TWI601931B - Heat and vapor chamber connecting structure and method thereof - Google Patents
Heat and vapor chamber connecting structure and method thereof Download PDFInfo
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- TWI601931B TWI601931B TW105105970A TW105105970A TWI601931B TW I601931 B TWI601931 B TW I601931B TW 105105970 A TW105105970 A TW 105105970A TW 105105970 A TW105105970 A TW 105105970A TW I601931 B TWI601931 B TW I601931B
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Description
本發明係有關一種導熱技術,尤指一種熱管和均溫板組接結構及其方法。 The invention relates to a heat conduction technology, in particular to a heat pipe and a uniform temperature plate assembly structure and a method thereof.
隨著電子元件的運算速度不斷提昇,其所產生的熱量亦越來越高,為了有效地解決此高發熱量的問題,業界已將具有良好導熱特性的均溫板和熱管進行廣泛性的使用,但是此等均溫板和熱管不論是其導熱效能、製作成本和製作容易度等皆存在有尚待加以改善的空間。 As the computing speed of electronic components continues to increase, the heat generated by them is becoming higher and higher. In order to effectively solve the problem of high heat generation, the industry has widely used uniform temperature plates and heat pipes with good thermal conductivity characteristics. However, such a temperature equalizing plate and a heat pipe have room for improvement, such as heat conductivity, production cost, and ease of manufacture.
習知的均溫板和熱管組接結構,主要是將熱管立設在均溫板上,二者的內部空間互不相通,僅能透過熱傳導方式來進行熱量的導離和散逸,前述結構並無法達到均溫板和熱管均溫效果,進而使其熱導效果大打折扣。業界為了解決前述問題,在均溫板上開設有供熱管連接的穿孔,但在製作過程中卻存在著製程繁瑣和複雜,且內部工作流體的循環效果亦不佳等問題,亟待加以改善者。 The conventional uniform temperature plate and heat pipe assembly structure mainly sets the heat pipe on the temperature equalization plate, and the internal spaces of the two are not connected to each other, and only the heat conduction method can be used for heat conduction and dissipation, and the foregoing structure is The uniform temperature plate and the heat pipe uniform temperature effect cannot be achieved, and the heat conduction effect is greatly reduced. In order to solve the above problems, the industry has a perforation for the connection of the heating pipe on the temperature equalizing plate. However, in the manufacturing process, there are problems such as cumbersome and complicated processes, and the circulation effect of the internal working fluid is also poor, which needs to be improved.
本發明之一目的,在於提供一種熱管和均溫板組接結構及其方法,其不僅可簡化製程更能夠有效地提昇導熱和散熱效能。 An object of the present invention is to provide a heat pipe and a temperature equalizing plate assembly structure and a method thereof, which can not only simplify the process, but also effectively improve the heat conduction and heat dissipation performance.
為了達成上述之目的,本發明係提供一種熱管和均溫板組接方法,其步驟包括:a)備一金屬板,對該金屬板加工形成有一穿孔及一環牆;b)備一熱管,該熱管具有一開口,對該熱管加工形成有一止擋部;c)將該熱管對應於該環牆立設,從而使該開口與該穿孔連通;d)將一芯棒從該穿孔插入並被該止擋部所阻擋;e)將一金屬粉末從該穿孔填入從而形成在該芯棒的外周圍;f)對經步驟e)的半成品進行一燒結加工,從而在該穿孔至該止擋部之間形成有一多孔性燒結組織,並構成一上殼體;g)備一下殼體,將該下殼體對應該上殼體封合連接;以及h)對經步驟g)的半成品施以一填液和一除氣封口製程。 In order to achieve the above object, the present invention provides a heat pipe and a temperature equalizing plate assembly method, the steps comprising: a) preparing a metal plate, forming a perforation and a ring wall for the metal plate; b) preparing a heat pipe, The heat pipe has an opening, and the heat pipe is formed with a stopper; c) the heat pipe is erected corresponding to the ring wall to communicate the opening with the hole; d) inserting a core rod from the hole and being Blocked by the stopper; e) filling a metal powder from the perforation to form an outer periphery of the mandrel; f) performing a sintering process on the semi-finished product of step e), thereby perforating to the stop portion Forming a porous sintered structure between them and forming an upper casing; g) preparing a casing, sealing the lower casing corresponding to the upper casing; and h) applying a semi-finished product through the step g) Filling and a degassing sealing process.
為了達成上述之目的,本發明係提供一種熱管和均溫板組接結構,包括一均溫板、一熱管、一多孔性燒結組織及一工作流體,該均溫板包括一下殼體和對應該下殼體封合連接的一上殼體,在該上殼體和該下殼體之間形成有一容腔,該上殼體設有一穿孔及自該穿孔周緣延伸而出的一環牆;該熱管具有一開口,該熱管以該開口對應該環牆立設並與該穿孔連通,在該熱管靠近該開口的位置成形有一止擋部;該多孔性燒結組織形成在該穿孔至該止擋部之間;該工作流體填注在該容腔內。 In order to achieve the above object, the present invention provides a heat pipe and a temperature equalizing plate assembly structure, comprising a temperature equalizing plate, a heat pipe, a porous sintered structure and a working fluid, the temperature equalizing plate comprising a lower casing and a pair An upper casing sealingly connected to the lower casing, a cavity formed between the upper casing and the lower casing, the upper casing being provided with a perforation and a ring wall extending from the periphery of the perforation; The heat pipe has an opening, the heat pipe is erected corresponding to the ring wall and communicates with the through hole, and a stop portion is formed at a position of the heat pipe near the opening; the porous sintered structure is formed in the through hole to the stop portion Between; the working fluid is filled in the cavity.
本發明還具有以下功效,利用多孔性燒結組織連接第一毛細組織和第二毛細組織,進而能夠達成內部工作流體的良好循環效果。 The present invention also has the effect of connecting the first capillary structure and the second capillary structure by the porous sintered structure, thereby achieving a good circulation effect of the internal working fluid.
10‧‧‧均溫板 10‧‧‧Wall plate
11a‧‧‧金屬板 11a‧‧‧Metal sheet
11‧‧‧上殼體 11‧‧‧Upper casing
111‧‧‧穿孔 111‧‧‧Perforation
112‧‧‧環牆 112‧‧‧Circle wall
12‧‧‧下殼體 12‧‧‧ Lower case
13‧‧‧第一毛細組織 13‧‧‧First capillary tissue
14‧‧‧第三毛細組織 14‧‧‧ Third capillary tissue
A‧‧‧容腔 A‧‧‧ cavity
20‧‧‧熱管 20‧‧‧heat pipe
21‧‧‧開口端 21‧‧‧Open end
211‧‧‧開口 211‧‧‧ openings
22‧‧‧封閉端 22‧‧‧closed end
23‧‧‧第二毛細組織 23‧‧‧Second capillary tissue
24、24a、24b‧‧‧止擋部 24, 24a, 24b‧‧‧ stop
30‧‧‧多孔性燒結組織 30‧‧‧Porous sintered structure
40‧‧‧工作流體 40‧‧‧Working fluid
8‧‧‧芯棒 8‧‧‧ mandrel
9‧‧‧金屬粉末 9‧‧‧Metal powder
a~h‧‧‧步驟 a~h‧‧‧step
圖1係本發明之方法流程圖。 Figure 1 is a flow chart of the method of the present invention.
圖2係本發明之金屬板剖視圖。 Figure 2 is a cross-sectional view of a metal plate of the present invention.
圖3係本發明之金屬板經成形加工後剖視圖。 Figure 3 is a cross-sectional view showing the metal sheet of the present invention after being formed.
圖4係本發明之熱管經成形加工後剖視圖。 Figure 4 is a cross-sectional view showing the heat pipe of the present invention after forming.
圖5係本發明之金屬板、熱管和芯棒組合剖視圖。 Figure 5 is a cross-sectional view showing a combination of a metal plate, a heat pipe and a mandrel of the present invention.
圖6係本發明之金屬粉末填入穿孔及金屬板的內壁剖視圖。 Figure 6 is a cross-sectional view showing the inner wall of the metal powder of the present invention filled with perforations and metal sheets.
圖7係本發明之上殼體和下上殼體組合剖視圖。 Figure 7 is a cross-sectional view showing the upper housing and the lower upper housing of the present invention.
圖8係本發明之另一實施例組合剖視圖。 Figure 8 is a cross-sectional view showing another embodiment of the present invention.
圖9係本發明之熱管之另一實施例外觀圖。 Figure 9 is an external view of another embodiment of the heat pipe of the present invention.
圖10係本發明之熱管之又一實施例剖視圖。 Figure 10 is a cross-sectional view showing still another embodiment of the heat pipe of the present invention.
有關本發明之詳細說明及技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。 The detailed description and technical content of the present invention are set forth in the accompanying drawings.
請參閱圖1至圖7所示,本發明提供一種熱管和均溫板組接方法,其方法步驟包括: Referring to FIG. 1 to FIG. 7 , the present invention provides a method for assembling a heat pipe and a temperature equalizing plate, and the method steps thereof include:
a)備一金屬板11a,對金屬板11a加工形成有一穿孔111及一環牆112;請參閱圖2及圖3所示,在此步驟中的金屬板11a可為鋁、銅或其合金所製成,以一成型模具(圖未示出)對金屬板11a進行沖孔和延伸的加工製程,以在金屬板11a上形成有複數穿孔111和分別自各穿孔111周緣延伸而出的一環牆112,穿孔111的數量可依實際需求來進行選用,對於微型散熱器亦可以單一穿孔111來進行設置。 a) preparing a metal plate 11a, forming a through hole 111 and a ring wall 112 for the metal plate 11a; as shown in FIG. 2 and FIG. 3, the metal plate 11a in this step may be made of aluminum, copper or an alloy thereof. Forming a punching and extending process for the metal plate 11a by a molding die (not shown) to form a plurality of through holes 111 and a ring wall 112 extending from the periphery of each of the through holes 111, respectively, on the metal plate 11a. The number of perforations 111 can be selected according to actual needs, and the micro heat sink can also be set by a single through hole 111.
b)備一熱管20,熱管20具有一開口211,對熱管20加工形成有一止擋部24;請參閱圖4所示,步驟b)可在步驟a)之前或之後施行,此步驟中的熱管20可以是鋁、銅或其合金所製成,其具有一開口端21和遠離開口端21的一封閉端22,開口端21具有一開口211,此熱管20的內部佈設有一第二毛細組織23,此第二毛細組織23可為一金屬編織網、多孔性粉末燒結物或槽溝。以一 成型治具(圖未示出)在熱管20的開口端21靠近開口211的位置成形有一止擋部24,此止擋部24的位置與開口端21的端邊相距約在0.5~10mm之間,本實施例的止擋部24為一環形凹槽。 b) a heat pipe 20 is provided, the heat pipe 20 has an opening 211, and the heat pipe 20 is processed to form a stop portion 24; as shown in FIG. 4, step b) can be performed before or after step a), the heat pipe in this step 20 may be made of aluminum, copper or an alloy thereof, and has an open end 21 and a closed end 22 away from the open end 21, the open end 21 has an opening 211, and the inside of the heat pipe 20 is provided with a second capillary structure 23 The second capillary structure 23 can be a metal woven mesh, a porous powder sinter or a groove. In a A forming fixture (not shown) is formed with a stop portion 24 at a position near the opening 211 of the open end 21 of the heat pipe 20. The position of the stop portion 24 is between 0.5 and 10 mm from the end of the open end 21. The stop portion 24 of this embodiment is an annular groove.
c)將熱管20對應於環牆112立設,從而使開口211與穿孔11連通;請參閱圖5所示,此步驟是在熱管20的開口端21外周壁塗覆一黏著劑(如錫膏,圖未示出)後,再將熱管20的開口端21對應於環牆112穿接,從而使開口211與穿孔111相互連通,此實施例的開口端21是容置在環牆112內部。 c) the heat pipe 20 is erected corresponding to the ring wall 112, so that the opening 211 is in communication with the through hole 11; as shown in FIG. 5, this step is to apply an adhesive (such as solder paste) to the outer peripheral wall of the open end 21 of the heat pipe 20. After the figure is not shown, the open end 21 of the heat pipe 20 is connected to the ring wall 112 so that the opening 211 and the through hole 111 communicate with each other. The open end 21 of this embodiment is housed inside the ring wall 112.
d)將一芯棒8從穿孔111插入並被止擋部24所阻擋;請參閱圖5所示,此步驟是將一芯棒8從穿孔111及熱管20的開口端21插入開口211內並被前述止擋部24所阻擋而定位。 d) inserting a mandrel 8 from the perforation 111 and being blocked by the stopper 24; as shown in FIG. 5, this step is to insert a mandrel 8 from the perforation 111 and the open end 21 of the heat pipe 20 into the opening 211 and Positioned by the aforementioned stop portion 24.
e)將一金屬粉末9從穿孔111填入從而形成在芯棒8外周圍;請參閱圖6所示,此步驟是將一金屬粉末9從穿孔111填入從而形成在芯棒8外周圍和熱管20的開口端21內壁之間,同時亦可在金屬板10的內壁灑上前述的金屬粉末9,藉以製作成一第一毛細組織13,此第一毛細組織13為一多孔性粉末燒結物。 e) a metal powder 9 is filled from the perforations 111 to be formed around the outer periphery of the mandrel 8; as shown in Fig. 6, this step is to fill a metal powder 9 from the perforations 111 to form around the outer periphery of the mandrel 8 and The metal powder 9 may be sprinkled between the inner walls of the open end 21 of the heat pipe 20 and the inner wall of the metal plate 10 to form a first capillary structure 13, which is a porous powder. Sintered material.
f)對經步驟e)的半成品進行一燒結加工,從而在穿孔111至止擋部24之間形成有一多孔性燒結組織30,並構成一上殼體11;請參閱圖6所示,此步驟是將已進行前述填入金屬粉末9和灑上金屬粉末9的半成品,送入一加熱設備(圖未示出)進行一燒結加工,完成燒結加工後必須將芯棒8移除,從而在穿孔111的周圍至止擋部24之間形成有一多孔性燒結組織30(如圖7所示),並構成一上殼體11,完成此製程後的多孔性燒結組織30是連接第一毛細組織13和第二毛細組織23。 f) performing a sintering process on the semi-finished product of step e) to form a porous sintered structure 30 between the perforations 111 and the stoppers 24, and forming an upper casing 11; see FIG. The semi-finished product which has been filled with the metal powder 9 and sprinkled with the metal powder 9 is sent to a heating device (not shown) for sintering, and the mandrel 8 must be removed after the sintering process, thereby perforating A porous sintered structure 30 (shown in FIG. 7) is formed between the periphery of the 111 and the stopper portion 24, and constitutes an upper casing 11, and the porous sintered structure 30 after the completion of the process is connected to the first capillary structure 13 And a second capillary structure 23.
g)備一下殼體12,將下殼體12對應上殼體11封合連接;請參閱圖7所示,在此步驟中下殼體12已預先加工形成有一空腔和佈設在空腔內部的一第三毛細組織14,此第三毛細組織14可為金屬編織網、多孔性粉末燒結物或槽溝等,將此下殼體12對應於前述上殼體11進行焊接封合,從而在上殼體11和下殼體12之間形成有一容腔A。 g) preparing the housing 12, and sealing the lower housing 12 corresponding to the upper housing 11; as shown in FIG. 7, in this step, the lower housing 12 has been pre-machined to form a cavity and disposed inside the cavity. a third capillary structure 14, the third capillary structure 14 may be a metal woven mesh, a porous powder sinter or a groove, etc., and the lower casing 12 is welded and sealed corresponding to the upper casing 11 so that A cavity A is formed between the upper casing 11 and the lower casing 12.
h)對經步驟g)的半成品施以一填液和一除氣封口製程。請參閱圖7所示,在此步驟是將水等液體,透過一輸液除氣管(圖未示出)將一工作流體40填入腔室A內,並進行除氣、封口等加工步驟,進而完成製作。 h) applying a liquid filling and a degassing sealing process to the semi-finished product of step g). Referring to FIG. 7, in this step, a liquid such as water is filled into the chamber A through an infusion degassing tube (not shown), and a processing step such as degassing and sealing is performed. Finish the production.
