CN106928886B - A kind of heat-conducting glue and preparation method thereof - Google Patents
A kind of heat-conducting glue and preparation method thereof Download PDFInfo
- Publication number
- CN106928886B CN106928886B CN201511021011.9A CN201511021011A CN106928886B CN 106928886 B CN106928886 B CN 106928886B CN 201511021011 A CN201511021011 A CN 201511021011A CN 106928886 B CN106928886 B CN 106928886B
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting glue
- sheet
- filling
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J107/00—Adhesives based on natural rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of heat-conducting glues and preparation method thereof, thermally conductive connection is carried out by the heat-conducting glue for being set between heat source generator and radiator, the heat-conducting glue is flat laminated structure, the heat-conducting glue has the upper and lower surfaces being parallel to each other, sheet heat filling is evenly distributed with inside the heat-conducting glue, the schistose surface of the sheet heat filling is perpendicular to the upper surface and the lower surface.What the orientation of the sheet heat filling in heat-conducting glue provided by the invention was highly directional, sheet heat filling is all perpendicular to the plain film direction of heat-conducting glue, the heat-conducting glue thermally conductive orientation with higher thus obtained, avoid the thermally conductive loss of the heat conduction particle of disordered arrangements, reduce the card bridging structure of sheet heat filling, improve the thermal coefficient of heat-conducting glue vertical direction, and the heat conduction particle that aligns while bigger mechanical strength and tearing toughness can also be obtained in vertical direction, physical property significantly improves.
Description
Technical field
The present invention relates to a kind of heat-conducting glues and preparation method thereof with thermally conductive function for radiating element, are suitable for each
Thermally conductive connection is carried out by heat-conducting glue between class heat source generator and radiator.
Background technique
Heat transfer is always an important process in electronics industry, and the operating temperature of component is often the weight of reliability
It will foundation.The especially assembling of microelectronics increasingly densification, working environment is sharply to high temperature direction change, heat dissipation problem
Just become vital Consideration in design of electronic products.Pass through thermally conductive gluing between all kinds of heat source generators and radiator
The heat dissipation design that agent carries out thermally conductive connection, such as semiconductor, power sourced electric, white domestic appliances and LED etc. industry is all this mostly
Sample.
Heat-conducting glue is a kind of functional product applied to bonding radiating element and other power consumption components, this
Adhesive tape usually has extremely strong adhesive strength, good adhesion strength and heating conduction, soft, compressible, is easy to be die cut, being divided into has
Substrate and without substrate.
The defects of generally existing thermal coefficient of current heat-conducting glue is low, physical property is poor, for high dissipating-heat environment adaptability
Difference.Double faced adhesive tape heating conduction without substrate is limited very big by heat-conducting glue, and thermal coefficient is difficult to add by lower cost solution
With improve, and thermal resistance with thickness increase decline quickly.There is single double faced adhesive tape of substrate to generally use PET film and make substrate, removes
It is limited, is also limited by substrate, it is difficult to meet the needs of electronic equipment dissipating heat by heat-conducting glue.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of heat-conducting glues and preparation method thereof, front institute is reduced or avoided
The problem of mentioning.
Specifically, the object of the present invention is to provide a kind of simple process, safe operation, sheet heat fillings at low cost
Highly directional heat-conducting glue, thermal coefficient with higher, be suitable between all kinds of heat source generators and radiator by heat-conducting glue into
The thermally conductive connection of row.
In order to solve the above technical problems, the invention proposes a kind of heat-conducting glue, for being set to heat source generator and heat dissipation
Thermally conductive connection is carried out by the heat-conducting glue between device, the heat-conducting glue is flat laminated structure, and the heat-conducting glue has mutually flat
Capable upper and lower surfaces are evenly distributed with sheet heat filling, the piece of the sheet heat filling inside the heat-conducting glue
Shape surface is perpendicular to the upper surface and the lower surface.
Preferably, the heat-conducting glue is by high molecular polymer, sheet heat filling, surface modifier, rheology modifier, anti-
Oxygen agent, tackifier, solvent, curing agent are made of raw material.
Preferably, the heat-conducting glue is made of the raw material of following mass parts：High molecular polymer：100 parts；Sheet is thermally conductive to fill out
Material：20-200 parts；Surface modifier：0.2-2 parts；Rheology modifier：0.2-2 parts；Antioxidant：0.1-1 parts；Tackifier：1-10
Part；Solvent：100-500 parts；Curing agent：0.1-1 parts.
Preferably, the high molecular polymer is natural rubber, butadiene-styrene rubber, Oppanol, polyacrylate, gathers
Or mixtures thereof one of vinyl ether resin.
Preferably, the surface modifier be silane coupling agent, titanate coupling agent, aluminate coupling agent and stearic acid it
Or mixtures thereof one.
Preferably, the rheology modifier be one of bentonite, organic clay, silica, cellulose, xanthan gum or its
Mixture.
Preferably, the sheet heat filling is one of platelet boron nitride, flake graphite and flake graphite alkene or its mixing
Object.
Preferably, the diameter of the sheet heat filling is 1~30 μm, with a thickness of 5~200nm.
The present invention also provides a kind of preparation methods of above-mentioned heat-conducting glue, include the following steps：
With high molecular polymer, sheet heat filling, surface modifier, rheology modifier, antioxidant, tackifier, solvent,
Curing agent is that raw material is proportionally uniformly mixed to form curtain coating material；
A mold is provided, the mold is placed on a plate conveyer belt, the mold and the plate conveyer belt
Between have a gap；
Curtain coating material is put into the mold and squeezes the curtain coating towards the gap along the plate conveyer belt
Material, while the plate conveyer belt is moved along the direction of extrusion, applies one on curtain coating material perpendicular to the curtain coating
The magnetic field in direction；Heat-conducting glue cast sheet is obtained by squeezing；
The heat-conducting glue will be obtained after the heat-conducting glue cast sheet dry solidification.
Preferably, the sheet heat filling needs to carry out surface modification treatment before mixing.
What the orientation of the sheet heat filling in heat-conducting glue provided by the invention was highly directional, sheet heat filling
All perpendicular to the plain film direction of heat-conducting glue, thus the heat-conducting glue thermally conductive orientation with higher obtained, avoid disordered arrangements
Heat conduction particle thermally conductive loss, reduce the card bridging structure of sheet heat filling, improve heat-conducting glue vertical direction
Thermal coefficient, and the heat conduction particle that aligns while bigger mechanical strength and tear-proof can also be obtained in vertical direction
Intensity, physical property significantly improve.
Detailed description of the invention
The following drawings are only intended to schematically illustrate and explain the present invention, not delimit the scope of the invention.Wherein,
The schematic cross-sectional view of the heat-conducting glue of a specific embodiment according to the present invention is shown in Fig. 1；
The preparation method schematic diagram of the heat-conducting glue of another specific embodiment according to the present invention is shown in Fig. 2；
The schematic cross-sectional view of the heat-conducting glue of another specific embodiment according to the present invention is shown in Fig. 3.
Specific embodiment
For a clearer understanding of the technical characteristics, objects and effects of the present invention, this hair of Detailed description of the invention is now compareed
Bright specific embodiment.Wherein, identical component uses identical label.
As described in background, in order to improve the heating conduction of heat-conducting glue, the present invention provides a kind of improved thermally conductive
The structure of glue, as shown in Figure 1, the sectional structure of its heat-conducting glue 100 that a specific embodiment according to the present invention is shown
Schematic diagram is such as schemed, it is of the invention for be set between heat source generator and radiator carried out by the heat-conducting glue 100 it is thermally conductive
Connection, the heat-conducting glue 100 are flat laminated structure, i.e. heat-conducting glue 100 has the upper surface 10 and lower surface 20 being parallel to each other, and are led
Sheet heat filling 30 is evenly distributed with inside hot glue 100, wherein the schistose surface of sheet heat filling 30 is perpendicular to heat-conducting glue
100 upper surface 10 and lower surface 20.Above-mentioned heat-conducting glue provided by the present invention, which can be, is directly used in the thermally conductive connection use of product
Laminated structure finished product or semi-finished product, that is, its can further with release paper cooperation packaging adhesive tape, be also possible to produce
The semi-manufactured fashion of product connection is directly used in after out.
Unlike the prior art, in heat-conducting glue of the invention, uniformly what mixing was filled is the heat filling of sheet, and
It is not graininess or other shapes of heat filling.Secondly, the sheet table of the sheet heat filling 30 in heat-conducting glue of the invention
Face is vertical with the upper and lower surface of heat-conducting glue 100.It is filled out that is, sheet in heat-conducting glue 100 provided by the invention is thermally conductive
What the orientation of material 30 was highly directional, sheet heat filling 30 is all perpendicular to the plain film direction of heat-conducting glue (in order to aobvious in Fig. 1
Show clear, simplified painting has been carried out to the orientation of sheet heat filling 30, being actually arranged with may not be so regular,
Although the schistose surface of all sheet heat fillings 30 is all perpendicular to the plain film direction of heat-conducting glue, sheet heat filling
30 are likely to be can arbitrarily deflect under plumbness, such as arrangement as shown in Figure 2, and actual conditions may
Be more closely similar to ordered state shown in Fig. 2, behind can also to this further explanation), thus obtain heat-conducting glue it is with higher
Thermally conductive orientation avoids the thermally conductive loss of the heat conduction particle of disordered arrangements, and the card for reducing sheet heat filling, which is put up a bridge, to be tied
Structure, improves the thermal coefficient of heat-conducting glue vertical direction, and the heat conduction particle aligned while can also be in vertical direction
Bigger mechanical strength and tearing toughness are obtained, physical property significantly improves.
In a specific embodiment, the sheet heat filling 30 can be platelet boron nitride, flake graphite and sheet stone
Or mixtures thereof one of black alkene.
In another specific embodiment, it is preferable that the heat-conducting glue 100 can be thermally conductive by high molecular polymer, sheet
Filler, surface modifier, rheology modifier, antioxidant, tackifier, solvent, curing agent are raw material, and agitated, curtain coating is oriented
It is made after type, solidification.
For example, in a specific embodiment, above-mentioned heat-conducting glue of the invention can be prepared with the raw material of following mass parts,
The raw material is：High molecular polymer：100 parts；Sheet heat filling：20-200 parts；Surface modifier：0.2-2 parts；Rheology changes
Property agent：0.2-2 parts；Antioxidant：0.1-1 parts；Tackifier：1-10 parts；50-500 parts of solvent；Curing agent：0.1-1 parts.
Specifically, the high molecular polymer can for natural rubber, butadiene-styrene rubber, Oppanol, polyacrylate,
Or mixtures thereof one of polyvinyl ether resin.The surface modifier can be silane coupling agent, titanate coupling agent, Aluminate
Or mixtures thereof one of coupling agent and stearic acid.The rheology modifier can be bentonite, organic clay, silica, fiber
Or mixtures thereof one of element, xanthan gum.
Embodiment 1
Raw material：100 parts of polyacrylate；70 parts of sheet heat filling graphene；40 parts of sheet heat filling graphite；Silane
1 part of coupling agent；1 part of bentonite；0.5 part of antioxidant；5 parts of tackifier；180 parts of solvent；0.5 part of curing agent.
Sheet heat filling 30 carries out surface modification treatment first, and modified sheet heat filling 30 is passed through with other raw materials
Stirring, curtain coating are oriented heat-conducting glue cast sheet with a thickness of 5-150 μm, and the magnetic field that curtain coating while applies vertical direction makes sheet
Heat filling 30 magnetization retrodeviate go to it is consistent with magnetic direction, thus formed perpendicular to heat-conducting glue sheet heat filling (below
It will be to this further description).The modified purpose in 30 surface of sheet heat filling is to improve sheet heat filling 30 in high score
Compatibility in sub- polymeric matrix, paramagnetic powder can also be added in modifying agent makes heat filling have magnetism, curtain coating
The purpose of oriented formation is to align sheet heat filling 30 in heat-conducting glue by the effect in magnetic field.Again by tape casting
Heat-conducting glue cast sheet afterwards is put into drying machine at 50-100 DEG C dry, curing molding 5-30min, is led after natural cooling
Hot coefficient is the heat-conducting glue of the highly directional high thermal conductivity coefficient of 20-30W/ (mK).
Embodiment 2
The method of the present embodiment is same as Example 1, and difference is：In the present embodiment, sheet heat filling graphene
40 parts；50 parts of sheet heat filling graphite.The heat-conducting glue material thermal conductivity of highly directional high thermal conductivity coefficient manufactured in the present embodiment
For 22W/ (mK).
Embodiment 3
The method of the present embodiment is same as Example 1, and difference is：In the present embodiment, sheet heat filling graphene
50 parts；40 parts of sheet heat filling boron nitride.The heat-conducting glue material conducts heat system of highly directional high thermal conductivity coefficient manufactured in the present embodiment
Number is 20W/ (mK).
Embodiment 4
The method of the present embodiment is same as Example 1, and difference is：In the present embodiment, high molecular polymer in raw material
Using 100 parts of natural rubber.The heat-conducting glue material thermal conductivity of highly directional high thermal conductivity coefficient manufactured in the present embodiment is 26W/
(m·K)。
From embodiment 1 as can be seen that heat-conducting glue of the invention is the technology by being cast oriented formation applying vertical magnetic field
Realize what the high orientation in heat-conducting glue 100 of sheet heat filling 30 was arranged, as shown in Fig. 2, being shown which according to this hair
The preparation method schematic diagram of the heat-conducting glue of another bright specific embodiment, such as schemes, and the preparation method includes the following steps：
First with high molecular polymer, sheet heat filling, surface modifier, rheology modifier, antioxidant, tackifier,
Solvent, curing agent are that raw material is proportionally uniformly mixed to form curtain coating material.In order to improve sheet heat filling in high molecular polymerization
It is modified that compatibility in object matrix, preferably sheet heat filling need to carry out it using surface modifier before mixing surface
Processing.
Then a mold 200 is provided, mold 200 is placed on a plate conveyer belt 300, and mold 200 and plate are defeated
Sending has a gap 400 between band 300.
The curtain coating material that sheet heat filling 30 and other raw materials are uniformly mixed to form is put into mold 200 later, and edge
The direction in gap 400 squeeze curtain coating material (arrow direction in such as Fig. 2), squeeze plate conveyer belt 300 while curtain coating is expected
It is mobile also along the direction of extrusion shown in arrow direction, and apply on curtain coating material perpendicular to curtain coating direction while squeezing
Magnetic field；To obtain heat-conducting glue cast sheet 500 by squeezing on the right side of Fig. 2, after 500 dry solidification of heat-conducting glue cast sheet i.e.
It can get heat-conducting glue 100 shown in FIG. 1, the comparative diagram of heat-conducting glue cast sheet 500 and heat-conducting glue 100 is shown in Fig. 3, is shown
Be another specific embodiment according to the present invention heat-conducting glue schematic cross-sectional view.Wherein, the sheet in Fig. 3 is thermally conductive
The orientation of filler 30 is also to use simplified painting, and actual conditions are also possible to that arrangement shape shown in Fig. 2 can be more closely similar to
State.
Under normal conditions, the magnetic force in magnetic field can only act on ferrimagnet generation, but when magnetic field strength reaches certain
Degree when, such as magnetic field strength reaches 1T or more (preferably magnetic field strength 10T~20T), and magneticaction can reach atomic scale,
Even nonferromugnetic material, such as this weak magnetic substance of sheet heat filling can also show apparent magnetic effect in high-intensity magnetic field
It answers.In magnetic field, there is the sheet heat filling of magnetic anisotropy, the energy of magnetization suffered by different directions is different, therefore sheet is led
Hot filler has the trend rotated under magneticaction, and until suffered magnetive attraction reaches minimum, this is in magnetic field
The rotation of magnetically anisotropic substance tends to basic principle.Under high-intensity magnetic field induction, sheet heat filling is readily formed orientation row
Column, it is hereby achieved that arrangement effect of the sheet heat filling perpendicular to the upper and lower surface of heat-conducting glue.Or it is specific at another
In embodiment, it can increase in surface modifier a small amount of when carrying out surface modification treatment to sheet heat filling 30
Have ferromagnetic material, such as the ferroferric oxide powder of superparamagnetism, so that 30 surface adhesion of sheet heat filling is some
Ferrimagnet has magnetic sheet heat filling 30 so as to obtain indirectly.In this case it only needs relatively low
The effect aligned can be realized in magnetic field strength, can save manufacture and the energy consumption cost of electromagnet.
Wherein, the sheet heat filling 30 under the admixture that right part is shown in Fig. 2 is disordered arrangements, by magnetic
The effect of field, so that the sheet heat filling 30 in the heat-conducting glue cast sheet 500 that right side obtains in Fig. 2 lies substantially in vertical configuration
State.Certainly, under actual conditions can not be arranged as shown in Fig. 1 or 3 it is regular, be more likely as Fig. 2 right side
Shown in sheet heat filling 30 in heat-conducting glue cast sheet 500 plumbness, although all sheet heat fillings 30 are in magnetic
All in plumbness under field action, but sheet heat filling 30 is also had no idea to control around the rotation of its vertical axis in magnetic field
Direction is possible to realize as shown in Fig. 1 or 3 unless applying a magnetic field again in the cross side of heat-conducting glue during the preparation process
State.
Therefore, in a specific embodiment, the present invention also " will apply again one perpendicular to diagram on curtain coating material simultaneously
The technical solution in the magnetic field of magnetic direction " is summarized into the scope of protection of present invention, that is, described in previous embodiment
" applying the magnetic field perpendicular to curtain coating direction on curtain coating material " includes " applying two perpendicular to curtain coating direction on curtain coating material
The technical solution (this programme is not shown in the figure) in orthogonal magnetic field " is filled out to obtain as sheet shown in Fig. 1 or 3 is thermally conductive
Material 30 has the technical effect of the arrangement for the orientation more increased, and can obtain better heating conduction and physical property.
In a specific embodiment, heat-conducting glue 100 is formed by 500 dry solidification of heat-conducting glue cast sheet, the heat-conducting glue
Cast sheet has a thickness H1, and the sheet heat filling 30 has a diameter R, wherein 10R≤H1≤200R.It is preferred that
Ground, the diameter of sheet heat filling 30 is 1~30 μm, with a thickness of 5~200nm；Heat-conducting glue cast sheet with a thickness of 10~200 μ
m。
After 500 dry solidification of heat-conducting glue cast sheet, sheet heat filling 30 will not change, but after dry solidification
The thickness of obtained heat-conducting glue 100 can become smaller, that is, as shown in Figure 1, in a specific embodiment, heat-conducting glue 100 has one
Thickness H, sheet heat filling 30 have a diameter R, wherein R≤H≤5R.It is also preferable that sheet heat filling 30 is straight
Diameter is 1~30 μm, with a thickness of 5~200nm；Heat-conducting glue 100 with a thickness of 5~150 μm.
In conclusion the present invention only has 10~200 μm using the heat-conducting glue cast sheet thickness of the tape casting preparation, it had been cast
Cheng Zhong, sheet heat filling are orientated by magnetic fields, and lamella is perpendicular to cast sheet surface；The sheet heat filling of use is along vertical
Histogram to thermal coefficient it is high, platelet boron nitride thermal coefficient >=300W/ (mK), flake graphite >=1500W/ (mK) and piece
Shape graphene >=5000W/ (mK), and heat filling highly directional arrangement in heat-conducting glue, reduce the card of sheet heat filling
Piece bridging structure, so that thermal coefficient, physical property significantly improve.
It will be appreciated by those skilled in the art that although the present invention is described in the way of multiple embodiments,
It is that not each embodiment only contains an independent technical solution.So narration is used for the purpose of for the sake of understanding in specification,
The skilled in the art should refer to the specification as a whole is understood, and by technical solution involved in each embodiment
Regard as and can be combined with each other into the modes of different embodiments to understand protection scope of the present invention.
The foregoing is merely the schematical specific embodiment of the present invention, the range being not intended to limit the invention.It is any
Those skilled in the art, made equivalent variations, modification and combination under the premise of not departing from design and the principle of the present invention,
It should belong to the scope of protection of the invention.
Claims (12)
1. a kind of preparation method of heat-conducting glue, includes the following steps：
With high molecular polymer, sheet heat filling (30), surface modifier, rheology modifier, antioxidant, tackifier, solvent,
Curing agent is that raw material is uniformly mixed to form curtain coating material；
A mold (200) is provided, the mold (200) is placed on a plate conveyer belt (300), the mold (200)
There is a gap (400) between the plate conveyer belt (300)；
Curtain coating material is put into the mold (200) and is squeezed along the plate conveyer belt (300) towards the gap (400)
It presses the curtain coating to expect, while the plate conveyer belt (300) is moved along the direction of extrusion, applies on curtain coating material vertical
In two orthogonal magnetic fields in the curtain coating direction；Heat-conducting glue cast sheet (500) are obtained by squeezing；
The heat-conducting glue (100) will be obtained after heat-conducting glue cast sheet (500) dry solidification.
2. preparation method as described in claim 1, which is characterized in that the sheet heat filling needs to carry out before mixing
Surface modification treatment.
3. preparation method as claimed in claim 2, which is characterized in that when carrying out surface modification treatment, the table of addition
Increase in the modifying agent of face and has ferromagnetic material.
4. preparation method as described in claim 1, which is characterized in that the heat-conducting glue cast sheet (500) has a thickness
H1, the sheet heat filling (30) have a diameter R, wherein 10R≤H1≤200R.
5. preparation method as described in claim 1, which is characterized in that the diameter of the sheet heat filling (30) is 1~30 μ
M, with a thickness of 5~200nm；The heat-conducting glue cast sheet (500) with a thickness of 10~200 μm.
6. the heat-conducting glue that a kind of preparation method as described in one of claim 1-5 obtains, for be set to heat source generator with
Thermally conductive connection is carried out by the heat-conducting glue (100) between radiator, which is characterized in that the heat-conducting glue (100) is plain film shape
Structure, the heat-conducting glue (100) have the upper surface (10) and lower surface (20) being parallel to each other, and the heat-conducting glue (100) is internal
It is evenly distributed with sheet heat filling (30), the schistose surface of the sheet heat filling (30) is perpendicular to the upper surface (10)
With the lower surface (20)；The heat-conducting glue is made of the raw material of following mass parts：High molecular polymer：100 parts；Sheet is thermally conductive
Filler：20-200 parts；Surface modifier：0.2-2 parts；Rheology modifier：0.2-2 parts；Antioxidant：0.1-1 parts；Tackifier：1-
10 parts；50-500 parts of solvent；Curing agent：0.1-1 parts.
7. heat-conducting glue as claimed in claim 6, which is characterized in that the high molecular polymer be natural rubber, butadiene-styrene rubber,
Or mixtures thereof one of Oppanol, polyacrylate, polyvinyl ether resin.
8. heat-conducting glue as claimed in claim 6, which is characterized in that the surface modifier is silane coupling agent, titanate esters idol
Join or mixtures thereof one of agent, aluminate coupling agent and stearic acid.
9. heat-conducting glue as claimed in claim 6, which is characterized in that the rheology modifier is bentonite, organic clay, dioxy
Or mixtures thereof one of SiClx, cellulose, xanthan gum.
10. heat-conducting glue as claimed in claim 6, which is characterized in that the sheet heat filling (30) is platelet boron nitride, piece
Or mixtures thereof one of shape graphite and flake graphite alkene.
11. heat-conducting glue as claimed in claim 6, which is characterized in that the heat-conducting glue (100) has a thickness H, and described
Shape heat filling (30) has a diameter R, wherein R≤H≤5R.
12. heat-conducting glue as claimed in claim 6, which is characterized in that the diameter of the sheet heat filling (30) is 1~30 μ
M, with a thickness of 5~200nm；The heat-conducting glue (100) with a thickness of 5~150 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511021011.9A CN106928886B (en) | 2015-12-30 | 2015-12-30 | A kind of heat-conducting glue and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511021011.9A CN106928886B (en) | 2015-12-30 | 2015-12-30 | A kind of heat-conducting glue and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106928886A CN106928886A (en) | 2017-07-07 |
| CN106928886B true CN106928886B (en) | 2018-11-30 |
Family
ID=59441811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511021011.9A Active CN106928886B (en) | 2015-12-30 | 2015-12-30 | A kind of heat-conducting glue and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106928886B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108359396B (en) * | 2018-03-01 | 2019-12-24 | 翁源泰得利新材料有限公司 | High-efficiency self-repairing liquid for tyre |
| CN108641610A (en) * | 2018-04-25 | 2018-10-12 | 常州驰科光电科技有限公司 | A kind of self-adhesive and high-strength conductive and heat-conductive film and preparation method thereof |
| CN109181592A (en) * | 2018-07-25 | 2019-01-11 | 佛山市高明区爪和新材料科技有限公司 | A kind of preparation method of heat-conducting glue |
| CN115491152A (en) * | 2022-10-10 | 2022-12-20 | 上海润势科技有限公司 | Heat-conducting packaging adhesive film and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102504707A (en) * | 2011-11-01 | 2012-06-20 | 特艾弗新材料科技（上海）有限公司 | Fast cured thermal conductive adhesive and preparation method thereof |
| CN104073193A (en) * | 2013-03-27 | 2014-10-01 | 南京喜力特胶粘剂有限公司 | Thermal conductive adhesive and preparing method thereof |
| CN104918468A (en) * | 2015-06-29 | 2015-09-16 | 华为技术有限公司 | Thermally conductive pad and electronic device |
-
2015
- 2015-12-30 CN CN201511021011.9A patent/CN106928886B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102504707A (en) * | 2011-11-01 | 2012-06-20 | 特艾弗新材料科技（上海）有限公司 | Fast cured thermal conductive adhesive and preparation method thereof |
| CN104073193A (en) * | 2013-03-27 | 2014-10-01 | 南京喜力特胶粘剂有限公司 | Thermal conductive adhesive and preparing method thereof |
| CN104918468A (en) * | 2015-06-29 | 2015-09-16 | 华为技术有限公司 | Thermally conductive pad and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106928886A (en) | 2017-07-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106928886B (en) | A kind of heat-conducting glue and preparation method thereof | |
| CN108485277B (en) | Oriented high-thermal-conductivity interface material and preparation method thereof | |
| Yu et al. | Enhanced through-plane thermal conductivity of boron nitride/epoxy composites | |
| CN103146024B (en) | Porous graphene/polymer complex structure, its preparation method and application | |
| US6663969B2 (en) | Heat conductive adhesive film and manufacturing method thereof and electronic component | |
| JP2019186555A (en) | Heat conductive sheet and manufacturing method of heat conductive sheet | |
| CN105219020B (en) | High-heat-conductance insulating materials, its preparation method and application | |
| Gao et al. | Improved electrical conductivity of PDMS/SCF composite sheets with bolting cloth prepared by a spatial confining forced network assembly method | |
| CN103224638B (en) | Textured Polymer Composites with High Thermal Conductivity of filler and preparation method thereof | |
| CN107641310B (en) | A kind of high thermal conductivity polyphenyl ether copper-clad plate and preparation method thereof | |
| CN102876044A (en) | Magnetic metal power/silicone rubber heat conduction composite material and preparation method thereof | |
| CN105906844B (en) | A kind of high heat conduction graphene nanocomposite material and preparation method thereof | |
| CN105255004B (en) | A kind of graphite resin composite material with nucleocapsid and preparation method thereof | |
| CN105623234B (en) | A kind of high heat conduction engineering plastics and preparation method thereof | |
| CN110734644A (en) | heat-conducting insulating boron nitride polymer composite material and preparation method thereof | |
| CN105504822A (en) | Preparation method of silicone rubber pad | |
| JP2000281995A (en) | Thermally conductive adhesive film and semiconductor device | |
| JP7175586B2 (en) | Boron nitride particle aggregate, method for producing the same, composition, and resin sheet | |
| CN108368418B (en) | Two-dimensional heat conducting material and use thereof | |
| JP2013145835A (en) | Method for manufacturing heat dissipation sheet | |
| CN109337291B (en) | Surface-modified graphene-carbon nitride-epoxy resin thermal interface material and preparation method thereof | |
| CN110204861A (en) | A kind of graphene composite material and preparation method of excellent thermal conductivity | |
| CN108276612B (en) | Preparation and application of graphene/silicon composite heat-conducting silicone grease | |
| JP2000191987A (en) | Thermally conductive adhesive film and semiconductive device | |
| CN103409115A (en) | Enhanced heat conducting interface material and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |