CN107484386A - The manufacture method of heat conducting device - Google Patents
The manufacture method of heat conducting device Download PDFInfo
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- CN107484386A CN107484386A CN201710377130.0A CN201710377130A CN107484386A CN 107484386 A CN107484386 A CN 107484386A CN 201710377130 A CN201710377130 A CN 201710377130A CN 107484386 A CN107484386 A CN 107484386A
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- plate
- heat conducting
- manufacture method
- conducting element
- capillary structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Abstract
The disclosure provides a kind of manufacture method of heat conducting device, comprises the following steps：The first plate is provided, wherein the first plate includes plate body and heat conducting element, plate body has the insertion end that relative heat conducting element is set, and insertion end defines siphunculus, heat conducting element set on-tube；The second plate is provided, wherein the second plate has the first openend；First capillary structure is set in the inwall of heat conducting element and the lower surface of plate body；Second capillary structure is set in the inwall of the second plate；And connection plate body makes the first plate be connected with the second plate and form a cavity in the first openend.The present invention can make heat conducting device have higher heat conduction efficiency.
Description
Technical field
The present invention relates to a kind of manufacture method, especially in regard to a kind of manufacture method of heat conducting device.
Background technology
Heat pipe (Heat Pipe) and temperature-uniforming plate, or vaporium (Vapor Chamber) etc. are dynamical heat transfer dresses
Put, it is characterized in that it is high heat transfer efficiency, in light weight, simple in construction, and it is not required to expend electric energy, therefore, heat pipe and vaporium institute group
Into heat conducting device be widely used in a variety of high performance heat dissipation element markets, such as server, communication equipment, height
Rank drafting card or high-effect LED heat dissipation elements etc..
It is first to set capillary structure (Wick Structure) respectively in the manufacture method of existing heat conducting device
It is inserted in the opening of steam chamber after the inwall of heat pipe and vaporium, then by heat pipe, then is welded heat pipe by being welded mode
It is assembled in the upper surface of steam chamber.However, this manufacture method will make heat pipe and steam chamber in the capillary structure of weld for not
Continuously, cause inner vapor space discontinuous, and cause the wall of the connections such as scolding tin, vaporium, heat pipe to there are thermal resistance
(Thermal Resistance), causes the reduction of heat conduction efficiency.
The content of the invention
The purpose of the present invention can make heat conducting device have higher heat to provide a kind of manufacture method of heat conducting device
Conduction efficiency.
The present invention provides a kind of manufacture method of heat conducting device, comprises the following steps：One first plate is provided, wherein the
One plate includes a plate body and an at least heat conducting element, and plate body has the insertion end that relative heat conducting element is set, insertion end definition
One siphunculus, heat conducting element set on-tube, one second plate is provided, wherein the second plate has one first openend, sets one the
One capillary structure in heat conducting element inwall and plate body lower surface, set one second capillary structure in the second plate inwall,
And connection plate body makes the first plate be connected with the second plate and form a cavity in the first openend.
In one embodiment, heat conducting element can be a heat pipe or a thermal conduction plate.In addition, the first plate can be formed in one.
In addition, the inside dimensions of the first openend of the second plate and the size of plate body are substantially identical.In addition, heat conducting element is to pass through burning
Knot or welding manner connection plate body.In addition, the first plate with the second plate is connected by sintering or welding manner.
In one embodiment, heat conducting element has one second openend, and manufacture method is further comprising the steps of：Make heat conduction first
Second openend of part is inserted on the inside of the siphunculus of plate body.
In one embodiment, heat conducting element has one second openend, and manufacture method is further comprising the steps of：Make heat conduction first
Second openend of part is inserted on the outside of the siphunculus of plate body.
In one embodiment, manufacture method is further comprising the steps of：One tool, the wherein shape of tool and the first plate are provided
Part is corresponding, sets the first capillary structure to insert leading for the first plate in the surface of tool, by the tool with the first capillary structure
Thermal element, the first capillary structure is arranged at by the inwall of heat conducting element and the lower surface of plate body and removing fixture by tool.
In one embodiment, the thickness of plate body and the first capillary structure, and the first openend and the second capillary structure away from
From substantially identical, therefore, when the plate body of the first plate connects the first openend of the second plate, the first capillary structure and second
Capillary structure connects, to form successional capillary structure.
