09 | 安徽顺彤包装材料有限公司 | Diamond-doped aluminum-based composite heat radiation material and preparation method thereof |
| CN208172426U (en) * | 2017-11-17 | 2018-11-30 | 深圳市康凌源科技有限公司 | A kind of water proof type liquid crystal display |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109790597A (en) * | 2016-10-05 | 2019-05-21 | 株式会社神户制钢所 | The manufacturing method of heat dissipation element copper alloy plate, heat dissipation element and heat dissipation element |
| CN207070536U (en) * | 2016-10-31 | 2018-03-02 | 深圳众思科技有限公司 | Assembling structure and terminal |
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