WO2018066414A1 - Copper alloy plate for heat dissipation component, heat dissipation component, and method for manufacturing heat dissipation component - Google Patents

Abstract

A copper alloy plate for a heat dissipation component, characterized in that: a phosphide including one or more of Fe, Ni, and Co is precipitated; the 0.2% proof stress is at least 100 MPa and the bend workability is excellent; the 0.2% proof stress measured at 850°C is at least 10 MPa; the 0.2% proof stress is at least 100 MPa and the electroconductivity is at least 50% IACS when the copper alloy plate is heated at 850°C for 30 minutes, then water-cooled, then subjected to an aging treatment for two hours at 500°C; and a process of heating to at least 650°C and an aging treatment are included in a part of the process for manufacturing a heat dissipation component.

Description

Copper alloy plate for heat dissipation component, heat dissipation component, and manufacturing method of heat dissipation component

This disclosure relates to a copper alloy plate for a heat dissipation component used when a plurality of components are joined to manufacture a heat dissipation component such as a vapor chamber (flat plate heat pipe). In particular, the present invention relates to a copper alloy plate for a heat dissipation component that is used when a process of heating to a temperature of 650 ° C. or higher, such as diffusion bonding or brazing, is included.

The speed of operation and the increase in integration density of CPUs mounted on desk-type PCs, notebook PCs, tablet terminals, mobile phones represented by smartphones, etc. are rapidly progressing. The amount of heat generation is further increasing. When the temperature of the CPU rises above a certain level, it causes malfunctions, thermal runaway, etc., so effective heat dissipation from a semiconductor device such as a CPU is a serious problem.
A heat sink is used as a heat dissipating component that absorbs heat from a semiconductor device and dissipates it into the atmosphere. Since the heat sink is required to have high thermal conductivity, copper, aluminum, or the like having a high thermal conductivity is used as a material. In the desk type PC, a method is used in which the heat of the CPU is transmitted to a heat radiating fin or the like installed on a heat sink and the heat is removed by a small fan installed in the desk type PC casing.

However, in notebook PCs, tablet terminals, etc. that do not have space for installing fans, vapor chambers (flat plate heat pipes) have come to be used as heat dissipating parts that have a higher heat transport capacity in a limited area. It was. The heat pipe exhibits higher heat dissipation characteristics than the heat sink by cyclically performing evaporation (heat absorption from the CPU) and condensation (release of absorbed heat) of the refrigerant sealed inside. In addition, it has been proposed to solve the heat generation problem of a semiconductor device by combining a heat pipe with a heat dissipation component such as a heat sink or a fan.

The vapor chamber further improves the heat dissipation performance of the tubular heat pipe (see Patent Documents 1 to 4). In order to efficiently condense and evaporate the refrigerant, a vapor chamber has been proposed in which fine holes are formed on the inner surface by roughening, grooving, or powder sintering, similar to a tubular heat pipe. .
In addition, a vapor chamber has been proposed that includes an external member (housing) and an internal member that is housed and fixed inside the external member. One or a plurality of internal members are arranged inside the external member in order to promote condensation, evaporation, and transport of the refrigerant, and fins, protrusions, holes, slits, and the like having various shapes are processed. This type of vapor chamber is manufactured by disposing the internal member inside the external member, and then joining and integrating the external member and the external member with the internal member by a method such as diffusion bonding or brazing. The vapor chamber is sealed by a method such as brazing after the refrigerant is put inside.
If the heat generation of the electronic components further increases and exceeds the heat removal capacity of the vapor chamber, a heat dissipation component of the type that has the same internal structure as the vapor chamber and continuously supplies the refrigerant from the outside is used (the interior has a low pressure You do n’t have to). The members used for the housing of this type of heat radiation component and the method of manufacturing the housing are the same as those of the vapor chamber (see Patent Document 5).

The material of the vapor chamber is made of oxygen-free copper (OFC), which has excellent thermal conductivity, corrosion resistance, workability, and etching properties. For example, a soft material (type O) of about 0.3 to 1.0 mm thick to hard Plate materials (including strips) made of materials (type H) are frequently used. An example of the manufacturing process of the vapor chamber using the OFC plate material will be described as follows.
First, patterns such as a plurality of grooves and irregularities are formed on one side of a rectangular plate member cut out from the OFC plate material by etching or pressing using a mold. Next, with the surface on which the pattern is formed facing inward, the two plate members are stacked one above the other and diffusion bonded in that state (see FIG. 1B). In diffusion bonding, in a vacuum atmosphere higher than 10 ⁻² atm, with a stress (pressing force) of about 2 to 6 MPa applied to the bonding portion, the temperature is raised to a high temperature of 800 to 900 ° C. It is carried out by maintaining the same temperature for about 120 minutes. A nozzle (small diameter tube) is fitted between the upper and lower plate members, and this nozzle is also joined.
After diffusion bonding, in a vacuum or reduced pressure atmosphere, working fluid (water or the like) is put into the vapor chamber through the nozzle, and then the nozzle is sealed.

When the vapor chamber is manufactured by brazing, a thin plate or foil such as a silver-copper braze or phosphor-copper braze in the shape of the joint is sandwiched between the plate members stacked one above the other, and in that state continuously in the heating furnace Insert, heat and braze. The brazing atmosphere is a vacuum atmosphere of about 10 ⁻¹ atm, a reducing atmosphere, or an inert gas atmosphere, and the heating temperature is 650 to 900 ° C. Further, in the brazing heating step, heating and brazing are performed in a state where a stress (pressing force) of about 2 to 5 MPa is applied to the joining portion so that the joining portion is not displaced due to vibration or the like.

Japanese Patent Laid-Open No. 2004-238672 JP 2007-315745 A JP 2014-134347 A Japanese Patent Laying-Open No. 2015-121355 International Publication No. 2014/171276

The pressure applied in diffusion bonding or brazing generally exceeds the 0.2% proof stress of the material at the holding temperature of diffusion bonding or brazing (the tensile strength when the permanent elongation reaches 0.2% in the tensile test). A value that is as large as possible is selected. The larger the applied pressure, the shorter the holding time at the holding temperature, and the higher the reliability of the bonded portion (no leakage, no unbonded portion, etc.). In addition, when a pressing force exceeding 0.2% proof stress is applied in diffusion bonding or brazing, the reliability of the bonded portion can be further improved and the holding time can be further shortened, but plastic deformation is applied to the pressure portion. Occurs, and the desired shape (design shape) cannot be maintained.
In the diffusion bonding or brazing of the vapor chamber, even when the material is an OFC plate, the pressure is determined within a range not exceeding the 0.2% proof strength of the OFC plate at the holding temperature, and the 0.2% proof strength is σ _{0. When .2} is applied, the applied pressure is usually in the range of (0.5 to 0.8) × σ _0.2 .

The 0.2% yield strength of the OFC plate measured at that temperature after holding at 700 to 900 ° C. for 30 minutes is as low as 8 MPa at 700 ° C., 6 MPa at 800 ° C., and 5 MPa at 900 ° C.
A plate member 1 having a thickness of 0.45 mm and a planar shape of 60 mm × 60 mm, etched on one side to a certain depth, leaving a surrounding frame, and a plate member 1 simulating a casing of a vapor chamber (see FIG. 1A) Was made. In this plate member 1, the width of the frame portion 2 is 7 mm, and the thickness of the etched thin portion 3 is 0.2 mm. Subsequently, as shown in FIG. 1B, the two plate members 1 and 1 are overlapped with the etched surfaces inside, heated to 850 ° C., and a pressure of 3 MPa (0.2% yield strength) is applied to the frame portion. 50% or more) and held for 30 minutes for diffusion bonding.

In the plate members 1 and 1 after diffusion bonding, slight dents and bulges were observed near the center of the thin portion 3. The cause of such deformation is that in diffusion bonding, the plate member 1 is heated to a high temperature exceeding the recrystallization temperature, and the Young's modulus and yield strength (yield stress) of the material are significantly reduced. It is presumed that creep deformation occurred in the thin-walled portion 3 due to gravity acting near the portion. Further, it is considered that the frame portion 2 is deformed in the lateral direction due to the applied pressure at the time of diffusion bonding, thereby generating an inward stress inside the frame portion 2 (upper and lower thin portions 3). This is presumed to be one of the causes of deformation (dents and bulges).

In the vapor chamber in which such deformation has occurred, the shape and volume of the internal space of the chamber changes, and the flow (flow path) and flow rate of the evaporated and condensed refrigerant change, and the desired thermal performance is achieved. Cannot be demonstrated. Further, a gap is formed between the vapor chamber and the heat generating part (CPU or the like), and the heat transfer performance is lowered.
Furthermore, when the OFC plate is heated to a temperature of 600 ° C. or higher, secondary recrystallization occurs and the crystal grains become coarse. For example, when heated to 800 ° C., the average crystal grain size becomes coarser to about 100 μm to several hundred μm even if the heating time is short. Since the density of gas, impurity elements, and inclusions is high at the grain boundaries of the coarsened crystal grains, the grain boundaries are more fragile than in the grains.

In a vapor chamber manufactured using an OFC plate having a thickness of 0.3 to 0.5 mm, the thickness of the etched or pressed portion is reduced to about 0.1 to 0.3 mm. When the average crystal grain size is increased to about 100 μm to several 100 μm, only about 1 to 3 crystal grains are present in the thickness direction in such a thin portion. In the vapor chamber, since the refrigerant repeatedly evaporates and condenses during use, tensile and compressive stresses repeatedly act on the thin wall portion due to the pressure change at that time. If the average crystal grain size is coarse, cracks propagating through the grain boundaries are likely to occur, and cracks that penetrate through the thin portion may occur. Then, the refrigerant inside the chamber leaks through the grain boundary and cannot be used as a vapor chamber. In addition, when the average crystal grain size is increased, the surface roughness of the copper alloy plate (vapor chamber) increases, the gap with the heat generating part (CPU, etc.) increases, and the heat transfer performance from the heat generating part to the vapor chamber increases. descend.
The above-described problems of diffusion bonding (deformation of a thin part, coarsening of crystal grains, etc.) also occur when a vapor chamber is manufactured by brazing.

When a material with high strength at high temperature is used as the material of the vapor chamber, the pressure applied during diffusion bonding or brazing is increased to shorten the holding time, improve the reliability of the joint, and further diffusion bonding or brazing It is considered that the deformation of the plate member 1 during attachment can be prevented. In addition, when using a material that can suppress the coarsening of crystal grains at high temperature, a large number of crystal grains can be present in the thickness direction in the thin portion of the plate member 1 to prevent leakage of the refrigerant in the vapor chamber. It is considered that the heat transfer performance can be prevented from decreasing. Moreover, when such a material is used, it is thought that the same effect is acquired also in the other thermal radiation components in which the process heated at high temperature is included in a part of manufacturing process.
Therefore, the main object of the embodiment of the present invention is to provide a material (copper alloy plate) having a high strength (0.2% proof stress value) at a high temperature as a material for a heat dissipation component such as a vapor chamber. Another object of the embodiment of the present invention is to provide a material (copper alloy plate) that suppresses the coarsening of crystal grains at a high temperature as a material for a heat dissipation component such as a vapor chamber.

The copper alloy plate for a heat dissipation component according to the embodiment of the present invention is used when a process of heating to 650 ° C. or more and an aging treatment are included as a part of the process of manufacturing the heat dissipation component. The phosphide containing 1 type or 2 types or more precipitates, has 0.2% yield strength of 100 MPa or more and excellent bending workability, 0.2% yield measured at 850 ° C. is 10 MPa or more, and 850 It is characterized by 0.2% proof stress of 100 MPa or more and conductivity of 50% IACS or more after heating at 50 ° C. for 30 minutes and then water cooling and then aging treatment at 500 ° C. for 2 hours. The copper alloy sheet preferably has an average crystal grain size of 100 μm or less after heating at 850 ° C. for 30 minutes. In addition, the board as used in the embodiment of the present invention includes a strip.
This copper alloy plate includes, for example, one or more of Fe, Co, and Ni and P: 0.01 to 0.2% by mass, and the total content [Fe + Co + Ni] of Fe, Co, and Ni is 0.00. It is 2 to 2.3% by mass, and the balance consists of Cu and inevitable impurities. This copper alloy further contains 0.01 to 0.3 mass% of one or more of Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, and Mn as required.

In addition, another copper alloy plate for heat dissipation component according to the embodiment of the present invention deposits silicide containing one or two of Ni and Co, 0.2% proof stress of 200 MPa or more, and excellent bending workability. 0.2% proof stress measured at 850 ° C. is 10 MPa or more, and 0.2% proof stress after heating at 850 ° C. for 30 minutes, water cooling, and then aging treatment at 500 ° C. for 2 hours is 300 MPa. As described above, the electrical conductivity is 50% IACS or more. The copper alloy sheet preferably has an average crystal grain size of 100 μm or less after heating at 850 ° C. for 30 minutes.
This copper alloy plate contains, for example, one or two of Ni and Co and Si, and the total content of Ni and Co [Ni + Co] is 1.6 to 3.5% by mass, and the total of Ni and Co The ratio [Ni + Co] / [Si] of the content [Ni + Co] to the Si content [Si] is 3.5 to 5.5, with the balance being Cu and inevitable impurities. This copper alloy further contains 0.01 to 0.3% by mass in total of one or more of Mg, Al, Cr, Ti, Zr, Zn, Sn, and Mn as required.

The copper alloy plate for heat radiating components according to the embodiment of the present invention is made of a precipitation hardening type copper alloy containing a phosphide or a silicide, and has a higher strength at a higher temperature than a conventional OFC. For this reason, the pressurizing force at the time of diffusion bonding can be increased, the holding time can be shortened, the reliability of the joint can be improved, and the deformation of the plate member (for example, the casing part of the vapor chamber) at the time of diffusion bonding can be prevented. Can be prevented.
In addition, when suppressing the coarsening of crystal grains at high temperatures, a large number of crystal grains are also present in the thickness direction in the thin part of the plate member (for example, the casing of the vapor chamber) to prevent leakage of the refrigerant from the inside. Can do.
Moreover, the copper alloy plate for heat radiating components which concerns on embodiment of this invention is an age hardening type, and an intensity | strength and electrical conductivity improve by performing an aging treatment after high temperature heating. Therefore, a heat radiation component having high strength and excellent heat radiation performance can be obtained by performing an aging treatment after a process of heating to 650 ° C. or more (diffusion bonding, brazing, laser welding, etc.).

It is a perspective view of the plate member by which the diffusion bonding of the vapor chamber was demonstrated, and the pattern was formed. FIG. 10 is a cross-sectional view illustrating a vapor chamber diffusion bonding in which two plate members (a casing component of the vapor chamber) are overlapped for bonding. It is a figure which shows the shape and dimension of a test piece used for the tensile test performed at 850 degreeC.

Hereinafter, the copper alloy plate for heat dissipation components according to the embodiment of the present invention will be described in more detail.
[Alloy composition]
Known precipitation-hardening type copper alloys applied to heat-radiating parts such as vapor chamber housings are known Cu- (Fe, Co, Ni) -P alloys and Cu- (Ni, Co) -Si alloys. Is mentioned.

(Cu- (Fe, Co, Ni) -P alloy)
This type of copper alloy contains one or more of Fe, Ni and Co and P, and Fe, Ni, Co and P form a compound (phosphide).
This copper alloy preferably has a total content of Fe, Co, and Ni [Fe + Co + Ni] of 0.2 to 2.3 mass%, a P content of 0.01 to 0.2 mass%, with the balance being Cu and Consists of inevitable impurities.
This copper alloy further contains 0.01 to 0.3 mass% of one or more of Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, and Mn as required.

Fe, Co, and Ni form a compound (phosphide) with P, have the effect of improving the strength and conductivity of the copper alloy sheet after aging treatment, and suppressing the coarsening of crystal grains during high-temperature heating. Fe and Co that do not form phosphide precipitate as a single substance and have the same action as the above phosphide, while Ni that does not form phosphide dissolves in Cu and improves the strength of the copper alloy plate. . However, when [Fe + Co + Ni] is less than 0.2% by mass, the 0.2% yield strength at 850 ° C. is less than 10 MPa. On the other hand, when [Fe + Co + Ni] exceeds 2.3 mass%, the electrical conductivity is lowered, and a coarse compound is crystallized in the melting and casting process of the alloy, so that bending workability, stamping workability and corrosion resistance are lowered. Therefore, [Fe + Co + Ni] is preferably in the range of 0.2 to 2.3 mass%. In this copper alloy, the effect of Ni is not sufficient when the content of Ni is less than 0.1% by mass, while the effect is saturated when the content exceeds 1% by mass. Therefore, when Ni is included, the Ni content is in the range of 0.1 to 1.0 mass%. A preferable lower limit value of [Fe + Co + Ni] is 0.25% and a preferable upper limit value is 2.1%, and a preferable lower limit value of Ni is 0.15% and a preferable upper limit value is 0.9%.
The copper alloy preferably includes one or two of Fe and Co among Fe, Co and Ni, and the total content [Fe + Co] of Fe and Co is preferably 0.2 to 2.3 mass%. In this case, 0.1 to 1.0% by mass of Ni can be included as necessary. With this composition, the average crystal grain size after heating at 850 ° C. for 30 minutes can be suppressed to 100 μm or less.

P has an action of reducing the amount of oxygen contained in the copper alloy by a deoxidation action and preventing hydrogen embrittlement when the heat dissipating part is heated in a reducing atmosphere containing hydrogen. The P content necessary for preventing hydrogen embrittlement is 0.01% by mass or more. In addition, solid solution P lowers the conductivity of the copper alloy, but when heated to the deposition temperature, Fe, Co, Ni and phosphide are formed, thereby reducing the strength, heat resistance, and conductivity of the copper alloy. improves. However, when the content of P exceeds 0.2% by mass, the amount of P that is dissolved is increased, and the electrical conductivity is lowered. Therefore, the P content is set to 0.01 to 0.2% by mass. When the strength, heat resistance and electrical conductivity are improved mainly by precipitation of the phosphide, the ratio [Fe + Co + Ni] / [P] of [Fe + Co + Ni] to P content [P] is preferably about 2 to 5. The preferable lower limit value of P is 0.013%, the preferable upper limit value is 0.17%, the more preferable lower limit value of [Fe + Co + Ni] / [P] is 2.3, and the more preferable upper limit value is 4.5. is there.

Since Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, and Mn have an effect of improving the strength and heat resistance of the copper alloy, one or more of these are added as necessary. . However, if the total content of one or more of these elements is less than 0.005% by mass, the effect is small, while if it exceeds 0.3% by mass, the conductivity decreases. Therefore, the total content of one or more of these elements is within the range of 0.005 to 0.3% by mass. The total content of one or more of these elements is preferably a lower limit of 0.01, more preferably a lower limit of 0.02% by mass, and preferably an upper limit of 0.25% by mass. is there.
Of these, Si, Al, Mn, and Ti reduce the electrical conductivity of the copper alloy even if contained in small amounts, and therefore the upper limit value of each element is preferably 0.1% by mass. Cr and Zr are elements having a large effect of suppressing the coarsening of crystal grains when heated to a high temperature because they have a small solid solution amount with respect to copper and are precipitated even in a relatively high temperature region. For this reason, when it is desired to refine the crystal grains of the copper alloy plate, Cr and Zr may be contained in an amount of 0.03 mass% or more, preferably 0.06 mass% or more in total of one or two kinds. When Cr and Zr are contained in a total of 0.03% by mass or more of one or two types, 850 even if [Fe + Co] is less than 0.2% by mass (however, [Fe + Co + Ni] is 0.2% by mass or more). The average grain size after heating at 30 ° C. for 30 minutes can be suppressed to 100 μm or less. On the other hand, since Cr and Zr lower the electrical conductivity, the total content of one or two of these elements is preferably 0.2% by mass or less.
In addition to the effect of improving the strength and the stress relaxation resistance, Sn and Mg have the effect of improving the stress relaxation resistance. When the temperature or operating environment of the heat dissipating component is 80 ° C or higher, creep deformation occurs and the contact area with a heat source such as a CPU is reduced, reducing heat dissipation, but improving stress relaxation resistance. Thus, this phenomenon can be suppressed. In order to acquire this effect, it is preferable that Sn content is 0.01 mass% or more, and Mg content is 0.005 mass% or more. On the other hand, the Sn content is preferably 0.2% by mass or less, and the Mg content is preferably 0.2% by mass or less from the viewpoint of preventing a decrease in conductivity of the copper alloy plate.
Zn improves the heat release resistance of the solder and the heat release resistance of the Sn plating. The vapor chamber may be soldered to an electronic component that is a heat dissipation part, and Sn plating may be performed on the vapor chamber to improve corrosion resistance. In such a case, a copper alloy plate containing Zn is suitably used as a material for the casing of the vapor chamber. Even if Zn is added in a small amount, it has the effect of improving the heat-resistant peelability, but even if Zn is contained in an amount exceeding 0.3% by mass, the effect is saturated, so the Zn content is 0.3% or less. It is preferable that The lower limit of the Zn content is more preferably 0.005% by mass, and still more preferably 0.01% by mass.

(Cu- (Ni, Co) -Si alloy)
This type of copper alloy contains one or two of Ni and Co and Si, and Ni, Co and Si form a compound (silicide).
This copper alloy preferably has a total content of Ni and Co [Ni + Co] of 1.6 to 3.5% by mass, and a ratio of the total content of Ni and Co [Ni + Co] to the Si content [Si] [ Ni + Co] / [Si] is 3.5 to 5.5, with the balance being Cu and inevitable impurities.
This copper alloy further contains 0.01 to 0.3% by mass in total of one or more of Mg, Al, Cr, Ti, Zr, Zn, Sn, and Mn as required.

Ni and Co have a function of forming a compound (silicide) with Si, improving the strength and electrical conductivity of the copper alloy after aging treatment, and suppressing the coarsening of crystal grains during high-temperature heating. However, when [Ni + Co] is less than 1.6% by mass, the 0.2% proof stress at 850 ° C. is less than 10 MPa, and the action of suppressing the coarsening of crystal grains is small. On the other hand, when [Ni + Co] exceeds 3.5% by mass, the electrical conductivity decreases, and a coarse compound crystallizes or precipitates, resulting in a decrease in hot workability. Accordingly, [Ni + Co] is set in the range of 1.6 to 3.5 mass%.
Further, when [Ni + Co] / [Si] is less than 3.5, excess Si is dissolved, and when it exceeds 5.5, excess Ni or Co is dissolved and conductivity is lowered. To do. Therefore, [Ni + Co] / [Si] is set in the range of 3.5 to 5.5.
In order to suppress the average crystal grain size after heating at 850 ° C. for 30 minutes to 100 μm or less, it is preferable to set [Ni + Co] to 2.4 mass% or more.

Since Mg, Al, Cr, Ti, Zr, Zn, Sn, and Mn have the effect of increasing the strength of the copper alloy, one or more of these are added as necessary. However, if the total content of one or more of these elements is less than 0.005% by mass, the effect is small, while if it exceeds 0.3% by mass, the electrical conductivity decreases. Therefore, the total content of one or more of these elements is within the range of 0.005 to 0.3% by mass. The total content of one or more of these elements is preferably a lower limit of 0.01% by mass, more preferably a lower limit of 0.02% by mass, and preferably an upper limit of 0.25% by mass. %.
Among these, since Al, Mn, and Ti are contained in a small amount, the electrical conductivity of the copper alloy is lowered, so the upper limit value is preferably 0.1% by mass. Cr and Zr are elements that have a large effect of suppressing the coarsening of crystal grains when heated to a high temperature. When the crystal grains are desired to be refined, the total of one or two of Cr and Zr is 0.03% or more. However, it is preferable to contain 0.06% by mass or more. When one or two of Cr and Zr are contained in a total of 0.03% or more, even when [Ni + Co] is less than 2.4% by mass (1.6% by mass or more), after heating at 850 ° C. for 30 minutes. The average crystal grain size can be suppressed to 100 μm or less. However, since Cr and Zr lower the electrical conductivity, the total content of one or two of these elements is preferably 0.2% by mass or less.
In addition to the effect of improving the strength and the stress relaxation resistance, Sn and Mg have the effect of improving the stress relaxation resistance. When the temperature or operating environment of the heat dissipating component is 80 ° C or higher, creep deformation occurs and the contact area with a heat source such as a CPU is reduced, reducing heat dissipation, but improving stress relaxation resistance. Thus, this phenomenon can be suppressed. In order to acquire this effect, it is preferable that Sn content is 0.01 mass% or more, and Mg content is 0.005 mass% or more. On the other hand, the Sn content is preferably 0.2% by mass or less, and the Mg content is preferably 0.2% by mass or less from the viewpoint of preventing a decrease in conductivity of the copper alloy plate.
Zn improves the heat release resistance of the solder and the heat release resistance of the Sn plating. The vapor chamber may be soldered to an electronic component that is a heat dissipation part, and Sn plating may be performed on the vapor chamber to improve corrosion resistance. In such a case, a copper alloy plate containing Zn is suitably used as a material for the casing of the vapor chamber. Even if Zn is added in a small amount, it has the effect of improving the heat-resistant peelability, but even if Zn is contained in an amount exceeding 0.3% by mass, the effect is saturated, so the Zn content is 0.3% or less. It is preferable that The lower limit of the Zn content is more preferably 0.005% by mass, and still more preferably 0.01% by mass.

[Method for producing copper alloy sheet]
The copper alloy sheet according to the embodiment of the present invention comprises (1) hot rolling-cold rolling-annealing, (2) hot rolling-cold rolling-annealing-cold rolling after soaking the ingot. 3) It can be produced by processes such as hot rolling, cold rolling, annealing, cold rolling, and low temperature annealing. In the above (1) to (3), the cold rolling-annealing step may be performed a plurality of times.
The annealing includes softening annealing, recrystallization annealing, or precipitation annealing (aging treatment). In the case of softening annealing or recrystallization annealing, the heating temperature may be selected from the range of 600 to 950 ° C., and the heating time may be selected from the range of 5 seconds to 1 hour. When softening annealing or recrystallization annealing also serves as a solution treatment, continuous annealing is preferably performed by heating at 650 to 950 ° C. for 5 seconds to 3 minutes. In the case of precipitation annealing, it is preferable that the annealing is performed under the condition that the temperature is maintained at about 350 to 600 ° C. for 0.5 to 10 hours. When softening annealing or recrystallization annealing also serves as a solution treatment, precipitation annealing can be performed in a subsequent step.

The final cold rolling is preferably selected from a range of a processing rate of 5 to 80% in accordance with the target 0.2% proof stress and bending workability.
Low temperature annealing softens the copper alloy plate without recrystallization in order to restore the ductility of the copper alloy plate. In the case of continuous annealing, it is maintained at 300 to 650 ° C. for about 1 second to 5 minutes. It is good to set in. In the case of batch-type annealing, it is preferable that the solid temperature of the copper alloy plate is maintained at 250 ° C. to 400 ° C. for about 5 minutes to 1 hour.

In the case of a Cu— (Fe, Co, Ni) —P alloy, a copper alloy plate having an excellent bending workability with a 0.2% proof stress of 100 MPa or more can be produced by the above production method. This copper alloy sheet had a 0.2% proof stress measured at 850 ° C. (measured after holding at 850 ° C. for 30 minutes) of 10 MPa or more, heated at 850 ° C. for 30 minutes, then cooled with water, and then heated at 500 ° C. for 2 hours. When the aging treatment is performed, it has a 0.2% proof stress of 100 MPa or more and a conductivity of 50% IACS or more.
In the case of a Cu— (Ni, Co) —Si alloy, a copper alloy sheet having an excellent bending workability with a 0.2% proof stress of 200 MPa or more can be produced by the above production method. This copper alloy sheet has a 0.2% yield strength measured at 850 ° C. (measured after holding at 850 ° C. for 30 minutes) is 10 MPa or more, heated at 850 ° C. for 30 minutes, then water-cooled, and then heated at 500 ° C. for 2 hours. When subjected to aging treatment, it has a 0.2% proof stress of 300 MPa or more and a conductivity of 50% IACS or more.

In the bending process, it is required that no cracks occur in the bent part. Furthermore, it is preferable that rough skin does not occur at the bend line and its vicinity. Even in the case of copper alloy plates of the same material, the ease of occurrence of cracking and rough skin due to bending depends on the ratio R / t of the bending radius R and the plate thickness t. When manufacturing heat-radiating parts such as vapor chambers using copper alloy sheets, the cracking of copper alloy sheets usually occurs when bending is performed with R / t ≦ 2 in both the rolling parallel direction and the perpendicular direction. It is required not to. As the bending workability of the copper alloy plate, it is preferable that no crack is generated by bending of R / t ≦ 1.5, and it is more preferable that no crack is generated by bending of R / t ≦ 1.0. The bending workability of a copper alloy plate is generally tested with a test piece having a plate width of 10 mm (see the bending workability test in Examples described later). When a copper alloy sheet is bent, cracks are more likely to occur as the bending width increases. Therefore, when the bending width is particularly large, when a test piece having a sheet width of 10 mm is used, R / t = 1.0. It is preferable that no crack is generated by bending, and it is preferable that no crack is generated by bending at R / t = 0.5. In order not to cause rough skin at the bend line and the vicinity thereof, the average crystal grain size (cutting method) measured in the plate width direction on the surface of the copper alloy plate is preferably 20 μm or less, and 15 μm or less. Is more preferable.

When manufacturing heat-radiating parts such as a vapor chamber, the copper alloy plate is processed into a predetermined shape by press molding, punching, cutting, etching, bending, etc. before being heated to a temperature of 650 ° C. or higher. Heating (degassing, joining (brazing, diffusion joining, welding (TIG, MIG, laser, etc.), heating for sintering), etc.) is processed into a heat radiating component.Copper alloy according to an embodiment of the present invention Since the plate has the above characteristics, it is not easily deformed in the conveyance and handling during the processing, and does not cause any trouble in performing the processing, and is measured at a high temperature (850 ° C.). 2% proof stress is 10MPa or more, increasing the pressure during diffusion bonding or brazing to shorten the holding time, improving the reliability of the joint, and further during diffusion bonding or brazing Further, it is possible to prevent the deformation of the copper alloy sheet, and to obtain a heat radiating component having a high 0.2% proof stress and conductivity by performing an aging treatment after the process of heating to 650 ° C. or higher. .

The heat-radiating component manufactured using the copper alloy plate according to the embodiment of the present invention is at least an external component mainly for the purpose of improving corrosion resistance and solderability after the above-described process of heating to 650 ° C. or higher. An Sn coating layer is formed on a part of the surface. The Sn coating layer includes electroplating, electroless plating, or those formed by heating to a melting point of Sn or lower or higher than the melting point of Sn. The Sn coating layer includes Sn metal and an Sn alloy, and the Sn alloy includes one or more of Bi, Ag, Cu, Ni, In, and Zn as alloy elements in addition to Sn in a total amount of 5% by mass or less. Things.

A base plating such as Ni, Co, Fe or the like can be formed under the Sn coating layer. These undercoats have a function as a barrier for preventing diffusion of Cu and alloy elements from the base material, and a function for preventing damage by increasing the surface hardness of the heat dissipation component. A Cu-Sn alloy layer is formed by plating Cu on the base plating, further plating Sn, and then performing a heat treatment to heat to a temperature lower than or higher than the melting point of Sn to form a Cu-Sn alloy layer and Sn A three-layer structure of the coating layer can also be used. The Cu—Sn alloy layer has a function as a barrier for preventing the diffusion of Cu and alloy elements from the base material, and a function for preventing damage by increasing the surface hardness of the heat dissipation component.

Further, in the heat radiating component manufactured using the copper alloy plate according to the embodiment of the present invention, a Ni coating layer is formed on at least a part of the outer surface as necessary after the above process of heating to 650 ° C. or higher. Is done. The Ni coating layer has a barrier that prevents the diffusion of Cu and alloy elements from the base material, a damage prevention by increasing the surface hardness of the heat dissipation component, and a function of improving corrosion resistance.

The copper alloy plate according to the embodiment of the present invention is preferably manufactured in the steps of cold rolling, recrystallization treatment with solution, cold rolling, and aging treatment after soaking and hot rolling the ingot. Is done. An aging treatment may be performed without performing cold rolling after the recrystallization treatment with solution treatment, and then cold rolling may be performed.
Melting and casting can be performed by ordinary methods such as continuous casting and semi-continuous casting. In addition, it is preferable to use what has little S, Pb, Bi, Se, As content as a copper melt | dissolution raw material. In addition, it is preferable to reduce O and H by paying attention to red heat (removal of water) of charcoal coated on the molten copper alloy, metal, scrap raw material, cast iron, drying of the mold, deoxidation of the molten metal, and the like.

The homogenization treatment is preferably held for 30 minutes or more after the temperature inside the ingot reaches a temperature of 800 ° C. or higher. The holding time of the homogenization treatment is more preferably 1 hour or more, and further preferably 2 hours or more.
After the homogenization treatment, hot rolling is started at a temperature of 800 ° C. or higher. The hot rolling is finished at a temperature of 650 ° C. or higher so that coarse (Fe, Ni, Co) —P precipitates or (Ni, Co) —Si precipitates are not formed on the hot rolled material. It is preferable to cool rapidly by a method such as water cooling. If the quenching start temperature after hot rolling is lower than 650 ° C., coarse (Fe, Ni, Co) —P precipitates or (Ni, Co) —Si precipitates are formed, and the structure tends to be non-uniform. The strength of the copper alloy plate (product plate) decreases. The end temperature of hot rolling (quenching start temperature) is preferably 700 ° C. or higher, and more preferably 750 ° C. or higher. In addition, the structure of the hot-rolled material rapidly cooled after hot rolling becomes a recrystallized structure. The recrystallization process accompanied by solutionization described later can also be performed by performing rapid cooling after hot rolling.

By applying a certain strain to the copper alloy sheet by cold rolling after hot rolling, a copper alloy sheet having a desired recrystallized structure (fine recrystallized structure) is obtained after the subsequent recrystallization process.
The recrystallization treatment with solution treatment is performed at a temperature of 650 to 950 ° C., preferably 670 to 900 ° C. for 3 minutes or less. When the content of the alloy element in the copper alloy is small, recrystallization treatment is performed in a lower temperature range within the above temperature range, and when the content of the element is large, recrystallization is performed at a higher temperature range within the above temperature range. It is preferable to carry out the treatment. By this recrystallization treatment, it is possible to dissolve the alloy element in the copper alloy base material and to form a recrystallized structure (crystal grain size of 1 to 20 μm) with good bending workability. When the temperature of this recrystallization process is lower than 650 ° C., the amount of Ni, Fe, Co, P or Ni, Co, Si is decreased and the strength is lowered. On the other hand, when the temperature of the recrystallization treatment exceeds 950 ° C. or the treatment time exceeds 3 minutes, the recrystallized grains become coarse.

After recrystallization treatment with solution, (a) cold rolling-aging treatment, (b) cold rolling-aging treatment-cold rolling, (c) cold rolling-aging treatment-cold rolling-low temperature annealing (D) Aging treatment—cold rolling, (e) Aging treatment—cold rolling—low temperature annealing can be selected.
The aging treatment (precipitation annealing) is performed under the condition of holding at a heating temperature of about 300 to 600 ° C. for 0.5 to 10 hours. When the heating temperature is less than 300 ° C., the amount of precipitation is small, and when it exceeds 600 ° C., the precipitate tends to be coarsened. The lower limit of the heating temperature is preferably 350 ° C, and the upper limit is preferably 580 ° C, more preferably 560 ° C. The holding time for the aging treatment is appropriately selected depending on the heating temperature, and is carried out within the range of 0.5 to 10 hours. If this holding time is less than 0.5 hours, precipitation is insufficient, and if it exceeds 10 hours, the amount of precipitation is saturated and productivity is lowered. The lower limit of the holding time is preferably 1 hour, more preferably 2 hours.

In the case of a Cu- (Fe, Co, Ni) -P-based alloy, the copper alloy sheet manufactured by the above preferred steps and conditions has a 0.2% proof stress of 300 MPa or more and excellent bending workability.
Also in the case of a Cu— (Ni, Co) —Si based alloy, the copper alloy plate manufactured by the above preferred steps and conditions has a 0.2% proof stress of 300 MPa or more and excellent bending workability.
In order to enable good bonding (no bonding failure, high bonding strength, etc.) by a method such as diffusion bonding or brazing at a temperature of 650 ° C. or higher, the surface roughness of the copper alloy plate (product) is The arithmetic average roughness Ra is 0.3 μm or less, the maximum height roughness Rz is 1.5 μm or less, and the internal oxidation depth is 0.5 μm or less, preferably 0.3 μm or less.
To make the surface roughness of the copper alloy plate (product) Ra: 0.3 μm, Rz: 1.5 μm or less, the surface roughness in the roll axis direction of the rolling roll used for the final cold rolling is, for example, Ra: 0.15 μm Rz: 1.0 μm or less, or polishing such as buffing or electrolytic polishing may be performed on the copper alloy plate after the final cold rolling. In order to reduce the internal oxidation depth of the copper alloy sheet (product) to 0.5 μm or less, the annealing atmosphere should be reducible and the dew point should be −5 ° C. or less, or the annealed copper alloy sheet should be mechanically polished The generated internal oxide layer may be removed or thinned by electrolytic polishing (buffing, brushing, etc.).

[Manufacturing method of heat dissipation parts]
The copper alloy plate according to the embodiment of the present invention is used, for example, as a material for a casing of a vapor chamber. The manufacturing process of the vapor chamber is the same as that using the conventional OFC plate material. Two plate members on which patterns such as grooves and irregularities are formed are joined by diffusion bonding or brazing, and the vapor chamber It becomes a housing. The copper alloy plate is heated to a high temperature of 650 ° C. or higher in this joining step.

Since the copper alloy plate according to the embodiment of the present invention has a 0.2% proof stress of 10 MPa or more even at 850 ° C., the pressure applied at the time of diffusion bonding or brazing is made from a conventional OFC plate material. Can be larger than For this reason, the reliability of a diffusion bonding part or a brazing part can be improved, and the holding time of a diffusion bonding or brazing can be shortened. Further, since the 0.2% proof stress at a high temperature is large, it is possible to prevent the plate member from being deformed such as a dent and a bulge during a heating process during diffusion bonding or brazing, for example. The 0.2% proof stress at 850 ° C. is preferably 12 MPa or more, and this value can be achieved in the copper alloy sheet according to the embodiment of the present invention.

In the copper alloy plate according to the embodiment of the present invention, when the average crystal grain size after high-temperature heating (850 ° C. × 30 minutes) is suppressed to 100 μm or less, cracks penetrating through thin portions of heat-radiating components such as a vapor chamber Generation and leakage of refrigerant can be prevented. Further, it is possible to prevent the surface roughness of the heat dissipating component from increasing, and to prevent an increase in the gap between the heat generating part (CPU and the like) and a decrease in heat transfer performance associated therewith.

Although the heat dissipating component after high temperature heating (heating at 650 ° C. or higher) is softened, the copper alloy according to the embodiment of the present invention is a precipitation hardening type, so that the following conditions (300 to 600 ° C. × The strength can be improved by performing an aging treatment for 0.5 to 10 hours. In addition, this aging treatment restores the conductivity that has been reduced by high-temperature heating. When the copper alloy plate according to the embodiment of the present invention is heated at 850 ° C. for 30 minutes (corresponding to diffusion bonding conditions) and then subjected to aging treatment under the above conditions, Cu— (Fe, Co, Ni) — The P-type alloy has a 0.2% proof stress of 100 MPa or more, and the Cu— (Ni, Co) —Si based alloy has a 0.2% proof stress of 300 MPa or more. In addition, due to this aging treatment, the conductivity of the copper alloy plate according to the embodiment of the present invention is 50% IACS or more in either alloy system. The copper alloy sheet according to the embodiment of the present invention has a conductivity after aging treatment lower than that of OFC. However, since the strength is high, it can be made thinner than OFC, thereby making up for a relatively low conductivity.

The aging treatment after high-temperature heating (after the bonding step), that is, heating to 650 ° C. or higher and bonding can be performed, for example, as follows.
(1) After cooling the heat dissipating component after high-temperature heating to a temperature of 300 ° C. or lower, it is reheated to the above temperature range, kept in the same range for a certain time, and precipitation hardened. In this case, the heat-radiating component after high-temperature heating is rapidly cooled by water cooling or the like while it is still at high temperature, or the heat-radiating component after high-temperature heating is reheated to the solution temperature and then rapidly cooled to pre-solution the copper alloy Is preferred.
(2) The heat-radiating component after high-temperature heating is kept in the temperature range for a certain time during cooling from high temperature, and is precipitated and cured. The heat dissipating component may be kept at a constant temperature within the deposition temperature range or may be continuously cooled within the deposition temperature range.
(3) After the step (2), the reheating of (1) is further performed to precipitate and harden the precipitation hardening type copper alloy.
In the embodiment of the present invention, after the joining step, aging treatment is performed without applying plastic working. When plastic processing is applied to the bonding material after high-temperature heating (after the bonding process) before aging treatment, the internal structure and dimensions of the heat-dissipating parts change, so the shape and dimensions of the refrigerant flow path do not match the design values. As a result, the target heat transfer performance cannot be exhibited as a heat dissipation component.
Generally, in precipitation type alloys, the degree of improvement in strength and electrical conductivity is greater when aging treatment is performed after plastic working, but the plastic working is not performed in CuFeP-based and CuNiSi-based alloys according to embodiments of the present invention. Even in the case of aging treatment, it is possible to achieve the same improvement in strength and conductivity as in the case of plastic working.

The copper alloys having the compositions shown in Tables 1 and 2 were melted in a charcoal coating atmosphere (No. 1 to 16, 18 to 29) or a vacuum atmosphere (No. 17), and cast into a graphite book mold at a molten metal temperature of 1200 ° C. An ingot having a thickness of 50 mm, a width of 200 mm, and a length of 70 mm was manufactured. Each ingot is heated to 950 ° C. (No. 1-16, 18-29) or 800 ° C. (No. 17), held for 1 hour, hot-rolled to a thickness of 16 mm, and water-cooled immediately after the hot rolling is completed. Thus, a hot rolled material having a thickness of 16 mm, a width of 200 mm, and a length of 215 mm was obtained. No. The hot rolled materials of 1 to 16 and 18 to 29 were further heated to 850 ° C., held for 30 minutes after reaching 850 ° C., and then water quenched. In addition, the composition analyzed with each hot-rolled material having a plate thickness of 16 mm was also the same as the values in Tables 1 and 2. Moreover, the surface roughness of any hot-rolled material is Ra: 0.08 to 0.15 μm, Rz: 0.8 to 1.2 μm, and the thickness cross section is polished to obtain a scanning electron microscope ( The internal oxidation depth measured by an observation magnification of 15000 times was 0.1 μm or less.
No. in Table 1 1 to 16 are Cu— (Fe, Co, Ni) —P, No. 17 is OFC, No. in Table 2. 18 to 29 are Cu— (Ni, Co) —Si based copper alloys.

No. The hot rolled materials 1 to 16 and 18 to 29 are each 1 mm chamfered on both sides and cold-rolled to a thickness of 1.25 mm (width 200 mm, length 2400 mm). It cut into B material of length 500mm.
About said A material, after cold-rolling to thickness 0.75mm, performing the aging treatment which heats at 500 degreeC for 2 hours, and also cold-rolling to thickness 0.3mm (working rate: 60%), a glass stone Strain relief annealing was performed in a furnace at 350 ° C. for 30 seconds. Using the obtained copper alloy sheet as a test material, 0.2% proof stress and elongation at room temperature (20 ° C.) and bending workability were measured. Moreover, using each test material, the average crystal grain size after heating at 850 ° C. for 30 minutes and the 0.2% proof stress and conductivity after further aging treatment were measured as follows. The results are shown in Tables 3 and 4.
About the above-mentioned B material, after giving an aging treatment heated at 500 ° C. for 2 hours, cold rolling to a thickness of 0.5 mm (processing rate: 60%), and removing distortion by heating at 350 ° C. for 30 seconds in a glass stone furnace Annealing was performed. Using the obtained copper alloy plate as a test material, 0.2% proof stress at 850 ° C. was measured as follows. The results are shown in Tables 3 and 4.

No. The 17 hot-rolled materials were each 1 mm chamfered on both sides and cold-rolled to a thickness of 0.71 mm (width 200 mm, length 4200 mm), which were 3700 mm long C material and 500 mm long D material. Carved into.
The C material is cold-rolled to a thickness of 0.43 mm, annealed at 350 ° C. for 2 hours, and further cold-rolled to a thickness of 0.3 mm (processing rate: 30%). Was subjected to strain relief annealing by heating at 350 ° C. for 30 seconds. Using the obtained copper plate as a test material, 0.2% proof stress and elongation at room temperature (20 ° C.) and bending workability were measured. Moreover, using each test material, the average crystal grain size after heating at 850 ° C. for 30 minutes and the 0.2% proof stress and conductivity after further aging treatment were measured as follows. The results are shown in Table 3.
The material D was annealed at 350 ° C. for 2 hours, then cold-rolled to a thickness of 0.5 mm (processing rate: 30%), and heated at 350 ° C. for 30 seconds in a glass furnace. Went. Using the obtained copper plate as a test material, 0.2% proof stress at 850 ° C. was measured as follows. The results are shown in Table 3.

(0.2% proof stress and elongation (room temperature))
Cut out JIS No. 5 tensile test piece from each sample material (A material and C material) so that the longitudinal direction is parallel to the rolling direction, and conduct tensile test according to JIS-Z2241 to measure proof stress and elongation. did. The yield strength is a tensile strength corresponding to a permanent elongation of 0.2%.

(Bending workability (room temperature))
The measurement of the bending workability was carried out according to the W bending test method specified in JBMA-T307 standard of the copper elongation association. A test piece having a width of 10 mm and a length of 30 mm was cut out from each of the test materials (A material and C material), and a jig with R / t = 0.5 was used. W. (Good Way (bending axis is perpendicular to rolling direction)) and B.I. W. (Bad Way (bending axis is parallel to the rolling direction)) was performed. Next, the presence or absence of cracks in the bent portion was visually observed with a 100 × optical microscope. W. Or B. W. P (P: Pass, pass), G. W. Or B. W. Those in which cracks occurred in one or both of these were evaluated as F (F: Fail, rejected).

(Average crystal grain size (after heating at 850 ° C. for 30 minutes))
Three test pieces (width 10 mm, length 250 mm) were cut out from each test material (material A and material C) so that the longitudinal direction was the rolling parallel direction. Each test piece was placed in a vacuum furnace, heated to 850 ° C. at an average temperature increase rate from room temperature of about 90 ° C./min, and held at the same temperature for 30 minutes after reaching 850 ° C. Next, the test piece was taken out of the furnace while maintaining the vacuum atmosphere, cooled to 250 ° C. in 240 seconds, taken out from the vacuum atmosphere, and cooled with water. Three samples each having a length of 20 mm were taken from each test piece, and the average crystal grain size was measured by a cutting method in a cross section parallel to the rolling direction of each sample (measurement direction was the rolling parallel direction). The average value of the data of 9 (3 × 3) samples for each specimen was taken as the average crystal grain size.

(0.2% yield strength and electrical conductivity (after 850 ° C. × 30 minutes heating and aging treatment))
A JIS No. 5 tensile test piece and a conductivity test piece (width 10 mm, length 250 mm) were cut out from each sample material (material A and material C) so that the longitudinal direction was the rolling parallel direction. Each test piece was placed in a vacuum furnace, heated to 850 ° C. at an average temperature increase rate from room temperature of about 90 ° C./min, and held at the same temperature for 30 minutes after reaching 850 ° C. Next, the test piece was taken out of the furnace while maintaining the vacuum atmosphere, cooled to 250 ° C. in 240 seconds, taken out from the vacuum atmosphere, and cooled with water. Subsequently, each test piece was heated to 500 ° C., held at the same temperature for 2 hours, and then cooled to room temperature over 90 minutes.
Using a tensile test piece, a tensile test was performed according to JIS-Z2241, and 0.2% yield strength and elongation were measured.
Using a conductivity test piece, the conductivity was measured by a four-terminal method using a double bridge in accordance with the nonferrous metal material conductivity measurement method defined in JIS-H0505.

(0.2% yield strength (850 ° C))
Three tensile test pieces each having the shape and dimensions (unit: mm) shown in FIG. 2 were produced from each test material (B material and D material). The tensile test piece was a 13B test piece defined in JISZ2241 (2011) as a basic shape, and protrusions (height 1.2 mm) for attaching an extensometer were formed at locations corresponding to both ends of the gauge distance. The tensile specimen is biaxially symmetric in plan view, the gauge distance (distance between the vertices of the protrusions) is 50 mm, the length of the parallel part is 70 mm, the width between the protrusions of the parallel part is 12.5 mm, and the protrusion of the parallel part The width of both sides of the projection is 12.8 mm, and the apex of the protrusion is finished to a radius of 0.1 mm. The longitudinal direction of the test piece was parallel to the rolling direction.
Using a precision universal testing machine (manufactured by Shimadzu Corporation, AG100kNG / XR type), each specimen was heated to 850 ° C. in an Ar atmosphere, and after reaching 850 ° C., held for 30 minutes, a tensile test was performed. . The temperature increase rate of the test piece was 30 ° C./min at the actual temperature, the tensile rate was 1.0 mm / min until 0.2% proof stress measurement, and thereafter 5.0 mm / min. The minimum value among the measured values of 0.2% proof stress by each of the three test pieces for each specimen was defined as the 0.2% proof stress of each specimen.
In the tensile test at 850 ° C., the minimum plate thickness that can be tested is about 0.5 mm. A and B materials are slightly different in cold rolling ratio before aging treatment (before C and D materials are annealed), but the conditions for subsequent aging treatment (C and D materials are annealed), cold rolling Therefore, it is considered that the characteristics of the A material and the B material (C material and D material) are almost the same. In addition, by heating at 850 ° C. for 30 minutes, the influence of the processing history so far is almost eliminated. Therefore, since the 0.2% proof stress of the A material and the B material (C material and D material) at 850 ° C. is considered to be almost the same, in this example, the measurement of the 0.2% proof stress at 850 ° C. The test was carried out with 5 mm B material and D material.

Referring to Tables 1 through 4, the conventional OFC No. No. 17 has a 0.2% proof stress at 850 ° C. corresponding to the heating temperature in the vapor chamber joining step, which is only 5.4 MPa. Moreover, the average crystal grain size after heating at 850 ° C. for 30 minutes is 125 μm, and the crystal grains are coarsened, and it can be estimated that a grain boundary penetrating the plate thickness is formed. Furthermore, the yield strength after heating at 850 ° C. × 30 minutes and 350 ° C. × 2 hours is as low as 40 MPa.

In contrast, no. Nos. 1 to 12 and 18 to 26 have a 0.2% yield strength at room temperature of 300 MPa or more, excellent bending workability, and a 0.2% yield strength at 850 ° C. of 10 MPa or more.
The yield strength after heating at 850 ° C. for 30 minutes and aging treatment at 500 ° C. for 2 hours is No. Nos. 1 to 12 are 100 MPa or more. 18 to 26 are 300 MPa or more, and both have a conductivity of 50% IACS or more.
No. No. 1 to No. 12 in which the total content of Fe and Co [Fe + Co] is 0.2 to 2.3 mass%. 1, 3 to 9, 11, 12, and No. 1 containing 0.09% by mass in total of Cr and Zr. No. 10 has an average crystal grain size of 100 μm or less after heating at 850 ° C. for 30 minutes. No. 18 to 26, the total content of Ni and Co [Ni + Co] is 2.4 to 3.5% by mass. 19 to 22, 24, No. containing 0.04% by mass in total of Cr and Zr. 23 and No. containing 0.07% by mass of Ti. No. 26 has an average crystal grain size of 100 μm or less after heating at 850 ° C. for 30 minutes.

On the other hand, No. Nos. 13 and 14 lack [Fe + Co + Ni]. No. 27 has a shortage of [Ni + Co], so the 0.2% yield strength at 850 ° C. is less than 10 MPa. No. No. 15 is excessive in [Fe + Co + Ni]. No. 28 is excessive in [Ni + Co]. Since No. 16 and 29 are excessive other elements, the proof stress conductivity after heating at 850 ° C. × 30 minutes and aging treatment at 500 ° C. × 2 hours is less than 50% IACS.

The disclosure of the present specification includes the following aspects.

Aspect 1:
A phosphide containing one or more of Fe, Ni, and Co is precipitated, has 0.2% proof stress of 100 MPa or more and excellent bending workability, and 0.2% proof stress measured at 850 ° C. is 10 MPa. This is the above, after heating for 30 minutes at 850 ° C., water cooling, then after aging treatment at 500 ° C. for 2 hours, 0.2% proof stress is 100 MPa or more, conductivity is 50% IACS or more, and manufactures heat dissipation parts A copper alloy sheet for a heat-radiating component, characterized in that a part of the process includes a process of heating to 650 ° C. or more and an aging treatment.

Aspect 2:
A silicide containing one or two of Ni and Co is precipitated, has 0.2% proof stress of 200 MPa or more and excellent bending workability, and 0.2% proof stress measured at 850 ° C. is 10 MPa or more. In the process of manufacturing a heat dissipation component, the 0.2% proof stress is 300 MPa or more and the conductivity is 50% IACS or more after aging at 850 ° C. for 30 minutes and then water cooling and then aging treatment at 500 ° C. for 2 hours. A copper alloy plate for a heat-radiating component, characterized in that a part thereof includes a process of heating to 650 ° C. or more and an aging treatment.

Aspect 3:
One or two of Fe and Co and P: 0.01 to 0.2% by mass, the total content of Fe and Co [Fe + Co] is 0.2 to 2.3% by mass, and the balance is Cu And a copper alloy plate for a heat-dissipating component described in the first aspect.

Aspect 4:
In addition, the heat dissipation described in aspect 3 is characterized in that Ni: 0.1 to 1.0% by mass, and the content of Fe, Co, and Ni [Fe + Co + Ni] is 0.2 to 2.3% by mass. Copper alloy sheet for parts.

Aspect 5:
Aspect 3 or 4 characterized in that it contains one or more of Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, and Mn in a total of 0.01 to 0.3% by mass. Copper alloy plate for heat dissipation parts.

Aspect 6:
It contains one or two of Ni and Co and Si, and the total content of Ni and Co [Ni + Co] is 1.6 to 3.5 mass%, and the total content of Ni and Co [Ni + Co] and Si is contained The copper alloy plate for a heat dissipation component according to aspect 2, wherein the ratio [Ni + Co] / [Si] of the amount [Si] is 3.5 to 5.5, and the balance is made of Cu and inevitable impurities.

Aspect 7:
The copper for heat-dissipating parts described in the aspect 6, characterized by containing 0.01 to 0.3% by mass in total of one or more of Mg, Al, Cr, Ti, Zr, Zn, Sn, and Mn Alloy plate.

Aspect 8:
6. The copper alloy plate for a heat-radiating component according to any one of embodiments 1 and 3 to 5, wherein the average crystal grain size after heating at 850 ° C. for 30 minutes is 100 μm or less.

Aspect 9:
8. The copper alloy plate for heat-radiating component according to any one of aspects 2, 6 and 7, wherein the average crystal grain size after heating at 850 ° C. for 30 minutes is 100 μm or less.

Aspect 10:
A heat dissipating part comprising a plurality of copper alloy plates for heat dissipating parts described in any one of aspects 1, 3 to 5 and 8 joined together by diffusion joining or brazing.

Aspect 11:
A heat dissipating component comprising a plurality of copper alloy plates for heat dissipating components described in any one of aspects 2, 6, 7, and 9 joined by diffusion bonding or brazing.

Aspect 12:
The heat radiating component according to aspect 10 or 11, wherein an Sn coating layer is formed on at least a part of the outer surface.

Aspect 13:
The heat dissipating component according to aspect 10 or 11, wherein a Ni coating layer is formed on at least a part of the outer surface.

Aspect 14:
Without processing the copper alloy plate for heat-dissipating parts described in any of the aspects 1, 3 to 5 and 8 into a predetermined shape, then heating and joining to 650 ° C. or higher, and subsequently applying plastic processing A method for manufacturing a heat-radiating component, characterized by performing an aging treatment to obtain a heat-radiating component having a 0.2% proof stress of 100 MPa or more and a conductivity of 50% IACS or more.

Aspect 15:
After processing the copper alloy plate for heat radiating parts described in any of the aspects 2, 6, 7, and 9 into a predetermined shape, the process of heating and joining to 650 ° C. or higher is performed, and then plastic processing is not performed. A method for manufacturing a heat dissipation component, characterized by performing an aging treatment to obtain a heat dissipation component having a 0.2% proof stress of 300 MPa or more and a conductivity of 50% IACS or more.

Aspect 16:
16. The method for manufacturing a heat dissipation component according to aspect 14 or 15, wherein an Sn coating layer is formed on at least a part of the outer surface of the heat dissipation component after the process of heating to 650 ° C. or higher.

Aspect 17:
16. The method for manufacturing a heat dissipation component according to aspect 14 or 15, wherein a Ni coating layer is formed on at least a part of the outer surface of the heat dissipation component after the process of heating to 650 ° C. or higher.

This application is accompanied by a priority claim based on a Japanese patent application, Japanese Patent Application No. 2016-19684, filed on October 5, 2016. Japanese Patent Application No. 2016-196884 is incorporated herein by reference.

1 Plate member

Claims (34)

1. A phosphide containing one or more of Fe, Ni, and Co is precipitated, has 0.2% proof stress of 100 MPa or more and excellent bending workability, and 0.2% proof stress measured at 850 ° C. is 10 MPa. This is the above, after heating for 30 minutes at 850 ° C., water cooling, then after aging treatment at 500 ° C. for 2 hours, 0.2% proof stress is 100 MPa or more, conductivity is 50% IACS or more, and manufactures heat dissipation parts A copper alloy sheet for a heat-radiating component, characterized in that a part of the process includes a process of heating to 650 ° C. or more and an aging treatment.
2. A silicide containing one or two of Ni and Co is precipitated, has 0.2% proof stress of 200 MPa or more and excellent bending workability, and 0.2% proof stress measured at 850 ° C. is 10 MPa or more. In the process of manufacturing a heat dissipation component, the 0.2% proof stress is 300 MPa or more and the conductivity is 50% IACS or more after aging at 850 ° C. for 30 minutes and then water cooling and then aging treatment at 500 ° C. for 2 hours. A copper alloy sheet for heat dissipation parts, characterized in that a part of the process includes heating to 650 ° C. and aging treatment.
3. One or two of Fe and Co and P: 0.01 to 0.2% by mass, the total content of Fe and Co [Fe + Co] is 0.2 to 2.3% by mass, and the balance is Cu The copper alloy plate for a heat radiating component according to claim 1, wherein the copper alloy plate is made of unavoidable impurities.
4. Further, Ni: 0.1 to 1.0% by mass, and the content of Fe, Co, and Ni [Fe + Co + Ni] is 0.2 to 2.3% by mass. Copper alloy plate for heat dissipation parts.
5. The heat dissipation according to claim 3, comprising one or more of Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, and Mn in a total of 0.01 to 0.3% by mass. Copper alloy sheet for parts.
6. 5. The heat dissipation according to claim 4, comprising one or more of Mg, Al, Si, Cr, Ti, Zr, Zn, Sn, and Mn in a total of 0.01 to 0.3% by mass. Copper alloy sheet for parts.
7. It contains one or two of Ni and Co and Si, and the total content of Ni and Co [Ni + Co] is 1.6 to 3.5 mass%, and the total content of Ni and Co [Ni + Co] and Si is contained 3. The copper alloy plate for a heat dissipation component according to claim 2, wherein the ratio [Ni + Co] / [Si] of the amount [Si] is 3.5 to 5.5, and the balance is made of Cu and inevitable impurities. .
8. The heat-radiating component according to claim 7, comprising one or more of Mg, Al, Cr, Ti, Zr, Zn, Sn, and Mn in a total amount of 0.01 to 0.3% by mass. Copper alloy plate.
9. The copper alloy plate for heat-radiating parts according to any one of claims 1 and 3 to 6, wherein an average crystal grain size after heating at 850 ° C for 30 minutes is 100 µm or less.
10. The copper alloy plate for a heat-radiating component according to any one of claims 2, 7, and 8, wherein an average crystal grain size after heating at 850 ° C for 30 minutes is 100 µm or less.
11. A heat radiating component comprising a plurality of copper alloy plates for a heat radiating component according to any one of claims 1 and 3 to 6, which are bonded to each other by diffusion bonding or brazing.
12. A heat dissipating component comprising a plurality of copper alloy plates for heat dissipating components described in claim 9 joined together by diffusion bonding or brazing.
13. A heat dissipating part comprising a plurality of copper alloy plates for heat dissipating parts described in any one of claims 2, 7, and 8 joined together by diffusion bonding or brazing.
14. A heat dissipating component comprising a plurality of copper alloy plates for heat dissipating components described in claim 10 joined to each other by diffusion bonding or brazing.
15. The heat-radiating component according to claim 11, wherein an Sn coating layer is formed on at least a part of the outer surface.
16. The heat dissipating component according to claim 12, wherein an Sn coating layer is formed on at least a part of the outer surface.
17. 14. The heat dissipating component according to claim 13, wherein an Sn coating layer is formed on at least a part of the outer surface.
18. The heat-radiating component according to claim 14, wherein a Sn coating layer is formed on at least a part of the outer surface.
19. The heat-radiating component according to claim 11, wherein a Ni coating layer is formed on at least a part of the outer surface.
20. 13. The heat dissipating component according to claim 12, wherein a Ni coating layer is formed on at least a part of the outer surface.
21. The heat dissipating component according to claim 13, wherein a Ni coating layer is formed on at least a part of the outer surface.
22. The heat dissipating component according to claim 14, wherein a Ni coating layer is formed on at least a part of the outer surface.
23. After the copper alloy plate for heat-dissipating parts according to any one of claims 1 and 3 to 6 is processed into a predetermined shape, it is heated to 650 ° C or higher, and subjected to a joining process, and then aging without applying plastic processing. A method of manufacturing a heat dissipation component, characterized in that a heat dissipation component having a 0.2% proof stress of 100 MPa or more and a conductivity of 50% IACS or more is obtained by performing a treatment.
24. After processing the copper alloy plate for heat radiating components according to claim 9 into a predetermined shape, a process of heating and joining to 650 ° C. or higher is performed, and then an aging treatment is performed without adding plastic processing, A method of manufacturing a heat dissipation component, comprising obtaining a heat dissipation component having a 0.2% proof stress and a conductivity of 50% IACS or higher.
25. After the copper alloy plate for a heat-dissipating component according to any one of claims 2, 7, and 8 is processed into a predetermined shape, it is heated to 650 ° C or more and subjected to a joining process, and then aging without applying plastic processing. A method of manufacturing a heat dissipation component, characterized in that a heat dissipation component having a 0.2% proof stress of 300 MPa or more and a conductivity of 50% IACS or more is obtained by performing a treatment.
26. After processing the copper alloy plate for a heat-radiating component according to claim 10 into a predetermined shape, a process of heating and joining to 650 ° C. or higher is performed, and then an aging treatment is performed without adding plastic processing, A method of manufacturing a heat dissipation component, comprising obtaining a heat dissipation component having a 0.2% proof stress and a conductivity of 50% IACS or higher.
27. The method for manufacturing a heat dissipation component according to claim 23, wherein an Sn coating layer is formed on at least a part of the outer surface of the heat dissipation component after the process of heating to 650 ° C or higher.
28. The method for manufacturing a heat dissipation component according to claim 24, wherein an Sn coating layer is formed on at least a part of the outer surface of the heat dissipation component after the process of heating to 650 ° C or higher.
29. The method for manufacturing a heat dissipation component according to claim 25, wherein an Sn coating layer is formed on at least a part of the outer surface of the heat dissipation component after the process of heating to 650 ° C or higher.
30. 27. The method of manufacturing a heat dissipation component according to claim 26, wherein an Sn coating layer is formed on at least a part of the outer surface of the heat dissipation component after the process of heating to 650 ° C. or higher.
31. The method for manufacturing a heat dissipation component according to claim 23, wherein a Ni coating layer is formed on at least a part of the outer surface of the heat dissipation component after the process of heating to 650 ° C or higher.
32. The method for manufacturing a heat dissipation component according to claim 24, wherein a Ni coating layer is formed on at least a part of the outer surface of the heat dissipation component after the process of heating to 650 ° C or higher.
33. The method for manufacturing a heat dissipation component according to claim 25, wherein a Ni coating layer is formed on at least a part of the outer surface of the heat dissipation component after the process of heating to 650 ° C or higher.
34. 27. The method for manufacturing a heat dissipation component according to claim 26, wherein after the process of heating to 650 ° C. or higher, a Ni coating layer is formed on at least a part of the outer surface of the heat dissipation component.

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