DE202015100693U1 - Plate-shaped heat pipe - Google Patents
Plate-shaped heat pipe Download PDFInfo
- Publication number
- DE202015100693U1 DE202015100693U1 DE201520100693 DE202015100693U DE202015100693U1 DE 202015100693 U1 DE202015100693 U1 DE 202015100693U1 DE 201520100693 DE201520100693 DE 201520100693 DE 202015100693 U DE202015100693 U DE 202015100693U DE 202015100693 U1 DE202015100693 U1 DE 202015100693U1
- Authority
- DE
- Germany
- Prior art keywords
- plate
- capillary structure
- heat pipe
- shaped heat
- pipe according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Plattenförmiges Wärmerohr, umfassend einen Hauptkörper (1), der eine erste Platte (11), eine zweite Platte (12), eine erste Kapillarstruktur (13) und ein Arbeitsfluid (2) aufweist, wobei die erste und zweite Platte (11, 12) aufeinanderliegen, wobei sich die erste Kapillarstruktur (13) zwischen der ersten und zweiten Platte (11, 12) befindet, wobei die erste Kapillarstruktur (13) mit der ersten und zweiten Platte (11, 12) mindestens einen Dampfkanal (14) definiert.A plate-shaped heat pipe comprising a main body (1) having a first plate (11), a second plate (12), a first capillary structure (13) and a working fluid (2), said first and second plates (11, 12) with the first capillary structure (13) between the first and second plates (11, 12), wherein the first capillary structure (13) with the first and second plates (11, 12) defines at least one vapor channel (14).
Description
Technisches Gebiet Technical area
Die Erfindung betrifft ein plattenförmiges Wärmerohr, das eine sehr kleine Dicke hat. The invention relates to a plate-shaped heat pipe, which has a very small thickness.
Stand der Technik State of the art
Die elektronischen Mobilgeräte sind immer kompakter ausgebildet. Die neuen elektronischen Mobilgeräte weisen eine höhere Rechenfähigkeit aber eine kleinere Dicke auf. Mit der Erhöhung der Rechenfähigkeit steigt auch die Betriebswärme, so dass die Anforderung an die Kühlung erhöht wird. Da die elektronischen Mobilgeräte kompakter sind, besitzen sie einen kleineren Innenraum. Dadurch ist die Anordnung eines Kühlventilators nicht möglich. Zur Kühlung kann nur ein Kupfer- oder Aluminiumpad verwendet werden, das die Kühlfläche vergrößern kann. Die Kühlwirkung des Kupfer- oder Aluminiumpads ist jedoch nicht ausreichend. The electronic mobile devices are increasingly compact. The new electronic mobile devices have a higher computing capability but a smaller thickness. As computing capability increases, so too does the operating heat, increasing the cooling requirement. Since the electronic mobile devices are more compact, they have a smaller interior space. As a result, the arrangement of a cooling fan is not possible. For cooling, only a copper or aluminum pad can be used, which can increase the cooling area. However, the cooling effect of the copper or aluminum pads is not sufficient.
Das Flachwärmerohr und der Vapor-Chamber-Kühler hat zwar eine kleine Dicke, ist die Reduzierung der Dicke durch die Füllung des Sinterpulvers begrenzt, so dass ein superdünner Aufbau nicht möglich ist. Wenn das Wärmerohr nach dem Füllen des Sinterpulvers flachgepresst wird, kann das Sinterpulver oder andere Kapillarstruktur (Netzkörper oder Faserkörper) beschädigt werden und somit die Funktion verlieren. Although the flat heat pipe and the vapor chamber cooler have a small thickness, the reduction of the thickness is limited by the filling of the sintering powder, so that a super-thin structure is not possible. If the heat pipe is pressed flat after filling the sinter powder, the sinter powder or other capillary structure (mesh body or fiber body) can be damaged and thus lose their function.
Der Vapor-Chamer-Kühler hat zwar eine sehr kleine Dicke, kann der Innenraum nach Schließen der Öffnung jedoch leicht verformt werden, wodurch der Dampfkanal verkleinert wird oder verschwindet, so dass der Kreislauf des Arbeitsfluids beeinflusst wird. Daher zielt der Erfinder darauf ab, ein plattenförmiges Wärmerohr anzubieten, die die obengenannten Nachteile überwinden kann. Although the Vapor Chamer cooler has a very small thickness, the inner space can be easily deformed after closing the opening, whereby the steam channel is reduced or disappears, so that the circulation of the working fluid is affected. Therefore, the inventor aims to provide a plate-shaped heat pipe which can overcome the above-mentioned disadvantages.
Aufgabe der Erfindung Object of the invention
Der Erfindung liegt die Aufgabe zugrunde, ein plattenförmiges Wärmerohr zu schaffen, das eine sehr kleine Dicke hat und zugleich einen Dampfkanal aufweist. Diese Aufgabe wird durch das erfindungsgemäße plattenförmige Wärmerohr gelöst, das einen Hauptkörper umfasst, der eine erste Platte, eine zweite Platte, eine erste Kapillarstruktur und ein Arbeitsfluid aufweist, wobei die erste und zweite Platte aufeinanderliegen, wobei sich die erste Kapillarstruktur zwischen der ersten und zweiten Platte befindet, wobei die erste Kapillarstruktur mit der ersten und zweiten Platte mindestens einen Dampfkanal definiert. The invention has for its object to provide a plate-shaped heat pipe, which has a very small thickness and at the same time has a steam channel. This object is achieved by the plate-shaped heat pipe according to the invention comprising a main body having a first plate, a second plate, a first capillary structure and a working fluid, wherein the first and second plates lie on one another, wherein the first capillary structure between the first and second Plate, wherein the first capillary structure with the first and second plate defines at least one vapor channel.
Kurze Beschreibung der Zeichnungen Brief description of the drawings
Wege zur Ausführung der Erfindung Ways to carry out the invention
Weitere Einzelheiten, Merkmale und Vorteile der Erfindung ergeben sich aus der nachfolgenden detaillierten Beschreibung in Verbindung mit den anliegenden Zeichnungen. Further details, features and advantages of the invention will become apparent from the following detailed description taken in conjunction with the accompanying drawings.
Die
Der Hauptkörper
Die erste Kapillarstruktur
Darauf ist die Erfindung nicht beschränkt. Die erste und zweite Platte haben eine Dicke von 0,01–0,15mm. The invention is not limited thereto. The first and second plates have a thickness of 0.01-0.15mm.
Im vorliegenden Ausführungsbeispiel ist die erste Kapillarstruktur
Claims (9)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104200485U TWM502163U (en) | 2015-01-12 | 2015-01-12 | Flat plate heating tube structure |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202015100693U1 true DE202015100693U1 (en) | 2015-03-12 |
Family
ID=53936339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE201520100693 Expired - Lifetime DE202015100693U1 (en) | 2015-01-12 | 2015-02-12 | Plate-shaped heat pipe |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3197578U (en) |
CN (1) | CN204404871U (en) |
DE (1) | DE202015100693U1 (en) |
TW (1) | TWM502163U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108332593A (en) * | 2018-03-27 | 2018-07-27 | 中山伟强科技有限公司 | A kind of multichannel loop type temperature-uniforming plate |
CN108702858A (en) * | 2016-02-18 | 2018-10-23 | 三星电子株式会社 | Electronic equipment with thermal-arrest/radiator structure |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105841531A (en) * | 2015-01-12 | 2016-08-10 | 奇鋐科技股份有限公司 | Flat heat pipe structure |
CN115060101B (en) * | 2022-06-29 | 2023-07-11 | 广州大学 | Unidirectional heat pipe of fluid diode structure based on capillary valve and processing method thereof |
-
2015
- 2015-01-12 CN CN201520017214.XU patent/CN204404871U/en active Active
- 2015-01-12 TW TW104200485U patent/TWM502163U/en unknown
- 2015-01-21 JP JP2015000226U patent/JP3197578U/en not_active Expired - Fee Related
- 2015-02-12 DE DE201520100693 patent/DE202015100693U1/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108702858A (en) * | 2016-02-18 | 2018-10-23 | 三星电子株式会社 | Electronic equipment with thermal-arrest/radiator structure |
US10798849B2 (en) | 2016-02-18 | 2020-10-06 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
US11047628B2 (en) | 2016-02-18 | 2021-06-29 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
US11098959B2 (en) | 2016-02-18 | 2021-08-24 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
US11555657B2 (en) | 2016-02-18 | 2023-01-17 | Samsung Electronics Co., Ltd. | Electronic device having heat collection/diffusion structure |
CN108332593A (en) * | 2018-03-27 | 2018-07-27 | 中山伟强科技有限公司 | A kind of multichannel loop type temperature-uniforming plate |
Also Published As
Publication number | Publication date |
---|---|
CN204404871U (en) | 2015-06-17 |
TWM502163U (en) | 2015-06-01 |
JP3197578U (en) | 2015-05-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R082 | Change of representative |
Representative=s name: ELBPATENT-MARSCHALL & PARTNER, DE Representative=s name: ELBPATENT-MARSCHALL & PARTNER MBB, DE |
|
R207 | Utility model specification |
Effective date: 20150423 |
|
R150 | Utility model maintained after payment of first maintenance fee after three years | ||
R157 | Lapse of ip right after 6 years |