CN204993472U - Mobile terminal with front camera and large LCD - Google Patents
Mobile terminal with front camera and large LCD Download PDFInfo
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- CN204993472U CN204993472U CN201520509787.4U CN201520509787U CN204993472U CN 204993472 U CN204993472 U CN 204993472U CN 201520509787 U CN201520509787 U CN 201520509787U CN 204993472 U CN204993472 U CN 204993472U
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- heat
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- mainboard
- mobile terminal
- back cover
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Abstract
The utility model discloses a mobile terminal with front camera and large LCD, it includes mainboard, mainboard supporting member and the backshell that is used for installing the chip, the backshell sets up the one side of keeping away from the mainboard in the chip, sets up the heat -conducting layer between chip and the backshell, sets up first heat dissipation layer between backshell and the heat -conducting layer, sets up first insulating layer between first heat dissipation layer and the backshell. The utility model discloses a mobile terminal with front camera and large LCD can be through the heat -conducting layer with its most heat orientation heat dissipation layer transmission heat dissipation to make heat on the heat dissipation layer towards mobile terminal with front camera and large LCD's transmission all around through the insulating layer, reduce and transmit the heat on mainboard supporting member and the backshell.
Description
Technical field
The utility model relates to technical field of electronic equipment, particularly relates to a kind of mobile terminal.
Background technology
The mobile terminals such as current mobile phone, in order to coordinate market demand, more and more develop to thin, lightization.And the mobile terminal such as thin, lightization mobile phone is faced with the problem of intensity and heat radiation.Mobile phone is thinner, the center of mobile phone or shell just more need the material of high strength to make, existing mobile phone center adopts stainless steel to make usually, but stainless radiating effect is not good, and due to the thinner thickness of mobile phone, heat on mainboard is easily delivered to panel and back cover, make panel and back cover hot, bring bad experience to consumer.
Therefore, in order to coordinate development that is thin, lightization mobile terminal, need high, the good heat dissipation effect of a kind of intensity of design and the good mobile terminal of Consumer's Experience badly.
Utility model content
An object of the present utility model is to provide a kind of mobile terminal, and its structure is simple, good heat dissipation effect.
Another object of the present utility model is to provide a kind of mobile terminal, and its intensity is high.
Another object of the present utility model is to provide a kind of mobile terminal, the heat major part that chip can produce by it is delivered to the surrounding of mobile terminal by heat dissipating layer, reduce the heat be delivered on the back cover of mobile terminal and panel, the experience effect of adding users.
For reaching this object, the utility model by the following technical solutions:
A kind of mobile terminal is provided, it comprises for the mainboard of chip, mainboard supporting member and back cover, described back cover is arranged at the side of described chip away from described mainboard, between described chip and described back cover, heat-conducting layer is set, first heat dissipating layer is set between described back cover and described heat-conducting layer, between described first heat dissipating layer and described back cover, the first thermal insulation layer is set.
The beneficial effects of the utility model are: mobile terminal of the present utility model by arranging heat-conducting layer between chip and back cover, heat dissipating layer and thermal insulation layer is set gradually between heat-conducting layer and back cover, by heat-conducting layer, most of heat of mobile terminal can be transmitted towards the side away from mainboard supporting member, namely heat major part is dispelled the heat towards heat dissipating layer transmission, reduce the heat be delivered on mainboard supporting member, and make the heat on heat dissipating layer towards the surrounding transmission of mobile terminal by thermal insulation layer, reduce the heat be delivered on mainboard supporting member and back cover.
Accompanying drawing explanation
Fig. 1 is the exploded perspective view of the mobile terminal described in the utility model embodiment.
The structural representation (when back cover is separated) that Fig. 2 is the mobile terminal described in the utility model embodiment.
Fig. 3 is the cross-sectional schematic of the mobile terminal described in the utility model one embodiment.
Fig. 4 is the cross-sectional schematic of the mobile terminal described in another embodiment of the utility model.
Fig. 5 is the cross-sectional schematic of the mobile terminal described in another embodiment of the utility model.
Fig. 6 is the cross-sectional schematic of the mobile terminal described in another embodiment of the utility model.
Fig. 7 is the cross-sectional schematic of the mobile terminal described in another embodiment of the utility model.
Fig. 8 is the cross-sectional schematic of the mobile terminal described in another embodiment of the utility model.
Fig. 9 is the cross-sectional schematic of the mobile terminal described in another embodiment of the utility model.
In Fig. 1 to 9:
1, panel; 2, mainboard supporting member; 3, mainboard; 4, back cover; 5, chip; 51, PMU module; 52, CPU module; 53, MCP module; 6, heat-conducting layer; 7, thermal insulation layer; 8, heat insulation gap; 9, heat dissipating layer.
