CN202601606U

CN202601606U - Combined heat-conducting fin

Info

Publication number: CN202601606U
Application number: CN 201220244367
Authority: CN
Inventors: 邓联文; 徐丽梅
Original assignee: HANPING (KUNSHAN) ELECTRONIC CO Ltd
Current assignee: HANPING (KUNSHAN) ELECTRONIC CO Ltd
Priority date: 2012-05-29
Filing date: 2012-05-29
Publication date: 2012-12-12
Anticipated expiration: 2022-05-29

Abstract

The utility model relates to a combined heat-conducting fin. The combined heat-conducting fin comprises a metal heat-conducting layer, wherein a graphite heat-conducting layer is coated on the bottom of the metal heat-conducting layer. The combined heat-conducting fin is used for rapid heat conduction of a heat source in an electronic device. The heat source in the electronic device is produced in a chip and converges to a point, and the temperature of the heat source in the electronic device can be quickly lowered by utilizing the combined heat-conducting fin.

Description

Composite heat-conducting fin

Technical field

The utility model relates to a kind of composite heat-conducting fin.

Background technology

High speed development along with electronic industry; Modern society's electronic installation is more and more universal; More and more like household electronic device, industrial electronics device and information communication devices such as PC, mobile phone, server, GPS navigation devices, function is more and more and powerful.Electronic apparatus functions is more and more to be reached from strength to strength, and its inside chip or electronic module are also more and more accordingly, and the speed of service is more and more faster.The inside chip or the electronic module speed of service are more and more faster, and the heat of generation is also more and more, and the heat energy that is collected in chip point or electronic module point is also more and more.Add the weak point of electronic installation, thin, light, littleization; So that in minimum space, to place considerable chip like this or electronic module; Short thin light little space can't or be difficult to go out heat conduction by fan is set merely; And chip or electronic module at high temperature can reduce service behaviour, shorten working life.Under the development trend of such electronic industry, certainly will to there be heat conducting material to come out resulting from the thermal energy conduction that produces when chip or electronic module are worked.Traditional heat conductive silica gel is a mode, and the heat conductive silica gel benefit is compressible, but heat conductive silica gel is compared metals such as copper, and heat conduction is too slow, and the fan of will arranging in pairs or groups usually, when requiring to reduce temperature fast and the space have in limited time and just seem powerless.The heat-conductive characteristic of simple copper is very good, but in current material, conductive coefficient surpasses also having of copper, and like diamond, silver, the conductive coefficient of graphite (graphite and diamond are the allotrope of graphite) just surpass copper.Diamond is too high with the cost of silver, can't sizable application, and simple graphite graphite surface conductive coefficient is to surpass copper, but Z is common just not as metals such as copper to the conductive coefficient of (thickness direction), the not high puzzlement of too crisp easy fracture yield in the processing of graphite scale.

The utility model content

For solving above-mentioned technological puzzlement problem, the utility model provides a kind of brand-new composite heat-conducting fin, and both excellent heat conducting performances of its bond and graphite, and the toughness ease of processing of metal very easily are processed into required form during sizable application, greatly improve yield.

The composite heat-conducting fin of the utility model comprises the metal heat-conducting layer, and the bottom of metal heat-conducting layer scribbles the graphite heat conducting layer.

Further, said metal heat-conducting layer and graphite heat conducting layer are compound one, and the non-composite surface of graphite heat conducting layer or metal thermosphere can optionally be provided with glue-line as thin as a wafer.

The gross thickness of the composite heat-conducting fin of the utility model is not less than 0.005mm.

With existing heat conducting material compared with techniques; The beneficial effect of the utility model is: the composite heat-conducting fin of the utility model, both excellent heat conducting performances of bond and graphite, and the toughness ease of processing of metal; Very easily be processed into required form during sizable application, greatly improve yield.

Description of drawings

Fig. 1 is the structural representation of the described a kind of composite heat-conducting fin of the utility model embodiment.

The implication of Reference numeral among the figure:

1, metal heat-conducting layer; 2, graphite heat conducting layer.

Embodiment

Below in conjunction with accompanying drawing and embodiment, the embodiment of the utility model is described in further detail.Following examples are used to explain the utility model, but are not used for limiting the scope of the utility model.

As shown in Figure 1; A kind of composite heat-conducting fin comprises metal heat-conducting layer 1, and the metal of this metal heat-conducting layer can be copper, nickel, silver, tin, zinc, iron, lithium, magnesium or these metal alloys; The top of metal heat-conducting layer 1 is a conductor, can optionally stick insulating barrier and glue-line.

The bottom of metal heat-conducting layer 1 and graphite heat conducting layer 2 are compound in one, and this graphite heat conducting layer 2 is electrographite or native graphite, and insulating barrier and glue-line can optionally be sticked in the bottom of graphite heat conducting layer 2.The composite heat conducting material sheet gross thickness of the utility model is not less than 0.005mm.The separated type material layer of composite heat-conducting fin is release liners or mould release membrance.When the full composite heat-conducting fin of the utility model specifically uses, can combine actual needs to paste glue-line as thin as a wafer at the non-composite surface of graphite heat conducting layer or metal heat-conducting layer.

The above only is the preferred implementation of the utility model; Should be pointed out that technical staff, under the prerequisite that does not break away from the utility model know-why for the present technique field; Can also make some improvement and modification, these improvement and modification also are regarded as the protection range of the utility model.

Claims

1. a composite heat-conducting fin comprises metal heat-conducting layer (1), it is characterized in that: metal heat-conducting layer (1) bottom scribbles graphite heat conducting layer (2).

2. composite heat-conducting fin according to claim 1 is characterized in that: the top surface of said metal heat-conducting layer (1) is a conductor, can stick insulating barrier and glue-line.

3. composite heat-conducting fin according to claim 1 is characterized in that: the gross thickness of described composite heat-conducting fin is not less than 0.005mm.

4. composite heat-conducting fin according to claim 1 is characterized in that: the top of said graphite heat conducting layer (2) and metal heat-conducting layer (1) are compound in one, and insulating barrier and glue-line can be sticked in the bottom of graphite heat conducting layer (2).

5. composite heat-conducting fin according to claim 1 is characterized in that: the metal of said metal heat-conducting layer (1) is copper, aluminium, nickel, silver, tin, zinc, iron, lithium, magnesium or these metal alloys.

6. composite heat-conducting fin according to claim 1, said graphite heat conducting layer (2) is electrographite or native graphite.