CN106928886A - A kind of heat-conducting glue and preparation method thereof - Google Patents
A kind of heat-conducting glue and preparation method thereof Download PDFInfo
- Publication number
- CN106928886A CN106928886A CN201511021011.9A CN201511021011A CN106928886A CN 106928886 A CN106928886 A CN 106928886A CN 201511021011 A CN201511021011 A CN 201511021011A CN 106928886 A CN106928886 A CN 106928886A
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting glue
- sheet
- filling
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J107/00—Adhesives based on natural rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a kind of heat-conducting glue and preparation method thereof, heat conduction connection is carried out by the heat-conducting glue for being arranged between heat source generator and radiator, the heat-conducting glue is flat laminated structure, the heat-conducting glue has the upper and lower surface being parallel to each other, the heat-conducting glue inner homogeneous are distributed with sheet heat filling, and the schistose surface of the sheet heat filling is perpendicular to the upper surface and the lower surface.What the orientation of the sheet heat filling in the heat-conducting glue that the present invention is provided was highly directional, sheet heat filling is all perpendicular to the plain film direction of heat-conducting glue, the heat-conducting glue for thus obtaining has heat conduction orientation higher, avoid the heat conduction loss of the heat conduction particle of disordered arrangements, reduce the card bridging structure of sheet heat filling, improve the thermal conductivity factor of heat-conducting glue vertical direction, and the heat conduction particle for aligning is while bigger mechanical strength and tearing toughness can also be obtained in vertical direction, physical property is significantly improved.
Description
Technical field
The present invention relates to a kind of heat-conducting glue with heat conduction function for radiating element and preparation method thereof, fit
For carrying out heat conduction connection by heat-conducting glue between all kinds of heat source generators and radiator.
Background technology
Heat transfer is always an important process in electronics industry, and the operating temperature of component is often reliable
The important evidence of property.The particularly assembling of microelectronics increasingly densification, its working environment is drastically to high temperature side
To change, heat dissipation problem also just turns into vital Consideration in design of electronic products.All kinds of thermal source hairs
Heat conduction connection is carried out by heat conduction adhesive between raw device and radiator, for example semiconductor, power sourced electric, white
The heat dissipation design of color household electrical appliances and LED etc. industry is all mostly so.
Heat-conducting glue is a kind of feature product for being applied to be bonded radiating element and other power consumption components
Product, this adhesive tape generally has extremely strong bonding strength, good adhesion strength and a heat conductivility, soft, can
Compression, it is easy to be die cut, being divided into has base material and without base material.
The defect such as current heat-conducting glue generally existing thermal conductivity factor is low, physical property is poor, for heat dissipation environment high
Bad adaptability.Two-sided tape heat conductivility without base material is limited very big by heat-conducting glue, and thermal conductivity factor is difficult to
Improved by lower cost solution, and thermal resistance with thickness increase decline quickly.There is the list of base material two-sided
Adhesive tape generally makees base material using PET film, except being limited by heat-conducting glue, is also limited by base material, difficult
The need for meet electronic equipment dissipating heat.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of heat-conducting glue and preparation method thereof, to be reduced or avoided
Problem noted earlier.
Specifically, it is an object of the invention to provide a kind of process is simple, safe operation, the sheet of low cost
The highly directional heat-conducting glue of heat filling, with thermal conductivity factor higher, it is adaptable to all kinds of heat source generators and radiating
Heat conduction connection is carried out by heat-conducting glue between device.
In order to solve the above technical problems, the present invention proposes a kind of heat-conducting glue, for being arranged at heat source generator
Heat conduction is carried out between radiator by the heat-conducting glue to be connected, the heat-conducting glue is flat laminated structure, described
Heat-conducting glue has the upper and lower surface being parallel to each other, and the heat-conducting glue inner homogeneous are distributed with sheet heat conduction
Filler, the schistose surface of the sheet heat filling is perpendicular to the upper surface and the lower surface.
Preferably, the heat-conducting glue is by high molecular polymer, sheet heat filling, surface modifier, rheology
Modifying agent, antioxidant, tackifier, solvent, curing agent are made up of raw material.
Preferably, the heat-conducting glue is made up of the raw material of following mass parts：High molecular polymer：100 parts；Piece
Shape heat filling：20-200 parts；Surface modifier：0.2-2 parts；Rheology modifier：0.2-2 parts；Antioxygen
Agent：0.1-1 parts；Tackifier：1-10 parts；Solvent：100-500 parts；Curing agent：0.1-1 parts.
Preferably, the high molecular polymer is natural rubber, butadiene-styrene rubber, Oppanol, poly- third
One of olefin(e) acid ester, polyvinyl ether resin or its mixture.
Preferably, the surface modifier be silane coupler, titanate coupling agent, aluminate coupling agent and
One of stearic acid or its mixture.
Preferably, the rheology modifier is bentonite, organic clay, silica, cellulose, xanthan
One of glue or its mixture.
Preferably, the sheet heat filling be one of platelet boron nitride, flake graphite and flake graphite alkene or
Its mixture.
Preferably, a diameter of 1~30 μm of the sheet heat filling, thickness is 5~200nm.
Present invention also offers a kind of preparation method of above-mentioned heat-conducting glue, comprise the following steps：
With high molecular polymer, sheet heat filling, surface modifier, rheology modifier, antioxidant, increasing
Stick, solvent, curing agent are proportionally uniformly mixed to form curtain coating material for raw material；
A mould is provided, the mould is placed on a flat board conveyer belt, the mould and the flat board
There is a gap between conveyer belt；
The curtain coating material is put into the mould and described towards gap extruding along the flat board conveyer belt
Curtain coating material, while the flat board conveyer belt is moved along the direction of extrusion, one is applied on the curtain coating material
Perpendicular to the magnetic field in the curtain coating direction；Heat-conducting glue cast sheet is obtained by extruding；
The heat-conducting glue will be obtained after the heat-conducting glue cast sheet dry solidification.
Preferably, the sheet heat filling needs to carry out surface modification treatment before mixing.
What the orientation of the sheet heat filling in the heat-conducting glue that the present invention is provided was highly directional, sheet is led
Hot filler is all perpendicular to the plain film direction of heat-conducting glue, thus the heat-conducting glue for obtaining has heat conduction orientation higher,
The heat conduction loss of the heat conduction particle of disordered arrangements is avoided, the card bridging structure of sheet heat filling is reduced,
The thermal conductivity factor of heat-conducting glue vertical direction is improve, and the heat conduction particle for aligning is while can also hang down
Nogata is significantly improved to bigger mechanical strength and tearing toughness, physical property is obtained.
Brief description of the drawings
The following drawings is only intended to, in schematic illustration and explanation is done to the present invention, not delimit the scope of the invention.
Wherein,
Fig. 1 is shown the cross section structure diagram of the heat-conducting glue of a specific embodiment of the invention；
Fig. 2 is shown the preparation method schematic diagram of the heat-conducting glue of another specific embodiment of the invention；
Fig. 3 is shown the cross section structure diagram of the heat-conducting glue of another specific embodiment of the invention.
Specific embodiment
In order to be more clearly understood to technical characteristic of the invention, purpose and effect, now compare accompanying drawing and say
Bright specific embodiment of the invention.Wherein, identical part uses identical label.
As described in background, in order to improve the heat conductivility of heat-conducting glue, improved the invention provides one kind
Heat-conducting glue structure, as shown in figure 1, it is shown leading for a specific embodiment of the invention
The cross section structure diagram of hot glue 100, such as schemes, of the invention for being arranged at heat source generator and radiator
Between heat conduction connection is carried out by the heat-conducting glue 100, the heat-conducting glue 100 is flat laminated structure, that is, lead
Hot glue 100 has the upper surface 10 and lower surface 20 being parallel to each other, and the inner homogeneous of heat-conducting glue 100 are distributed with piece
Shape heat filling 30, wherein the schistose surface of sheet heat filling 30 is perpendicular to the upper surface of heat-conducting glue 100
10 and lower surface 20.Above-mentioned heat-conducting glue provided by the present invention can be directly used in product heat conduction connection and use
The finished product or semi-finished product of laminated structure, i.e. it can further coordinate the adhesive tape of packaging with release liners,
It can be the semi-manufactured fashion that product connection is directly used in after producing.