Embodiment
The technical solution of the utility model is further illustrated by embodiment below in conjunction with accompanying drawing.
Fig. 3 is the structure cross-sectional schematic of the mobile terminal that the utility model one embodiment provides.As shown in Figure 3, in the present embodiment, mobile terminal comprises for the mainboard 3 of chip 5, mainboard supporting member 2 and back cover 4, described back cover 4 is arranged at the side of described chip 5 away from described mainboard 3, between described chip 5 and described back cover 4, heat-conducting layer 6 is set, first heat dissipating layer 7 is set between described back cover 4 and described heat-conducting layer 6, between described first heat dissipating layer 7 and described back cover 4, first thermal insulation layer 8 is set.By arranging heat-conducting layer 6 between chip 5 and back cover 4, and the first heat dissipating layer 7 is also set between heat-conducting layer 6 and back cover 4, by heat-conducting layer 6, most of heat of mobile terminal can be transmitted towards the side away from mainboard supporting member 2, namely heat major part transmits heat radiation towards the first heat dissipating layer 7, reduce the heat be delivered on mainboard supporting member 2, make the heat on the first heat dissipating layer 7 towards the surrounding transmission of mobile terminal by the first thermal insulation layer 8 simultaneously, reduce the heat be delivered on back cover 4.User is when using this mobile terminal, the heat sent due to chip 5 is most of by the surrounding transmission of the first heat dissipating layer 7 towards mobile terminal, and the heat be delivered on back cover 4 and mainboard supporting member 3 is few, further increase user's experience effect in use.
As shown in Figure 1, 2, 3, in the present embodiment, mobile terminal is mobile phone, mainboard 3 adopts pcb board, mainboard supporting member 2 also can be described as the center of mobile terminal, and in order to ensure higher structural strength, mainboard supporting member 2 (i.e. center) adopts stainless steel to make, chip 5 is included as the PMU unit 51 that system and modules carry out powering, the CPU element 52 of the communication requirement of process modules and assistance CPU element 52 carry out the MCP unit 53 of data processing, PMU unit 51, CPU element 52 and MCP unit 53 are all parts that on mainboard 3, caloric value is larger, certainly in other embodiments of the present utility model, mobile terminal also can be panel computer, Wearable terminal etc., mainboard 3 can also adopt flexible circuit board (FPC) etc., chip 5 can also comprise except PMU unit 51, other heat generating components beyond CPU element 52 and MCP unit 53.
Back cover 4 of the present utility model adopts the metal with higher-strength to make.In an embodiment of the present utility model, described back cover 4 adopts stainless steel to make.By adopting stainless steel to make back cover 4, the intensity of mobile terminal can be ensured.
As shown in Figure 3, in the present embodiment, the described size of the first heat dissipating layer 7 and the size of described back cover 4 match.The heat sent to make chip 5 can be delivered to the surrounding of mobile terminal smoothly by the first heat dissipating layer 7, the size of the first heat dissipating layer 7 can be arranged and match with the size of back cover 4, namely the first heat dissipating layer 4 can be covered with the side of back cover near chip.
As shown in Figure 3, in the present embodiment, described first thermal insulation layer 8 is set in the position of described first heat dissipating layer 7 described chip 5 corresponding between described back cover 4.By arranging the first thermal insulation layer 8 in the position of chip 5 correspondence, the heating region of chip 5 is isolated by the first thermal insulation layer 8, namely the heat that chip 5 sends can not be delivered on back cover 4 by the first heat dissipating layer 7, and the first heat dissipating layer 7 does not also directly contact with the position not being provided with the first thermal insulation layer 8 between back cover 4, reduces the temperature on back cover 4.
As shown in Figure 4, in the present embodiment, described first thermal insulation layer 8 is covered with the side of described back cover 4 near described chip 5.By the first thermal insulation layer 8 is covered with the side of back cover 4 near chip 5, make the first heat dissipating layer 7 completely isolated by the first thermal insulation layer 8 with back cover 4, the heat namely on the first heat dissipating layer 7 can not be delivered on back cover 4.
As shown in Figure 5, in the present embodiment, described mainboard supporting member 2 arranges the second thermal insulation layer 9 near the side of described mainboard 3.Mobile terminal in use, although the heat major part that chip 5 sends exports on the first heat dissipating layer 7 by heat-conducting layer 6, but also have partial heat can be delivered on mainboard supporting member 2 by mainboard 3, therefore at mainboard supporting member 2, second thermal insulation layer 9 is set near the side of mainboard 3, can make mainboard supporting member 2 completely and mainboard 3 isolate, heat on mainboard 3 also cannot be delivered on mainboard supporting member 3, improves Consumer's Experience.
