TWM575647U - Heat-dissipation structure of middle frame - Google Patents

Abstract

A heat dissipation structure for a middle frame includes: a body; the body has a frame portion and at least one heat exchange portion, the frame portion is adjacent to and connected to the heat exchange portion, and the heat exchange portion has an airtight chamber therein, and The airtight chamber has a capillary structure and a working fluid, and the medium frame heat dissipation structure having both strength and heat dissipation performance can be provided through the creation system.

Description

Middle frame heat dissipation structure

A medium-frame heat dissipation structure, especially a medium-frame heat dissipation structure having both structural strength and high thermal conductivity.

As mobile devices become more powerful, internal computing chips must also provide high-efficiency execution speeds, and high heat generated in mobile devices must be de-heated, thereby preventing wafer burnout and due to mobile devices. The thinner the lighter, the smaller the space for the internal electronic components, and the heat dissipating components must be designed to fit in a narrow space. In the prior art, the average temperature plate is designed to be used as a middle frame or a back cover for carrying electronic components of a mobile device. First, a manufacturer directly directly forms a copper material having a better heat conduction efficiency characteristic into a two-phase heat exchange cavity. The middle frame or back cover of the chamber is not strong because of the soft nature of the copper material. It is easy to deform and the support is not good. Therefore, another manufacturer first makes the aluminum or aluminum alloy material with strong structural strength. The middle frame or the back cover, and then the temperature equalizing plate or the heat pipe is combined with the aluminum middle frame or the back cover by diffusion bonding, etc., but the diffusion bonding is easy to generate high heat, when the centering frame or the back cover is both When the warm plate or the heat pipe is subjected to the diffusion bonding work, it is easy to evaporate or destroy the internal capillary structure in the temperature equalizing plate or the heat pipe, thereby increasing the defect rate. Therefore, another manufacturer can bond the middle frame with the heat pipe or the uniform temperature plate through double-sided adhesive or liquid glue material, but the double-sided adhesive or liquid glue used in the bonding work is easy to make the middle frame and the uniform temperature plate or the heat pipe. Thermal resistance is generated between the two, which in turn reduces the heat transfer efficiency, and the adhesion to each other also causes the thickness to be too thick to be placed in a limited space such as a narrow space. Therefore, how to set the heat-dissipating unit with good heat-conducting efficiency in a limited space, and to have the strength of the middle frame structure, the frame or the back cover with good heat dissipation performance and sufficient carrying capacity is the first in the industry. aims.

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a medium-frame heat dissipation structure with good support strength and high thermal conductivity. For the purpose of the above, the present invention provides a middle frame heat dissipation structure, comprising: a body having a frame portion and at least one heat exchange portion, the frame portion being adjacent to and connected to the heat exchange portion, The heat exchange portion has an airtight chamber, and the airtight chamber has a capillary structure and a working fluid. For the purpose of the above, the present invention provides a middle frame heat dissipation structure, comprising: a body; the body has a frame portion and at least one heat exchange element and a joint portion, the frame portion connecting the joint portion, the heat The exchange element is embedded in the joint, and the outer edge of the heat exchange element is adjacent and connected to the frame by laser welding or mechanical pressing. Through the heat dissipation structure of the frame, the material with better structural strength is selected as the material of the frame, and the material with better heat conductivity is selected as the material of the heat exchange part, and finally combined by laser welding to improve the structural strength of the frame. And the lack of thermal conductivity is not good.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. Please refer to the figures 1, 2, 3 and 4, which are the three-dimensional decomposition and combination diagram of the first embodiment of the frame heat dissipation structure. As shown in the figure, the middle frame heat dissipation structure includes: a body The body 1 has a frame portion 11 and at least one heat exchange portion 12 adjacent to and connected to the heat exchange portion 12, the heat exchange portion 12 has an airtight chamber 121 therein, and the gas The dense chamber 121 has at least one capillary structure 122 and a working fluid 123 (which may be a gas (refrigerant) or a liquid such as acetone, pure water, water tank fine, alcohol, etc.), and the heat exchange portion 12 and the frame portion 11 The material of the heat exchange portion 12 and the frame portion 11 is any one or a combination of gold, silver, copper, aluminum, titanium, or titanium alloy. The body 1 has a first plate body 11a and a second plate body 11b, and the first and second plates 11a, 11b are made of gold, silver, copper, stainless steel, aluminum, commercial pure titanium, titanium. Any one or a combination of the alloys, the first and second plates 11a, 11b are any of the same or different materials. The first and second plates 11a and 11b are superposed on each other to define the airtight chamber 121, and the first plate 11a is made of a material having a better supporting strength, such as any of the foregoing stainless steel or titanium alloy, and the second The plate body 11b is made of a material having better heat conductivity, such as gold, silver, copper, or commercial pure titanium, and the first and second plates 11a and 11b are superposed on each other to form a vapor-liquid chamber having a gas-tight chamber 121. The heat exchange portion 12 is formed in a cycle. The arrangement of the corresponding matching heat source may be one or more of the heat exchange portions 12, that is, the second plate body 11b may be a plurality of corresponding ones and the upper and lower sides of the first plate body 11a. A part is bonded by means of laser welding or mechanical pressing, as shown in Fig. 4. Please refer to FIG. 5 , which is a perspective exploded view of the second embodiment of the heat dissipation structure of the present invention. As shown in the figure, the technical features of the first embodiment are the same as those of the first embodiment, and therefore will not be described herein. The difference between the present embodiment and the foregoing first embodiment is that the frame portion 11 is combined with a heat exchange element 2. The body 1 is recessed with a joint portion 13 and the joint portion 13 is connected to the frame portion 11. The joint portion 13 is a groove having an open side 131 and a closed side 132. The heat exchange element 2, one side of the closed side 132 is attached to the other side to be convex or cut or lower than the open side 131, and the outer edge of the heat exchange element 2 is integrated with the frame portion 11 by laser welding. Please refer to FIGS. 6 and 7 for a perspective exploded view and a combined cross-sectional view of a third embodiment of the heat dissipation structure of the present invention. As shown in the figure, the present embodiment is identical to the technical features of the second embodiment. Therefore, the difference between the present embodiment and the first embodiment is that the joint portion 13 of the body 1 is uniformly perforated, and the through hole penetrates the upper and lower sides of the body 1, and the heat exchange is performed. The component 2 is embedded or embedded in the through hole, and both sides of the heat exchange element 2 are selected to be aligned or protruded or lower than the upper and lower sides of the body 1. The heat exchange element 2 of the second and third embodiments has an airtight chamber 21, and the airtight chamber 21 has a capillary structure 22 and a working fluid 23, and the heat exchange element 2 is a In the embodiment, the temperature equalizing plate is used as the illustrative embodiment, but is not limited thereto, and the temperature equalizing plate or the flat heat pipe is transmitted through the region where the airtight chamber 21 is not provided. (ie, the inactive end region), that is, the outer edge of the temperature equalization plate is laser- or laser-bonded to the frame portion 11. The heat exchange element 2 of the second and third embodiments described above may also be replaced by any other good conductor of heat conduction such as a copper block or a graphite block or a graphene sheet or a commercially pure titanium. The airtight chambers 121, 21 in the above first to third embodiments are permeable to a support structure, and the support structure may be a solid column 3, a wave plate 4, and an intermediate support member 5 having horizontal and vertical vent holes. The hollow ring 6 and the like are placed in the airtight chambers 121, 21, or protrude from the inner surface of one side plate to the other side to abut the corresponding inner surface or capillary, and are lifted by the aforementioned components. The support strength of the airtight chambers 121, 21 is used (as shown in Figures 8, 9, 10, 11). This creation mainly solves the problem that the middle frame structure only uses the material with good thermal conductivity to cause the lack of strength of the middle frame, and through the material with better structural strength such as stainless steel or titanium or aluminum or aluminum alloy as the middle frame main structure, then the heat conduction The better-performing materials are combined to form a middle frame structure having a gas-tight chamber with a uniform temperature effect or to integrate the heat exchange element with the middle frame, thereby improving the lack of conventional frame strength and heat dissipation efficiency, and Moreover, due to the high cost of the material with better thermal conductivity, the material of different characteristics is used in the sub-area, and the material cost can be greatly saved. And by the method of forming the heat exchange element and the laser welding method, it is possible to improve the conventional method of combining the middle frame with the heat exchange element by ordinary welding or diffusion bonding or by forming the middle frame into the heat absorbing area having the airtight chamber. Further, due to the high temperature generated by diffusion bonding or ordinary welding, the internal working liquid is evaporated or the capillary structure is damaged.

1‧‧‧ Ontology

11‧‧‧ Frame Department

11a‧‧‧First board

11b‧‧‧Second plate

12‧‧‧Hot Exchange Department

121‧‧‧ airtight chamber

122‧‧‧Capillary structure

123‧‧‧Working fluid

13‧‧‧Combination Department

131‧‧‧ open side

132‧‧‧ Closed side

2‧‧‧Heat exchange components

21‧‧‧ airtight chamber

22‧‧‧Capillary structure

23‧‧‧Working fluid

3‧‧‧solid column

4‧‧‧ Wave board

5‧‧‧Intermediate support

6‧‧‧ hollow ring

1 is a perspective exploded view of a first embodiment of a frame heat dissipation structure in the present invention; FIG. 2 is a perspective assembled view of a first embodiment of the frame heat dissipation structure in the creation; A cross-sectional view of the first embodiment of the frame heat dissipation structure is created; FIG. 4 is another perspective combination view of the first embodiment of the frame heat dissipation structure of the present invention; 3 is an exploded perspective view of a third embodiment of the frame heat dissipation structure of the present invention; FIG. 7 is a third embodiment of the frame heat dissipation structure of the present invention. FIG. 8 is a combined cross-sectional view of a fourth embodiment of the frame heat dissipation structure of the present invention; FIG. 9 is a combined sectional view of the fifth embodiment of the frame heat dissipation structure of the present invention; A cross-sectional view of a sixth embodiment of the frame heat dissipation structure of the present invention; FIG. 11 is a combined sectional view of a seventh embodiment of the frame heat dissipation structure of the present invention.

Claims (10)

A heat dissipation structure for a middle frame includes: a body having a frame portion and at least one heat exchange portion, wherein the frame portion is adjacent to and connected to the heat exchange portion, and the heat exchange portion has an airtight chamber therein, and The airtight chamber has a capillary structure and a working fluid. The medium heat dissipation structure according to claim 1, wherein the body has a first plate body and a second plate body, and the first and second plate systems are the same or different materials. . The medium heat dissipation structure according to claim 1, wherein the heat exchange portion and the frame portion are the same or different materials, and the heat exchange portion and the frame portion are made of gold. Any one or combination of silver, copper, aluminum, titanium, or titanium alloy. The medium heat dissipation structure according to claim 1, wherein the working fluid system is a gas or a liquid, and the liquid is any one of a refrigerant, acetone, pure water, a water tank, and an alcohol. A heat dissipation structure for a middle frame includes: a body having a frame portion and at least one heat exchange element and a joint portion, the frame portion connecting the joint portion, the heat exchange element being embedded in the joint portion, and The outer edges of the heat exchange elements are adjacent and connected to the frame by laser welding. The medium heat dissipation structure according to claim 5, wherein the heat exchange element has an airtight chamber, and the airtight chamber has at least one capillary structure and a working fluid, and the heat exchange element is For either a uniform temperature plate or a flat heat pipe. The medium heat dissipation structure according to claim 5, wherein the joint portion is recessed on one side of the body, and the concave portion is a groove having an open side and a closed side. One side of the heat exchange element is attached to the other side of the closed side to be selectively convex or tangential or lower than the open side. The medium heat dissipation structure according to claim 5, wherein the joint portion is a continuous perforation, the through hole is penetrated through the upper and lower sides of the body, and the heat exchange element is embedded in the through hole. Inside, and the sides of the heat exchange element are selected to be aligned or convex or lower than the upper and lower sides of the body. The medium heat dissipation structure according to claim 5, wherein the heat exchange element is any one of a copper block or a graphite block or a graphene sheet or a commercial pure titanium. The medium heat dissipation structure according to claim 5, wherein the working fluid system is a gas or a liquid, and the liquid is any one of a refrigerant, an acetone, a pure water, a water tank, and an alcohol.