In one embodiment, before the step of forming cavity making the first plate and the link of the second plate, in addition to
Lower step：An at least support member is provided and support member is set in the second capillary structure and the plate of the first plate on the second plate
Between the first capillary structure on body, to avoid the first plate from collapsing.Wherein, the structure of support member and the first capillary structure or the
Two capillary structures are identical.
In one embodiment, manufacture method is further comprising the steps of：There is provided multiple radiating fins and by the radiating fin
It is combined in heat conducting element.
In one embodiment, manufacture method is further comprising the steps of：A working fluid is vacuumized and filled to cavity in chamber
In vivo.
From the above, by the manufacture method of heat conducting device of the invention, heat conducting element and steam chamber (cavity) can be made
Between inwall formed successional capillary structure without thermal resistance exist, therefore, gaseous working fluid can not hinder
Ground is quickly transferred to each heat conducting element from steam chamber, moreover, can also lead to through the condensed gaseous working fluid of heat conducting element
Cross capillary structure and be unobstructedly back to steam chamber.Therefore, manufacture method of the invention can have heat conducting device higher
Heat conduction efficiency.
Brief description of the drawings
Fig. 1 is a kind of schematic flow sheet of the manufacture method of heat conducting device of the preferred embodiment of the present invention.
Fig. 2A to Fig. 2 I is respectively the manufacturing process schematic diagram of the heat conducting device of one embodiment of the invention.
Fig. 3 is the schematic perspective view of the heat conducting device of Fig. 2 I embodiment.
Fig. 4 is the schematic perspective view of the heat conducting device of Fig. 2 I another embodiment.
Fig. 5 to Fig. 7 is respectively the schematic cross-sectional view of the heat conducting device of different embodiments of the present invention.
Description of reference numerals：
1st, 1a~1d：Heat conducting device
11：First plate
111、111c：Plate body
1111：Siphunculus
112、112a、112c：Heat conducting element
1121、121：Inwall
12：Second plate
13：Capillary structure
131：First capillary structure
132：Second capillary structure
14、14b：Support member
15：Radiating fin
16：Cavity
2：Tool
A：Region
d1：Thickness
d2：Distance
E1：First openend
E2：Second openend
H：Heat
I1：Insertion end
P1：Arrow (direct of travel for being vaporized into gaseous working fluid)
P2：Arrow (direct of travel for being condensed into the working fluid of liquid)
S01 to S05：Step
S1：Upper surface
S2：Lower surface
Embodiment
Hereinafter with reference to relevant drawings, illustrate the manufacture method of the heat conducting device according to the preferred embodiment of the present invention, wherein
Identical element will be illustrated with identical reference marks.
It refer to shown in Fig. 1, it shows for a kind of flow of the manufacture method of heat conducting device of the preferred embodiment of the present invention
It is intended to.
The manufacture method of heat conducting device comprises the following steps：One first plate is provided, wherein the first plate includes a plate
Body and at least a heat conducting element, plate body have at least insertion end that relative heat conducting element is set, and insertion end defines a siphunculus, led
Thermal element covers on-tube；(step S01), one second plate is provided, wherein the second plate has one first openend (step
S02), one first capillary structure is set in the inwall of heat conducting element and lower surface (step S03), one second capillary of setting of plate body
Structure connects the first plate and the second plate in the inwall (step S04) of the second plate, and connection plate body in the first openend
Connect and form a cavity (step S05).
Hereinafter, it refer to Fig. 1 and coordinate Fig. 2A to Fig. 2 I embodiment, to illustrate that above-mentioned steps S01's to step S05 is detailed
Thin content.Wherein, Fig. 2A to Fig. 2 F is respectively the manufacturing process schematic diagram of the heat conducting device 1 of one embodiment of the invention.
In step S01, as shown in Fig. 2A and Fig. 2 B, it is to provide the first plate 11, wherein the first plate 11 includes plate body
111 and at least one heat conducting element 112, plate body 111 there is relative upper surface S1 and lower surface S2.Meanwhile plate body 111 has phase
At least insertion end I1 set to the quantity of heat conducting element 112, shape, position, each insertion end 11 surround a ring of plate body 111
Shape region simultaneously extends towards upper surface S1 directions, therefore can each self-defined one logical tubular structure (siphunculus 1111), heat conduction on plate body 111
Element 112 then corresponds to set on-tube 1111.In addition, heat conducting element 112 is connected to relatively close upper surface S1 side, and plate body
111 from lower surface S2 see be closed state.
The material of plate body 111 or heat conducting element 112 can be that thermal conductivity factor (Heat Transfer Coefficient) is high
Metal (such as, but not limited to copper, aluminium) or alloy.The plate body 111 of the present embodiment and the material of heat conducting element 112 are all with copper, and the
One plate 11 is exemplified by being connected to two heat conducting elements 112 on the upper surface S1 of plate body 111.Wherein, heat conduction member
Part 112 can be a heat pipe (Heat Pipe) or a thermal conduction plate (Temperature plate, also known as temperature-uniforming plate), be not intended to limit.
First plate 11 can be formed in one, or be combined by two different components.First plate of the present embodiment
11 be so that two different components combine as an example.In this, as foregoing plate body 111 have corresponding to the quantity of heat conducting element 112,
The insertion end I1 that shape, position are set, and there is heat conducting element 112 the openend E2 corresponding to insertion end I1 (can be described as second
Openend E2), and be the insertion for first making the second openend E2 of heat conducting element 112 be socketed on plate body 111 in step S01
Siphunculus 1111 defined in I1 is held, and heat conducting element 112 is connected to the siphunculus 1111 that insertion end I1 is defined, thereby forms first
Plate 11.
It should be noted that Fig. 2 B illustrate that the second openend E2 from the embodiment of the inner side of siphunculus 1111 socket, and, warp
Configured by the difference of bore, the second openend E2 can also be socketed from the outside of siphunculus 1111, that is, the second openend E2 is arranged
In the insertion end I2 outside of siphunculus 1111.In this, using such as sintering (Sintering, such as naked light, laser light, infrared ray
Or other mode of heatings sintering), or heat conducting element 112 is connected to the insertion end of plate body 111 in a manner of welding (Welding)
I1, it is not intended to limit.
Then, in step S02, as shown in Figure 2 C, it is to provide the second plate 12, wherein the second plate 12 has an opening
Hold E1 (can be described as the first openend E1).The second plate 12 substantially groove-like of the present embodiment and there is the first openend E1,
It can be processed from strand by metal or alloy.In order that in follow-up processing procedure, the first plate 11 can combine with the second plate 12
Smoothly, the first openend E1 of the present embodiment restriction inside dimensions and the size of plate body 111 are substantially identical, therefore, connect both
Can tight union when connecing.
In addition, in step S03, the first capillary structure 131 is set in the inwall 1121 and plate body 111 of heat conducting element 112
Lower surface S2 on.In the present embodiment, in order to set the first capillary structure 131 on the first plate 11, as shown in Figure 2 D, this
The manufacture method of embodiment can also include the steps of：One tool 2 is provided, wherein, the shape of tool 2 and the first plate 11 are (such as
Shown in Fig. 2 B) it is corresponding.In this, the profile of tool 2 is corresponding with the lower surface S2 of the inwall 1121 of heat conducting element 112 and plate body 111
It is identical.Then, then the first capillary structure 131 is set in the surface of tool 2.In this, the first capillary structure 131 is arranged at tool
(it need not be set if having inner surface) on 2 outer surface, then, as shown in Figure 2 E, by controlling with the first capillary structure 131
In the heat conducting elements 112 of the first plates 11 of insertion of tool 2 and smooth plate body 111 lower surface S2, with by tool 2 by the first capillary
Structure 131 is arranged on the inwall 1121 of heat conducting element 112 and the lower surface S2 of plate body 111；And then removing fixture 2, such as scheme
Shown in 2F, the first capillary structure 131 is arranged on the inwall 1121 of heat conducting element 112 and the lower surface S2 of plate body 111.By
Then pass through tool 2 and first capillary structure 131 is arranged on to the inwall 1121 of heat conducting element 112 and the lower surface S2 of plate body 111
On, therefore, in the junction of heat conducting element 112 and plate body 111, such as in Fig. 2 F region A, the first capillary structure 131 is company
Continuous property structure, thermal resistance presence is not had.
Then, step S04 is carried out, as shown in Figure 2 G, the second capillary structure 132 is set in the inwall 121 of the second plate 12
On, the second capillary structure 132 is also continuity structure.In the present embodiment, in order that capillary structure inside heat conducting device 1
For continuous structure, as illustrated in figure 2h, the totalling thickness d 1 of the capillary structure 131 of plate body 111 and first, and the first openend E1 with
The reserved distance d2 of second capillary structure 132 is substantially identical, therefore, as shown in figure 2i, the second plate is connected in the first plate 11
When 12, the first capillary structure 131 can just be connected with the second capillary structure 132 and form successional capillary structure 13.
It is noted that the first above-mentioned capillary structure 131 can have different structures to set from the second capillary structure 132
Meter, common there are about four kinds, be respectively：Plough groove type, mesh-type (braiding), fiber type and sintered type, the present invention do not limit.Compared with
Good person, it is to use sintered type capillary structure, main cause is that, according to sintered type capillary structure, no matter heat conducting element 112 is with what
Kind shape, orientation, angle are placed, and condensed working fluid is carried out capillary backflow with can all not hindering.
Further, since the substantially tabular of plate body 111, in order that the first plate 11 after connection will not collapse, such as Fig. 2 H
Shown in Fig. 2 I, the present embodiment can also before the step S05 that both are connected in the first plate 11 and the second plate 12, first provide to
A few support member 14, and the plate of second capillary structure 132 and first plate 11 of the support member 14 on the second plate 12 is set
Between the first capillary structure 131 on body 111.It is to show 4 support members 14 to be located at the first capillary structure in this embodiment
131 and second between capillary structure 132.In follow-up processing procedure, support member 14, which can be removed or not remove, all may be used.
Finally, then step S05 is carried out：Plate body 111 is connected in the first openend E1 inner side, makes the first plate 11 and second
Plate 12 connects and forms cavity 16.Due to the first openend E1 of the second plate 12 inside dimensions and the size of plate body 111
It is substantially identical, therefore can be combined closely during both connections.Wherein, can by sintering (such as naked light, laser, infrared ray or other add
Hot mode sinters), or the first plate 11 is connected the second plate 12 with welding manner, it is not intended to limit.
Therefore, as shown in figure 2i, in heat conducting device 1, the first plate 11 is connected with the second plate 12 and forms cavity
16 (can be described as vaporium), one working fluid of refilling (not shown) is in cavity 16.Wherein, the selection of working fluid can be with
It is refrigerant, such as freon (Freon), ammonia, acetone, methanol, ethanol, heptane, or water etc., can be according to the species or shape of thermal source
For formula, as long as selected working fluid can be vaporized into gaseous state by thermal source, you can be condensed into liquid again.Notably
It is, though example of the present embodiment using refrigerant as working fluid, and when selecting him to plant working fluid, working fluid is injected into heat
Before the cavity 16 of conduction device 1, first cavity 16 must be vacuumized, prevent the impurity for having beyond working fluid in cavity 16
Gas (such as air), due to these foreign gases and vaporization-condensation cycle is not involved in, and is referred to as incondensable gas, do not coagulated
Knot gas, when heat conducting device 1 works, can be occupied in the cavity 16 of certain volume in addition to it can cause vapourizing temperature and raise
Space, influence heat conduction efficiency.Certainly, if if being working fluid using water, can be not required to vacuumize cavity 16.
Hold, by the manufacture method of the heat conducting device 1 of the present embodiment, heat conducting element 112 and steam chamber (cavity can be made
16) it is all successional capillary structure 13 between or in cavity 16, exists without thermal resistance, gaseous working fluid can have
Ground is hindered to be quickly transferred to from steam chamber in each heat conducting element 112, moreover, through the condensed liquid work of heat conducting element 112
Make fluid also without hindering can be back to steam chamber by capillary structure 13, and therefore, the manufacture method of the present embodiment can make
Heat conducting device 1 has higher heat conduction efficiency.
In addition, please respectively refer to shown in Fig. 3 to Fig. 6, wherein, Fig. 3 is the solid of the heat conducting device 1 of Fig. 2 I embodiment
Schematic diagram, Fig. 4 is the heat conducting device 1a of Fig. 2 I another embodiment schematic perspective view, and Fig. 5 and Fig. 6 is respectively the present invention
Heat conducting device 1b, 1c of different embodiments schematic cross-sectional view.
As shown in figure 3, the heat conducting element 112 of the heat conducting device 1 of the present embodiment is the heat pipe of cylinder or cone.Not
With in embodiment, such as shown in Fig. 4, heat conducting device 1a heat conducting element 112a be the thermal conduction plate of a flat board or bricked (
Warm plate).Wherein, temperature-uniforming plate is at least the vacuum cavity being welded to form by upper and lower two panels metal sheet, can be quick by local heat source
The high performance heat radiating device of large-area flat-plate is transmitted to, therefore can solve the more heat dissipation problem of critical conditions and have higher
Radiating efficiency.
In addition, as shown in figure 5, with Fig. 2 I heat conducting device 1 primary difference is that, Fig. 5 heat conducting device 1b's
Support member 14b structure is identical with the first capillary structure 131 or the second capillary structure 132.In other words, support member 14b material
It can also be capillary structure.So, it is possible to provide the more conducting paths of working fluid, in addition to as structural support, can also increase
Whole work efficiency.
In addition, as shown in fig. 6, the heat conducting device 1c of the present embodiment the first plate 11c is exemplified by being integrally formed.Change
Yan Zhi, plate body 111c and heat conducting element 112c are to be bent, be process by solid memder.
In addition, heat conducting device 1a~1c other technical characteristics and its manufacture method can refer to Fig. 1, Fig. 2A to Fig. 2 I
The manufacturing process of heat conducting device 1, is repeated no more in this.
In order to increase heat dissipation, in various embodiments, radiating fin can be also installed additional on heat conducting element, to carry again
Rise the heat transfer efficiency of heat conducting device.Hereinafter, it is to illustrate so that Fig. 2 I heat conducting device 1 installs radiating fin additional as an example, when
So, radiating fin can be also installed on above-mentioned heat conducting device 1a~1c, and the present invention neither limits.
It refer to shown in Fig. 7, the heat conducting device 1d of the present embodiment manufacture method can also include the steps of：There is provided more
Individual radiating fin 15, the radiating fin 15 is combined on heat conducting element 112.It is by the radiating fin in this embodiment
15 are combined in a manner of being arranged parallel to each other on the outer surface of heat conducting element 112.The material of radiating fin 15 also can be thermal conductivity system
The high metals of number, and can sinter, weld, socket or snap are connected to heat conducting element 112, heat conduction member will be transmitted to
The heat energy of part 112 is rapidly dispersed into the external world by radiating fin 15, to improve heat transfer efficiency.
Therefore, when heat conducting device 1d vaporium (cavity 16) contacts with pyrotoxin, heat H can be conducted to vaporium
(cavity 16), vaporium (cavity 16) is set to have higher temperature and the working fluid of inside is vaporizated into gaseous state, it is gaseous
Working fluid up, and (will represent that working fluid is vaporizated into gaseous state by heat toward the direction movement of heat conducting element 112 with arrow P1
Direct of travel afterwards), reaching heat possessed by the working fluid of heat conducting element 112 can dissipate toward the outside of heat conducting element 112,
Certainly can also assist to dissipate out heat by radiating fin 15 so that the condensable workflow into liquid of gaseous working fluid
Body, the working fluid of liquid can be back in vaporium along the first capillary structure 131 of the inwall 1121 of heat conducting element 112
Second capillary structure 132 (representing to be condensed into the direct of travel of the working fluid of liquid with arrow P2), holds working fluid
Continuous circulating reflux is in heat conducting device 1d.
In summary, by the manufacture method of heat conducting device of the invention, heat conducting element and steam chamber (cavity) can be made
Between inwall formed successional capillary structure without thermal resistance exist, therefore, gaseous working fluid can not hinder
Ground is quickly transferred to each heat conducting element from steam chamber, moreover, can also lead to through the condensed gaseous working fluid of heat conducting element
Cross capillary structure and be unobstructedly back to steam chamber.Therefore, manufacture method of the invention can have heat conducting device higher
Heat conduction efficiency.
Illustrative is the foregoing is only, rather than is restricted person.Any design and scope without departing from the present invention, and to it
The equivalent modifications of progress or change, are intended to be limited solely by claim.
Claims (15)
1. a kind of manufacture method of heat conducting device, comprises the following steps：
One first plate is provided, wherein first plate includes a plate body and an at least heat conducting element, and the plate body has relative be somebody's turn to do
At least insertion end that heat conducting element is set, the insertion end defines a siphunculus, and the heat conducting element is socketed the siphunculus；
One second plate is provided, wherein second plate has one first openend；
One first capillary structure is set in the lower surface of the inwall of the heat conducting element and the plate body；
One second capillary structure is set in the inwall of second plate；And
The plate body is connected in first openend, first plate is connected with second plate and forms a cavity.
2. manufacture method as claimed in claim 1, the wherein heat conducting element are a heat pipe or a thermal conduction plate.
3. manufacture method as claimed in claim 1, wherein first plate are formed in one.
4. manufacture method as claimed in claim 1, the wherein heat conducting element have one second openend, the manufacture method is also wrapped
Include following steps：
Second openend of the heat conducting element is set to be inserted on the inside of the siphunculus of the plate body.
5. manufacture method as claimed in claim 1, the wherein heat conducting element have one second openend, the manufacture method is also wrapped
Include following steps：
Second openend of the heat conducting element is set to be inserted on the outside of the siphunculus of the plate body.
6. manufacture method as claimed in claim 1, the wherein inside dimensions of first openend and the size essence of the plate body
It is identical.
7. manufacture method as claimed in claim 1, further comprising the steps of：
A tool is provided, the wherein shape of the tool is corresponding with first plate；
First capillary structure is set in the surface of the tool；
The tool with first capillary structure is inserted to the heat conducting element of first plate；
First capillary structure is arranged at by the inwall of the heat conducting element and the lower surface of the plate body by the tool；And
Remove the tool.
8. manufacture method as claimed in claim 1, the wherein plate body and the thickness of first capillary structure, and first opening
End is substantially identical with the distance of second capillary structure.
9. manufacture method as claimed in claim 1, wherein first capillary structure connect second capillary structure.
10. manufacture method as claimed in claim 1, wherein forming the chamber making first plate be connected with second plate
It is further comprising the steps of before the step of body：
An at least support member is provided；And
The support member is set in this first mao on the plate body of second capillary structure on second plate and first plate
Between fine texture.
11. the structure of manufacture method as claimed in claim 10, the wherein support member and first capillary structure or this second
Capillary structure is identical.
12. manufacture method as claimed in claim 1, the wherein heat conducting element are to connect the plate by sintering or welding manner
Body.
13. manufacture method as claimed in claim 1, wherein first plate and second plate are by sintering or the side of welding
Formula connects.
14. manufacture method as claimed in claim 1, further comprising the steps of：
Multiple radiating fins are provided；And
By the radiating fin combination in the heat conducting element.
15. manufacture method as claimed in claim 1, further comprising the steps of：
The cavity is vacuumized；And
A working fluid is filled in the cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/615,140 US10663231B2 (en) | 2016-06-08 | 2017-06-06 | Manufacturing method of heat conducting device |
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|---|---|---|---|
| US201662347459P | 2016-06-08 | 2016-06-08 | |
| US62/347,459 | 2016-06-08 |
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| CN112254559A (en) * | 2020-10-21 | 2021-01-22 | 碳元科技股份有限公司 | Three-dimensional radiator and preparation method thereof |
| CN112363593A (en) * | 2019-06-28 | 2021-02-12 | 河南烯力新材料科技有限公司 | Heat conduction structure, manufacturing method thereof and mobile device |
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| CN112363593A (en) * | 2019-06-28 | 2021-02-12 | 河南烯力新材料科技有限公司 | Heat conduction structure, manufacturing method thereof and mobile device |
| CN112363593B (en) * | 2019-06-28 | 2023-06-02 | 河南烯力新材料科技有限公司 | Heat conduction structure, manufacturing method thereof and mobile device |
| CN110769647A (en) * | 2019-10-22 | 2020-02-07 | 东莞领杰金属精密制造科技有限公司 | Manufacturing method of vapor chamber |
| CN112254559A (en) * | 2020-10-21 | 2021-01-22 | 碳元科技股份有限公司 | Three-dimensional radiator and preparation method thereof |
| EP3988885A1 (en) * | 2020-10-22 | 2022-04-27 | Cooler Master Co., Ltd. | Vapor chamber heatsink assembly |
| TWI804812B (en) * | 2020-10-22 | 2023-06-11 | 訊凱國際股份有限公司 | Heat dissipating device |
| US11913726B2 (en) | 2020-10-22 | 2024-02-27 | Cooler Master Co., Ltd. | Vapor chamber heatsink assembly |
| TWI828112B (en) * | 2022-04-12 | 2024-01-01 | 邁萪科技股份有限公司 | Heat dissipation module and manufacturing method thereof |
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|---|---|
| CN107484386B (en) | 2019-09-03 |
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