As shown in Figure 6, in the present embodiment, described mainboard supporting member 2 arranges the second thermal insulation layer 9 away from the side of described mainboard 3.Mobile terminal in use, although the heat major part that chip 5 sends exports on the first heat dissipating layer 7 by heat-conducting layer 6, but also have partial heat can be delivered on mainboard supporting member 2 by mainboard 3, and then other parts of its mobile terminal away from the side of mainboard 3 are delivered to by mainboard supporting member 2, such as, on panel, therefore at mainboard supporting member 2, second thermal insulation layer 9 is set away from the side of mainboard 3, can make mainboard supporting member 2 completely and mainboard supporting member 2 isolate away from other parts of the mobile terminal of the side of mainboard 3, heat on mainboard 3 also cannot be delivered on other parts of mobile terminal by mainboard supporting member 3.Preferably, described second thermal insulation layer 9 is covered with described mainboard supporting member 2 near a side of described mainboard 3 or the side that is covered with away from described mainboard 3.
In an embodiment of the present utility model, between described mainboard 3 and described second thermal insulation layer 9, second heat dissipating layer 10 is set.As shown in Figure 7, in the present embodiment, described second heat dissipating layer 10 is arranged on the side of described mainboard supporting member 2 near described mainboard 3, and between described mainboard 3 and described second thermal insulation layer 9.Because most of heat of chip 5 is only passed to the first heat dissipating layer 7 by heat-conducting layer 6, and the partial heat of remainder can be delivered to the side of mainboard 3 away from chip 5 by mainboard 3, the surrounding that heat on mainboard 3 can be passed to mobile terminal by the second heat dissipating layer 10 is set, and then dispel the heat, improve radiating efficiency.As shown in Figure 8, the second heat dissipating layer 10 can also be arranged on mainboard supporting member 2 away from the side of mainboard 3 and between mainboard supporting member 2 and the second thermal insulation layer 9.The position of the second heat dissipating layer 10 can be arranged on the side of mainboard supporting member 2 near mainboard 3, also the side of mainboard supporting member 2 away from mainboard 3 can be arranged on, only need the position of guarantee second heat dissipating layer 10 between mainboard 3 and the second heat dissipating layer, therefore the second heat dissipating layer 10 needs heat remaining on mainboard 3 to pass out.
In an embodiment of the present utility model, first heat dissipating layer 7 and the second heat dissipating layer 10 can be all graphite radiating layer, graphite is carbonaceous element crystalline mineral, its crystallization screen work is hexagon layer structure, belong to hexagonal crystal system, the stratiform cleavage that tool is complete, cleavage surface is based on molecular link, more weak to van der Waals' force, therefore its native floatability is fine.Graphite has the following advantages: (1), heat-resisting quantity: the fusing point of graphite is 3850 ± 50 DEG C, boiling point is 4250 DEG C, even if through the calcination of superhigh temperature electric arc, the loss of weight is very little, thermal coefficient of expansion is also very little, graphite intensity temperature improves and strengthens, and 2000 DEG C time, graphite intensity doubles; (2), conduction, thermal conductivity are good: the conductivity of graphite is higher than general nonmetallic ore 100 times, and thermal conductivity exceedes the metal materials such as steel, iron, lead, and conductive coefficient raises with temperature and reduces, and even at very high temperatures, graphite becomes heat guard; (3), lubrification is good: the greasy property of graphite depends on the size of graphite flakes, and scale is larger, and coefficient of friction is less, and greasy property is better; (4) chemical stability: graphite has good chemical stability at normal temperatures, can the corrosion of acidproof, alkaline-resisting and organic solvent-resistant; (5), plasticity: the good toughness of graphite, can be ground into very thin thin slice; (6), thermal shock resistance: be able to take the acute variation of temperature and unlikely destruction when graphite uses at normal temperatures, during temperature jump, the change in volume of graphite is little, can not crack.
In another embodiment of the present utility model, the first heat dissipating layer 7 and the second heat dissipating layer 10 can also be Copper Foil heat dissipating layer, and Copper Foil adds other metal a certain proportion of by copper and makes and form, and Copper Foil generally has 90 paper tinsels and two kinds, 88 paper tinsels, and being copper content is 90% and 88%.In a metal, the thermal conductivity of copper is best, and its coefficient of heat conduction is 401W/mK, and therefore adopt Copper Foil to make heat radiation, 9, the heat that heat-conducting layer 6 can be made to pass over exhales as far as possible at short notice, ensures the normal use of mobile terminal.
