CN105072868B - Mobile terminal and the method to mobile terminal heat dissipation - Google Patents
Mobile terminal and the method to mobile terminal heat dissipation Download PDFInfo
- Publication number
- CN105072868B CN105072868B CN201510412407.XA CN201510412407A CN105072868B CN 105072868 B CN105072868 B CN 105072868B CN 201510412407 A CN201510412407 A CN 201510412407A CN 105072868 B CN105072868 B CN 105072868B
- Authority
- CN
- China
- Prior art keywords
- heat
- layer
- mainboard
- mobile terminal
- rear shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
The present invention discloses a kind of mobile terminal, it includes mainboard, mainboard supporting member and the rear shell for chip, rear shell is arranged at side of the chip away from mainboard, heat-conducting layer is set between chip and rear shell, first heat dissipating layer is set between rear shell and heat-conducting layer, first thermal insulation layer is set between the first heat dissipating layer and rear shell.Invention additionally discloses a kind of method to radiate to above-mentioned mobile terminal, by setting heat-conducting layer between rear shell and chip, heat dissipating layer and thermal insulation layer are set gradually between heat-conducting layer and rear shell, after the chip fever of mobile terminal, heat is by heat-conducting layer to heat dissipating layer transmission, due to there is provided thermal insulation layer, making heat pass through surrounding transmission of the heat dissipating layer to mobile terminal.The mobile terminal of the present invention can be radiated its most of heat towards heat dissipating layer transmission by heat-conducting layer, and make surrounding transmission of the heat on heat dissipating layer towards mobile terminal by thermal insulation layer, reduce the heat being delivered in mainboard supporting member and rear shell.
Description
Technical field
The present invention relates to technical field of electronic equipment, more particularly to a kind of mobile terminal and to mobile terminal heat dissipation
Method.
Background technology
The mobile terminal such as mobile phone more and more develops to coordinate market to need to thin, lightization at present.And it is thin, gently change mobile phone
The problem of intensity and heat dissipation being faced with Deng mobile terminal.Mobile phone is thinner, and the center or shell of mobile phone are just with greater need for the material of high intensity
Material is made, and existing mobile phone center generally use stainless steel is made, but the heat dissipation effect of stainless steel is bad, and due to the thickness of mobile phone
Spend relatively thin, the heat on mainboard is transmitted as readily to panel and rear shell, makes panel and rear shell hot, bad body is brought to consumer
Test.
Therefore, in order to coordinate the development of thin lightization mobile terminal, there is an urgent need for design a kind of high intensity, good heat dissipation effect and
The good mobile terminal of user experience.
The content of the invention
It is an object of the present invention to provide a kind of mobile terminal, its simple in structure, good heat dissipation effect.
It is another object of the present invention to provide a kind of mobile terminal, its intensity are high.
A further object of the present invention is to provide a kind of mobile terminal, and heat that it can produce chip is largely logical
The surrounding that heat dissipating layer is delivered to mobile terminal is crossed, reduces the heat being delivered in the rear shell and panel of mobile terminal, increases user
Experience effect.
For this purpose, the present invention uses following technical scheme：
A kind of mobile terminal is provided, it includes mainboard, mainboard supporting member and the rear shell for chip, the rear shell
Be arranged at side of the chip away from the mainboard, heat-conducting layer be set between the chip and the rear shell, the rear shell with
First heat dissipating layer is set between the heat-conducting layer, first thermal insulation layer is set between first heat dissipating layer and the rear shell.
A kind of method to radiate to above-mentioned mobile terminal is also provided, by setting heat-conducting layer between rear shell and chip,
Heat dissipating layer and thermal insulation layer are set gradually between heat-conducting layer and rear shell, after the chip fever of mobile terminal, heat passes through heat conduction
Layer is to heat dissipating layer transmission, due to there is provided thermal insulation layer, making heat pass through surrounding transmission of the heat dissipating layer to mobile terminal.