請再參閱圖7所示,本發明提供一種熱管和均溫板組接結構,包括一均溫板(Vapor Chamber)10、一熱管(Heat Pipe)20、一多孔性燒結組織30及一工作流體40,均溫板10包括一下殼體12和對應下殼體12封合連接的一上殼體11,在上殼體11和下殼體12之間形成有一容腔A,於容腔A內部佈設有一第一毛細組織13,上殼體11設有一穿孔111及自穿孔111周緣延伸而出的一環牆112;熱管20具有一開口211及內部佈設有一第二毛細組織23,熱管20以開口211對應環牆112立設並與穿孔111連通,在熱管20靠近開口211的位置成形有一止擋部24;多孔性燒結組織30形成在穿孔111至止擋部24之間並且連接第一毛細組織13和第二毛細組織23;工作流體40填注在容腔A內。 Referring to FIG. 7 again, the present invention provides a heat pipe and a uniform temperature plate assembly structure, including a Vapor Chamber 10, a Heat Pipe 20, a porous sintered structure 30, and a work. The fluid 40, the temperature equalizing plate 10 includes a lower casing 12 and an upper casing 11 correspondingly connected to the lower casing 12, and a cavity A is formed between the upper casing 11 and the lower casing 12 in the cavity A. The inner casing 11 is provided with a first capillary structure 13 , and the upper casing 11 is provided with a through hole 111 and a ring wall 112 extending from the periphery of the through hole 111 . The heat pipe 20 has an opening 211 and a second capillary structure 23 is disposed therein, and the heat pipe 20 is opened. 211 corresponding to the annular wall 112 is erected and communicates with the through hole 111, and a stop portion 24 is formed at a position of the heat pipe 20 near the opening 211; the porous sintered structure 30 is formed between the through hole 111 and the stopper portion 24 and connects the first capillary structure 13 and second capillary structure 23; the working fluid 40 is filled in the cavity A.
使用時液態的工作流體40受熱後將產生蒸發而生成為氣態的工作流體40,此氣態的工作流體40將攜帶大量的熱量朝向各熱管20的開口211處流動,並且到達熱管20的封閉端22,此等氣態的工作流體40在透過熱管20與多數散熱片(圖未示出)的接觸散逸後,將被冷凝為液態的工作流體40並且依序經過第二毛細組織23、多孔性燒結組織30及第一毛細組織13而回流至容腔A 內,由於第一毛細組織13和第二毛細組織23是透過多孔性燒結組織30連接,藉以形成一連續性回流路徑進而能夠增加液體的回流速度。 When in use, the liquid working fluid 40, upon heating, will evaporate to form a gaseous working fluid 40 that will carry a significant amount of heat toward the opening 211 of each heat pipe 20 and to the closed end 22 of the heat pipe 20. The gaseous working fluid 40 will be condensed into a liquid working fluid 40 and sequentially passed through the second capillary structure 23, porous sintered structure after being dissipated through the heat pipe 20 in contact with a plurality of fins (not shown). 30 and the first capillary structure 13 and returned to the cavity A Since the first capillary structure 13 and the second capillary structure 23 are connected through the porous sintered structure 30, a continuous reflux path is formed to increase the reflux speed of the liquid.
請參閱圖8所示,本發明之熱管和均溫板組接結構除了可以如前述實施例外,亦可在環牆112的外周壁塗覆一黏著劑後,再將熱管20的開口端21對應於環牆112套接,從而使開口211與穿孔111相互連通,此實施例的環牆112是容置在開口端21內部。 Referring to FIG. 8 , in addition to the foregoing embodiment, the heat pipe and the temperature equalizing plate assembly structure of the present invention may be coated with an adhesive on the outer peripheral wall of the annular wall 112, and then the open end 21 of the heat pipe 20 is correspondingly The ring wall 112 is sleeved so that the opening 211 and the through hole 111 communicate with each other. The ring wall 112 of this embodiment is housed inside the open end 21.
請參閱圖9所示,本實施例的熱管與前述實施例的熱管差異在於其止擋部,本實施例的止擋部24a為在熱管20的開口端21靠近開口211位置沖設有複數凹坑,藉以作為前述芯棒8插入後的阻擋之作用。 Referring to FIG. 9, the heat pipe of the present embodiment is different from the heat pipe of the foregoing embodiment in the stop portion. The stop portion 24a of the embodiment is provided with a plurality of recesses at the open end 21 of the heat pipe 20 near the opening 211. The pit serves as a barrier to the insertion of the aforementioned core rod 8.
請參閱圖10所示,本實施例的止擋部24b為在熱管20的開口端21靠近開口211內壁直接成形有一內擋環,藉以作為前述芯棒8插入後的阻擋之作用。 Referring to FIG. 10, the stopper portion 24b of the present embodiment directly forms an inner retaining ring near the inner wall of the opening 211 at the open end 21 of the heat pipe 20, thereby acting as a barrier after the insertion of the mandrel bar 8.
綜上所述,本發明之熱管和均溫板組接結構及其方法,確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合發明專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障發明人之權利。 In summary, the heat pipe and the uniform temperature plate assembly structure and the method thereof can achieve the intended use purpose, and solve the lack of the prior art, and because of the novelty and the progressiveness, fully meet the requirements of the invention patent application. In accordance with the Patent Law, please apply for the patent in detail, so as to protect the rights of the inventor.
10‧‧‧均溫板 10‧‧‧Wall plate
11a‧‧‧金屬板 11a‧‧‧Metal sheet
11‧‧‧上殼體 11‧‧‧Upper casing
111‧‧‧穿孔 111‧‧‧Perforation
112‧‧‧環牆 112‧‧‧Circle wall
12‧‧‧下殼體 12‧‧‧ Lower case
13‧‧‧第一毛細組織 13‧‧‧First capillary tissue
14‧‧‧第三毛細組織 14‧‧‧ Third capillary tissue
A‧‧‧容腔 A‧‧‧ cavity
20‧‧‧熱管 20‧‧‧heat pipe
21‧‧‧開口端 21‧‧‧Open end
211‧‧‧開口 211‧‧‧ openings
22‧‧‧封閉端 22‧‧‧closed end
23‧‧‧第二毛細組織 23‧‧‧Second capillary tissue
24‧‧‧止擋部 24‧‧‧stop
30‧‧‧多孔性燒結組織 30‧‧‧Porous sintered structure
40‧‧‧工作流體 40‧‧‧Working fluid
Claims (13)
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TW105105970A TWI601931B (en) | 2016-02-26 | 2016-02-26 | Heat and vapor chamber connecting structure and method thereof |
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TW105105970A TWI601931B (en) | 2016-02-26 | 2016-02-26 | Heat and vapor chamber connecting structure and method thereof |
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TW201730496A TW201730496A (en) | 2017-09-01 |
TWI601931B true TWI601931B (en) | 2017-10-11 |
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TWI690684B (en) * | 2019-01-31 | 2020-04-11 | 雙鴻科技股份有限公司 | Vapor chamber and heat dissipation device having the same |
TW202420521A (en) * | 2022-11-08 | 2024-05-16 | 大陸商廣州力及熱管理科技有限公司 | An integrated circuit device with thermal dissipating package |
TWI831706B (en) * | 2023-06-13 | 2024-02-01 | 大陸商奇宏電子(深圳)有限公司 | Heating jig |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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TW200840986A (en) * | 2007-04-02 | 2008-10-16 | Neobulb Technologies Inc | Heat pipe and making thereof |
US7472479B2 (en) * | 2005-08-12 | 2009-01-06 | Foxconn Technology Co., Ltd. | Heat pipe and method of producing the same |
WO2014107939A1 (en) * | 2013-01-14 | 2014-07-17 | 深圳市万景华科技有限公司 | Vertical type heat conduction structure and manufacturing method therefor |
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Patent Citations (3)
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US7472479B2 (en) * | 2005-08-12 | 2009-01-06 | Foxconn Technology Co., Ltd. | Heat pipe and method of producing the same |
TW200840986A (en) * | 2007-04-02 | 2008-10-16 | Neobulb Technologies Inc | Heat pipe and making thereof |
WO2014107939A1 (en) * | 2013-01-14 | 2014-07-17 | 深圳市万景华科技有限公司 | Vertical type heat conduction structure and manufacturing method therefor |
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