In another embodiment of the present utility model, first heat dissipating layer 7 and the second heat dissipating layer 10 can also be aluminum alloy heat radiation layer, the heat conductivility of aluminium is only second to copper, and be far more than iron, the coefficient of heat conduction of aluminium is 237W/mK, and the coefficient of heat conduction of iron is 80W/mK, therefore also can accelerate heat radiation with the heat dissipating layer 9 that aluminium alloy is made, improve radiating efficiency, ensure the normal use of mobile terminal.
Fig. 9 is the structure cross-sectional schematic of the mobile terminal provided in another embodiment of the present utility model.As shown in Figure 9, in the present embodiment, at described mainboard supporting member 2, panel 1 is set away from the side of described mainboard 3, described second thermal insulation layer 9 is set between described panel 1 and described mainboard supporting member 2.By arranging the second thermal insulation layer 9 at mainboard supporting member 2 away from the side of described mainboard 3, the heat that chip 5 sends is isolated by the second thermal insulation layer 9 being delivered to by mainboard 3 after on mainboard supporting member 2, namely heat can not be delivered on panel 1, when user makes a phone call, panel 1 can not generate heat, and has good customer experience.
In an embodiment of the present utility model, described heat-conducting layer 6 adopts phase-change material layers.The characteristic of phase-change material makes its physical state after being heated to change, and then fully can fill the gap of contact-making surface, namely heat-conducting layer 6 can be filled in each gap of needs heat radiation in the state of flowing after being heated, and increases heat-conducting area, accelerates heat transfer speed.Described phase-change material layers is any one in inorganic PCM layer, organic PCM layer or compound PCM layer.Mineral-type PCM mainly contains crystalline hydrate salt, molten salts, metal or alloy class etc.; Organic PCM mainly comprises paraffin, acetic acid and other organic substances; Compound PCM layer is organic PCM and inorganic PCM mixes, and composite phase-change heat-storage material effectively can overcome the shortcoming of single inorganic matter or the existence of organic substance phase-change heat-storage material, can improve again the effect of phase-change material and expand its range of application.Therefore, the hot research problem that composite phase-change heat-storage material has become heat accumulating field is developed.But combined phase-change material also may bring latent heat of phase change to decline, or in long-term phase transition process the shortcoming such as easy sex change.
In an embodiment of the present utility model, described first thermal insulation layer 8 and the second thermal insulation layer 9 are heat insulation foam.Heat insulation foam not only can reach heat insulation effect; panel 1 and back cover 4 safety in use can also be protected; because heat insulation foam has certain cushioning effect; time panel 1 and back cover 4 are in use subjected to external impact; outside active force is delivered on heat insulation foam by panel 1 and back cover 4; undertaken cushioning, disperseing by heat insulation foam, can the safety of available protecting panel 1 and back cover 4 and terminal inner components and parts.
As shown in Figure 9, in embodiment of the present utility model, between described mainboard 3 and described mainboard supporting member 2, there is heat insulation gap 11.Preferably, described heat insulation gap 11 is not less than 1mm.By arranging heat insulation gap 11 between mainboard supporting member 2 and mainboard 3, reduce mainboard 3 to amass with the direct contact surface of mainboard supporting member 2, further minimizing is delivered to the heat on mainboard supporting member 2 by mainboard 3, and coordinates heat-conducting layer 6 to guide the heat on mainboard 3 to shift towards the side away from mainboard supporting member 2.The described side away from mainboard supporting member 2 refers to the position arranging back cover 4.
As shown in Figure 9, in an embodiment of the present utility model, described heat-conducting layer 6 is fixed on described chip 5.Cross and heat-conducting layer 6 is fixed on chip 5, while chip 5 generates heat, heat can be absorbed rapidly, concurrent raw physical deformation, fill each corner on the surface of full chip 5.
" first " of the present utility model, " second " etc., only for being distinguished in description, not special implication.
Below know-why of the present utility model is described in conjunction with specific embodiments.These describe just in order to explain principle of the present utility model, and can not be interpreted as the restriction to the utility model protection range by any way.Based on explanation herein, those skilled in the art does not need to pay performing creative labour can associate other embodiment of the present utility model, and these modes all will fall within protection range of the present utility model.
Claims (10)
1. a mobile terminal, it is characterized in that, it comprises for the mainboard of chip, mainboard supporting member and back cover, described back cover is arranged at the side of described chip away from described mainboard, between described chip and described back cover, heat-conducting layer is set, first heat dissipating layer is set between described back cover and described heat-conducting layer, between described first heat dissipating layer and described back cover, the first thermal insulation layer is set.
2. mobile terminal according to claim 1, is characterized in that, the size of described first heat dissipating layer and the size of described back cover match.
3. mobile terminal according to claim 1, is characterized in that, arranges described first thermal insulation layer in the position of described first heat dissipating layer described chip corresponding between described back cover; Or described first thermal insulation layer is covered with the side of described back cover near described chip.
4. mobile terminal according to claim 1, is characterized in that, described mainboard supporting member arranges the second thermal insulation layer near the side of described mainboard; And/or described mainboard supporting member arranges the second thermal insulation layer away from the side of described mainboard.
5. mobile terminal according to claim 4, is characterized in that, arranges the second heat dissipating layer between described mainboard and described second thermal insulation layer.
6. mobile terminal according to claim 4, is characterized in that, described second thermal insulation layer is covered with described mainboard supporting member near a side of described mainboard or the side that is covered with away from described mainboard.
7. mobile terminal according to claim 5, is characterized in that, described first heat dissipating layer is graphite radiating layer, Copper Foil heat dissipating layer or aluminum alloy heat radiation layer; And/or described second heat dissipating layer is graphite radiating layer, Copper Foil heat dissipating layer or aluminum alloy heat radiation layer.
8. mobile terminal according to claim 4, is characterized in that, described first thermal insulation layer is heat insulation foam; And/or,
Described second thermal insulation layer is heat insulation foam.
9. the mobile terminal according to any one of claim 1 to 8, is characterized in that, described heat-conducting layer is phase-change material layers; And/or,
Described back cover adopts stainless steel to make; And/or,
Described mainboard supporting member adopts stainless steel to make.
10. the mobile terminal according to any one of claim 1 to 8, is characterized in that, has heat insulation gap between described mainboard and described mainboard supporting member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520509787.4U CN204993472U (en) | 2015-07-14 | 2015-07-14 | Mobile terminal with front camera and large LCD |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520509787.4U CN204993472U (en) | 2015-07-14 | 2015-07-14 | Mobile terminal with front camera and large LCD |
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| Publication Number | Publication Date |
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| CN204993472U true CN204993472U (en) | 2016-01-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520509787.4U Expired - Fee Related CN204993472U (en) | 2015-07-14 | 2015-07-14 | Mobile terminal with front camera and large LCD |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105072868A (en) * | 2015-07-14 | 2015-11-18 | 广东欧珀移动通信有限公司 | Mobile terminal and method for heat radiation of mobile terminal |
| CN106455441A (en) * | 2016-10-25 | 2017-02-22 | 南京中新赛克科技有限责任公司 | Efficient temperature control device for handheld terminal device |
| US10606327B2 (en) | 2017-06-16 | 2020-03-31 | Qualcomm Incorporated | Heat reduction using selective insulation and thermal spreading |
| WO2021213118A1 (en) * | 2020-04-23 | 2021-10-28 | 华为技术有限公司 | Mobile terminal |
-
2015
- 2015-07-14 CN CN201520509787.4U patent/CN204993472U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105072868A (en) * | 2015-07-14 | 2015-11-18 | 广东欧珀移动通信有限公司 | Mobile terminal and method for heat radiation of mobile terminal |
| WO2017008575A1 (en) * | 2015-07-14 | 2017-01-19 | 广东欧珀移动通信有限公司 | Mobile terminal and method for dissipating heat of said mobile terminal |
| CN105072868B (en) * | 2015-07-14 | 2018-04-27 | 广东欧珀移动通信有限公司 | Mobile terminal and the method to mobile terminal heat dissipation |
| CN106455441A (en) * | 2016-10-25 | 2017-02-22 | 南京中新赛克科技有限责任公司 | Efficient temperature control device for handheld terminal device |
| CN106455441B (en) * | 2016-10-25 | 2018-11-16 | 南京中新赛克科技有限责任公司 | A kind of high efficiency temperature controlled device of hand-held terminal device |
| US10606327B2 (en) | 2017-06-16 | 2020-03-31 | Qualcomm Incorporated | Heat reduction using selective insulation and thermal spreading |
| WO2021213118A1 (en) * | 2020-04-23 | 2021-10-28 | 华为技术有限公司 | Mobile terminal |
| CN114698336A (en) * | 2020-04-23 | 2022-07-01 | 华为技术有限公司 | Mobile terminal |
| EP4132244A4 (en) * | 2020-04-23 | 2023-09-13 | Huawei Technologies Co., Ltd. | Mobile terminal |
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Legal Events
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160120 |
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| CF01 | Termination of patent right due to non-payment of annual fee |