Beneficial effects of the present invention are：The present invention mobile terminal by setting heat-conducting layer between chip and rear shell,
Heat dissipating layer and thermal insulation layer are set gradually between heat-conducting layer and rear shell, can be by heat-conducting layer by most of heat court of mobile terminal
Transmitted to the side away from mainboard supporting member, i.e., heat is most of radiates towards heat dissipating layer transmission, and reduction is delivered to mainboard branch
The heat on component is supportted, and surrounding transmission of the heat on heat dissipating layer towards mobile terminal is made by thermal insulation layer, reduction is delivered to
Heat on mainboard supporting member and rear shell.
Brief description of the drawings
Fig. 1 is the exploded perspective view of the mobile terminal described in the embodiment of the present invention.
Fig. 2 is the structure diagram of the mobile terminal described in the embodiment of the present invention (when rear shell separates).
Fig. 3 is the schematic cross-sectional view of the mobile terminal described in one embodiment of the invention.
Fig. 4 is the schematic cross-sectional view of the mobile terminal described in another embodiment of the present invention.
Fig. 5 is the schematic cross-sectional view of the mobile terminal described in another embodiment of the present invention.
Fig. 6 is the schematic cross-sectional view of the mobile terminal described in another embodiment of the present invention.
Fig. 7 is the schematic cross-sectional view of the mobile terminal described in another embodiment of the present invention.
Fig. 8 is the schematic cross-sectional view of the mobile terminal described in another embodiment of the present invention.
Fig. 9 is the schematic cross-sectional view of the mobile terminal described in another embodiment of the present invention.
In Fig. 1 to 9：
1st, panel；2nd, mainboard supporting member；3rd, mainboard；4th, rear shell；5th, chip；51st, PMU modules；52nd, CPU module；53、
MCP modules；6th, heat-conducting layer；7th, the first heat dissipating layer；8th, first thermal insulation layer；9th, second thermal insulation layer；10th, the second heat dissipating layer；11st, it is heat-insulated
Gap.
Embodiment
Further illustrate technical scheme below with reference to the accompanying drawings and specific embodiments.
Fig. 3 is the structure schematic cross-sectional view for the mobile terminal that one embodiment of the invention provides.As shown in figure 3, in this implementation
In example, mobile terminal includes mainboard 3, mainboard supporting member 2 and the rear shell 4 for chip 5, and the rear shell 4 is arranged at institute
Side of the chip 5 away from the mainboard 3 is stated, heat-conducting layer 6, the rear shell 4 and institute are set between the chip 5 and the rear shell 4
State and the first heat dissipating layer 7 is set between heat-conducting layer 6, first thermal insulation layer 8 is set between first heat dissipating layer 7 and the rear shell 4.It is logical
The setting heat-conducting layer 6 between chip 5 and rear shell 4 is crossed, and the first heat dissipating layer 7, Ke Yitong is also set up between heat-conducting layer 6 and rear shell 4
Cross the side transmission that most of heat of mobile terminal is directed away from mainboard supporting member 2 by heat-conducting layer 6, i.e. heat major part court
Transmit and radiate to the first heat dissipating layer 7, reduce and be delivered to heat on mainboard supporting member 2, while make the by first thermal insulation layer 8
Heat on one heat dissipating layer 7 reduces the heat being delivered in rear shell 4 towards the surrounding transmission of mobile terminal.User should in use
During mobile terminal, due to the most of surrounding transmission by the first heat dissipating layer 7 towards mobile terminal of heat that chip 5 is sent, and
The heat being delivered in rear shell 4 and mainboard supporting member 3 is few, further increases the experience effect of user when in use.
As shown in Figure 1, 2, 3, in the present embodiment, mobile terminal is mobile phone, and mainboard 3 uses pcb board, mainboard supporting member
2 are alternatively referred to as the center of mobile terminal, and in order to ensure higher structural strength, mainboard supporting member 2 (i.e. center) is using stainless
Steel is made；Chip 5 is included as system and modules are powered PMU units 51, the communication requirement for handling modules
CPU element 52 and assist CPU element 52 carry out data processing MCP units 53, PMU units 51, CPU element 52 and
MCP units 53 are the components that caloric value is larger on mainboard 3, and certainly in other embodiments of the invention, mobile terminal also may be used
Think tablet computer, wearable terminal etc., mainboard 3 can also use flexible circuit board (FPC) etc., and chip 5 can also include removing
Other heat generating components beyond PMU units 51, CPU element 52 and MCP units 53.
The rear shell 4 of the present invention is made of the metal with higher-strength.In one embodiment of this invention, the rear shell
4 are made of stainless steel.By the way that rear shell 4 is made of stainless steel, it is ensured that the intensity of mobile terminal.
As shown in figure 3, in this present embodiment, the size of first heat dissipating layer 7 and the size of the rear shell 4 match.
In order to enable the heat that chip 5 is sent smoothly to be delivered to the surrounding of mobile terminal by the first heat dissipating layer 7, first can be dissipated
The size of thermosphere 7 sets the size with rear shell 4 to match, i.e., the first heat dissipating layer 4 can be covered with one side of the rear shell close to chip.
As shown in figure 3, in this present embodiment, the chip 5 is corresponded between first heat dissipating layer 7 and the rear shell 4
Position the first thermal insulation layer 8 is set.By setting first thermal insulation layer 8 in 5 corresponding position of chip so that the hair of chip 5
Thermal region is isolated by first thermal insulation layer 8, i.e., the heat that chip 5 is sent will not be delivered in rear shell 4 by the first heat dissipating layer 7, and
And first the position that first thermal insulation layer 8 is not provided between heat dissipating layer 7 and rear shell 4 be also not directly contacted with, reduce the temperature in rear shell 4
Degree.
As shown in figure 4, in this present embodiment, the first thermal insulation layer 8 is covered with the rear shell 4 close to the one of the chip 5
Side.By the way that first thermal insulation layer 8 is covered with one side of the rear shell 4 close to chip 5 so that the first heat dissipating layer 7 and rear shell 4 pass through the
One thermal insulation layer 8 is completely isolated, i.e., the heat on the first heat dissipating layer 7 is not transferred in rear shell 4.
As shown in figure 5, in this present embodiment, the mainboard supporting member 2 close to the side of the mainboard 3 set second every
Thermosphere 9.Mobile terminal when in use, although the heat that sends of chip 5 is largely exported to the first heat dissipating layer 7 by heat-conducting layer 6
On, but also partial heat can be delivered on mainboard supporting member 2 by mainboard 3, therefore in mainboard supporting member 2 close to main
The side of plate 3 sets second thermal insulation layer 9, and mainboard supporting member 2 can be made to isolate completely with mainboard 3, the heat on mainboard 3 also without
Method is delivered on mainboard supporting member 3, improves user experience.
As shown in fig. 6, in this present embodiment, side of the mainboard supporting member 2 away from the mainboard 3 set second every
Thermosphere 9.Mobile terminal when in use, although the heat that sends of chip 5 is largely exported to the first heat dissipating layer 7 by heat-conducting layer 6
On, but also partial heat can be delivered on mainboard supporting member 2 by mainboard 3, and then transmitted by mainboard supporting member 2
To other components of the mobile terminal of its side away from mainboard 3, such as on panel, therefore in mainboard supporting member 2 away from main
The side of plate 3 sets second thermal insulation layer 9, can make mainboard supporting member 2 completely with one of mainboard supporting member 2 away from mainboard 3
Other components of the mobile terminal of side are isolated, and the heat on mainboard 3 also can not be delivered to mobile terminal by mainboard supporting member 2
Other components on.Preferably, the second thermal insulation layer 9 is covered with one side of the mainboard supporting member 2 close to the mainboard 3
Or it is covered with the one side away from the mainboard 3.
In one embodiment of this invention, the second heat dissipating layer 10 is set between the mainboard 3 and the second thermal insulation layer 9.
As shown in fig. 7, in this present embodiment, second heat dissipating layer 10 is arranged on the mainboard supporting member 2 close to the mainboard 3
Side, and between the mainboard 3 and the second thermal insulation layer 9.Since heat-conducting layer 6 only passes most of heat of chip 5
Pass the first heat dissipating layer 7, and remaining partial heat can be delivered to side of the mainboard 3 away from chip 5 by mainboard 3, set the
Two heat dissipating layers 10 can be by the surrounding of the heat transfer on mainboard 3 to mobile terminal, and then radiates, and improves radiating efficiency.
As shown in figure 8, the second heat dissipating layer 10 can also be arranged on side of the mainboard supporting member 2 away from mainboard 3 and be supported positioned at mainboard
Between component 2 and second thermal insulation layer 9.The position of second heat dissipating layer 10 can be arranged on mainboard supporting member 2 close to the one of mainboard 3
Side, can also be arranged on side of the mainboard supporting member 2 away from mainboard 3, it is only necessary to ensure that the position of the second heat dissipating layer 10 is located at
Between mainboard 3 and second thermal insulation layer 9, therefore the second heat dissipating layer 10 needs remaining heat transfer on mainboard 3.
In one embodiment of this invention, the first heat dissipating layer 7 and the second heat dissipating layer 10 all can be graphite thermal layer, graphite
It is carbonaceous element crystalline mineral, its crystallization screen work is hexagon layer structure, belongs to hexagonal crystal system, has complete stratiform cleavage,
Cleavage surface is weaker to van der Waals' force based on molecular link, therefore its native floatability is fine.Graphite has the following advantages：(1)、
Heat-resisting quantity：The fusing point of graphite is 3850 ± 50 DEG C, and boiling point is 4250 DEG C, even if through superhigh temperature electric arc calcination, the loss of weight
Very little, also very little, graphite intensity are improved and strengthened thermal coefficient of expansion with temperature, and at 2000 DEG C, graphite intensity doubles；
(2), conduction, thermal conductivity are good：The electric conductivity of graphite is 100 times higher than general nonmetallic ore, and thermal conductivity exceedes the metals such as steel, iron, lead
Material, thermal conductivity factor are raised and reduced with temperature, or even at very high temperatures, graphite is into heat guard；(3), lubricity is good：Stone
The greasy property of ink depends on the size of graphite flakes, and scale is bigger, and friction coefficient is smaller, and greasy property is better；(4) chemistry is steady
It is qualitative：Graphite has good chemical stability at normal temperatures, can acidproof, alkaline-resisting and organic solvent-resistant corrosion；(5), plasticity：
The good toughness of graphite, can be ground into very thin thin slice；(6), thermal shock resistance：It is able to take the play of temperature when graphite uses at normal temperatures
Strong change and will not destroy, during temperature jump, the volume change of graphite is little, will not crack.
In another embodiment of the invention, the first heat dissipating layer 7 and the second heat dissipating layer 10 can also be copper foil heat dissipating layer, copper
Paper tinsel adds a certain proportion of other metals to make to form by copper, and copper foil generally has two kinds of 90 paper tinsels and 88 paper tinsels, is that copper content is 90%
With 88%.In a metal, the thermal conductivity of copper is best, its coefficient of heat conduction is 401W/mK, therefore is made and radiated of copper foil, and 9,
The heat that heat-conducting layer 6 passes over can be made to exhale in a short time as far as possible, ensure the normal use of mobile terminal.
In another embodiment of the present invention, the first heat dissipating layer 7 and the second heat dissipating layer 10 can also be aluminum alloy heat radiation layer,
The heat conductivility of aluminium is only second to copper, and is far more than iron, and the coefficient of heat conduction of aluminium is 237W/mK, and the coefficient of heat conduction of iron is
80W/mK, therefore the heat dissipating layer 9 made of aluminium alloy can also accelerate to radiate, and improve radiating efficiency, ensure the normal of mobile terminal
Use.
Fig. 9 is the structure schematic cross-sectional view of the mobile terminal provided in another embodiment of the present invention.As shown in figure 9, in
In the present embodiment, panel 1, the panel 1 and the master are set in side of the mainboard supporting member 2 away from the mainboard 3
The second thermal insulation layer 9 is set between plate supporting member 2.By being set in side of the mainboard supporting member 2 away from the mainboard 3
Second thermal insulation layer 9, the heat that chip 5 is sent after being delivered to by mainboard 3 on mainboard supporting member 2 by second thermal insulation layer 9 into
Row isolation, i.e., heat is not transferred on panel 1, and when user makes a phone call, panel 1 will not generate heat, and has good client's body
Test.
In one embodiment of this invention, the heat-conducting layer 6 uses phase-change material layers.The characteristic of phase-change material cause its
Physical state can change after heated, and then can be sufficient filling with the gap of contact surface, i.e., heat-conducting layer 6 be heated after can be in
In each gap that the state filling needs of flowing radiate, increase heat-conducting area, accelerate heat transfer speed.The phase-change material layers
For any one in inorganic PCM layer, organic PCM layer or compound PCM layer.Inorganic PCM mainly has crystalline hydrate salt, melting
Salt, metal or alloy class etc.；Organic PCM mainly includes paraffin, acetic acid and other organic matters；Compound PCM layer is as organic
PCM and inorganic PCM are mixed, and composite phase-change heat-storage material can effectively overcome single inorganic matter or organic matter phase-change thermal storage
Material there are the shortcomings that, and the application effect of phase-change material can be improved and expand its application range.Therefore, compound phase is developed
Change heat storage material has become the hot research problem in heat accumulating field.But combined phase-change material may also can bring phase transformation to dive
Heat declines, or in long-term phase transition process the shortcomings of easy denaturation.
In one embodiment of this invention, the first thermal insulation layer 8 and second thermal insulation layer 9 are heat-insulated foam.Heat-insulated bubble
Cotton can not only reach heat-insulated effect, safety that can be with protection panels 1 and rear shell 4 in use, because heat-insulated bubble
Cotton has certain cushioning effect, panel 1 and rear shell 4 in use by external impact when, exterior effect
Power is delivered on heat-insulated foam by panel 1 and rear shell 4, by heat-insulated foam into row buffering, scattered, can effectively protect panel 1
With rear shell 4 and the safety of terminal inner component.
As shown in figure 9, have in an embodiment of the present invention, between the mainboard 3 and the mainboard supporting member 2 heat-insulated
Gap 11.Preferably, the heat-insulated gap 11 is not less than 1mm.It is heat-insulated by being set between mainboard supporting member 2 and mainboard 3
Gap 11, reduces mainboard 3 and the direct contact surface of mainboard supporting member 2 accumulates, and further reduces and is delivered to mainboard support by mainboard 3
Heat on component 2, and the side transfer for coordinating heat-conducting layer 6 to guide the heat on mainboard 3 to be directed away from mainboard supporting member 2.
The side of the remote mainboard supporting member 2 refers to the position for setting rear shell 4.
As shown in figure 9, in one embodiment of this invention, the heat-conducting layer 6 is fixed on the chip 5.Cross heat conduction
Layer 6 is fixed on chip 5, can rapidly absorb heat while chip 5 generates heat, and concurrently gives birth to physical deformation, fills full core
Each corner on the surface of piece 5.
" first ", " second " etc. of the present invention, is used only for being distinguish between in description, not special implication.
Above in association with the specific embodiment technical principle that the invention has been described.These descriptions are intended merely to explain the present invention's
Principle, and limiting the scope of the invention cannot be construed in any way.Based on explanation herein, the technology of this area
Personnel would not require any inventive effort the other embodiments that can associate the present invention, these modes are fallen within
Within protection scope of the present invention.
Claims (7)
1. a kind of mobile terminal, it is characterised in that it includes mainboard, mainboard supporting member and the rear shell for chip, institute
State rear shell and be arranged at side of the chip away from the mainboard, heat-conducting layer is set between the chip and the rear shell, it is described
First heat dissipating layer is set between rear shell and the heat-conducting layer, and setting first is heat-insulated between first heat dissipating layer and the rear shell
Layer, has heat-insulated gap, the heat-insulated gap is not less than 1mm, the mainboard between the mainboard and the mainboard supporting member
Second thermal insulation layer is provided with supporting member, the second thermal insulation layer is covered with the mainboard supporting member close to the one of the mainboard
Side, or the second thermal insulation layer are covered with the one side of the mainboard supporting member away from the mainboard, and the mainboard supports structure
Part is provided with the second heat dissipating layer close to the side of the mainboard.
2. mobile terminal according to claim 1, it is characterised in that the size of first heat dissipating layer and the rear shell
Size matches.
3. mobile terminal according to claim 1, it is characterised in that right between first heat dissipating layer and the rear shell
Answer the position of the chip that the first thermal insulation layer is set；Or, the first thermal insulation layer is covered with the rear shell close to the chip
One side.
4. mobile terminal according to claim 1, it is characterised in that first heat dissipating layer is graphite thermal layer, copper foil
Heat dissipating layer or aluminum alloy heat radiation layer；And/or second heat dissipating layer is graphite thermal layer, copper foil heat dissipating layer or aluminium alloy radiate
Layer.
5. mobile terminal according to claim 1, it is characterised in that the first thermal insulation layer is heat-insulated foam；And/or
The second thermal insulation layer is heat-insulated foam.
6. mobile terminal according to any one of claims 1 to 5, it is characterised in that the heat-conducting layer is phase-change material layers；
And/or the rear shell is made of stainless steel；And/or the mainboard supporting member is made of stainless steel.
A kind of 7. method of claim 1 to 6 any one of them mobile terminal heat dissipation, it is characterised in that by rear shell with
Heat-conducting layer is set between chip, heat dissipating layer and thermal insulation layer are set gradually between heat-conducting layer and rear shell, when the chip of mobile terminal
After fever, heat by heat-conducting layer to heat dissipating layer transmission, due to there is provided thermal insulation layer, making heat by heat dissipating layer to mobile terminal
Surrounding transmission.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510412407.XA CN105072868B (en) | 2015-07-14 | 2015-07-14 | Mobile terminal and the method to mobile terminal heat dissipation |
| PCT/CN2016/082506 WO2017008575A1 (en) | 2015-07-14 | 2016-05-18 | Mobile terminal and method for dissipating heat of said mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510412407.XA CN105072868B (en) | 2015-07-14 | 2015-07-14 | Mobile terminal and the method to mobile terminal heat dissipation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105072868A CN105072868A (en) | 2015-11-18 |
| CN105072868B true CN105072868B (en) | 2018-04-27 |
Family
ID=54502103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510412407.XA Active CN105072868B (en) | 2015-07-14 | 2015-07-14 | Mobile terminal and the method to mobile terminal heat dissipation |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105072868B (en) |
| WO (1) | WO2017008575A1 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105072868B (en) * | 2015-07-14 | 2018-04-27 | 广东欧珀移动通信有限公司 | Mobile terminal and the method to mobile terminal heat dissipation |
| CN105739618B (en) * | 2016-01-26 | 2019-08-16 | 努比亚技术有限公司 | Center and mobile terminal |
| CN206472427U (en) | 2016-09-28 | 2017-09-05 | 华为技术有限公司 | Radiating structure for electronic equipment and electronic equipment |
| US10606327B2 (en) | 2017-06-16 | 2020-03-31 | Qualcomm Incorporated | Heat reduction using selective insulation and thermal spreading |
| CN107613718A (en) * | 2017-08-15 | 2018-01-19 | 深圳天珑无线科技有限公司 | A kind of conductive structure and electronic equipment |
| CN108093611B (en) * | 2018-01-29 | 2024-03-29 | 广东小天才科技有限公司 | Radiating structure of intelligent watch |
| CN108770295A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | A kind of electronic equipment and radiating subassembly |
| CN108770292B (en) * | 2018-06-11 | 2020-09-04 | Oppo广东移动通信有限公司 | Electronic equipment and heat dissipation assembly |
| CN108770291B (en) * | 2018-06-11 | 2020-07-31 | Oppo广东移动通信有限公司 | Heat dissipation assembly and electronic device |
| CN109699163A (en) * | 2019-02-25 | 2019-04-30 | 英业达科技有限公司 | Heat insulation structural |
| CN210535212U (en) | 2019-08-16 | 2020-05-15 | 昆山国显光电有限公司 | Flexible display screen and flexible display device |
| CN113380283B (en) * | 2021-06-09 | 2022-08-02 | 西安交通大学 | M2 solid state disk heat dissipation subsides |
| DE102022119665A1 (en) | 2022-08-04 | 2024-02-15 | Ruag Ammotec Ag | Workpiece carrier for an automated production line for ammunition with at least two ammunition parts |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102404976A (en) * | 2010-09-16 | 2012-04-04 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| CN202857205U (en) * | 2012-01-30 | 2013-04-03 | 深圳市爱诺菲科技有限公司 | Heat radiation electromagnetic wave absorption paster |
| CN203896662U (en) * | 2014-06-27 | 2014-10-22 | 广东欧珀移动通信有限公司 | Mobile terminal composite type heat radiating structure and mobile phone |
| CN104737634A (en) * | 2013-06-19 | 2015-06-24 | 阿莫绿色技术有限公司 | Hybrid insulation sheet and electronic equipment comprising same |
| CN204993472U (en) * | 2015-07-14 | 2016-01-20 | 广东欧珀移动通信有限公司 | Mobile terminal with front camera and large LCD |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2780776A4 (en) * | 2011-11-15 | 2015-08-26 | Henkel US IP LLC | Electronic devices assembled with thermally insulating layers |
| CN104243634A (en) * | 2013-06-13 | 2014-12-24 | 苏州沛德导热材料有限公司 | Mobile phone rear shell |
| KR102184621B1 (en) * | 2014-02-21 | 2020-11-30 | 삼성전자주식회사 | Mobile communication terminal with radiat-heat sheet |
| CN105072868B (en) * | 2015-07-14 | 2018-04-27 | 广东欧珀移动通信有限公司 | Mobile terminal and the method to mobile terminal heat dissipation |
-
2015
- 2015-07-14 CN CN201510412407.XA patent/CN105072868B/en active Active
-
2016
- 2016-05-18 WO PCT/CN2016/082506 patent/WO2017008575A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102404976A (en) * | 2010-09-16 | 2012-04-04 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| CN202857205U (en) * | 2012-01-30 | 2013-04-03 | 深圳市爱诺菲科技有限公司 | Heat radiation electromagnetic wave absorption paster |
| CN104737634A (en) * | 2013-06-19 | 2015-06-24 | 阿莫绿色技术有限公司 | Hybrid insulation sheet and electronic equipment comprising same |
| CN203896662U (en) * | 2014-06-27 | 2014-10-22 | 广东欧珀移动通信有限公司 | Mobile terminal composite type heat radiating structure and mobile phone |
| CN204993472U (en) * | 2015-07-14 | 2016-01-20 | 广东欧珀移动通信有限公司 | Mobile terminal with front camera and large LCD |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017008575A1 (en) | 2017-01-19 |
| CN105072868A (en) | 2015-11-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105072868B (en) | Mobile terminal and the method to mobile terminal heat dissipation | |
| CN104994712A (en) | Mobile terminal and method for dissipating heat of mobile terminal | |
| CN204981729U (en) | High -efficient thermal film who contains thermal conductive adhesive | |
| CN204993472U (en) | Mobile terminal with front camera and large LCD | |
| CN107787167A (en) | A kind of mobile terminal | |
| CN110256981A (en) | A kind of graphene heat conduction and heat radiation film | |
| CN108493511A (en) | Heat dissipation sleeve pipe structure for automobile batteries | |
| CN205161029U (en) | Electromagnetic shielding heat dissipation film | |
| CN202306432U (en) | Heat dissipation cold plate for mainboard of compact peripheral component interconnect (CPCI) server | |
| CN205124208U (en) | A thermal -insulated membrane and thermal -insulated structure for electronic components | |
| CN207491451U (en) | A kind of center heat dissipation graphite flake | |
| CN205030021U (en) | Heat dissipation device | |
| CN203289808U (en) | Novel graphite heat conduction device | |
| CN207118192U (en) | Mobile electronic device | |
| CN204994196U (en) | A thermal -insulated membrane of heat dissipation and heat radiation structure for electronic components | |
| CN209561374U (en) | A kind of electronic equipment | |
| CN204498543U (en) | A kind of Graphene heat dissipation film | |
| CN211670998U (en) | Electrothermal film | |
| CN202551606U (en) | Aluminum-carbon heat conducting shielding laminated foil | |
| CN203012616U (en) | Heat-dissipating electricity-saving device of notebook computer | |
| CN202799529U (en) | Self-adhesive soft heat conduction substrate | |
| CN207337332U (en) | A kind of computer thermoelectric cooling unit | |
| CN212846685U (en) | Heat dissipation system of tablet computer | |
| CN203068869U (en) | Arc-shaped refrigeration component | |
| CN205789936U (en) | A kind of flexible insulation heat dissipation film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |