CN110779367A - Manufacturing method of soaking plate without water filling port - Google Patents
Manufacturing method of soaking plate without water filling port Download PDFInfo
- Publication number
- CN110779367A CN110779367A CN201910981891.6A CN201910981891A CN110779367A CN 110779367 A CN110779367 A CN 110779367A CN 201910981891 A CN201910981891 A CN 201910981891A CN 110779367 A CN110779367 A CN 110779367A
- Authority
- CN
- China
- Prior art keywords
- water filling
- soaking plate
- water injection
- water
- filling port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0283—Means for filling or sealing heat pipes
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a manufacturing method of a vapor chamber without a water filling port, which comprises the steps of processing an upper cover and a lower cover of the vapor chamber with a water filling port structure, wherein the water filling port structure is positioned at the corresponding position of the edge of the upper cover and the edge of the lower cover; the upper cover and the lower cover are buckled, and a water injection pipe is arranged at the water injection port structure; plugging the water injection pipe after liquid injection; and cutting off the water injection port structure along the outer side of the buckled edge of the upper cover and the lower cover, and sealing the cut part. The invention can process the soaking plate structure without water filling port, which can greatly reduce the occupation of the soaking plate in the inner space of the electronic product.
Description
Technical Field
The invention relates to the technical field of soaking plate processing, in particular to a manufacturing method for processing and forming a soaking plate without a water filling port in appearance.
Background
In the 5G era, electronic devices have been developed in the trends of integration, high frequency, high speed, etc., and the development of internal electronic chip technology has led to an increasing reduction in size and an increase in power. As semiconductor dimensions shrink, heat flux increases. The heat dissipation challenge of electronic products is becoming more serious. Heat pipes and vapor chambers, which are devices that dissipate heat by the phase change principle, are being rapidly applied to electronic products, such as high-end smart phones, LEDs, and the like.
Vapor chambers are accelerating for 5G smart phones. However, the soaking plate is limited to the current processing technology of the soaking plate, and the refrigerant medium needs to be injected in the manufacturing process of the soaking plate, so that the appearance of the soaking plate product is all provided with a water injection port. The structure wastes space especially under the condition that the internal space of the electronic product is tightened, and cannot play a due role. Patent CN 107830757A discloses a product design without a water filling port, but the thickness of the soaking plate processed and formed by the method is in the range of 3mm-5mm, and the method cannot be applied to electronic products, and the processing technology of drilling a water filling port and then sealing the water filling port in the technical scheme cannot be applied to the processing technology of the existing ultrathin soaking plate.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a forming method of an ultrathin soaking plate without a water filling port in appearance, which is used for eliminating the structure of the water filling port in the appearance of a product, and specifically provides the following technical scheme:
the manufacturing method of the soaking plate without the water filling port is characterized by comprising the following steps of:
processing an upper cover and a lower cover of a soaking plate with a water injection port structure, wherein the water injection port structure is positioned at the corresponding position of the edge of the upper cover and the edge of the lower cover;
after the capillary structure is placed, the upper cover and the lower cover are buckled, the edges are aligned and sealed, and a water injection pipe is arranged at the structure of a water injection port;
injecting liquid into a cavity formed by buckling an upper cover and a lower cover through a water injection pipe;
plugging the water injection pipe;
and cutting off the water injection port structure along the outer side of the buckled edge of the upper cover and the lower cover, and sealing the cut part.
Further, the water injection port structure is positioned on the side edges or the corners of the upper cover and the lower cover.
Furthermore, the capillary structure is laid, glued, welded and sintered.
Furthermore, the water injection pipe is inserted into the water injection port structure or is formed by integrally molding and processing the surface of the water injection port structure.
Furthermore, the diameter of the water injection pipe is smaller than or equal to the thickness of the soaking plate.
Furthermore, the plugging of the water injection pipe adopts a mode of applying pressure to a part of the water injection pipe or injecting a plugging agent; the pressure is applied by stamping; the plugging agent is polyurethane, acrylate, water glass, epoxy resin or urea resin.
Further, the cut part is sealed by welding, and the welding is cold welding or laser welding or a combination thereof.
The invention has the beneficial effects that:
the invention adopts the processing mode of firstly plugging the water injection pipe and then cutting off and sealing, realizes the purpose that the appearance of the finished product has no water injection port, is more beneficial to the improvement of the heat dissipation efficiency of the electronic product and is beneficial to the full utilization of the internal space of the electronic product; after the liquid injection, the mode of stamping or injecting a plugging agent is adopted, so that the operation difficulty is low, and the processing is convenient; the soaking plate water injection port is processed by adopting a cold welding and non-contact welding mode, so that the cut-off part can be fully sealed.
Drawings
FIG. 1 is a schematic view of a vapor chamber without a water filling port according to a first embodiment of the present invention;
FIG. 2 is a schematic view of a soaking plate without water filling holes according to a second embodiment of the present invention;
FIG. 3 is a schematic view of a vapor chamber without a water filling port according to a third embodiment of the present invention;
fig. 4 is a diagram illustrating a fourth embodiment of the method for manufacturing a soaking plate without a water filling port according to the present invention.
Wherein the reference numerals are as follows:
Upper cover water filling nozzle structure 11 and lower cover water filling structure 21
Capillary structure 3
Bushing arrangement 5
Plugging agent 6
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the detailed description and specific examples, while indicating some embodiments of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1-4 schematically illustrate various embodiments of a method of making a water injection port-less vapor chamber of the present invention.
Fig. 1 schematically shows a first embodiment of a fabrication method of a soaking plate without a water filling port according to the present invention, the soaking plate includes an upper cover 1 and a lower cover 2, an internal cavity is formed between the upper cover 1 and the lower cover 2 after the upper cover 1 and the lower cover 2 are fastened to accommodate a working fluid for heat transfer, and an upper cover water filling port structure 11 and a lower cover water filling structure 21 are integrally formed at corresponding positions on the edge of the upper cover 1 and the edge of the lower cover 2 respectively; a capillary structure 3 is arranged on the inner surface of the lower cover 2; the upper cover 1 is buckled with the lower cover 2, and the upper cover water injection structure 11 and the lower cover water injection structure 21 are opposite up and down to form a water injection pipe 4. After the edges of the upper cover 1 and the lower cover 2 are sealed, the water is injected into a cavity formed by buckling the upper cover and the lower cover through a water injection pipe 4; after the cavity is filled with the working fluid, pressure is applied to the position of the water injection pipe 4 in a stamping mode to form plugging, and the working fluid is blocked from flowing out; the water injection port structure is cut off along the outer side of the edge where the upper cover 1 and the lower cover 2 are buckled, the cut-off part is sealed in a cold welding mode, laser melting welding is carried out in situ, and the sealing effect is further strengthened.
Fig. 2 schematically shows a second embodiment of the method for manufacturing a soaking plate without a water filling port according to the present invention, and unlike the first embodiment, the upper cap water filling port structure 11 and the lower cap water filling port structure 21 are integrally formed at corresponding positions of corners of the edge of the upper cap 1 and the edge of the lower cap 2.
Fig. 3 schematically shows a third embodiment of the method for manufacturing a soaking plate without a water filling port according to the present invention, which is different from the first and second embodiments, in this embodiment, the upper cover water filling port structure 11 and the lower cover water filling structure 21 form a sleeve structure 5 after being fastened and are communicated with an internal cavity formed after being fastened, and the water filling pipe 4' is a pipe having an outer diameter smaller than an inner diameter of the sleeve structure, is inserted into the sleeve structure 5 formed after the upper cover water filling port structure 11 and the lower cover water filling structure 21 are fastened in an inserting manner, and is communicated with the cavity formed by the upper cover 1 and the lower cover 2. After the edges of the upper cover 1 and the lower cover 2 are sealed, working fluid is injected into a cavity formed by the upper cover and the lower cover after being buckled through the water injection pipe 4'.
Fig. 4 schematically shows a fourth embodiment of the method for manufacturing a soaking plate without a water filling port according to the present invention, which is different from the first, second, and third embodiments in that after the cavity is filled with the working fluid, the working fluid is switched to be a plugging agent fluid, a plugging agent 6 is filled into the water filling pipe 4' until the liquid level of the plugging agent exceeds the edge of the buckling, the plugging agent 6 is epoxy resin, and the switching can be realized by a valve or other switching control methods in the prior art. After the plugging agent 6 is solidified in the water injection pipe 4', cutting off the water injection port structure along the outer side of the edge where the upper cover 1 and the lower cover 2 are buckled, sealing the cut-off part in a cold welding mode, and carrying out laser fusion welding in situ to further strengthen the sealing effect.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "both ends", "both sides", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the elements referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus, are not to be construed as limiting the present invention.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.
Claims (8)
1. The manufacturing method of the soaking plate without the water filling port is characterized by comprising the following steps of:
processing an upper cover and a lower cover of a soaking plate with a water injection port structure, wherein the water injection port structure is positioned at the corresponding position of the edge of the upper cover and the edge of the lower cover;
after the capillary structure is placed, the upper cover and the lower cover are buckled, the edges are aligned and sealed, and a water injection pipe is arranged at the structure of a water injection port;
injecting liquid into a cavity formed by buckling an upper cover and a lower cover through a water injection pipe;
plugging the water injection pipe;
and cutting off the water injection port structure along the outer side of the buckled edge of the upper cover and the lower cover, and sealing the cut part.
2. The method for manufacturing a soaking plate without a water filling port according to claim 1, wherein the plugging of the water filling pipe is performed by applying pressure to a part of the water filling pipe; the applied pressure is a punch.
3. The method for manufacturing the soaking plate without the water filling port according to claim 1, wherein the plugging of the water filling pipe is performed by injecting a plugging agent into a part of the water filling pipe; the blocking agent is one of polyurethane, acrylate, water glass, epoxy resin and urea resin.
4. The fabrication method of the soaking plate without the water injection hole according to any one of claims 1 to 3, wherein the water injection hole structure is located at the side edges or the corners of the upper cover and the lower cover.
5. The method for manufacturing the soaking plate without the water filling port according to any one of claims 1 to 3, wherein the placing capillary structure adopts the modes of laying, gluing, welding and sintering.
6. The method for manufacturing a soaking plate without a water filling port according to any one of claims 1 to 3, wherein the water filling pipe is inserted into the water filling port structure or is integrally formed and processed on the surface of the water filling port structure.
7. The method for manufacturing a soaking plate without a water filling port according to claim 6, wherein the diameter of the water filling pipe is smaller than or equal to the thickness of the soaking plate.
8. The method for manufacturing the soaking plate without the water injection port according to any one of claims 1 to 3, wherein the cut part is sealed by welding, and the welding is cold welding or laser welding or a combination thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910981891.6A CN110779367B (en) | 2019-10-16 | 2019-10-16 | Manufacturing method of soaking plate without water filling port |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910981891.6A CN110779367B (en) | 2019-10-16 | 2019-10-16 | Manufacturing method of soaking plate without water filling port |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110779367A true CN110779367A (en) | 2020-02-11 |
| CN110779367B CN110779367B (en) | 2021-01-15 |
Family
ID=69385537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910981891.6A Active CN110779367B (en) | 2019-10-16 | 2019-10-16 | Manufacturing method of soaking plate without water filling port |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110779367B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202014433U (en) * | 2011-03-18 | 2011-10-19 | 索士亚科技股份有限公司 | Isothermal vapor chamber with seal |
| CN105318756A (en) * | 2014-07-22 | 2016-02-10 | 苏州泰硕电子有限公司 | Ultrathin uniform temperature plate and manufacturing method thereof |
| CN105352352A (en) * | 2015-11-18 | 2016-02-24 | 上海利正卫星应用技术有限公司 | Ultra-thin even-temperature plate device and manufacturing method thereof |
| CN106225532A (en) * | 2016-07-29 | 2016-12-14 | 苏州聚力电机有限公司 | A kind of mouth-sealing method of temperature-uniforming plate |
| CN108302968A (en) * | 2018-02-23 | 2018-07-20 | 奇鋐科技股份有限公司 | Temperature-uniforming plate water filling portion's edge sealing structure and its manufacturing method |
| CN109870054A (en) * | 2017-12-04 | 2019-06-11 | 泰硕电子股份有限公司 | Without gas removing pipe samming board fabrication method |
| CN110285699A (en) * | 2019-07-26 | 2019-09-27 | 联德精密材料（中国）股份有限公司 | A kind of compound temperature-uniforming plate and its manufacturing method |
-
2019
- 2019-10-16 CN CN201910981891.6A patent/CN110779367B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202014433U (en) * | 2011-03-18 | 2011-10-19 | 索士亚科技股份有限公司 | Isothermal vapor chamber with seal |
| CN105318756A (en) * | 2014-07-22 | 2016-02-10 | 苏州泰硕电子有限公司 | Ultrathin uniform temperature plate and manufacturing method thereof |
| CN105352352A (en) * | 2015-11-18 | 2016-02-24 | 上海利正卫星应用技术有限公司 | Ultra-thin even-temperature plate device and manufacturing method thereof |
| CN106225532A (en) * | 2016-07-29 | 2016-12-14 | 苏州聚力电机有限公司 | A kind of mouth-sealing method of temperature-uniforming plate |
| CN109870054A (en) * | 2017-12-04 | 2019-06-11 | 泰硕电子股份有限公司 | Without gas removing pipe samming board fabrication method |
| CN108302968A (en) * | 2018-02-23 | 2018-07-20 | 奇鋐科技股份有限公司 | Temperature-uniforming plate water filling portion's edge sealing structure and its manufacturing method |
| CN110285699A (en) * | 2019-07-26 | 2019-09-27 | 联德精密材料（中国）股份有限公司 | A kind of compound temperature-uniforming plate and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110779367B (en) | 2021-01-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103000595B (en) | A kind of multidirectional turnover phase change heat-transfer device and preparation method thereof | |
| CN106298695A (en) | Encapsulation module, encapsulation module stacked structure and preparation method thereof | |
| CN110779367B (en) | Manufacturing method of soaking plate without water filling port | |
| CN103692590B (en) | A kind of transformer shell glue-pouring device and use the method for this device encapsulating | |
| CN103956347B (en) | A kind of 3D encapsulates chip | |
| CN103857252A (en) | Superslim gearbox control module | |
| CN113276348B (en) | Injection mold and injection molding method | |
| CN102394229A (en) | Plate radiator | |
| CN104961093A (en) | Method using low-melting-point alloy for sealing micro heat pipe filling hole | |
| CN204167286U (en) | A kind of big current diode chip encapsulating structure | |
| JP2014109401A (en) | Heat pipe and its manufacturing method | |
| CN206864451U (en) | A kind of anticracking notching construction of two-sided copper foil package substrate | |
| CN107808879A (en) | A kind of Switching Power Supply module and its method for packing | |
| CN103115163B (en) | A kind of ball valve core and production method thereof | |
| CN206595245U (en) | A kind of multitower diode (led) module | |
| CN203967068U (en) | Be applicable to the heat abstractor of heater members | |
| CN207558775U (en) | A kind of eutectic sintering fixture for being used to implement microwave hybrid circuit high-precision load | |
| CN205231041U (en) | Electronic packaging shell is heat sink to weld bear building -up structure | |
| CN206505376U (en) | A kind of shell mechanism of oil immersion server | |
| CN203584604U (en) | Three junction surface sealing structure of engine cylinder block | |
| CN203826363U (en) | Novel 3D packaged chip | |
| CN208589438U (en) | A kind of power supply mould group | |
| CN207782070U (en) | A kind of soft copper bar structure | |
| CN202196774U (en) | Plastic packaged power diode with welded metal pad | |
| CN203659843U (en) | Double-tabletop silicon controlled rectifier (SCR) device packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |