TW201827614A - Copper alloy sheet for heat radiation component - Google Patents

Abstract

To provide a copper alloy sheet for heat radiation component large in strength at high temperature and capable of providing sufficient high strength and heat radiation performance to a heat radiation component after manufacturing when a process for heating to the high temperature at 650 DEG C or higher in a part of processes for manufacturing the heat radiation component. There is provided a copper alloy sheet having phosphide containing one or more kind of Fe, Ni, Co deposited, bearing force of 100 MPa or more and excellent flexure processability, bearing force at 850 DEG C of 10 MPa or more, bearing force after heating at 850 DEG C, then water cooling for 30 min. and aging treating of 100 MPa or more and conductivity of 50% IACS or more. There is provided a copper alloy sheet having phosphide containing one or more kind of Ni, Co deposited, bearing force of 200 MPa or more and excellent flexure processability, bearing force at 850 DEG C of 10 MPa or more, bearing force after heating at 850 DEG C, then water cooling for 30 min. and aging treating of 300 MPa or more and conductivity of 50% IACS or more.

Description

Copper alloy plate for exothermic parts, exothermic parts and method for manufacturing exothermic parts

[0001] The present disclosure relates to a copper alloy plate for heat dissipating parts when a plurality of parts are joined and used for manufacturing heat dissipating parts such as a vapor chamber (flat plate heat pipe). In particular, it is a copper alloy plate for heat dissipating parts used in a process of heating to a temperature of 650 ° C. or higher in diffusion bonding, brazing, or the like.

[0002] The speed of operation and the high density of CPUs of CPUs mounted on desktop PCs, notebook PCs, tablet terminals, and smartphones represented by smartphones have rapidly progressed. The amount of heat generated per unit area of the CPU is further increased. If the temperature of the CPU rises to a temperature above a certain level, it may cause malfunctions, thermal runaway, etc., so that effective heat dissipation by a semiconductor device such as a CPU becomes an urgent problem. A heat sink is used as a heat radiation component that absorbs heat of a semiconductor device and dissipates into the atmosphere. Since the heat sink system requires high thermal conductivity, copper or aluminum having high thermal conductivity is used as a raw material. The desktop PC uses a method of conducting heat from the CPU to the heat dissipation fins installed in the heat sink, etc., to exhaust heat by a small fan installed in the desktop PC frame. [0003] However, notebook PCs, tablet terminals, and the like, which do not have a space where a fan is installed, are used as heat radiation parts having a high heat transfer capability in a limited area, and a steam chamber (flat heat pipe) is used. The heat pipe is circulated by evaporation (heat absorption by the CPU) and condensation (release of absorbed heat) of the refrigerant enclosed therein, and exerts heat release characteristics higher than that of the radiator. In addition, it is proposed to solve the heat generation problem of the semiconductor device by combining the heat pipe with the heat radiation part of the radiator or the fan. [0004] The steam chamber improves the heat release performance of the tubular heat pipe (refer to Patent Documents 1 to 4). As a vapor chamber, in order to efficiently condense and evaporate the refrigerant, it is proposed to perform roughening processing, groove processing, and fine pores due to powder sintering on the inner surface in the same manner as the tubular heat pipe. In addition, as a steam chamber, there is a proposal to accommodate an internal member fixed to the internal member by an external member (frame). In order to promote the condensation, evaporation, and transportation of the refrigerant, the internal member is one or more arranged inside the external member, and is processed into various shapes of fins, protrusions, holes, slits, and the like. This type of steam chamber is manufactured by arranging the internal components inside the external components and then integrating the external components with each other and the external components and the internal components by diffusion bonding, brazing, or the like. The steam chamber is filled with refrigerant inside, and then sealed by brazing or the like. When the heat generated by the electronic parts becomes greater and exceeds the heat-dissipating capacity of the steam chamber, a heat-radiating part having the same internal structure as the steam chamber and continuously supplying refrigerant from the outside can be used (it is not necessary to set the inside to a low pressure) ). The members of the frame body used for the heat-radiating parts of this form, and the manufacturing method of the frame body are the same as the steam chamber (refer to Patent Document 5). [0005] As a raw material of the vapor chamber, oxygen-free copper (OFC) composed of excellent thermal conductivity, corrosion resistance, workability, and etching properties is often used. For example, a soft material with a thickness of about 0.3 to 1.0 mm is often used. O) ~ Sheets (including strips) of hard materials (quality H). If an example of the manufacturing process of a steam chamber using OFC sheet material is explained, it is as follows. First, on one surface of a rectangular plate member cut out from an OFC sheet material, a pattern in which a plurality of grooves, irregularities, etc. are formed by etching processing or stamping processing using a mold is formed. Next, the surface on which the aforementioned pattern has been formed is set to the inside, two plate members are vertically stacked, and diffusion bonding is performed in this state (see FIG. 1B). Diffusion bonding above 10 lines ^{- 2} after vacuum pressure is applied about the state of stress of 6MPa 2 ~ (pressing force) in the joint, heated to a high temperature to 800 ~ 900 ℃ of arriving at a particular temperature of about 10 to 120 minutes , Keep at the same temperature. Still, a nozzle (thin-diameter tube) is inserted between the upper and lower plate members, and this nozzle is also joined. After diffusion bonding, a working fluid (water, etc.) is poured into the steam chamber through the nozzle in a vacuum or reduced pressure environment, and then the nozzle is sealed. [0006] In the case of manufacturing by a brazing vapor chamber, a thin plate or foil of silver copper solder, phosphor copper solder, etc., holding the shape of the joint portion is sandwiched between the plate members stacked one above the other, and the heating is continuously inserted in this state It is heated in a furnace and brazed together. Environment-based brazing of 10 ^- about ¹ atm of vacuum atmosphere, a reducing atmosphere, or an inert gas atmosphere, the heating temperature is 650 ~ 900 ℃. In addition, in the brazing heating step, heating and brazing are performed in a state where a stress (applied pressure) of about 2 to 5 MPa is applied to the joining portion so that vibration or the like does not cause deviation in the joining portion. [Prior Art Literature] [Patent Literature] [0007] [Patent Literature 1] Japanese Patent Application Publication No. 2004-238672 [Patent Literature 2] Japanese Patent Application Publication No. 2007-315745 [Patent Literature 3] Japanese Patent Application Publication No. 2014-134347 Gazette [Patent Document 4] Japanese Patent Laid-Open No. 2015-121355 [Patent Document 5] International Publication No. 2014/171276

[Problems to be Solved by the Invention] [0008] The pressure applied in diffusion bonding or brazing is generally 0.2% of the endurance of the material that does not exceed the holding temperature of the diffusion bonding or brazing (permanent in the tensile test When the deformation reaches 0.2% of the tensile strength), select the largest possible value. The greater the pressure, the shorter the retention time at the aforementioned retention temperature, and the more reliable the junction (no leakage, no unjoined spaces, etc.). In addition, in the case of diffusion bonding or brazing, the application of pressure exceeding 0.2% of the endurance can improve the reliability of the joint and shorten the retention time, but the plastic deformation in the pressurized part cannot maintain the desired Shape (design shape). For diffusion bonding or brazing in the steam chamber, when the raw material is OFC sheet, the pressure is also determined not to exceed the 0.2% endurance range of the OFC sheet at the holding temperature. When 0.2% endurance is set to σ _0.2 , add The pressure system is usually set to the range of (0.5 ~ 0.8) × σ _0.2 . [0009] After holding at 700 to 900 ° C for 30 minutes, the 0.2% endurance of the OFC plate measured at this temperature is as small as 8 MPa at 700 ° C, 6 MPa at 800 ° C, and 5 MPa at 900 ° C. A single-sided OFC plate with a thickness of 0.45 mm and a planar shape of 60 mm × 60 mm is left, and the surrounding frame portion is etched to a specific depth to produce a plate member 1 (see FIG. 1A) that imitates the frame of a steam chamber. The width of the frame portion 2 of this plate member 1 is 7 mm, and the thickness of the thin-walled portion 3 to be etched is 0.2 mm. Next, as shown in FIG. 1B, the two plate members 1, 1 are overlapped with the etched surface as the inner side, heated to 850 ° C, and an applied pressure of 3 MPa (50% of 0.2% endurance) is applied to the frame. Above) Hold for 30 minutes to perform diffusion bonding. [0010] After diffusion bonding, the plate members 1, 1 are observed to be slightly depressed and raised near the central portion of the thin-walled portion 3. The reason for such deformation is presumed to be diffusion bonding, the plate member 1 is heated to a high temperature exceeding the recrystallization temperature, and the Young's modulus and endurance (yield stress) of the material are significantly reduced, so by acting on the thin The gravity near the central portion of the wall portion 3 causes creep deformation in the thin portion 3. In addition, it can be considered that the frame portion 2 is deformed in the lateral direction by the pressure applied during diffusion bonding, thereby generating an inward stress on the inner side of the frame portion 2 (the upper and lower thin-walled portions 3), but this stress is also estimated as One of the causes of the aforementioned deformation (depression and bulge). [0011] Changes in the shape and volume of the internal space of the vapor chamber system chamber caused by such deformation, the flow direction (flow path) and flow rate of the evaporated and condensed refrigerant change, and the desired thermal performance cannot be achieved. In addition, a gap is generated between the steam chamber and the heat generating member (CPU or the like), and the heat transfer performance is lowered. Furthermore, the OFC sheet material is heated to a temperature of 600 ° C. or higher to cause secondary recrystallization, and the crystal grains become coarse. For example, if heated to 800 ° C., even if the heating time is short, the average crystal grain size is coarsened to about 100 μm to several 100 μm. The grain boundary system of the coarsened crystal grains becomes more brittle because the density of gas, impurity elements, and inclusions becomes higher, and the grain boundary system is more brittle than the grains. [0012] The thickness of the portion etched or stamped in the steam chamber produced by using an OFC plate with a plate thickness of 0.3 to 0.5 mm becomes thinner to about 0.1 to 0.3 mm. The average crystal grain size is coarsened to about 100 μm to several 100 μm. In such a thin-walled part, only about 1 to 3 crystal grains exist in the wall thickness direction. In the steam chamber, the refrigerant repeatedly evaporates and condenses during use, so the pressure changes at that time, and the tensile and compressive stress repeatedly act on the thin-walled portion. If the average crystal grain size is coarse, cracks at the propagating grain boundary are likely to occur, and cracks may penetrate through the thin-walled portion. If it changes in this way, the refrigerant inside the chamber leaks through the grain boundary and cannot be used as a vapor chamber. In addition, if the average crystal grain size becomes larger, the surface roughness of the copper alloy plate (steam chamber) becomes larger, the gap with the heat generating portion (CPU, etc.) becomes larger, and the heat transfer performance from the heat generating portion to the steam chamber decreases. The problems of diffusion bonding described above (deformation of thin-walled portions, coarsening of crystal grains, etc.) also occur when the vapor chamber is manufactured by brazing. [0013] It can be considered that when a material with high strength at high temperature is used as a raw material of the vapor chamber, the pressure during diffusion bonding or brazing is increased to shorten the retention time, so that the reliability of the joint is improved, which can be further prevented Deformation of the plate member 1 during diffusion bonding or brazing. In addition, it may be considered that when a material that suppresses the coarsening of crystal grains at high temperature is used, most of the crystal grains are also present in the wall thickness direction in the thin-walled portion of the plate member 1 to prevent the leakage of refrigerant in the vapor chamber, Prevent the degradation of heat transfer performance. In addition, in the case of using such a material, it is considered that the same effect can also be obtained in a part of the manufacturing process including other exothermic parts in the process of performing high-temperature heating. Therefore, the embodiment of the present invention is used as a raw material for exothermic parts such as a steam chamber, and its main purpose is to provide a material (copper alloy plate) with high strength (0.2% endurance value) at high temperature. In addition, the embodiment of the present invention is used as a raw material for exothermic parts such as a vapor chamber, and another object is to provide a material (copper alloy plate) that can suppress the coarsening of crystal grains at high temperatures. [Means to solve the problem] [0014] The copper alloy plate for heat dissipating parts according to an embodiment of the present invention is characterized by being used as a part of the manufacturing process of heat dissipating parts, including processes and aging that are heated to 650 ° C or more In the case of treatment, one or more phosphides containing Fe, Ni, and Co are precipitated, which has 0.2% endurance of 100 MPa or more and excellent bending workability. The 0.2% endurance measured at 850 ° C is 10 MPa or more, and After heating at 850 ° C for 30 minutes, water cooling, followed by aging treatment at 500 ° C for 2 hours, the 0.2% endurance is 100 MPa or more, and the conductivity is 50% IACS or more. This copper alloy plate is ideally heated at 850 ° C for 30 minutes with an average crystal grain size of 100 μm or less. Still, the board system referred to in the embodiment of the present invention includes strips. This copper alloy plate contains, for example, one or more of Fe, Co, and Ni and P: 0.01 to 0.2% by mass, and the total content of Fe, Co, and Ni [Fe + Co + Ni] is 0.2 to 2.3% by mass. The remaining part is composed of Cu and inevitable impurities. This copper alloy system further contains one or more types of Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, and Mn as necessary, and contains 0.01 to 0.3% by mass in total. [0015] In addition, the copper alloy plate for other heat dissipating parts according to an embodiment of the present invention is characterized in that one or two kinds of silicides containing Ni and Co are precipitated, and has 0.2% endurance of 200 MPa or more and excellent bending processing The 0.2% endurance measured at 850 ° C is 10 MPa or more, and the water is cooled after heating at 850 ° C for 30 minutes, followed by aging treatment at 500 ° C for 2 hours. The 0.2% endurance is 300 MPa or more, and the conductivity is 50% IACS the above. This copper alloy plate is ideally heated at 850 ° C for 30 minutes with an average crystal grain size of 100 μm or less. This copper alloy plate contains, for example, one or two of Ni and Co and Si, the total content of Ni and Co [Ni + Co] is 1.6 ~ 3.5% by mass, and the total content of Ni and Co [Ni + Co] and Si The content [Si] ratio [Ni + Co] / [Si] is 3.5 ~ 5.5, and the rest is composed of Cu and inevitable impurities. This copper alloy system further contains one or more types of Mg, Al, Cr, Ti, Zr, Zn, Sn, and Mn as necessary, and the total content includes 0.01 to 0.3% by mass. [Effects of the Invention] [0016] The copper alloy plate for heat dissipating parts according to an embodiment of the present invention is composed of a precipitation hardening type copper alloy containing phosphide or silicide, which has a higher strength at high temperature than the previous OFC high. Therefore, the pressure applied during the diffusion bonding can be increased to shorten the holding time, the reliability of the bonding portion is improved, and the deformation of the plate member (such as the frame part of the vapor chamber) in the diffusion bonding can be prevented. In addition, to suppress the coarsening of crystal grains at high temperatures, the thin wall portion of the plate member (for example, the frame of the steam chamber) also allows most of the crystal grains to exist in the wall thickness direction, thereby preventing leakage of refrigerant from the inside. In addition, the copper alloy plate for heat radiation parts according to the embodiment of the present invention is an age-hardening type, and the strength and conductivity are improved by aging treatment after high-temperature heating. Therefore, after a process (diffusion bonding, brazing, laser welding, etc.) heated to 650 ° C. or higher, aging treatment is performed to obtain a high-strength heat radiation part with excellent heat radiation performance.

[0018] Hereinafter, the copper alloy plate for heat dissipating parts according to an embodiment of the present invention will be described in more detail. [Alloy composition] As precipitation-hardening copper alloys suitable for exothermic parts such as frames of steam chambers, there may be mentioned Cu- (Fe, Co, Ni) -P based alloys that are generally well known, and Cu- (Ni , Co) -Si series alloy. [0019] (Cu- (Fe, Co, Ni) -P series alloy) The copper alloy series of this series contains one or more types of Fe, Ni, Co and P, Fe, Ni, Co and P series forming compounds (Phosphide). This copper alloy is ideally the total content of Fe, Co, and Ni [Fe + Co + Ni] is 0.2 to 2.3% by mass, the P content is 0.01 to 0.2% by mass, and the remainder is composed of Cu and inevitable impurities. This copper alloy system further contains one or more types of Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, and Mn as necessary, and contains 0.01 to 0.3% by mass in total. [0020] Fe, Co, and Ni form a compound (phosphide) with P, which improves the strength and conductivity of the copper alloy plate after aging treatment, and has the effect of suppressing the coarsening of crystal grains when heated at high temperature. Fe and Co that do not form phosphides precipitate as monomers and have the same function as the phosphides described above. On the other hand, Ni that does not form phosphides dissolves in Cu and improves the strength of the copper alloy plate. However, when [Fe + Co + Ni] is less than 0.2% by mass, the 0.2% endurance at 850 ° C becomes less than 10 MPa. On the other hand, if [Fe + Co + Ni] exceeds 2.3% by mass, the electrical conductivity decreases, and coarse compounds are precipitated crystals during the alloy melting and casting step, and bending workability, press workability, and corrosion resistance decrease. Therefore, [Fe + Co + Ni] is ideal in the range of 0.2 to 2.3% by mass. In addition, in this copper alloy, when the Ni-based content is less than 0.1% by mass, the above-mentioned effects are insufficient. On the other hand, when the content exceeds 1% by mass, the above-mentioned effects are saturated. Therefore, when Ni is included, the Ni content is set in the range of 0.1 to 1.0% by mass. The ideal lower limit of [Fe + Co + Ni] is 0.25%, the ideal upper limit is 2.1%, and the ideal lower limit of Ni is 0.15%, and the ideal upper limit is 0.9%. The above copper alloy system contains one or two of Fe and Co among Fe, Co, and Ni, and the total content of Fe and Co [Fe + Co] is preferably 0.2 to 2.3% by mass. In this case, 0.1 to 1.0% by mass of Ni may be included as necessary. With this composition, the average crystal grain size after heating at 850 ° C. for 30 minutes can be suppressed to 100 μm or less. [0021] P reduces the amount of oxygen contained in the copper alloy by deoxidation, and has the effect of preventing hydrogen embrittlement when heating an exothermic part in a hydrogen-containing reducing environment. The P content necessary to prevent hydrogen embrittlement is 0.01% by mass or more. In addition, the P-solution that has been dissolved lowers the conductivity of the copper alloy, but by heating to the precipitation temperature to form Fe, Co, Ni, and phosphide, the strength, heat resistance, and conductivity of the copper alloy increase. However, if the content of P exceeds 0.2% by mass, the amount of P in solid solution increases, and the conductivity decreases. Therefore, the content of P is set to 0.01 to 0.2% by mass. When the improvement of strength, heat resistance and electrical conductivity is mainly achieved by the precipitation of the above phosphide, the ratio of [Fe + Co + Ni] and P content [P] [Fe + Co + Ni] / [P] is About 2 ~ 5 is ideal. The ideal lower limit value of P is 0.013%, the ideal upper limit value is 0.17%, and the ideal lower limit value of [Fe + Co + Ni] / [P] is 2.3, and the ideal upper limit value is 4.5. [0022] Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, Mn system has the effect of improving the strength and heat resistance of the copper alloy, so one or more of these are added as necessary . However, if the total content of one or more of these elements is less than 0.005 mass%, the effect is small. On the other hand, if it exceeds 0.3 mass%, the conductivity decreases. Therefore, the total content of one or more of these elements is set in the range of 0.005 to 0.3% by mass. The total content of one or more of these elements is preferably a lower limit of 0.01, more preferably a lower limit of 0.02% by mass, and an upper limit of 0.25% by mass. Among them, since Si, Al, Mn, and Ti are contained in a small amount, the conductivity of the copper alloy is also reduced, so it is desirable to set the upper limit of each element to 0.1% by mass. The Cr and Zr series have a small amount of solid solution to copper and are also precipitated in a relatively high temperature region. Therefore, they are elements that have a large effect of suppressing the coarsening of crystal grains when heated to a high temperature. Therefore, when it is intended to miniaturize the crystal grains of the copper alloy plate, the total of Cr or Zr 1 or 2 should be 0.03% by mass or more, preferably 0.06% by mass or more. When the total of Cr or Zr 1 or 2 is 0.03% by mass or more, even if [Fe + Co] is less than 0.2% by mass (however, [Fe + Co + Ni] is 0.2% by mass or more), The average crystal grain size after heating at 850 ° C for 30 minutes can be suppressed to less than 100 μm. On the other hand, since Cr and Zr reduce the electrical conductivity, it is desirable that the total content of one or two of these elements is 0.2% by mass or less. In addition to the effect of improving strength and stress relaxation resistance, Sn and Mg have the effect of improving stress relaxation resistance. If the temperature of the heat-dissipating parts or the operating environment becomes 80 ° C or above, creep deformation will occur and the contact area with the heat source such as the CPU will be reduced, and the heat dissipation will be reduced, but the stress relaxation resistance will be improved to suppress this phenomenon. In order to obtain this effect, the Sn content is preferably 0.01% by mass or more, and the Mg content is preferably 0.005% by mass or more. On the other hand, from the viewpoint of preventing a decrease in the electrical conductivity of the copper alloy sheet, the Sn content is preferably 0.2% by mass or less, and the Mg content is preferably 0.2% by mass or less. Zn system improves the heat-resistant peelability of solder and Sn-plated heat-resistant peelability. In the steam chamber, there are electronic parts that are soldered to the heat dissipation portion, and in order to improve corrosion resistance, Sn plating is sometimes applied to the steam chamber. In such a case, a copper alloy plate containing Zn is suitably used as the raw material of the frame of the vapor chamber. The Zn system has the effect of improving the heat-resistant peelability even when added in a small amount. However, since the effect is saturated even if it contains Zn in excess of 0.3% by mass, the content of Zn is preferably 0.3% or less. The lower limit of the Zn content is preferably 0.005% by mass, more preferably 0.01% by mass. [0023] (Cu- (Ni, Co) -Si-based alloy) The copper alloy of this series contains one or more of Ni and Co, and Ni, Co and Si form a compound (silicide). This copper alloy is ideally the total content of Ni and Co [Ni + Co] is 1.6 to 3.5% by mass, the ratio of the total content of Ni and Co [Ni + Co] to the content of Si [Si] [Ni + Co] / [ Si] is 3.5 ~ 5.5, and the rest is composed of Cu and inevitable impurities. This copper alloy system further contains one or more types of Mg, Al, Cr, Ti, Zr, Zn, Sn, and Mn as necessary, and the total content includes 0.01 to 0.3% by mass. [0024] Ni and Co form a compound (silicide) with Si, which improves the strength and conductivity of the copper alloy after aging treatment, and has the effect of suppressing the coarsening of crystal grains when heated at high temperature. However, when [Ni + Co] is less than 1.6% by mass, the 0.2% endurance at 850 ° C becomes less than 10 MPa, and the effect of suppressing the coarsening of crystal grains is small. On the other hand, if [Ni + Co] exceeds 3.5% by mass, the electrical conductivity decreases, and the coarse compound precipitates crystals or precipitates and the hot workability decreases. Therefore, [Ni + Co] is set in the range of 1.6 to 3.5% by mass. In addition, when [Ni + Co] / [Si] is less than 3.5, the excess Si becomes solid solution, and if it exceeds 5.5, the excess Ni or Co becomes solid solution, and the conductivity decreases. Therefore, [Ni + Co] / [Si] is set in the range of 3.5 to 5.5. When the average crystal particle size after heating at 850 ° C. for 30 minutes is suppressed to 100 μm or less, it is desirable to set [Ni + Co] to 2.4% by mass or more. [0025] The Mg, Al, Cr, Ti, Zr, Zn, Sn, and Mn systems have the effect of enhancing the strength of the copper alloy, so one or more of these are added as necessary. However, if the total content of one or more of these elements is less than 0.005 mass%, the effect is small. On the other hand, if it exceeds 0.3 mass%, the conductivity decreases. Therefore, the total content of one or more of these elements is set in the range of 0.005 to 0.3% by mass. The total content of one or more of these elements is preferably a lower limit of 0.01% by mass, more preferably a lower limit of 0.02% by mass, and an upper limit of 0.25% by mass. Among them, since Al, Mn, and Ti are contained in a small amount, the conductivity of the copper alloy is also reduced, so it is desirable to set the upper limit to 0.1% by mass. Cr and Zr are elements that have a large effect of suppressing the coarsening of crystal grains when heated to a high temperature. When the crystal grains are to be refined, the total of Cr and Zr 1 or 2 is 0.03% by mass or more, preferably 0.06 It is better if the quality is above%. In the case where Cr or Zr contains one or two of 0.03% or more, even if [Ni + Co] is less than 2.4% by mass (1.6% by mass or more), the average crystallization after heating at 850 ° C for 30 minutes The particle size is suppressed below 100 μm. However, because Cr and Zr reduce the conductivity, it is desirable that the total content of one or two of these elements is 0.2% by mass or less. In addition to the effect of improving strength and stress relaxation resistance, Sn and Mg have the effect of improving stress relaxation resistance. If the temperature of the heat-dissipating parts or the operating environment becomes 80 ° C or above, creep deformation will occur and the contact area with the heat source such as the CPU will be reduced, and the heat dissipation will be reduced, but the stress relaxation resistance will be improved to suppress this phenomenon. In order to obtain this effect, the Sn content is preferably 0.01% by mass or more, and the Mg content is preferably 0.005% by mass or more. On the other hand, from the viewpoint of preventing a decrease in the electrical conductivity of the copper alloy sheet, the Sn content is preferably 0.2% by mass or less, and the Mg content is preferably 0.2% by mass or less. Zn system improves the heat-resistant peelability of solder and Sn-plated heat-resistant peelability. In the steam chamber, there are electronic parts that are soldered to the heat dissipation portion, and in order to improve corrosion resistance, Sn plating is sometimes applied to the steam chamber. In such a case, a copper alloy plate containing Zn is suitably used as the raw material of the frame of the vapor chamber. The Zn system has the effect of improving the heat-resistant peelability even when added in a small amount. However, since the effect is saturated even if it contains Zn in excess of 0.3% by mass, the content of Zn is preferably 0.3% or less. The lower limit of the Zn content is preferably 0.005% by mass, more preferably 0.01% by mass. [Manufacturing method of copper alloy sheet] The copper alloy sheet according to the embodiment of the present invention is to perform soaking treatment on the ingots, followed by (1) hot rolling-cold rolling-annealing, (2) hot rolling-cold rolling -Annealing-cold rolling, (3) hot rolling-cold rolling-annealing-cold rolling-low temperature annealing and other steps can be manufactured. In the above (1) to (3), the steps of cold rolling-annealing may also be performed multiple times. The aforementioned annealing system includes softening annealing, recrystallization annealing, or precipitation annealing (aging treatment). In the case of softening annealing or recrystallization annealing, the heating temperature is selected from the range of 600 to 950 ° C, and the heating time is selected from the range of 5 seconds to 1 hour. When the softening annealing or recrystallization annealing is also combined with the solution treatment, it is preferable to perform continuous annealing with heating at 650 to 950 ° C for 5 seconds to 3 minutes. In the case of precipitation annealing, it is better to maintain the conditions of 0.5 to 10 hours in the temperature range of about 350 to 600 ° C. In the case where the softening annealing or the recrystallization annealing also performs the solution treatment, the precipitation annealing may be performed in the subsequent step. [0027] Finally, the cold rolling system is set to 0.2% of the endurance and bending workability, which is preferably selected from the range of the processing rate of 5 to 80%. Low-temperature annealing is designed to restore the ductility of the copper alloy plate without softening the copper alloy plate. The continuous annealing is formulated to maintain the environment at 300 ~ 650 ℃ for about 1 second to 5 minutes. Better. In addition, in the case of batch annealing, the physical temperature of the copper alloy plate is preferably 250 ° C. to 400 ° C. for about 5 minutes to 1 hour. [0028] In the case of the Cu- (Fe, Co, Ni) -P-based alloy, by the above manufacturing method, the 0.2% endurance is 100 MPa or more, and a copper alloy plate having excellent bending workability can be manufactured. This copper alloy plate was measured at 850 ° C (measured after holding at 850 ° C for 30 minutes). The 0.2% endurance was 10 MPa or more. After heating at 850 ° C for 30 minutes, it was water-cooled, followed by aging treatment at 500 ° C for 2 hours At the time, it has 0.2% endurance of 100MPa or more, and 50% IACS or more conductivity. In the case of Cu- (Ni, Co) -Si-based alloy, the 0.2% endurance is 200 MPa or more by the above manufacturing method, and a copper alloy sheet having excellent bending workability can be manufactured. This copper alloy plate was measured at 850 ° C (measured after holding at 850 ° C for 30 minutes). The 0.2% endurance was 10 MPa or more. After heating at 850 ° C for 30 minutes, it was water-cooled, followed by aging treatment at 500 ° C for 2 hours At the time, it has a 0.2% endurance of 300 MPa or more and a conductivity of 50% IACS or more. [0029] In the aforementioned bending workability system, it is required that no cracks occur in the bent portion. Furthermore, it is desirable that no surface roughness occurs in the bending line and the vicinity. Even for copper alloy plates of the same material, the ease of cracking due to bending and the roughness of the surface depends on the ratio R / t of the bending radius R to the plate thickness t. When a copper alloy plate is used to manufacture heat-radiating parts such as a vapor chamber, as the bending workability of the copper alloy plate, it is generally required that no bending occurs when R / t ≦ 2 is bent in the parallel direction and the right-angle direction of rolling. As the bending workability of the copper alloy plate, it is ideal that no bending occurs at the bending of R / t ≦ 1.5, and that it does not occur at the bending of R / t ≦ 1.0. The bending workability of the copper alloy plate is generally tested with a test piece having a plate width of 10 mm (refer to the bending workability test of the examples described later). In the case of bending a copper alloy plate, the larger the bending width, the easier it is to crack, so especially when the bending width is tested with a test piece with a plate width of 10 mm, bending with R / t = 1.0 does not cause cracking It is ideal, and it is ideal that bending with R / t = 0.5 does not cause cracking. In addition, in order not to cause surface roughness in the bending line and the vicinity, the average crystal grain size (cutting method) measured on the surface of the copper alloy plate in the plate width direction is preferably 20 μm or less, and 15 μm or less is more preferable . [0030] In the case of manufacturing exothermic parts such as a steam chamber, the copper alloy plate is processed by press forming, punching, cutting, etching, bending workability, etc. before being heated to a temperature of 650 ° C. or higher Specific shapes are processed to exothermic parts by high-temperature heating (heating for degassing, bonding (brazing, diffusion bonding, fusion bonding (TIG, MIG, laser, etc.), sintering, etc.). Regarding embodiments of the present invention The copper alloy plate has the above-mentioned characteristics, and the transportation and operation during the above-mentioned processing will not be easily deformed, and there is no obstacle in the implementation of the above-mentioned processing. Furthermore, the 0.2% endurance measured at high temperature (850 ° C) is 10 MPa or more , Increase the pressure applied during diffusion bonding or brazing to shorten the holding time, improve the reliability of the joint, and further prevent the deformation of the copper alloy plate during diffusion bonding or brazing. Further, when heated to 650 After the process above ℃, by performing aging treatment, a heat release part with high 0.2% endurance and conductivity can be obtained. [0031] The heat release manufactured using the copper alloy plate according to the embodiment of the present invention After the above process of heating the parts to 650 ° C or higher, as necessary, the improvement of corrosion resistance and solderability is the main purpose, and a Sn coating layer is formed on at least a part of the outer surface. The Sn coating layer includes plating, It is formed by electroless plating, or after such plating, and heated to below or above the melting point of Sn. The Sn coating layer contains Sn metal and Sn alloy, as Sn alloy, it is other than Sn, as The alloying elements include one or more of Bi, Ag, Cu, Ni, In, and Zn, and the total content is 5 mass% or less. [0032] Under the Sn coating layer, Ni, Co, Fe, etc. can be formed Underlayer plating. These underlayer plating functions as a barrier to prevent the diffusion of Cu and alloy elements from the base material, and to prevent scratches by increasing the surface hardness of the heat-dissipating parts. Cu is plated on the plating, and after Sn plating, heat treatment is performed below the melting point of Sn or above the melting point to form a Cu-Sn alloy layer, which can also be used for underplating, Cu-Sn alloy layer and Sn It consists of three layers of coating layer. The Cu-Sn alloy layer is used to prevent expansion from the base material. The barrier function of Cu and alloy elements, and the function of preventing scratches by increasing the surface hardness of the heat dissipating parts. [0033] In addition, heat dissipating parts manufactured using the copper alloy plate according to the embodiment of the present invention After the above process of heating to 650 ° C. or more, as necessary, a Ni coating layer is formed on at least a part of the outer surface. The Ni coating layer has a barrier to prevent the diffusion of Cu and alloy elements from the base material, and the heat release component becomes larger The function of the surface hardness to prevent scratches and improve the corrosion resistance. [0034] The copper alloy sheet according to the embodiment of the present invention is ideally soaked in a heat-treated ingot, followed by hot rolling, followed by cold rolling, melting It is manufactured by the steps of recrystallization treatment, cold rolling and aging treatment. After the recrystallization treatment accompanying the solution, the aging treatment is performed without cold rolling, and then cold rolling may be performed. The dissolution and casting can be carried out by the usual methods such as continuous casting and semi-continuous casting. Still, it is desirable to use a material with a small content of S, Pb, Bi, Se, and As as a copper melting raw material. Also, pay attention to the fiery heating (moisture removal) of the charcoal coated with the copper alloy melt, the base metal, the scrap material, the drying of the casting duct, the mold, and the deoxidation of the melt. It is desirable to reduce O and H. [0035] The homogenization treatment is ideal after the temperature inside the ingot reaches a temperature of 800 ° C. or more and is kept for 30 minutes or more. The holding time of the homogenization treatment is preferably more than 1 hour, more preferably 2 hours. After the homogenization treatment, hot rolling is started at a temperature above 800 ° C. In the way that the hot rolled material does not form coarse (Fe, Ni, Co) -P precipitates or (Ni, Co) -Si precipitates, the hot rolling system ends at a temperature above 650 ° C, from which temperature Methods such as water cooling and rapid cooling are ideal. If the rapid cooling start temperature after hot rolling is lower than 650 ° C, coarse (Fe, Ni, Co) -P precipitates or (Ni, Co) -Si precipitates are formed, and the structure tends to become uneven, and the copper alloy plate (Product board) strength is reduced. The end temperature of hot rolling (starting temperature of quenching) is preferably 700 ° C or higher, and more preferably 750 ° C or higher. Still, the structure of the hot rolled material that has been quenched after hot rolling becomes a recrystallized structure. The recrystallization treatment accompanying the dissolution described below can also perform rapid cooling after hot rolling. [0036] By cold rolling after hot rolling, a certain strain is applied to the copper alloy plate, and then after the recrystallization treatment, a copper alloy plate having a desired recrystallization structure (fine recrystallization structure) can be obtained. The recrystallization treatment accompanying the solution is carried out at a temperature of 650 to 950 ° C, ideally 670 to 900 ° C for 3 minutes or less. When the content of the alloy element in the copper alloy is small, the recrystallization treatment is performed in the lower temperature range in the above temperature range, and when the content of the foregoing element is large, the recrystallization treatment is performed in the higher temperature range in the above temperature range as ideal. By this recrystallization treatment, the alloy elements are solid-dissolved in the copper alloy base material, and at the same time, a bendable workability becomes a good recrystallized structure (crystal grain size is 1-20 μm). If the temperature of this recrystallization treatment is lower than 650 ° C, the solid solution amount of Ni, Fe, Co, P or Ni, Co, Si becomes small, and the strength decreases. On the other hand, if the temperature of the recrystallization treatment exceeds 950 ° C or the treatment time exceeds 3 minutes, the recrystallized grains become coarse. [0037] After recrystallization treatment with solution, the system can be selected (a) cold rolling-aging treatment, (b) cold rolling-aging treatment-cold rolling, (c) cold rolling-aging treatment-cold rolling-low temperature annealing , (D) any step of aging treatment-cold rolling, (e) aging treatment-cold rolling-low temperature annealing. The aging treatment (precipitation annealing) is carried out at a heating temperature of about 300 to 600 ° C. for 0.5 to 10 hours. If the heating temperature is less than 300 ° C, the amount of precipitation is small, and if it exceeds 600 ° C, the precipitate tends to coarsen. The lower limit of the heating temperature is ideally set to 350 ° C, the upper limit is ideally set to 580 ° C, and more preferably 560 ° C. The retention time of the aging treatment is appropriately selected by the heating temperature, and is performed in the range of 0.5 to 10 hours. If the holding time is less than 0.5 hours, the precipitation becomes insufficient, and even if the retention time exceeds 10 hours, the precipitation amount is saturated, and the productivity decreases. The lower limit of the holding time is ideally set to 1 hour, and more preferably set to 2 hours. [0038] In the case of a Cu- (Fe, Co, Ni) -P-based alloy, the copper alloy plate produced by the above ideal steps and conditions has a 0.2% endurance of 300 MPa or more and has excellent bending workability. In the case of Cu- (Ni, Co) -Si-based alloys, the copper alloy plate series manufactured with the above ideal steps and conditions has a 0.2% endurance of 300 MPa or more, and has excellent bending workability. In addition, the surface roughness of the copper alloy plate (product) that can be used for good bonding (no joint failure, high bonding strength, etc.) at a temperature of 650 ° C. or higher by diffusion bonding, brazing, etc. is the arithmetic average roughness Ra is 0.3 μm or less, the maximum height roughness Rz is 1.5 μm or less, the internal oxidation depth is 0.5 μm or less, and most preferably 0.3 μm or less. The surface roughness of the copper alloy plate (product) is set to Ra: 0.3 μm, Rz: 1.5 μm or less. The surface roughness in the roll axis direction of the rolling roll used for the last cold rolling is, for example, Ra: 0.15 μm, Rz : Below 1.0μm, or the copper alloy plate after the last cold rolling can be polished by polishing, electrolytic polishing, etc. In addition, the internal oxidation depth of the copper alloy plate (product) is set to 0.5 μm or less by setting the annealing environment to be reductive while setting the dew point to -5 ° C. or less, or mechanically polishing the annealed copper alloy plate ( (Polishing, brushing, etc.) or electrolytic grinding to remove the internal oxide layer that has been generated, or to thin it. [Manufacturing method of exothermic parts] The copper alloy plate according to the embodiment of the present invention is used as a raw material of a frame of a vapor chamber, for example. The manufacturing process of the steam chamber is the same as that of the OFC sheet material using the previous material. The two plate members formed with patterns such as grooves or irregularities are joined by diffusion bonding or brazing to form the frame of the steam chamber. The copper alloy plate is heated at a high temperature above 650 ° C in this joining step. [0040] The copper alloy sheet according to the embodiment of the present invention also has a 0.2% endurance of 10 MPa or more at 850 ° C, so the pressure applied during diffusion bonding or brazing is the same as the case where the OFC sheet material of the previous material is used as a raw material In comparison, it can become larger. Therefore, the reliability of the diffusion bonding portion or the brazing portion is improved, and the retention time of the diffusion bonding or brazing can be shortened. In addition, since the 0.2% resistance at a high temperature is large, for example, the heating process at the time of diffusion bonding or brazing can prevent deformation of the plate member such as depressions and bumps. The 0.2% endurance at 850 ° C is ideally 12 MPa or more, and this value is achievable in the copper alloy plate according to the embodiment of the present invention. [0041] In the case of the copper alloy sheet according to the embodiment of the present invention, the average crystal grain size after high-temperature heating (850 ° C. × 30 minutes) is suppressed to 100 μm or less, which prevents the thinness of heat-radiating parts penetrating through the steam chamber and the like The rupture of the wall and the leakage of refrigerant. In addition, it is possible to prevent the surface roughness of the heat-dissipating parts from becoming larger, to prevent the gap between the heat generating part (CPU, etc.) from increasing, and the accompanying decrease in heat transfer performance. [0042] The exothermic parts after high-temperature heating (heating at 650 ° C. or higher) are softened, but because the copper alloy according to the embodiment of the present invention is a precipitation hardening type, the following conditions (300 to 600 ℃ × 0.5 ~ 10 hours) Aging treatment can increase the strength. Furthermore, by this aging treatment, the conductivity reduced by high-temperature heating is restored. In addition, for the copper alloy plate according to the embodiment of the present invention, after heating at 850 ° C. for 30 minutes (corresponding to diffusion bonding conditions), and performing aging treatment under the aforementioned conditions, the Cu- (Fe, Co, Ni)- The P-based alloy system represents 100 MPa or more, and the Cu- (Ni, Co) -Si-based alloy system represents 0.2% endurance of 300 MPa or more. In addition, by this aging treatment, the electrical conductivity of the copper alloy sheet according to the embodiment of the present invention is 50% IACS or higher for any alloy system. The conductivity of the copper alloy sheet according to the embodiment of the present invention after aging treatment is lower than OFC. However, because of its high strength, it can be thinner than OFC, which can compensate for the lower conductivity. [0043] After high-temperature heating (after the bonding step), that is, heating to 650 ° C. or higher, the aging treatment after bonding can be performed in the following manner, for example. (1) After cooling the exothermic parts heated at high temperature to a temperature below 300 ° C, reheat to the aforementioned temperature range, and keep it in the same range for a specific time to precipitate and harden. In this case, when the exothermic part after high-temperature heating is still at high temperature, quench it with water cooling, or reheat the exothermic part after high-temperature heating to the solution temperature and then quench it. It is ideal to dissolve the copper alloy in advance. (2) The exothermic parts after heating at high temperature are kept in the aforementioned temperature range for a certain period of time during the cooling of the high temperature to precipitate and harden. The exothermic part is maintained at a specific temperature within the aforementioned precipitation temperature range, and can be continuously cooled within the aforementioned precipitation temperature range. (3) After the step (2) above, reheating the above (1) is further performed to precipitate and harden the precipitation hardening type copper alloy. In the embodiment of the present invention, after the joining step, aging treatment is performed without applying plastic working. If the bonding material after high-temperature heating (after the bonding step) is plastically processed before the aging treatment, the internal structure and dimensions of the heat-dissipating parts change, so the shape and size of the refrigerant flow path do not conform to the design value. This result As a heat-dissipating component, the heat transfer performance cannot be achieved. In general, those who perform aging treatment after precipitation-type alloy-based plastic processing are to increase the strength and the electrical conductivity. However, the CuFeP-based and CuNiSi-based alloy systems according to the embodiments of the present invention have not undergone plastic processing. In the case of aging treatment, it can also achieve the same level of strength and electrical conductivity as the case of plastic processing. [Example 1] [0044] A copper alloy having the composition shown in Tables 1 and 2 is dissolved in a charcoal-coated environment (No. 1 to 16, 18 to 29) or a vacuum environment (No. 17) at the melt temperature Cast at 1200 ° C in a splicing mold (book mold) to produce ingots with a thickness of 50 mm, a width of 200 mm, and a length of 70 mm. Heat each ingot to 950 ° C (No. 1 ~ 16, 18 ~ 29) or 800 ° C (No. 17), hold it for 1 hour, hot-roll to 16mm in thickness, and immediately water-cool it after the hot-rolling to obtain a thickness of 16mm , 200mm wide, 215mm hot rolled material. Regarding No. 1 to 16, 18 to 29, the hot-rolled material system was further heated to 850 ° C, and after reaching 850 ° C for 30 minutes, water quenching was performed. The composition of each hot-rolled material with a plate thickness of 16 mm is also the same as the values in Tables 1 and 2. In addition, for any hot-rolled material, the surface roughness is also Ra: 0.08 to 0.15 μm, Rz: 0.8 to 1.2 μm, and the thickness of the polished plate is measured by a scanning electron microscope (observation magnification: 15,000 times). The oxidation depth is 0.1 μm or less. No. 1 ~ 16 in Table 1 are Cu- (Fe, Co, Ni) -P series, No. 17 is OFC, and No. 18 ~ 29 in Table 2 are Cu- (Ni, Co) -Si series copper alloys . [0045] [0046] [0047] No. 1 ~ 16, 18 ~ 29 hot-rolled materials are cut on both sides of each plane 1mm, cold rolled to a thickness of 1.25mm (width 200mm, length 2400mm), this is cut into a length of 1900mm A material and a length of 500mm Of B material. About the above-mentioned A material system, cold rolling to a thickness of 0.75 mm, an aging treatment heated at 500 ° C. for 2 hours, and further cold rolling to a thickness of 0.3 mm (processing rate: 60%), followed by heating at 350 ° C. for 30 seconds in a saltpeter furnace Of strain relief annealing. Using the obtained copper alloy plate as a test material, 0.2% endurance at room temperature (20 ° C), ductility, and bending workability were measured. In addition, using each test material, the average crystal grain size after heating at 850 ° C for 30 minutes, and further 0.2% endurance and conductivity after aging treatment were measured in the following manner. The results are shown in Tables 3 and 4. About the above-mentioned B material system, after applying aging treatment heated at 500 ° C for 2 hours, it was cold rolled to a thickness of 0.5 mm (processing rate: 60%), and strain relief annealing was performed at 350 ° C for 30 seconds in a saltpeter furnace. Using the obtained copper alloy plate as a test material, the 0.2% endurance at 850 ° C was measured by the following method. The results are shown in Tables 3 and 4. [0048] The hot-rolled material of No. 17 cuts both planes by 1 mm on each side, cold-rolls to a thickness of 0.71 mm (width 200 mm, length 4200 mm), and cuts this into a C material with a length of 3700 mm and a D material with a length of 500 mm. About the above-mentioned C material system, cold rolling to a thickness of 0.43 mm, annealing at 350 ° C. for 2 hours, and further cold rolling to a thickness of 0.3 mm (processing rate: 30%), heating at 350 ° C. for 30 seconds in a saltpeter furnace Strain relief annealing. Using the obtained copper plate as a test material, 0.2% endurance and ductility at room temperature (20 ° C) and bending workability were measured. In addition, using each test material, the average crystal grain size after heating at 850 ° C for 30 minutes, and further 0.2% endurance and conductivity after aging treatment were measured in the following manner. This result is shown in Table 3. The D material system was annealed at 350 ° C. for 2 hours, then cold rolled to a thickness of 0.5 mm (processing rate: 30%), and subjected to strain relief annealing at 350 ° C. for 30 seconds in a saltpeter furnace. Using the obtained copper plate as a test material, the 0.2% endurance at 850 ° C was measured by the following method. This result is shown in Table 3. [0049] (0.2% endurance and ductility (room temperature)) From each test material (A material and C material), a JIS No. 5 tensile test piece was cut out so that the longitudinal direction became the rolling parallel direction, based on JIS- Z2241 was subjected to a tensile test to measure the endurance and ductility. The endurance is a tensile strength equivalent to 0.2% of permanent deformation. [0050] (Bending workability (room temperature)) The measurement of the bending workability was carried out in accordance with the W bending test method prescribed by the drawn copper wire association standard JBMA-T307. A test piece with a width of 10 mm and a length of 30 mm is cut out from each test material (A material and C material), and a jig with R / t = 0.5 is used to perform GW (Good Way (the bending axis is perpendicular to the rolling direction)) and BW (Bad Way (the bending axis is parallel to the rolling direction)) bending. Next, visually observe the presence or absence of cracks in the bending part with a 100-fold optical microscope, and evaluate those who did not produce cracks in both GW and BW as P (P: Pass, Pass), and either in GW or BW If one or both of them are broken, it is evaluated as F (F: Fail, failed). (Average crystal grain size (after heating at 850 ° C for 30 minutes)) From each test material (material A and material C), three test pieces were cut out so that the longitudinal direction became the rolling parallel direction ( 10mm wide and 250mm long). Each test piece was placed in a vacuum furnace, and the average temperature increase rate from room temperature was set to about 90 ° C / min and heated to 850 ° C. After reaching 850 ° C, the temperature was maintained at the same temperature for 30 minutes. Next, the test piece was taken out from the furnace while maintaining the vacuum environment as it was, cooled to 250 ° C. in 240 seconds, and then taken out from the vacuum environment and water-cooled. Three specimens each having a length of 20 mm were taken from each test piece, and the average crystal grain size was measured by a cutting method in a cross section parallel to the rolling direction of each specimen (the measuring direction was the parallel direction of rolling). Regarding each test material, the average value of the data of 9 samples (3 × 3) was set as the average crystal particle size. [0052] (0.2% endurance and conductivity (after heating and aging treatment at 850 ° C. for 30 minutes)) From each test material (A material and C material), JIS5 was cut out in such a way that the longitudinal direction became the rolling parallel direction No. tensile test piece and conductivity test piece (width 10mm, length 250mm). Each test piece was placed in a vacuum furnace, and the average temperature increase rate from room temperature was set to about 90 ° C / min and heated to 850 ° C. After reaching 850 ° C, the temperature was maintained at the same temperature for 30 minutes. Next, the test piece was taken out from the furnace while maintaining the vacuum environment as it was, cooled to 250 ° C. in 240 seconds, and then taken out from the vacuum environment and water-cooled. Next, after heating each test piece to 500 degreeC and keeping it at the same temperature for 2 hours, it cooled to room temperature in 90 minutes. Using a tensile test piece, a tensile test was performed in accordance with JIS-Z2241, and 0.2% endurance and ductility were measured. Using an electrical conductivity test piece, the electrical conductivity was measured by the four-terminal method using a double bridge in accordance with the non-ferrous metal material electrical conductivity measurement method prescribed in JIS-H0505. (0.2% endurance (850 ° C)) From each test material (material B and material D), three tensile test pieces of the shape and size (unit: mm) shown in FIG. 2 were each produced. The tensile test piece is a 13B test piece specified in JISZ2241 (2011) as a basic shape, and protrusions (height 1.2 mm) for mounting the extensometer are formed at the two ends corresponding to the punctuation distance. The tensile test piece has a 2-axis symmetrical shape in plan view, the punctuation distance (distance between the apexes of the protrusions) is 50 mm, the length of the parallel parts is 70 mm, the width between the protrusions of the parallel parts is 12.5 mm, and both sides of the protrusions of the parallel parts The width is 12.8mm, and the apex of the protrusion is modified to a radius of 0.1mm. The longitudinal direction of the test piece is parallel to the rolling direction. Using a precision universal testing machine (Shimadzu Corporation, AG100kNG / XR model), each test piece was heated to 850 ° C under an Ar environment, and after reaching 850 ° C for 30 minutes, a tensile test was performed. The temperature increase rate of the test piece was set to 30 ° C / min at the solid temperature, the tensile rate was set to 1.0 mm / min in 0.2% endurance measurement, and thereafter it was set to 5.0 mm / min. Regarding each test material, the minimum value among the measured values of 0.2% endurance obtained from each of three test pieces was set to 0.2% endurance of each test material. The minimum thickness that can be tested in the tensile test system at 850 ° C is about 0.5 mm. The processing rates of cold rolling before material A and material B before aging treatment (before annealing of material C and material D) are slightly different, but because of the conditions of subsequent aging treatment (annealing of material C and material D), cold rolling The processing rate and the conditions for strain relief annealing are the same, so it can be considered that the characteristics of the A material and the B material (C material and D material) are substantially the same. Furthermore, by heating at 850 ° C for 30 minutes, the influence of the processing history up to now is substantially eliminated. Therefore, the 0.2% endurance of A and B materials (C and D materials) at 850 ° C can be considered to be approximately the same, so in this example, the 0.2% endurance at 850 ° C was measured with a thickness of 0.5mm B materials and D materials. [0054] [0055] [0056] If you look at Tables 1 to 4, the OFC No. 17 of the previous example is only 5.4 MPa at 0.2% endurance at 850 ° C which is equivalent to the heating temperature of the joining step of the vapor chamber. In addition, if the average crystal grain size after heating at 850 ° C. for 30 minutes is 125 μm, the crystal grains become coarse, and it is possible to estimate the possibility of occurrence of grain boundaries penetrating through the plate thickness. Furthermore, the endurance after heating at 850 ° C for 30 minutes and 350 ° C for 2 hours is as low as 40 MPa. [0057] In contrast, Nos. 1 to 12, 18 to 26 have a 0.2% endurance at room temperature of 300 MPa or more, excellent bending workability, and a 0.2% endurance at 850 ° C of 10 MPa or more. Endurance after 850 ℃ × 30 minutes heating and 500 ℃ × 2 hours aging treatment No.1 ~ 12 is 100MPa or more, No.18 ~ 26 is 300MPa or more, any conductivity is 50% IACS or more. Among No.1 ~ 12, the total content of Fe and Co [Fe + Co] is 0.2 ~ 2.3 mass% of No.1, 3 ~ 9,11,12 and the total contains 0.09 mass% of Cr and Zr. The average crystal grain size of the 10 series after heating at 850 ° C for 30 minutes is 100 μm or less. Also, among Nos. 18 to 26, the total content of Ni and Co [Ni + Co] is No. 19 to 22, 24 with 2.4 to 3.5 mass%, and No. 23 with a total of 0.04 mass% Cr and Zr. And No. 26 system containing 0.07 mass% Ti has an average crystal grain size of 100 μm or less after heating at 850 ° C. for 30 minutes. [0058] On the other hand, No. 13, 14 series [Fe + Co + Ni] is insufficient, and No. 27 series [Ni + Co] is insufficient, so the 0.2% endurance at 850 ° C. is less than 10 MPa. In addition, No.15 series [Fe + Co + Ni] excess, No.28 series [Ni + Co] excess, No.16,29 series other elements excess, so heating at 850 ℃ × 30 minutes and 500 ℃ × 2 hours aging The endurance conductivity after treatment is less than 50% IACS. [0059] The disclosure content of this specification includes the following aspects. Aspect 1: A copper alloy plate for exothermic parts, which is characterized by the precipitation of one or more phosphides containing Fe, Ni, Co, and has 0.2% endurance of 100MPa or more and excellent bending workability at 850 ° C The measured 0.2% endurance is 10MPa or more. After heating at 850 ° C for 30 minutes, water cooling is performed, followed by aging treatment at 500 ° C for 2 hours. The 0.2% endurance is 100MPa or more, and the conductivity is 50% IACS or more. Part of the manufacturing process includes heating to 650 ℃ above the process and aging treatment. Aspect 2: A copper alloy plate for exothermic parts, which is characterized by the precipitation of one or more silicides containing Ni and Co, and has 0.2% endurance of 200 MPa or more and excellent bending workability, measured at 850 ° C 0.2% endurance is 10MPa or more. After heating at 850 ° C for 30 minutes, water cooling, followed by aging treatment at 500 ° C for 2 hours, 0.2% endurance is 300MPa or more, and conductivity is 50% IACS or more. One part includes the process and aging treatment heated to above 650 ℃. Aspect 3: The copper alloy plate for heat dissipating parts as in aspect 1, which contains one or two of Fe and Co and P: 0.01 to 0.2% by mass, and the total content of Fe and Co [Fe + Co] is 0.2 ~ 2.3% by mass, the remaining part is composed of Cu and inevitable impurities. Aspect 4: The copper alloy plate for heat dissipating parts as in aspect 3, which further contains Ni: 0.1 to 1.0% by mass, and the contents of Fe and Co and Ni [Fe + Co + Ni] are 0.2 to 2.3% by mass. Aspect 5: The copper alloy plate for heat dissipating parts as in aspect 3 or 4, wherein one or more of Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, Mn are included in a total of 0.01 ~ 0.3% by mass. Aspect 6: The copper alloy plate for exothermic parts as in aspect 2, which contains one or more of Ni and Co and Si, and the total content of Ni and Co [Ni + Co] is 1.6 to 3.5% by mass, The ratio of the total content of Ni and Co [Ni + Co] to the content of Si [Si] [Ni + Co] / [Si] is 3.5 to 5.5, and the rest is composed of Cu and inevitable impurities. Aspect 7: The copper alloy plate for heat dissipation parts according to aspect 6, wherein one or more types of Mg, Al, Cr, Ti, Zr, Zn, Sn, and Mn are included in a total of 0.01 to 0.3% by mass. Aspect 8: The copper alloy plate for exothermic parts according to any one of aspects 1 and 3 to 5, wherein the average crystal grain size after heating at 850 ° C for 30 minutes is 100 μm or less. Aspect 9: The copper alloy plate for exothermic parts according to any one of aspects 2, 6, and 7, wherein the average crystal grain size after heating at 850 ° C for 30 minutes is 100 μm or less. Aspect 10: A heat dissipating part, which is characterized by a plurality of heat dissipating parts of any one of aspects 1, 3 to 5 and 8 that are joined to each other by diffusion bonding or brazing, and are made of a copper alloy plate. Aspect 11: A heat dissipating part, which is characterized by a plurality of heat dissipating parts according to any one of aspects 2, 6, 7, and 9 which are joined to each other by diffusion bonding or brazing. Aspect 12: The exothermic part of aspect 10 or 11, wherein the Sn coating layer is formed on at least a part of the outer surface. Aspect 13: The heat dissipating part of aspect 10 or 11, wherein a Ni coating layer is formed on at least a part of the outer surface. Aspect 14: A method for manufacturing a heat-dissipating component, characterized by processing the heat-dissipating component according to any one of aspects 1, 3 to 5 and 8 to a specific shape with a copper alloy plate, heating it to above 650 ° C, and applying The joining process is followed by aging treatment without applying plastic processing to obtain a heat-radiating part having a 0.2% endurance of 100 MPa or more and a conductivity of 50% IACS or more. Aspect 15: A method for manufacturing a heat-dissipating part, which is characterized by processing the heat-dissipating part as described in any one of aspects 2, 6, 7 and 9 to a specific shape with a copper alloy plate, heating it to above 650 ° C, and applying The joining process is followed by aging treatment without applying plastic processing to obtain a heat-radiating part having a 0.2% endurance of 300 MPa or more and a conductivity of 50% IACS or more. Aspect 16: The manufacturing method of the exothermic part of aspect 14 or 15, wherein, after the process of heating to 650 ° C. or higher, an Sn coating layer is formed on at least a part of the outer surface of the exothermic part. Aspect 17: A method for manufacturing a heat-dissipating component according to aspect 14 or 15, wherein, after the process of heating to 650 ° C. or higher, a Ni coating layer is formed on at least a part of the outer surface of the heat-dissipating component. [0060] This application is accompanied by the claim that the Japanese patent application with the filing date of October 5, 2016, and Japanese Patent Application No. 2016-196884 are set as the priority of the basic application. Japanese Patent Application No. 2016-196884 is incorporated into this specification by reference.

[0061]

1‧‧‧ Plate member

2‧‧‧frame

3‧‧‧Thin Wall

[0017] FIG. 1A illustrates a perspective view of a plate member that has been pattern-formed by diffusion bonding of a vapor chamber. [Figure 1B] A cross-sectional view illustrating a state in which diffusion bonding of a vapor chamber is overlapped in order to join two plate members (frame parts of a vapor chamber). [Figure 2] A diagram showing the shape and dimensions of a test piece used in a tensile test conducted at 850 ° C.

Claims (34)

A copper alloy plate for exothermic parts, which is characterized by the precipitation of one or more phosphides containing Fe, Ni, Co, and has 0.2% endurance of 100MPa or more and excellent bending workability, 0.2% measured at 850 ° C The endurance is 10MPa or more. After 30 minutes of heating at 850 ° C, water cooling is performed, followed by aging treatment at 500 ° C for 2 hours. The 0.2% endurance is 100MPa or more, and the conductivity is 50% or more. Including heating to 650 ℃ above the process and aging treatment. A copper alloy plate for exothermic parts, characterized by the precipitation of one or two kinds of silicides containing Ni and Co, having 0.2% endurance of 200 MPa or more and excellent bending workability, and the 0.2% endurance measured at 850 ° C is 10 MPa Above, heating at 850 ° C for 30 minutes followed by water cooling, followed by aging treatment at 500 ° C for 2 hours. The 0.2% endurance is 300MPa or more, and the conductivity is 50% IACS or more. Process and aging treatment above 650 ℃. For example, the copper alloy plate for exothermic parts of claim 1, which contains one or two of Fe and Co and P: 0.01 ~ 0.2% by mass, the total content of Fe and Co [Fe + Co] is 0.2 ~ 2.3% by mass The remaining part is composed of Cu and inevitable impurities. The copper alloy plate for exothermic parts according to claim 3, which further contains Ni: 0.1 to 1.0% by mass, and the contents of Fe and Co and Ni [Fe + Co + Ni] is 0.2 to 2.3% by mass. The copper alloy plate for heat dissipating parts according to claim 3, wherein one or more types of Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, and Mn are included in a total of 0.01 to 0.3% by mass. The copper alloy plate for heat dissipating parts according to claim 4, wherein one or more types of Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, and Mn are included in a total of 0.01 to 0.3% by mass. For example, the copper alloy plate for exothermic parts of claim 2, which contains one or more of Ni and Co and Si, the total content of Ni and Co [Ni + Co] is 1.6 ~ 3.5% by mass, and that of Ni and Co The ratio [Ni + Co] / [Si] of the total content [Ni + Co] to the Si content [Si] is 3.5 to 5.5, and the rest is composed of Cu and inevitable impurities. The copper alloy plate for heat dissipating parts according to claim 7, wherein one or more types of Mg, Al, Cr, Ti, Zr, Zn, Sn, and Mn are included in a total of 0.01 to 0.3% by mass. The copper alloy plate for exothermic parts according to any one of claims 1 and 3 to 6, wherein the average crystal grain size after heating at 850 ° C for 30 minutes is 100 μm or less. The copper alloy plate for exothermic parts according to any one of 7 and 8, wherein the average crystal grain size after heating at 850 ° C for 30 minutes is 100 μm or less. A heat-dissipating part characterized by a plurality of copper alloy plates for heat-dissipating parts such as any one of claims 1 and 3 to 6 joined together by diffusion bonding or brazing. A heat-dissipating part, characterized in that it is composed of copper alloy plates for plural heat-dissipating parts as claimed in item 9 that are mutually joined by diffusion bonding or brazing. A heat dissipating part characterized by a plurality of copper alloy plates for heat dissipating parts such as any one of claims 2, 7 and 8 which are joined to each other by diffusion bonding or brazing. A heat-dissipating part, characterized in that the plurality of heat-dissipating parts as claimed in item 10 are mutually joined by diffusion bonding or brazing, and are made of copper alloy plates. The heat releasing part according to claim 11, wherein a Sn coating layer is formed on at least a part of the outer surface. The heat releasing part according to claim 12, wherein a Sn coating layer is formed on at least a part of the outer surface. The heat dissipating component according to claim 13, wherein a Sn coating layer is formed on at least a part of the outer surface. The heat releasing part according to claim 14, wherein the Sn coating layer is formed on at least a part of the outer surface. The heat releasing part according to claim 11, wherein a Ni coating layer is formed on at least a part of the outer surface. The heat releasing component according to claim 12, wherein a Ni coating layer is formed on at least a part of the outer surface. The heat releasing part according to claim 13, wherein a Ni coating layer is formed on at least a part of the outer surface. The heat releasing part according to claim 14, wherein a Ni coating layer is formed on at least a part of the outer surface. A method for manufacturing a heat-dissipating part, characterized by processing a copper alloy plate for a heat-dissipating part according to any one of claims 1 and 3 to 6 into a specific shape, applying heat to above 650 ° C, and a joining process, followed by Aging treatment is performed without applying plastic processing to obtain a heat-radiating part having a 0.2% endurance of 100 MPa or more and a conductivity of 50% IACS or more. A method for manufacturing heat-dissipating parts, characterized by processing the heat-dissipating parts according to claim 9 into a specific shape with a copper alloy plate, applying heat to above 650 ° C, and joining processes, followed by aging treatment without applying plastic processing , To obtain heat release parts with 0.2% endurance above 100MPa and conductivity above 50% IACS. A method for manufacturing a heat-dissipating part, characterized by processing a copper alloy plate for a heat-dissipating part according to any one of claims 2, 7 and 8 into a specific shape, applying heat to a temperature above 650 ° C, and a joining process, followed by Aging treatment is performed without applying plastic processing to obtain a heat-radiating part having a 0.2% endurance of 300 MPa or more and a conductivity of 50% IACS or more. A method for manufacturing a heat-dissipating part, characterized by processing the heat-dissipating part according to claim 10 into a specific shape with a copper alloy plate, applying heat to above 650 ° C, and joining processes, followed by aging treatment without applying plastic processing , To obtain heat release parts with 0.2% endurance above 300MPa and conductivity above 50% IACS. The method for manufacturing a heat-dissipating component according to claim 23, wherein after the process of heating to 650 ° C. or higher, a Sn coating layer is formed on at least a part of the outer surface of the heat-dissipating component. The method for manufacturing a heat-dissipating part according to claim 24, wherein after the process of heating to 650 ° C. or higher, an Sn coating layer is formed on at least a part of the outer surface of the heat-dissipating part. The method for manufacturing a heat-dissipating component according to claim 25, wherein after the process of heating to 650 ° C. or higher, an Sn coating layer is formed on at least a part of the outer surface of the heat-dissipating component. The method for manufacturing a heat-dissipating component according to claim 26, wherein after the process of heating to 650 ° C. or higher, an Sn coating layer is formed on at least a part of the outer surface of the heat-dissipating component. The method for manufacturing a heat-dissipating component according to claim 23, wherein, after the process of heating to 650 ° C. or higher, a Ni coating layer is formed on at least a part of the outer surface of the heat-dissipating component. The method for manufacturing a heat-dissipating component according to claim 24, wherein, after the process of heating to 650 ° C. or higher, a Ni coating layer is formed on at least a part of the outer surface of the heat-dissipating component. The method for manufacturing a heat-dissipating part according to claim 25, wherein, after the process of heating to 650 ° C. or higher, a Ni coating layer is formed on at least a part of the outer surface of the heat-dissipating part. The method for manufacturing a heat-dissipating part according to claim 26, wherein, after the process of heating to 650 ° C. or higher, a Ni coating layer is formed on at least a part of the outer surface of the heat-dissipating part.