CN101873785A - Electronic equipment cabinet - Google Patents

Electronic equipment cabinet Download PDF

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Publication number
CN101873785A
CN101873785A CN200910301709A CN200910301709A CN101873785A CN 101873785 A CN101873785 A CN 101873785A CN 200910301709 A CN200910301709 A CN 200910301709A CN 200910301709 A CN200910301709 A CN 200910301709A CN 101873785 A CN101873785 A CN 101873785A
Authority
CN
China
Prior art keywords
heat
electronic equipment
plate
heating panel
equipment chassis
Prior art date
Application number
CN200910301709A
Other languages
Chinese (zh)
Inventor
詹子于
Original Assignee
鸿富锦精密工业(深圳)有限公司
鸿海精密工业股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 鸿富锦精密工业(深圳)有限公司, 鸿海精密工业股份有限公司 filed Critical 鸿富锦精密工业(深圳)有限公司
Priority to CN200910301709A priority Critical patent/CN101873785A/en
Publication of CN101873785A publication Critical patent/CN101873785A/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/181Enclosures

Abstract

The invention relates to an electronic equipment cabinet. The inner wall and the outer wall of a side plate of a heat dispersion cabinet are respectively provided with a heat absorption plate and a heat dissipation plate, the heat absorption plate is connected with the heat dissipation plate through a heat conducting pipe and used for absorbing the heat generated by elements inside the cabinet and conducting the heat to the heat dissipation plate, the heat conducting pipe transfers the heat to the heat dissipation plate, and the heat dissipation plate is used for conducting the heat to the outside. The heat dispersion cabinet can efficiently improve the heat dissipation efficiency.

Description

Electronic equipment chassis

Technical field

The present invention relates to a kind of electronic equipment chassis.

Background technology

As everyone knows, the electronic component in electronic equipment (as the computer) cabinet on the mainboard can produce a lot of heats when work, and these heats have very big influence to the useful life and the service behaviour of electronic component.At present, people are in order to solve heat dissipation problem in the cabinet, normally installation radiator and radiator fan dispel the heat on the central processing unit on the mainboard, but this traditional radiating mode is in the weather of sweltering heat or under the situation of computer overwork, electronic equipment (as computer) crash suddenly or the probability that restarts still very high, bring inconvenience to the user.

Summary of the invention

In view of above content, be necessary to provide a kind of electronic equipment chassis that improves radiating efficiency.

A kind of electronic equipment chassis, the inside and outside wall of its side plate are respectively equipped with an absorber plate and a heating panel, and described absorber plate connects described heating panel by at least one heat pipe.

Above-mentioned electronic equipment chassis is by using described absorber plate, heat pipe and heating panel, improved the radiating efficiency of cabinet, thereby the useful life of electronic component in the raising cabinet, stablize the service behaviour of electronic component in the cabinet, reduce the probability that electronic equipment crashes suddenly or restarts under the situation of hot environment or overwork.

Description of drawings

Fig. 1 is the stereogram of the better embodiment of electronic equipment chassis of the present invention.

Fig. 2 is the stereogram that electronic equipment chassis is removed the part side plate among Fig. 1.

Embodiment

Below in conjunction with accompanying drawing and better embodiment the present invention is described in further detail:

Please jointly referring to figs. 1 through Fig. 2, the better embodiment of electronic equipment chassis of the present invention comprises that one roughly is the housing 10 of cuboid, described housing 10 comprises some side plates, wherein the inwall of side plate 100 is provided with an absorber plate 101, outer wall is provided with a heating panel 102, and described absorber plate 101 connects described heating panel 102 by some heat pipes 20 that penetrate described side plate 100.Also run through on the described side plate 100 and be provided with some ventilation holes 103.In the present embodiment, be provided with a mainboard (figure does not show) with group on these side plate 100 opposing sideplates.

Wherein, described absorber plate 101 is roughly a rectangle, and its surface is provided with some ripple grooves that are arranged side by side 1010, and described absorber plate 101 is used to draw the heat that element produced on the described mainboard.Described groove 1010 can increase endotherm area better to absorb heat.The shape of described absorber plate 101 also can be designed to other shapes, is not limited to present embodiment.

Described heat pipe 20 is roughly a cylinder, and it adopts the mode of welding to connect described absorber plate 101 and described heating panel 102, and the heat transferred that described absorber plate 101 is absorbed is to described heating panel 102.Described heat pipe 20 also can be designed to other shapes, and described heat pipe 20 and described absorber plate 101 and heating panel 102 also can be respectively be connected with other connected mode such as thread connecting mode.

Described heating panel 102 is roughly a rectangle, and its surface is provided with a projection 1020, and described heating panel 102 is used to distribute the heat that is conducted by described heat pipe 20.Described protruding 1020 can increase the area of dissipation of described heating panel 102 better to dispel the heat.Described protruding 1020 also can be designed to some aesthetic pattern or nameplate sign, are not limited to present embodiment.

Electronic equipment chassis of the present invention has improved radiating efficiency by using described absorber plate 101, heat pipe 20 and heating panel 102, improve the useful life of electronic component in the cabinet, stablize the service behaviour of electronic component in the cabinet, reduce the probability that electronic equipment crashes suddenly or restarts under the situation of high temperature ring change border or overwork.

Claims (6)

1. electronic equipment chassis, the inside and outside wall of its side plate is respectively equipped with an absorber plate and a heating panel, and described absorber plate connects described heating panel by at least one heat pipe.
2. electronic equipment chassis as claimed in claim 1 is characterized in that: the surface of described absorber plate is provided with some ripple grooves.
3. electronic equipment chassis as claimed in claim 1 is characterized in that: there are some projectioies on the surface of described heating panel.
4. electronic equipment chassis as claimed in claim 1 is characterized in that: described heat pipe penetrates described side plate to connect described absorber plate and heating panel.
5. electronic equipment chassis as claimed in claim 1 is characterized in that: run through being provided with some louvres on the described side plate.
6. electronic equipment chassis as claimed in claim 1 is characterized in that: be provided with mainboard with group on this side plate opposing sideplates.
CN200910301709A 2009-04-21 2009-04-21 Electronic equipment cabinet CN101873785A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200910301709A CN101873785A (en) 2009-04-21 2009-04-21 Electronic equipment cabinet

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200910301709A CN101873785A (en) 2009-04-21 2009-04-21 Electronic equipment cabinet
US12/470,464 US20100264790A1 (en) 2009-04-21 2009-05-21 Computer enclosure

Publications (1)

Publication Number Publication Date
CN101873785A true CN101873785A (en) 2010-10-27

Family

ID=42980479

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910301709A CN101873785A (en) 2009-04-21 2009-04-21 Electronic equipment cabinet

Country Status (2)

Country Link
US (1) US20100264790A1 (en)
CN (1) CN101873785A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104503538A (en) * 2014-12-12 2015-04-08 柳州市京阳节能科技研发有限公司 Self control efficient energy-saving temperature-reducing computer host
CN109465800A (en) * 2018-09-20 2019-03-15 巢湖市金辉自控设备有限公司 It is a kind of to be easily installed the frequency converter accommodating mechanism used and application method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150185792A1 (en) * 2013-12-26 2015-07-02 Shih-Wun Li DUAL-layer SYSTEM COMPUTER ENCLOSURE

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JP2003065689A (en) * 2001-08-24 2003-03-05 Furukawa Electric Co Ltd:The Sealed cooling device
CN1749924A (en) * 2004-09-16 2006-03-22 扎尔曼技术株式会社 Computer
CN2838218Y (en) * 2005-10-24 2006-11-15 南京泰通科技有限公司 Repeater casing with thermo-tube radiator
CN1877825A (en) * 2005-06-08 2006-12-13 上海雷硕医疗器械有限公司 Heat sink structure of medical apparatus

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US5113315A (en) * 1990-08-07 1992-05-12 Cirqon Technologies Corporation Heat-conductive metal ceramic composite material panel system for improved heat dissipation
US5258887A (en) * 1992-06-15 1993-11-02 Eaton Corporation Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels
US5307237A (en) * 1992-08-31 1994-04-26 Hewlett-Packard Company Integrated circuit packaging with improved heat transfer and reduced signal degradation
US5513070A (en) * 1994-12-16 1996-04-30 Intel Corporation Dissipation of heat through keyboard using a heat pipe
JP3269397B2 (en) * 1995-09-19 2002-03-25 株式会社デンソー Printed wiring board
US6104611A (en) * 1995-10-05 2000-08-15 Nortel Networks Corporation Packaging system for thermally controlling the temperature of electronic equipment
US5671120A (en) * 1996-02-07 1997-09-23 Lextron Systems, Inc. Passively cooled PC heat stack having a heat-conductive structure between a CPU on a motherboard and a heat sink
JP3923703B2 (en) * 2000-03-29 2007-06-06 ローム株式会社 Printed wiring board having heat dissipation means
US20030094266A1 (en) * 2001-11-21 2003-05-22 Fritsch Brian D. Cabinet having heat exchanger integrally installed between roof and solar shield
JP3804861B2 (en) * 2002-08-29 2006-08-02 株式会社デンソー Electrical device and wiring board
JP3757200B2 (en) * 2002-09-25 2006-03-22 株式会社日立アドバンストデジタル Electronic equipment with cooling mechanism
US6770967B2 (en) * 2002-12-23 2004-08-03 Eastman Kodak Company Remote thermal vias for densely packed electrical assemblage
KR100683412B1 (en) * 2005-06-11 2007-02-20 삼성전자주식회사 Computer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003065689A (en) * 2001-08-24 2003-03-05 Furukawa Electric Co Ltd:The Sealed cooling device
CN1749924A (en) * 2004-09-16 2006-03-22 扎尔曼技术株式会社 Computer
CN1877825A (en) * 2005-06-08 2006-12-13 上海雷硕医疗器械有限公司 Heat sink structure of medical apparatus
CN2838218Y (en) * 2005-10-24 2006-11-15 南京泰通科技有限公司 Repeater casing with thermo-tube radiator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104503538A (en) * 2014-12-12 2015-04-08 柳州市京阳节能科技研发有限公司 Self control efficient energy-saving temperature-reducing computer host
CN104503538B (en) * 2014-12-12 2018-12-04 柳州市京阳节能科技研发有限公司 Auto-control energy-saving cooling host computer
CN109465800A (en) * 2018-09-20 2019-03-15 巢湖市金辉自控设备有限公司 It is a kind of to be easily installed the frequency converter accommodating mechanism used and application method

Also Published As

Publication number Publication date
US20100264790A1 (en) 2010-10-21

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20101027