TW201423019A - Vapor chamber and method of manufacturing the same - Google Patents

Abstract

A method of manufacturing a vapor chamber includes steps of: attaching a first edge of a first metal cover plate to a second edge of a second metal cover plate; placing the first metal cover plate and the second metal cover plate on a die after attachment; and using a punch head to punch the first edge and the second edge in a direction toward the die so as to seal the first edge and the second edge completely.

Description

Temperature equalizing plate and manufacturing method thereof

The invention relates to a temperature equalizing plate and a manufacturing method thereof, in particular to a temperature equalizing plate which forms a sealed state of an edge of a two metal cover plate by a stamping process and a manufacturing method thereof.

The working principle of the uniform temperature plate is operated by the evaporation condensation cycle of the working fluid enclosed in the plate-shaped cavity, so that it has the characteristics of rapid average temperature, thereby having the functions of rapid heat conduction and heat diffusion. In general, the uniform temperature plate is made of a metal casing, a capillary structure, and a working fluid through annealing, vacuuming, and sealing. However, compared with the heat pipe, the disadvantage of the conventional temperature plate is mainly reflected in the high unit price derived from its high manufacturing cost, and its high manufacturing cost mainly comes from the sealing technology of the metal casing. Therefore, how to reduce the manufacturing cost of the metal shell sealing welding of the uniform temperature plate has become one of the main research topics of the current uniform temperature plate.

The invention provides a temperature equalizing plate and a manufacturing method thereof, which use the stamping process to form a sealed state of the edge of the two metal cover plates to solve the above problems.

According to an embodiment of the present invention, a method for manufacturing a temperature equalizing plate includes: bonding a first edge of a first metal cover to a second edge of a second metal cover; a metal cover plate and the second metal cover plate are placed on a die; and the first edge and the second edge are punched toward the die in a punch to make the first edge Forming a sealed state with the second edge.

According to another embodiment, the temperature equalization plate of the present invention comprises a first metal cover, a second metal cover, a capillary structure, and a working fluid. The first edge of one of the first metal cover plates and the second edge of one of the second metal cover plates are sealed by a stamping process in the above manufacturing method. The capillary structure is formed between the first metal cover and the second metal cover. The working fluid is disposed between the first metal cover and the second metal cover.

In summary, the present invention utilizes a stamping process to form a sealed state of the edges of the two metal cover plates of the temperature equalization plate. The process is simple, and the manufacturing efficiency of the temperature equalizing plate can be effectively improved, thereby reducing the manufacturing cost.

The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.

Please refer to FIG. 1 to FIG. 4 , FIG. 1 is a flow chart of a method for manufacturing a temperature equalizing plate according to a first embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view of a temperature equalizing plate 1 before pressing, FIG. 3 . It is a schematic cross-sectional view of the temperature equalizing plate 1 after punching, and FIG. 4 is a microscopic structural view of the first edge 100 and the second edge 120 of the uniformly heated plate 1 after pressing.

First, a step S10 is performed to form a capillary structure 14 between the first metal cover 10 and the second metal cover 12, wherein the capillary structure 14 can be a grooved capillary structure. The porous capillary structure, the network capillary structure, the powder sintered capillary structure or the composite capillary structure depends on the practical application. It should be noted that the composite capillary structure described above may be composed of at least two capillary structures of a grooved capillary structure, a porous capillary structure, a network capillary structure and a powder sintered capillary structure. Then, in step S12, the first edge 100 of the first metal cover 10 is attached to the second edge 120 of the second metal cover 12, and the first metal cover 10 and the second metal cover 12 are A plurality of support columns 16 are disposed to support the first metal cover 10 and the second metal cover 12, thereby avoiding problems such as depression or bulging of the first metal cover 10 and the second metal cover 12.

Next, step S14 is performed to place the bonded first metal cover 10 and the second metal cover 12 on a die 30. Next, step S16 is performed to punch the first edge 100 and the second edge 120 with a punch 32 in the direction of the die 30 (in the direction indicated by the arrow A in FIG. 3) so that the first edge 100 and the second edge The edge 120 forms a sealed state. In this embodiment, the first metal cover 10 and the second metal cover 12 may be made of soft metal such as copper or aluminum, but not limited thereto. After the first edge 100 and the second edge 120 are stamped with a suitable force, the metal grain boundaries of the first edge 100 and the second edge 120 may be broken and then recombined, so that the first edge 100 and the second edge 120 form a seal. Status, as shown in Figure 4. Thereby, the present invention can quickly and effectively seal the peripheral edges of the temperature equalizing plate 1 via a simple stamping process, thereby reducing the manufacturing cost. It should be noted that since the first edge 100 and the second edge 120 form a sealed state through the stamping process, no foreign matter such as solder or sealant remains between the first edge 100 and the second edge 120, and There will be traces of soldering, as shown in Figure 4.

Next, step S18 is performed to fill a working fluid (eg, water) 18 between the first metal cover 10 and the second metal cover 12. Next, in step S20, the cavity between the first metal cover 10 and the second metal cover 12 is evacuated to complete the manufacture of the temperature equalizing plate 1 shown in FIG.

As shown in FIG. 3, the manufactured uniform temperature plate 1 includes the first metal cover 10, the second metal cover 12, the capillary structure 14, the support column 16, and the working fluid 18 described above. When the punch 32 stamps the first edge 100 and the second edge 120, the punch 32 can cut the trailing end material 34 from the first edge 100 and the second edge 120 to seal the first edge 100 from the second edge 120. The side is relatively flat.

Referring to Fig. 3, please refer to Fig. 5. Fig. 5 is a schematic cross-sectional view of the stamped uniform temperature plate 1' according to the second embodiment of the present invention. The main difference between the temperature equalizing plate 1' and the above-mentioned temperature equalizing plate 1 is that the temperature equalizing plate 1' further includes a clip 20 for clamping the first edge 100 and the second edge 120 forming the sealed state, Strengthen the sealing effect. It should be noted that the components of the same reference numerals as those shown in FIG. 3 are substantially the same, and will not be described again.

Referring to FIG. 2, please refer to FIG. 6. FIG. 6 is a schematic cross-sectional view of the temperature equalizing plate 1" before punching according to the third embodiment of the present invention. The main temperature plate 1" is different from the above-mentioned uniform temperature plate 1. The first edge 100 and the second edge 120 of the temperature equalizing plate 1" have concave and convex surface structures 102, 122 before stamping. When the first edge 100 and the second edge 120 of the temperature equalizing plate 1" are in FIG. When the die 30 and the punch 32 are punched, the uneven surface The structures 102, 122 can enhance the effect of destroying the grain boundary of the metal, thereby enhancing the sealing effect. In this embodiment, the uneven surface structures 102, 122 may be in a zigzag shape, but are not limited thereto. In addition, the present invention may also form the concave-convex surface structure 102 only on the first edge 100 or the concave-convex surface structure 122 only on the second edge 120. In other words, at least one of the first edge 100 and the second edge 120 may have a textured surface structure prior to stamping, depending on the application. It should be noted that the components of the same reference numerals as those shown in FIG. 2 have substantially the same operation principle, and are not described herein again.

In summary, the present invention utilizes a stamping process to form a sealed state of the edges of the two metal cover plates of the temperature equalization plate. The process is simple, and the manufacturing efficiency of the temperature equalizing plate can be effectively improved, thereby reducing the manufacturing cost. In addition, the present invention can clamp and clamp the edges of the two metal cover sheets in a sealed state to enhance the sealing effect.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

1, 1 ', 1" ‧ ‧ temperate plate

10‧‧‧First metal cover

12‧‧‧Second metal cover

14‧‧‧Capillary structure

16‧‧‧Support column

18‧‧‧Working fluid

20‧‧‧ Clips

30‧‧‧ die

32‧‧‧ Punch

34‧‧‧End material

100‧‧‧ first edge

120‧‧‧ second edge

102, 122‧‧‧ concave surface structure

S10-S20‧‧‧Steps

Fig. 1 is a flow chart showing a method of manufacturing a temperature equalizing plate according to a first embodiment of the present invention.

Figure 2 is a schematic cross-sectional view of the temperature equalization plate before stamping.

Figure 3 is a schematic cross-sectional view of the uniform temperature plate after stamping.

Figure 4 is a micrograph of the first and second edges of the stamped isothermal plate.

Fig. 5 is a schematic cross-sectional view showing a stamped uniform temperature plate according to a second embodiment of the present invention.

Fig. 6 is a schematic cross-sectional view showing a temperature equalizing plate before punching according to a third embodiment of the present invention.

1‧‧‧Wall plate

10‧‧‧First metal cover

12‧‧‧Second metal cover

14‧‧‧Capillary structure

16‧‧‧Support column

18‧‧‧Working fluid

30‧‧‧ die

32‧‧‧ Punch

34‧‧‧End material

100‧‧‧ first edge

120‧‧‧ second edge

Claims (12)

A method for manufacturing a temperature equalizing plate includes: bonding a first edge of a first metal cover to a second edge of a second metal cover; and bonding the first metal cover to the first metal cover The second metal cover is placed on a die; and the first edge and the second edge are punched in a direction of the die with a punch to form a sealed state between the first edge and the second edge. The manufacturing method of the temperature equalizing plate according to claim 1, further comprising: cutting the material of the tail end from the first edge and the second edge when the punch punches the first edge and the second edge. The method of manufacturing a temperature equalizing plate according to claim 1, wherein at least one of the first edge and the second edge has a concave-convex surface structure before punching. The method for manufacturing a temperature equalizing plate according to claim 1, further comprising: clamping the first edge and the second edge in a sealed state by a clip. The method of manufacturing a temperature equalizing plate according to claim 1, wherein the first metal cover and the second metal cover are made of copper or aluminum. The method for manufacturing a temperature equalizing plate according to claim 1, further comprising: Forming a capillary structure between the first metal cover and the second metal cover; and providing a plurality of support columns between the first metal cover and the second metal cover to support the first metal cover a plate and the second metal cover; and filling a working fluid between the first metal cover and the second metal cover. The method for producing a uniform temperature plate according to claim 6, wherein the capillary structure is a grooved capillary structure, a porous capillary structure, a network capillary structure, a powder sintered capillary structure or a composite capillary structure. A temperature equalizing plate comprising: a first metal cover; a second metal cover, a first edge of the first metal cover and a second edge of the second metal cover as claimed in claim 1 The manufacturing method is formed into a sealed state by a stamping process; a capillary structure is formed between the first metal cover and the second metal cover; and a working fluid is filled in the first metal cover and the first Between two metal cover plates. The temperature equalizing plate according to claim 8, further comprising a plurality of supporting columns disposed between the first metal cover and the second metal cover to support the first metal cover and the second metal cover board. The temperature equalizing plate according to claim 8, further comprising a clip for clamping and forming a seal The first edge of the state and the second edge. The temperature equalizing plate of claim 8, wherein the first metal cover and the second metal cover are made of copper or aluminum. The temperature equalizing plate according to claim 8, wherein the capillary structure is a grooved capillary structure, a porous capillary structure, a mesh capillary structure, a powder sintered capillary structure or a composite capillary structure.