CN104007797A - Computer cooling device - Google Patents

Computer cooling device Download PDF

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Publication number
CN104007797A
CN104007797A CN201410243228.3A CN201410243228A CN104007797A CN 104007797 A CN104007797 A CN 104007797A CN 201410243228 A CN201410243228 A CN 201410243228A CN 104007797 A CN104007797 A CN 104007797A
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China
Prior art keywords
heat
ring
dissipation metal
layer
conducting layer
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Application number
CN201410243228.3A
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Chinese (zh)
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CN104007797B (en
Inventor
颜一鸣
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Jishou University
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Jishou University
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Publication of CN104007797A publication Critical patent/CN104007797A/en
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Publication of CN104007797B publication Critical patent/CN104007797B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention relates to a computer cooling device. The computer cooling device comprises a plurality of annular cooling metal fins; each annular cooling metal fin comprises a base, a heat absorbing layer, a heat-conducting layer and a cooling layer, wherein the heat absorbing layer, the heat-conducting layer and the cooling layer are all arranged on the base, the heat absorbing layer is located at the center of the base, the heat-conducting layer covers the heat absorbing layer, the cooling layer covers the heat-conducting layer; the base and the heat absorbing layer are made of the same materials which include 20%-40% of silicon, 30%-50% of copper, 5%-15% of gold and 10%-30% of aluminum in percentage by weight, and all the materials are evenly mixed together and then molded in a die-casting manner; the heat-conducting layer is made of materials including 20%-60% of aluminum and 40%-80% of copper in percentage by weight, and the materials are evenly mixed together and then molded in a die-casting manner; the cooling layer is made of aluminum. The computer cooling device is good in cooling effect and low in cost.

Description

A kind of computer heat radiating device
Technical field
The present invention relates to computer realm, relate in particular to a kind of computer heat radiating device.
Background technology
The use of computing machine has obtained very large universal, but computer to dissipate heat performance is large multi-user pay close attention to most a bit, in hot summer, or in the concentrated region of work intensity, as Internet bar, intensive workplace etc., be easy to make computing machine heating itself, when hot soak condition, be easy to make computing machine blue screen, or burn inner electronic devices and components, the loss that causes vital document, lose greatly, and need repairing, cost of idleness and resource.
In prior art, people adopt the cooperation of aluminium base and fan to dispel the heat, but, as everyone knows, although the cost of aluminium is lower, heat conductivility is not best, can not be very efficient by the temperature conduction on computer hardware out, thereby after long-term use, hardware Yin Wendu can not get effectively conduction out, thereby causes burning.
Summary of the invention
In view of this, be necessary to provide a kind of computer heat radiating device that can effectively conduct and reduce hardware temperatures.
The present invention realizes like this, a kind of computer heat radiating device, comprise a plurality of ring-type heat dissipation metal plates, the diameter single-candidate of described a plurality of ring-type heat dissipation metal plates is successively decreased, diameter circlet shape heat dissipation metal plate is arranged in the ring-type heat dissipation metal plate inner chamber that diameter is large, and a plurality of ring-type heat dissipation metal plates are coaxially installed, in described a plurality of ring-type heat dissipation metal plate, height in peripheral ring-type heat dissipation metal plate is lower than in the interior ring-type heat dissipation metal plate enclosing, the xsect of described ring-type heat dissipation metal plate is bullet shaped, ring-type heat dissipation metal plate comprises pedestal, heat-sink shell, heat-conducting layer and heat dissipating layer, described heat-sink shell, heat-conducting layer and heat dissipating layer are all located on pedestal, and the center of heat-sink shell in pedestal, heat-conducting layer is wrapped on the outside surface of heat-sink shell, heat dissipating layer is wrapped on the outside surface of heat-conducting layer,
The material of described pedestal and heat-sink shell is identical, by distributing by weight, comprises that silicon 20%~40%, copper 30%~50%, gold 5%~15% and aluminium 10%~30 form, by die cast after even mixing;
The material of described heat-conducting layer is: by distributing by weight, comprise that aluminium 20%~60% and copper 40%~80% form, by die cast after even mixing;
The material of described heat dissipating layer is aluminium.
Further, the material of described pedestal and heat-sink shell is identical, by distributing by weight, comprises that silicon 30%, copper 40%, gold 10% and aluminium 20% form, by die cast after even mixing.
Further, the material of described heat-conducting layer is: by distributing by weight, comprise that aluminium 40% and copper 60% form, by die cast after even mixing.
The advantage of a kind of computer heat radiating device provided by the invention is: the present invention is simple and reasonable, by ring-type heat dissipation metal plate is divided into pedestal, heat-sink shell, the array configuration of heat-conducting layer and heat dissipating layer, because the material of pedestal and heat-sink shell is silicon, copper, the array configuration of gold and aluminium, due to silicon, copper, the heat conductivility of gold is far longer than the heat conductivility of aluminium, thereby easily the temperature on hardware is derived, promote the radiating rate of hardware, heat-conducting layer is mainly the combination of aluminium and copper, the main conduction heat that plays a part, the material of heat dissipating layer is aluminium, main plaing a part dispelled the heat, by ring-type heat dissipation metal plate is designed to bullet shaped, mainly in order to increase the area of dissipation of outside, improve radiating efficiency, thereby avoided because of hardware temperatures too high, cause the phenomenon that parts burn to occur, save great amount of cost resource.
Accompanying drawing explanation
Fig. 1 is the front view of a kind of computer heat radiating device of the present invention;
Fig. 2 is the vertical view in Fig. 1;
Fig. 3 is that A-A in Fig. 2 is to cut-open view.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
See also Fig. 1, Fig. 2 and Fig. 3, wherein Fig. 1 is the front view of a kind of computer heat radiating device of the present invention; Fig. 2 is the vertical view in Fig. 1; Fig. 3 is that A-A in Fig. 2 is to cut-open view.
Described a kind of computer heat radiating device, comprise a plurality of ring-type heat dissipation metal plates 10, the diameter single-candidate of described a plurality of ring-type heat dissipation metal plates 10 is successively decreased, diameter circlet shape heat dissipation metal plate 10 is arranged in ring-type heat dissipation metal plate 10 inner chambers that diameter is large, and a plurality of ring-type heat dissipation metal plates 10 are coaxially installed, in described a plurality of ring-type heat dissipation metal plate 10, height in peripheral ring-type heat dissipation metal plate 10 is lower than in the interior ring-type heat dissipation metal plate 10 enclosing, the xsect of described ring-type heat dissipation metal plate 10 is bullet shaped, ring-type heat dissipation metal plate 10 comprises pedestal 11, heat-sink shell 12, heat-conducting layer 13 and heat dissipating layer 14, described heat-sink shell 12, heat-conducting layer 13 and heat dissipating layer 14 are all located on pedestal 11, and the center of heat-sink shell 12 in pedestal 11, heat-conducting layer 13 is wrapped on the outside surface of heat-sink shell 12, heat dissipating layer 14 is wrapped on the outside surface of heat-conducting layer 13,
Described pedestal 11 is identical with the material of heat-sink shell 12, by distributing by weight, comprises that silicon 20%~40%, copper 30%~50%, gold 5%~15% and aluminium 10%~30 form, by die cast after even mixing;
The material of described heat-conducting layer 13 is: by distributing by weight, comprise that aluminium 20%~60% and copper 40%~80% form, by die cast after even mixing;
The material of described heat dissipating layer 14 is aluminium.
In practical operation, described pedestal 11 is identical with the material of heat-sink shell 12, by distributing by weight, comprise that silicon 30%, copper 40%, gold 10% and aluminium 20% form, by die cast after even mixing, the material of described heat-conducting layer 13 is: by distributing by weight, comprise that aluminium 40% and copper 60% form, by die cast after even mixing, so, required cost minimization, and heat conductivility is splendid.
The present invention is simple and reasonable, by ring-type heat dissipation metal plate 10 is divided into pedestal 11, heat-sink shell 12, the array configuration of heat-conducting layer 13 and heat dissipating layer 14, because the material of pedestal 11 and heat-sink shell 12 is silicon, copper, the array configuration of gold and aluminium, due to silicon, copper, the heat conductivility of gold is far longer than the heat conductivility of aluminium, thereby easily the temperature on hardware is derived, promote the radiating rate of hardware, heat-conducting layer 13 is mainly the combination of aluminium and copper, the main conduction heat that plays a part, the material of heat dissipating layer 14 is aluminium, main plaing a part dispelled the heat, by ring-type heat dissipation metal plate 10 is designed to bullet shaped, mainly in order to increase the area of dissipation of outside, improve radiating efficiency, thereby avoided because of hardware temperatures too high, cause the phenomenon that parts burn to occur, save great amount of cost resource.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.

Claims (3)

1. a computer heat radiating device, comprise a plurality of ring-type heat dissipation metal plates (10), it is characterized in that, the diameter single-candidate of described a plurality of ring-type heat dissipation metal plates (10) is successively decreased, diameter circlet shape heat dissipation metal plate (10) is arranged in ring-type heat dissipation metal plate (10) inner chamber that diameter is large, and a plurality of ring-type heat dissipation metal plates (10) are coaxially installed, in described a plurality of ring-type heat dissipation metal plates (10), height in peripheral ring-type heat dissipation metal plate (10) is lower than in the interior ring-type heat dissipation metal plate (10) enclosing, the xsect of described ring-type heat dissipation metal plate (10) is bullet shaped, ring-type heat dissipation metal plate (10) comprises pedestal (11), heat-sink shell (12), heat-conducting layer (13) and heat dissipating layer (14), described heat-sink shell (12), heat-conducting layer (13) and heat dissipating layer (14) are all located on pedestal (11), and the center of heat-sink shell (12) in pedestal (11), heat-conducting layer (13) is wrapped on the outside surface of heat-sink shell (12), heat dissipating layer (14) is wrapped on the outside surface of heat-conducting layer (13),
Described pedestal (11) is identical with the material of heat-sink shell (12), by distributing by weight, comprises that silicon 20%~40%, copper 30%~50%, gold 5%~15% and aluminium 10%~30 form, by die cast after even mixing;
The material of described heat-conducting layer (13) is: by distributing by weight, comprise that aluminium 20%~60% and copper 40%~80% form, by die cast after even mixing;
The material of described heat dissipating layer (14) is aluminium.
2. a kind of computer heat radiating device according to claim 1, it is characterized in that, described pedestal (11) is identical with the material of heat-sink shell (12), by distributing by weight, comprise that silicon 30%, copper 40%, gold 10% and aluminium 20% form, by die cast after even mixing.
3. a kind of computer heat radiating device according to claim 1, is characterized in that, the material of described heat-conducting layer (13) is: by distributing by weight, comprise that aluminium 40% and copper 60% form, by die cast after even mixing.
CN201410243228.3A 2014-06-04 2014-06-04 Computer cooling device Expired - Fee Related CN104007797B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410243228.3A CN104007797B (en) 2014-06-04 2014-06-04 Computer cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410243228.3A CN104007797B (en) 2014-06-04 2014-06-04 Computer cooling device

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CN104007797A true CN104007797A (en) 2014-08-27
CN104007797B CN104007797B (en) 2017-05-10

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104879673A (en) * 2015-06-11 2015-09-02 东莞市闻誉实业有限公司 Novel tubular lamp
CN104879667A (en) * 2015-06-11 2015-09-02 东莞市闻誉实业有限公司 Lighting equipment
CN104896351A (en) * 2015-06-11 2015-09-09 东莞市闻誉实业有限公司 Cylindrical cooling lamp
CN104976536A (en) * 2015-06-11 2015-10-14 东莞市闻誉实业有限公司 Tubular illuminating lamp

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012088807A1 (en) * 2010-12-28 2012-07-05 Qin Biao Led illumination lamp and lamp fixture thereof
CN102563583A (en) * 2012-01-30 2012-07-11 陆炜 Radiating structure
US20130092358A1 (en) * 2010-06-24 2013-04-18 Jingdezhen Fared Technology Co., Ltd. Ceramic radiation heat dissipation structure
CN203466182U (en) * 2013-09-14 2014-03-05 东莞市兆科电子材料科技有限公司 Ceramic cooling fin having advantages of good heat conduction performance and light weight

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130092358A1 (en) * 2010-06-24 2013-04-18 Jingdezhen Fared Technology Co., Ltd. Ceramic radiation heat dissipation structure
WO2012088807A1 (en) * 2010-12-28 2012-07-05 Qin Biao Led illumination lamp and lamp fixture thereof
CN102563583A (en) * 2012-01-30 2012-07-11 陆炜 Radiating structure
CN203466182U (en) * 2013-09-14 2014-03-05 东莞市兆科电子材料科技有限公司 Ceramic cooling fin having advantages of good heat conduction performance and light weight

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104879673A (en) * 2015-06-11 2015-09-02 东莞市闻誉实业有限公司 Novel tubular lamp
CN104879667A (en) * 2015-06-11 2015-09-02 东莞市闻誉实业有限公司 Lighting equipment
CN104896351A (en) * 2015-06-11 2015-09-09 东莞市闻誉实业有限公司 Cylindrical cooling lamp
CN104976536A (en) * 2015-06-11 2015-10-14 东莞市闻誉实业有限公司 Tubular illuminating lamp
CN104879667B (en) * 2015-06-11 2017-06-16 东莞市闻誉实业有限公司 Lighting apparatus
CN104976536B (en) * 2015-06-11 2017-09-01 东莞市闻誉实业有限公司 Tubular type illuminator
CN104896351B (en) * 2015-06-11 2017-12-26 东莞市闻誉实业有限公司 Tubular radiating lamp
CN104879673B (en) * 2015-06-11 2018-01-30 东莞市闻誉实业有限公司 Tubular type light fixture

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