CN203040098U

CN203040098U - Structure of temperature-uniforming plate

Info

Publication number: CN203040098U
Application number: CN 201320016698
Authority: CN
Inventors: 杨修维
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2013-01-11
Filing date: 2013-01-11
Publication date: 2013-07-03
Anticipated expiration: 2023-01-11

Abstract

The utility model relates to the structure of a temperature-uniforming plate. The structure comprises a first body, a second body, and a working fluid. The first body has a plurality of first channels and a plurality of second channels which are communicated; and the second body has a third channel, the first body and the second body are communicated, and the first channels, the second channels and the third channel are communicated and have capillary structures, and the working fluid is filled. Through the design of the structure of the temperature-uniforming plate, not only can temperature uniforming and heat transmission be realized through the first body, but also far-end heat dissipation can be realized through the second body, so that the overall heat dissipation efficiency is substantially improved.

Description

Equalizing plate structure

Technical field

A kind of equalizing plate structure refers to a kind of equalizing plate structure that has large tracts of land samming conduction heat sources and far-end heat radiation simultaneously especially.

Background technology

With existing electronic equipment gradually with frivolous as the demand of bragging about, so each item all must dwindle its size thereupon, but the size of electronic equipment is dwindled the major obstacle that the thermal change of following and producing becomes electronic equipment and system enhancement performance.The semiconductor dimensions that no matter forms electronic component is constantly dwindled, and still requires to increase performance constantly.

When semiconductor dimensions is dwindled, heat flux increases as a result, it only is all increases of heat that the challenge that heat flux increase cause is cooled off product surpasses, overheated because the increase of heat flux causes at different time and the meeting of different length size, may cause electronic failure or damage.

So known dealer is for solving above-mentioned known technology because of the narrow and small problem of heat-dissipating space, so being arranged at chip (wafer/body) top with a kind of VC (Vapor chamber) heat abstractor (structure) uses as heat radiation, in order to increase the capillary limit in the VC, utilize the copper post, the coating sintering, the sintering post, the foaming post, capillary structures such as tool hole (crack) supporter are in order to support as the backflow road, and the design of above-mentioned supporter mainly is because on little temperature-uniforming plate, lower wall thickness thinner (1.5mm is following to be used), if in the binding of no supporter, lower wall may cause thermal expansion, and causes anergy.

Known temperature-uniforming plate is that a kind of the even heat with face is conducted, it mainly is the cryosurface that is transferred heat to opposite side by the heating surface that a side contacts with thermal source uniformly, it has the conduction of larger area heat, advantages such as heat-transfer rate is fast, and its shortcoming is heat to be passed to the far-end heat radiation, if it is heat can't dispel the heat in good time, then long-pending hot near pyrotoxin, so a shortcoming still is the disadvantage of temperature-uniforming plate easily.

The utility model content

For this reason, for solving the shortcoming of above-mentioned known technology, main purpose of the present utility model provides a kind of equalizing plate structure that promotes heat dissipation.

For reaching above-mentioned purpose, the utility model provides a kind of equalizing plate structure, and described equalizing plate structure comprises: one first body, one second body, a working fluid;

Described first body has a plurality of first passages and a plurality of second channel, described first and second passage is interconnected, described second body has a third channel, this second body connects this first body, and this third channel and aforementioned first and second passage are interconnected, and this first, second and third channel wall has a capillary structure, and described working fluid is filled in aforementioned first and second body.

Particularly, the utility model provides a kind of equalizing plate structure, comprises:

One first body has a plurality of first passages and a plurality of second channel, and described first and second passage is interconnected; One second body has a third channel, and this second body connects this first body, make this third channel and aforementioned first and second passage be interconnected, and this first, second and third channel wall has a capillary structure; One working fluid is filled in aforementioned first and second body.

Preferably, it is wherein arbitrary that described equalizing plate structure, described capillary structure are chosen as reticulate body and corpus fibrosum and agglomerated powder opisthosoma and groove.

Preferably, described equalizing plate structure, described first and second channel vertical is staggered to be communicated with.

Preferably, described equalizing plate structure, described first body passes through extrusion forming.

Preferably, described equalizing plate structure, described second body is a heat pipe.

Preferably, described equalizing plate structure, described first body also have one first closed side and one second closed side, in order to seal the two ends of this first passage respectively.

Preferably, described equalizing plate structure, described second body also have one first end and one second end, and described first end is connected with this first body, and this second end extends to opposite this first extreme direction.

Preferably, described equalizing plate structure also has a radiator, and this radiator connects with an end of opposite this first body of this second body.

Preferably, described equalizing plate structure, described second body also have one first end and one second end, and this first end and this second end are connected with this first body simultaneously, and first end of this second body and this second end also have a conducting part between the two, and this conducting part is connected with a radiator.

Can make described temperature-uniforming plate not only have large-area heat by the utility model passes effect, also has the function that far-end conducts heat, and then can significantly promote the integral heat sink effect of temperature-uniforming plate.

Description of drawings

Fig. 1 is the first embodiment three-dimensional exploded view of the utility model equalizing plate structure;

Fig. 2 is the first embodiment assembled sectional view of the utility model equalizing plate structure;

Fig. 3 is the second embodiment three-dimensional combination figure of the utility model equalizing plate structure;

Fig. 4 is the 3rd embodiment three-dimensional combination figure of the utility model equalizing plate structure.

The main element symbol description

First body 11

First passage 111

Second channel 112

First closed side 113

Second closed side 114

Second body 12

Third channel 121

First end 122

Second end 123

Conducting part 124

Working fluid 2

Capillary structure 3

Radiator 4

Embodiment

Characteristic on above-mentioned purpose of the present utility model and structure thereof and the function will be illustrated according to appended graphic preferred embodiment.

See also Fig. 1, Fig. 2, be first embodiment three-dimensional exploded view and the assembled sectional view of the utility model equalizing plate structure, as shown in the figure, the equalizing plate structure of present embodiment comprises: one first body 11, one second body 12, a working fluid 2;

Described first body 11 has a plurality of first passages 111 and a plurality of second channel 112, and described first and second passage 111,112 is interconnected.

Described first and second passage 111,112 vertical interlaceds are communicated with, and described first body 11 has one first closed side 113 and one second closed side 114, is located at the two ends of this first passage 111 respectively.

Described second body 12 has a third channel 121, this second body 12 connects this first body 11, and make this third channel 121 and aforementioned first, two passages 111,112 are interconnected, and this is first years old, two, triple channel 111,112,121 wall has a capillary structure 3, described second body 12 is a heat pipe, and this second body 12 also has one first end 122 and one second end 123, described first end 122 is connected with this first body 11, this second end 123 extends to the direction of opposite this first end 122, it is wherein arbitrary that described capillary structure 3 is chosen as reticulate body and corpus fibrosum and agglomerated powder opisthosoma and groove, present embodiment is with groove embodiment as an illustration, be not limited but do not regard it as, described working fluid 2 is filled in aforementioned first, two bodies 11, in 12.

Described first body 11 can pass through extrusion forming, and when this first body 11 of extrusion forming, the first passage 111 of these first body, 11 inside of moulding simultaneously, and offer a plurality of grooves 1111 in the wall of this first passage 111, again pass through the mode of machining in this first body 11 thereafter, offer the second channel 112 that is vertical and is communicated with this first passage 111 in addition, the closed at both ends that at last this first passage 111 is open shape, and this second body 12 is connected with this first body 12, and make this first, two, triple channel 111,112,121 are interconnected, at last with this first body 11, second body 12 vacuumizes and inserts working fluid 2.

See also Fig. 3, the second embodiment three-dimensional combination figure for the utility model equalizing plate structure, as shown in the figure, present embodiment is identical with the aforementioned first embodiment part-structure, then will repeat no more at this, be not existing together for also having a radiator 4 of present embodiment and aforementioned first embodiment, this radiator 4 connects with an end of these second body, 12 opposite these first bodies 11, and by this second body 12 working fluid of adsorbed heat by inside guided to this radiator 4 and to be connected part, cool off by this radiator 4 again.

See also Fig. 4, the 3rd embodiment three-dimensional combination figure for the utility model equalizing plate structure, as shown in the figure, present embodiment is identical with the aforementioned first embodiment part-structure, then will repeat no more at this, for first end 122 and second end 123 that do not exist together for described second body 12 of present embodiment and aforementioned first embodiment is connected with this first body 11 simultaneously, and first end 122 of this second body 12 also has a conducting part 124 between the two with this second end 123, and this conducting part 124 is connected with a radiator 4.

By the first～three embodiment of the present utility model, can improve near the excessively disappearance of long-pending heat pyrotoxin of known temperature-uniforming plate, effectively reach the effect that heat is passed to the far-end heat radiation.

Claims

1. an equalizing plate structure is characterized in that, comprises:

One first body has a plurality of first passages and a plurality of second channel, and described first and second passage is interconnected;

One second body has a third channel, and this second body connects this first body, make this third channel and aforementioned first and second passage be interconnected, and this first, second and third channel wall has a capillary structure;

One working fluid is filled in aforementioned first and second body.

2. equalizing plate structure as claimed in claim 1 is characterized in that, it is wherein arbitrary that described capillary structure is chosen as reticulate body and corpus fibrosum and agglomerated powder opisthosoma and groove.

3. equalizing plate structure as claimed in claim 1 is characterized in that, described first and second channel vertical is staggered to be communicated with.

4. equalizing plate structure as claimed in claim 1 is characterized in that, described first body passes through extrusion forming.

5. equalizing plate structure as claimed in claim 1 is characterized in that, described second body is a heat pipe.

6. equalizing plate structure as claimed in claim 1 is characterized in that, described first body also has one first closed side and one second closed side, in order to seal the two ends of this first passage respectively.

7. equalizing plate structure as claimed in claim 1 is characterized in that, described second body also has one first end and one second end, and described first end is connected with this first body, and this second end extends to opposite this first extreme direction.

8. equalizing plate structure as claimed in claim 1 is characterized in that, also has a radiator, and this radiator connects with an end of opposite this first body of this second body.

9. equalizing plate structure as claimed in claim 1, it is characterized in that, described second body also has one first end and one second end, and this first end and this second end are connected with this first body simultaneously, and first end of this second body and this second end also have a conducting part between the two, and this conducting part is connected with a radiator.