Unlike the prior art, in heat-conducting glue of the invention, what uniform mixing was filled is the heat conduction of sheet
Filler, rather than graininess or other shapes of heat filling.Secondly, the sheet in heat-conducting glue of the invention
The schistose surface of heat filling 30 is vertical with the upper and lower surface of heat-conducting glue 100.That is, of the invention
What the orientation of the sheet heat filling 30 in the heat-conducting glue 100 of offer was highly directional, sheet heat conduction is filled out
Material 30 all perpendicular to heat-conducting glue plain film direction (it is clear in order to show in Fig. 1, to sheet heat filling 30
Orientation carried out simplified painting, its actual being arranged with may not be so regular, although all sheets
The schistose surface of heat filling 30 is all perpendicular to the plain film direction of heat-conducting glue, but sheet heat filling 30
It is likely to be what can arbitrarily be deflected under plumbness, for example, arranges as shown in Figure 2, it is actual
Situation may be more closely similar to the ordered state shown in Fig. 2, behind this can also be further illustrated), thus
The heat-conducting glue of acquisition has heat conduction orientation higher, it is to avoid the heat conduction loss of the heat conduction particle of disordered arrangements,
The card bridging structure of sheet heat filling is reduced, the thermal conductivity factor of heat-conducting glue vertical direction is improve, and
And the heat conduction particle for aligning is while can also be strong in the bigger mechanical strength of vertical direction acquisition and tear-proof
Degree, physical property is significantly improved.
In a specific embodiment, the sheet heat filling 30 can be platelet boron nitride, flake graphite
With one of flake graphite alkene or its mixture.
In another specific embodiment, it is preferable that the heat-conducting glue 100 can by high molecular polymer,
Sheet heat filling, surface modifier, rheology modifier, antioxidant, tackifier, solvent, curing agent are
Raw material, is made after agitated, curtain coating oriented formation, solidification.
For example, in a specific embodiment, can be prepared with the raw material of following mass parts of the invention above-mentioned
Heat-conducting glue, the raw material is：High molecular polymer：100 parts；Sheet heat filling：20-200 parts；Table
Face modifying agent：0.2-2 parts；Rheology modifier：0.2-2 parts；Antioxidant：0.1-1 parts；Tackifier：1-10
Part；Solvent 50-500 parts；Curing agent：0.1-1 parts.
Specifically, the high molecular polymer can be natural rubber, butadiene-styrene rubber, Oppanol, poly-
One of acrylate, polyvinyl ether resin or its mixture.The surface modifier can for silane coupler,
One of titanate coupling agent, aluminate coupling agent and stearic acid or its mixture.The rheology modifier can be
One of bentonite, organic clay, silica, cellulose, xanthans or its mixture.
Embodiment 1
Raw material：100 parts of polyacrylate；70 parts of sheet heat filling Graphene；Sheet heat filling graphite
40 parts；1 part of silane coupler；1 part of bentonite；0.5 part of antioxidant；5 parts of tackifier；Solvent 180
Part；0.5 part of curing agent.
Sheet heat filling 30 first carries out surface modification treatment, modified sheet heat filling 30 and its
Its raw material is agitated, curtain coating is oriented the heat-conducting glue cast sheet that thickness is 5-150 μm, applies while curtain coating
The magnetic field of vertical direction make sheet heat filling 30 magnetize retrodeviate go to it is consistent with magnetic direction, so as to form vertical
The straight sheet heat filling (below will be to this further description) in heat-conducting glue.Sheet heat filling 30
The modified purpose in surface is to improve sheet 30 compatibility in high molecular polymer matrix of heat filling, also may be used
Paramagnetic powder is added in modifying agent makes heat filling have magnetic, and the purpose for being cast oriented formation is to make
Sheet heat filling 30 is aligned in heat-conducting glue by the effect in magnetic field.Again by the heat conduction after flow casting molding
Glue cast sheet is dried in being put into drying machine at 50-100 DEG C, curing molding 5-30min, after natural cooling
It is the heat-conducting glue of the highly directional high thermal conductivity coefficient of 20-30W/ (mK) to thermal conductivity factor.
Embodiment 2
The method of the present embodiment is same as Example 1, and difference is：In the present embodiment, sheet heat filling
40 parts of Graphene；50 parts of sheet heat filling graphite.Highly directional high thermal conductivity coefficient manufactured in the present embodiment is led
Hot glue material thermal conductivity is 22W/ (mK).
Embodiment 3
The method of the present embodiment is same as Example 1, and difference is：In the present embodiment, sheet heat filling
50 parts of Graphene；40 parts of sheet heat filling boron nitride.Highly directional high thermal conductivity coefficient manufactured in the present embodiment
Heat-conducting glue material thermal conductivity is 20W/ (mK).
Embodiment 4
The method of the present embodiment is same as Example 1, and difference is：In the present embodiment, macromolecule in raw material
Polymer uses 100 parts of natural rubber.The heat conduction glue material of highly directional high thermal conductivity coefficient manufactured in the present embodiment is led
Hot coefficient is 26W/ (mK).
From embodiment 1 as can be seen that heat-conducting glue of the invention is by being cast oriented formation applying vertical magnetic field
Technology realize sheet heat filling 30 in heat-conducting glue 100 high orientation arrangement, as shown in Fig. 2 its
In be shown another specific embodiment of the invention heat-conducting glue preparation method schematic diagram, such as scheme,
The preparation method comprises the following steps：
First with high molecular polymer, sheet heat filling, surface modifier, rheology modifier, antioxidant,
Tackifier, solvent, curing agent are proportionally uniformly mixed to form curtain coating material for raw material.Led to improve sheet
Compatibility of the hot filler in high molecular polymer matrix, preferably sheet heat filling needs profit before mixing
Surface modification treatment is carried out to it with surface modifier.
Then a mould 200 is provided, mould 200 is placed on a flat board conveyer belt 300, mould 200
There is a gap 400 between peaceful sheet conveying belt 300.
The curtain coating material that sheet heat filling 30 and other raw materials are uniformly mixed to form is put into mould 200 afterwards
In, and along direction extruding curtain coating material (direction of arrow in such as Fig. 2) in gap 400, extruding curtain coating material
While flat board conveyer belt 300 also along the direction of extrusion movement shown in the direction of arrow, and in the same of extruding
When curtain coating material on apply perpendicular to curtain coating direction magnetic field；So as to be led by extruding on the right side of Fig. 2
Hot glue cast sheet 500, can obtain the heat-conducting glue 100 shown in Fig. 1 after the dry solidification of heat-conducting glue cast sheet 500,
The compares figure of heat-conducting glue cast sheet 500 and heat-conducting glue 100 shows that in figure 3, it is shown according to this hair
The cross section structure diagram of the heat-conducting glue of another bright specific embodiment.Wherein, the sheet heat conduction in Fig. 3
The orientation of filler 30 is also to employ simplified painting, and actual conditions are also possible to that Fig. 2 institutes can be more closely similar to
The ordered state for showing.
Under normal circumstances, the magnetic force in magnetic field can only be acted to ferrimagnet, but when magnetic field intensity reaches
During to certain degree, such as magnetic field intensity reaches more than 1T (preferably magnetic field intensity 10T~20T), magnetic force
Effect can reach atomic scale, even nonferromugnetic material, such as this weak magnetic substance of sheet heat filling
Also obvious magnetic effect can be shown in high-intensity magnetic field.In magnetic field, the sheet heat conduction with magnetic anisotropy
Filler, the energy of magnetization suffered by different directions is different, therefore sheet heat filling has generation under magneticaction
The trend of rotation, untill suffered magnetive attraction reaches minimum, this is magnetically anisotropic substance in magnetic field
Rotation tends to general principle.Under high-intensity magnetic field induction, sheet heat filling is readily formed and aligns, from
And arrangement effect of the sheet heat filling perpendicular to the upper and lower surface of heat-conducting glue can be obtained.Or at another
In specific embodiment, can change on surface when surface modification treatment is carried out to sheet heat filling 30
Increase on a small quantity in property agent and possess ferromagnetic material, the ferroferric oxide powder of such as superparamagnetism so that piece
The surface adhesion of shape heat filling 30 some ferrimagnets, lead such that it is able to obtain the sheet for possessing magnetic indirectly
Hot filler 30.In this case relatively low magnetic field intensity is only needed to be capable of achieving the effect for aligning, can
To save manufacture and the energy consumption cost of electromagnet.
Wherein, the sheet heat filling 30 under the admixture that right part shows in Fig. 2 is disordered arrangements,
By the effect in magnetic field so that the sheet heat filling in the heat-conducting glue cast sheet 500 that right side obtains in Fig. 2
30 lie substantially in plumbness.Certainly, can not possibly be arranged as shown in Fig. 1 or 3 under actual conditions
Obtain regular like that, be more likely that the sheet heat conduction in heat-conducting glue cast sheet 500 as shown in the right side of fig 2 is filled out
Material 30 plumbness, although all sheet heat fillings 30 under magnetic fields all in plumbness,
But magnetic field also has no idea to control, sheet heat filling 30 is around the rotation direction of its vertical axis, unless made
Cross side during standby in heat-conducting glue applies a magnetic field again, is possible to realize as shown in Fig. 1 or 3
State.
Therefore, in a specific embodiment, the present invention also " will apply one to hang down again on curtain coating material simultaneously
During the technical scheme in the straight magnetic field in diagram magnetic direction " is summarized into the scope of protection of present invention, i.e.
" applying the magnetic field perpendicular to curtain coating direction on curtain coating material " described in previous embodiment is included " in stream
Prolong the two orthogonal magnetic fields applied on material perpendicular to curtain coating direction " technical scheme (in this programme figure
It is not shown), it is used to obtain the sheet heat filling 30 as shown in Fig. 1 or 3 with the orientation more increased
The technique effect of arrangement, can obtain more preferable heat conductivility and physical property.
In a specific embodiment, heat-conducting glue 100 is formed by the dry solidification of heat-conducting glue cast sheet 500, institute
Heat-conducting glue cast sheet is stated with a thickness H1, the sheet heat filling 30 has a diameter R, wherein
10R≤H1≤200R.Preferably, a diameter of 1~30 μm of sheet heat filling 30, thickness is 5~200nm；
The thickness of heat-conducting glue cast sheet is 10~200 μm.
After the dry solidification of heat-conducting glue cast sheet 500, sheet heat filling 30 will not change, but dry
The thickness of the heat-conducting glue 100 obtained after dry solidification can diminish, i.e. as shown in figure 1, in a specific implementation
In example, heat-conducting glue 100 has a thickness H, and sheet heat filling 30 has a diameter R, wherein R
≤H≤5R.It is also preferable that a diameter of 1~30 μm of sheet heat filling 30, thickness is 5~200nm；
The thickness of heat-conducting glue 100 is 5~150 μm.
In sum, the present invention only has 10~200 μm using heat-conducting glue cast sheet thickness prepared by the tape casting,
In casting processes, sheet heat filling is orientated by magnetic fields, and lamella is perpendicular to cast sheet surface；Adopt
Sheet heat filling thermal conductivity factor vertically is high, platelet boron nitride thermal conductivity factor
>=300W/ (mK), flake graphite >=1500W/ (mK) and flake graphite alkene >=5000W/ (mK), and heat conduction is filled out
Material highly directional arrangement in heat-conducting glue, reduces the card bridging structure of sheet heat filling so that heat conduction system
Number, physical property are significantly improved.
Although it will be appreciated by those skilled in the art that the present invention is described according to the mode of multiple embodiments
, but not each embodiment only includes an independent technical scheme.So described only in specification
It is that for the sake of clarity, those skilled in the art should be understood specification as an entirety, and will
Involved technical scheme regards that can be mutually combined into the mode of different embodiments understands as in each embodiment
Protection scope of the present invention.
Schematical specific embodiment of the invention is the foregoing is only, the scope of the present invention is not limited to.
Any those skilled in the art, the equivalent change made on the premise of design of the invention and principle is not departed from
Change, change and combine, the scope of protection of the invention all should be belonged to.
Claims (10)
1. a kind of heat-conducting glue, the heat-conducting glue (100) is passed through for being arranged between heat source generator and radiator
Carry out heat conduction connection, it is characterised in that the heat-conducting glue (100) is flat laminated structure, the heat-conducting glue (100)
With the upper surface (10) and lower surface (20) that are parallel to each other, heat-conducting glue (100) inner homogeneous point
Sheet heat filling (30) is furnished with, the schistose surface of the sheet heat filling (30) is perpendicular to the upper table
Face (10) and the lower surface (20).
2. heat-conducting glue as claimed in claim 1, it is characterised in that the heat-conducting glue by high molecular polymer,
Sheet heat filling, surface modifier, rheology modifier, antioxidant, tackifier, solvent, curing agent are
Raw material is made.
3. heat-conducting glue as claimed in claim 1, it is characterised in that the heat-conducting glue is by following mass parts
Raw material is made：High molecular polymer：100 parts；Sheet heat filling：20-200 parts；Surface modifier：
0.2-2 parts；Rheology modifier：0.2-2 parts；Antioxidant：0.1-1 parts；Tackifier：1-10 parts；Solvent
50-500 parts；Curing agent：0.1-1 parts.
4. heat-conducting glue as claimed in claim 2 or claim 3, it is characterised in that the high molecular polymer is day
One of right rubber, butadiene-styrene rubber, Oppanol, polyacrylate, polyvinyl ether resin or it is mixed
Compound.
5. the heat-conducting glue as described in claim 2-4, it is characterised in that the surface modifier is silane idol
One of connection agent, titanate coupling agent, aluminate coupling agent and stearic acid or its mixture.
6. the heat-conducting glue as described in one of claim 2-5, it is characterised in that the rheology modifier is swollen
One of profit soil, organic clay, silica, cellulose, xanthans or its mixture.
7. the heat-conducting glue as described in one of claim 2-6, it is characterised in that the sheet heat filling (30)
It is one of platelet boron nitride, flake graphite and flake graphite alkene or its mixture.
8. heat-conducting glue as claimed in claim 7, it is characterised in that the sheet heat filling (30)
A diameter of 1~30 μm, thickness is 5~200nm.
9. a kind of preparation method of heat-conducting glue as described in one of claim 1-8, comprises the following steps：
With high molecular polymer, sheet heat filling, surface modifier, rheology modifier, antioxidant, increasing
Stick, solvent, curing agent are proportionally uniformly mixed to form curtain coating material for raw material；
A mould (200) is provided, the mould (200) is placed on a flat board conveyer belt (300),
There is a gap (400) between the mould (200) and the flat board conveyer belt (300)；
The curtain coating material is put into the mould (200) and along the flat board conveyer belt (300) towards institute
Gap (400) the extruding curtain coating material is stated, while the flat board conveyer belt (300) is along the direction of extrusion
It is mobile, the magnetic field perpendicular to the curtain coating direction is applied on the curtain coating material；Heat-conducting glue is obtained by extruding
Cast sheet (500)；
The heat-conducting glue (100) will be obtained after heat-conducting glue cast sheet (500) dry solidification.
10. preparation method as claimed in claim 9, it is characterised in that the sheet heat filling is mixed
Need to carry out surface modification treatment before conjunction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511021011.9A CN106928886B (en) | 2015-12-30 | 2015-12-30 | A kind of heat-conducting glue and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511021011.9A CN106928886B (en) | 2015-12-30 | 2015-12-30 | A kind of heat-conducting glue and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106928886A true CN106928886A (en) | 2017-07-07 |
| CN106928886B CN106928886B (en) | 2018-11-30 |
Family
ID=59441811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511021011.9A Active CN106928886B (en) | 2015-12-30 | 2015-12-30 | A kind of heat-conducting glue and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106928886B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108359396A (en) * | 2018-03-01 | 2018-08-03 | 翁源泰得利新材料有限公司 | A kind of efficient self-mending liquid for tire |
| CN108641610A (en) * | 2018-04-25 | 2018-10-12 | 常州驰科光电科技有限公司 | A kind of self-adhesive and high-strength conductive and heat-conductive film and preparation method thereof |
| CN109181592A (en) * | 2018-07-25 | 2019-01-11 | 佛山市高明区爪和新材料科技有限公司 | A kind of preparation method of heat-conducting glue |
| CN115491152A (en) * | 2022-10-10 | 2022-12-20 | 上海润势科技有限公司 | Heat-conducting packaging adhesive film and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102504707A (en) * | 2011-11-01 | 2012-06-20 | 特艾弗新材料科技（上海）有限公司 | Fast cured thermal conductive adhesive and preparation method thereof |
| CN104073193A (en) * | 2013-03-27 | 2014-10-01 | 南京喜力特胶粘剂有限公司 | Thermal conductive adhesive and preparing method thereof |
| CN104918468A (en) * | 2015-06-29 | 2015-09-16 | 华为技术有限公司 | Thermally conductive pad and electronic device |
-
2015
- 2015-12-30 CN CN201511021011.9A patent/CN106928886B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102504707A (en) * | 2011-11-01 | 2012-06-20 | 特艾弗新材料科技（上海）有限公司 | Fast cured thermal conductive adhesive and preparation method thereof |
| CN104073193A (en) * | 2013-03-27 | 2014-10-01 | 南京喜力特胶粘剂有限公司 | Thermal conductive adhesive and preparing method thereof |
| CN104918468A (en) * | 2015-06-29 | 2015-09-16 | 华为技术有限公司 | Thermally conductive pad and electronic device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108359396A (en) * | 2018-03-01 | 2018-08-03 | 翁源泰得利新材料有限公司 | A kind of efficient self-mending liquid for tire |
| CN108641610A (en) * | 2018-04-25 | 2018-10-12 | 常州驰科光电科技有限公司 | A kind of self-adhesive and high-strength conductive and heat-conductive film and preparation method thereof |
| CN109181592A (en) * | 2018-07-25 | 2019-01-11 | 佛山市高明区爪和新材料科技有限公司 | A kind of preparation method of heat-conducting glue |
| CN115491152A (en) * | 2022-10-10 | 2022-12-20 | 上海润势科技有限公司 | Heat-conducting packaging adhesive film and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106928886B (en) | 2018-11-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106928886A (en) | A kind of heat-conducting glue and preparation method thereof | |
| CN108485277B (en) | Oriented high-thermal-conductivity interface material and preparation method thereof | |
| CN103146024B (en) | Porous graphene/polymer complex structure, its preparation method and application | |
| CN101787178B (en) | Heat-conduction electric insulation composite material component and manufacturing method thereof | |
| CN104194325B (en) | A kind of preparation method of heat conduction injecting magnetic composite | |
| CN102775755B (en) | Polyaryl ether nitrile (PEN) and carbonyl iron powder (Fe(CO)5) composite magnetic material and preparation method thereof | |
| US20200208036A1 (en) | Composite thermal interface materials, thermal interface components, and methods for making the same | |
| CN107641310B (en) | A kind of high thermal conductivity polyphenyl ether copper-clad plate and preparation method thereof | |
| CN106531391A (en) | Soft magnetic powder composition and manufacturing method for magnetic element | |
| CN102876044A (en) | Magnetic metal power/silicone rubber heat conduction composite material and preparation method thereof | |
| CN105219020A (en) | High-heat-conductance insulating material, its preparation method and application | |
| CN105504822A (en) | Preparation method of silicone rubber pad | |
| CN102391818A (en) | Insulated thermal conductive adhesive and preparation method thereof | |
| CN103409115B (en) | A kind of enhancement type heat-conducting interface material and preparation method thereof | |
| CN105255004A (en) | Graphite resin composite material of core-shell structure and preparation method thereof | |
| CN104072966A (en) | Multi-element composite heat-conducting functional master batch and preparation method thereof | |
| JP2000191987A (en) | Thermally conductive adhesive film and semiconductive device | |
| CN104497477A (en) | Heat conductive composite material and preparation method thereof | |
| CN113881190A (en) | Epoxy resin composite material for packaging power electronic transformer and preparation method thereof | |
| CN205313450U (en) | Heat -conducting adhesive tape | |
| CN108929521B (en) | High-thermal-conductivity and high-electric-conductivity graphene-based composite material and preparation method thereof | |
| CN112724921B (en) | Low-viscosity heat-conducting flame-retardant silicone rubber sealant and preparation method thereof | |
| CN205347307U (en) | Heat -conducting adhesive tape | |
| CN102568736A (en) | Rigid anisotropy bonded neodymium iron boron permanent magnet | |
| CN112457625A (en) | Graphene composite material, graphene composite heat-conducting plastic and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |