CN111447791A - Heat radiation combination structure of hand-held device - Google Patents
Heat radiation combination structure of hand-held device Download PDFInfo
- Publication number
- CN111447791A CN111447791A CN202010263059.5A CN202010263059A CN111447791A CN 111447791 A CN111447791 A CN 111447791A CN 202010263059 A CN202010263059 A CN 202010263059A CN 111447791 A CN111447791 A CN 111447791A
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- China
- Prior art keywords
- outer frame
- frame body
- heat exchange
- exchange unit
- heat
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat radiation combination structure of a handheld device, comprising: an outer frame body, a two-phase flow heat exchange unit; the outer frame body is provided with a hollow accommodating space at the center and surrounds the periphery of the hollow accommodating space; the two-phase flow heat exchange unit is arranged in the hollow accommodating space and is connected and combined with the outer frame body through an injection molding structural member, so that the quick and stable combination is achieved.
Description
Technical Field
The invention relates to a heat dissipation combination structure of a handheld device, in particular to a heat dissipation combination structure of a handheld device, which uses an integral enveloping structure body as a connecting structure to further connect an outer frame of the handheld device and a two-phase flow heat exchange unit.
Background
With the multiplication of the efficiency and processing speed of the handheld mobile device, the internal electronic components generate a high thermal response and are conducted to the whole handheld device, so that the user is scalded and the electronic components are overheated to crash or burn, which is a necessary solution for cooling the internal electronic components.
In order to reduce heat, the manufacturers usually add an auxiliary heat transfer element such as a copper sheet, a graphite sheet, a thin heat pipe, a two-phase flow heat exchange unit, etc. in the mobile device to dissipate heat generated by the internal electronic element or guide the heat to a far end for heat dissipation.
The integrated center housing 3 is formed by a single material through milling or punching, the single material is aluminum or aluminum alloy or copper alloy, the light material is selected but the structural strength is lost, the material with better structural strength is selected but the weight is increased, if the material with better heat conduction efficiency is selected, such as pure copper, the heat conduction efficiency can be improved, but the weight is heavier, and the soft structural strength of the pure copper is not good, so the center housing 4 selected from the single material cannot give consideration to the heat conduction efficiency and the structural strength.
Furthermore, referring to fig. 6, the conventional middle frame housing 4 is used for carrying various electronic components 5 and heat dissipation or heat conduction components 6, when the heat conduction performance of the material of the middle frame housing 4 is not good, heat conduction must be performed by the heat dissipation or heat conduction components 5, and the heat dissipation or heat conduction components 6 must be attached to the middle frame housing 4 and then stacked with the electronic components 5 for heat conduction, so that the overall thickness and weight of the middle frame housing 4 are increased, and the effects of thinning and light weight cannot be achieved.
In addition, since the handheld device is thinner and lighter, how to select materials that can achieve both the lighter weight and thinner thickness and have good structural strength is a drawback that is the first improvement of the industry.
Disclosure of Invention
Accordingly, the present invention has been made keeping in mind the above problems occurring in the related art, and an object of the present invention is to provide a heat dissipating structure of a handheld device, which is formed by integrally wrapping and connecting a structural member to a housing body for quick connection with a two-phase heat exchange unit.
To achieve the above object, the present invention provides a heat dissipation combination structure of a handheld device, comprising:
the outer frame body is provided with a hollow accommodating space, and the outer frame body surrounds the periphery of the hollow accommodating space;
and the two-phase flow heat exchange unit is arranged in the hollow accommodating space and is connected and combined with the outer frame body through an injection molding structural member.
The handheld device heat dissipation combination structure is characterized in that the injection molding structural component is an integrally wrapped injection molding structural component, the outer frame body and the two-phase flow heat exchange unit are placed into an injection molding die together for integral injection molding, and then the injection molding structural component is molded and simultaneously connected with the outer frame body and the two-phase flow heat exchange unit.
The handheld device heat dissipation combination structure is characterized in that the injection molding structural part is any one of plastic and metal.
The handheld device heat dissipation combination structure is characterized in that the two-phase flow heat exchange unit is a flat heat pipe or a temperature-equalizing plate.
The heat dissipation combination structure of the handheld device is characterized in that the outer frame body and the two-phase flow heat exchange unit are made of the same or different materials.
The heat dissipation combination structure of the handheld device is characterized in that the outer frame body and the two-phase flow heat exchange unit are made of any one of copper, aluminum, stainless steel, ceramic, copper alloy, aluminum alloy, commercial pure titanium and titanium alloy.
The handheld device heat dissipation combination structure is characterized in that the two-phase flow heat exchange unit is provided with at least one airtight chamber, and a capillary structure is arranged in the airtight chamber and filled with a working fluid.
When the outer frame body and the two-phase flow heat exchange unit are not in an integrally formed structure, the injection molding structural member can be formed in an integrally injection mode, and meanwhile, the outer frame body and the two-phase flow heat exchange unit are quickly combined into a whole through connection of the injection molding structural member.
The invention has the main advantages that the outer frame body used as the handheld device for enhancing the structural strength and the two-phase flow heat exchange unit used for bearing and conducting heat conduction on the electronic element are respectively and independently manufactured, and then the injection molding structural member is molded in an integral injection mode to connect and combine the outer frame body and the two-phase flow heat exchange unit into a whole, so that the outer frame body and the two-phase flow heat exchange unit can be quickly and simply combined and fixed, besides heat insulation can be carried out by the structural member, the defects that the existing integral handheld device middle frame only can provide single material characteristics and is difficult to process and the like can be greatly improved, and the outer frame body and the two-phase flow heat exchange unit are respectively and independently arranged and manufactured.
The outer frame body is combined with the two-phase flow heat exchange unit to form a combination, the two-phase flow heat exchange unit with the two-phase flow heat exchange effect can be directly used for simultaneously carrying the electronic element and conducting heat, the arrangement of a heat dissipation and heat transfer element is omitted on the premise of not increasing the heat transfer element and the thickness, the overall weight and the thickness are greatly reduced, and the purposes of light weight and thinning are achieved.
Drawings
FIG. 1 is an exploded perspective view of a heat sink assembly of a hand-held device according to a first embodiment of the present invention;
FIG. 2 is a perspective assembly view of a heat dissipation assembly of a handheld device according to a first embodiment of the present invention;
FIG. 3 is an exploded perspective view of a heat sink assembly of a hand-held device according to a second embodiment of the present invention;
FIG. 4 is a sectional view of a heat sink combination structure of a handheld device according to a second embodiment of the present invention;
FIG. 5 is an exploded perspective view of a heat sink assembly of a handheld device in accordance with a third embodiment of the present invention;
FIG. 6 is a perspective assembly view of a heat dissipation assembly of a handheld device in accordance with a third embodiment of the present invention;
fig. 7 is a schematic cross-sectional view of the prior art.
Description of reference numerals: an outer frame body 1; a hollow accommodating space 11; a groove portion 12; a two-phase flow heat exchange unit 2; a first vapor chamber 2 c; a second vapor chamber 2 d; a gas-tight chamber 21; a capillary structure 211; a working fluid 212; a lip 22; a middle frame shell 4; an electronic component 5; a heat dissipating or conducting element 6.
Detailed Description
The above objects, together with the structural and functional features thereof, are accomplished by the preferred embodiments according to the accompanying drawings.
Referring to fig. 1 and fig. 2, a heat dissipation combination structure of a handheld device according to a first embodiment of the present invention is shown in a three-dimensional exploded and assembled view, and includes: an outer frame body 1, a two-phase flow heat exchange unit 2;
the outer frame body 1 has at least one hollow accommodating space 11, in this embodiment, a hollow accommodating space 11 is provided at the center of the outer frame body 1, and the outer frame body 1 surrounds the hollow accommodating space 11;
the two-phase flow heat exchange unit 2 is disposed in the hollow accommodating space 11 and connected to the outer frame body 1 through an injection molding structure 3, the two-phase flow heat exchange unit 2 has at least one airtight chamber 21, the airtight chamber 21 has at least one capillary structure 211 therein and is filled with a working fluid 212, and the two-phase flow heat exchange unit 2 is a flat heat pipe or a temperature-equalizing plate.
The injection molding structural member 3 is an integrally wrapped injection molding structural member, the outer frame body 1 and the two-phase flow heat exchange unit 2 are placed into an injection molding die (not shown) together for integral injection molding, and then the injection molding structural member 3 is molded and simultaneously connected with the outer frame body 1 and the two-phase flow heat exchange unit 2, wherein the injection molding structural member 3 is any one of plastic and metal.
The outer frame body 1 and the two-phase flow heat exchange unit 2 can be made of the same or different materials, and the outer frame body 1 and the two-phase flow heat exchange unit 2 are made of any one of copper, aluminum, stainless steel, ceramic, copper alloy, aluminum alloy, commercial pure titanium and titanium alloy.
Please refer to fig. 3 and fig. 4, which are three-dimensional exploded and assembled cross-sectional views of a second embodiment of a heat dissipation combination structure of a handheld device of the present invention, and as shown in the figures, part of the structure of the present embodiment is the same as that of the first embodiment, and therefore will not be described herein, but the difference between the present embodiment and the first embodiment is that a groove 12 is formed on an inner edge of an outer frame body 1, a two-phase flow heat exchange unit 2 is a uniform temperature plate, a lip 22 is formed on an outer edge of the two-phase flow heat exchange unit 2, one end of an injection molding structural member 3 is embedded in the groove 12, and the other end of the injection molding structural member covers the lip 22, so that the outer frame body 1 and the two-phase flow heat exchange unit 2 are.
Referring to fig. 5 and 6, a third embodiment of a heat dissipation combination structure of a handheld device according to the present invention is shown in an exploded view and an assembled view, as shown in the figures, the structure of the present embodiment is the same as that of the second embodiment, and therefore will not be described herein again, but the difference between the present embodiment and the second embodiment is that the two-phase flow heat exchange unit 2 of the present embodiment is composed of a first temperature equalizing plate 2c and a second temperature equalizing plate 2d, the first temperature equalizing plate 2c and the second temperature equalizing plate 2d are made of stainless steel and copper material respectively, the first and second temperature equalizing plates 2c and 2d can be connected together by the injection molding structure 3, or the first and second temperature equalizing plates 2c and 2d and the outer frame body 1 are connected to the outer frame body 1 and the two-phase flow heat exchanging unit 2 (the first temperature equalizing plate 2c and the second temperature equalizing plate 2d) through the injection molding structural member 3 at the same time for fixing.
The main purpose of the present invention is to independently manufacture an outer frame body 1 used as a handheld device for enhancing structural strength and a two-phase flow heat exchange unit 2 used for carrying and conducting heat conduction to electronic components, and then to form an injection molding structural member 3 by an integral injection molding method to connect and combine the outer frame body 1 and the two-phase flow heat exchange unit 2 into a whole, so that the two elements of the outer frame body 1 and the two-phase flow heat exchange unit 2 can be quickly and simply combined and fixed, besides the structural member can be used for heat insulation, the present invention can also greatly improve the defects that the existing integral handheld device middle frame can only provide single material characteristics and is difficult to process, and the two elements are independently arranged and manufactured.
The outer frame body 1 of the invention combines the two-phase flow heat exchange unit 2 for a combination, can directly provide work of bearing electronic elements and heat conduction through the two-phase flow heat exchange unit 2 with the two-phase flow heat exchange effect, saves the arrangement of heat dissipation and heat transfer elements on the premise of not increasing the heat transfer elements and the thickness, greatly reduces the overall weight and the thickness, and achieves the purposes of light weight and thinning.
Claims (9)
1. A heat dissipation combination structure of a handheld device, comprising:
the outer frame body is provided with a hollow accommodating space, and the outer frame body surrounds the periphery of the hollow accommodating space;
and the two-phase flow heat exchange unit is arranged in the hollow accommodating space and is connected and combined with the outer frame body through an injection molding structural member.
2. The heat dissipating combination structure of claim 1, wherein the injection-molded structure is a one-piece molded structure, the two-phase heat exchange unit and the outer frame body are integrally injection-molded in an injection mold, and the injection-molded structure is then molded to connect the outer frame body and the two-phase heat exchange unit.
3. The heat dissipating combination structure of claim 1, wherein the injection molded structure is one of plastic and metal.
4. The handset heat dissipation coupling of claim 1, wherein the two-phase flow heat exchange element is a flat heat pipe or a vapor plate.
5. The heat dissipating combination structure of claim 1, wherein the outer frame body and the two-phase heat exchange unit are made of the same or different materials.
6. The heat dissipating combination structure of claim 1, wherein the material of the outer frame body and the two-phase heat exchanging unit is any one of copper, aluminum, stainless steel, ceramic, copper alloy, aluminum alloy, commercially pure titanium and titanium alloy.
7. The hand-held device heat dissipation coupling of claim 1, wherein the two-phase flow heat exchange unit has at least one airtight chamber having a capillary structure therein and filled with a working fluid.
8. The heat dissipation assembly of claim 1, wherein the two-phase heat exchange unit comprises at least a first vapor chamber and a second vapor chamber, and is integrally connected to the injection-molded structure.
9. The heat dissipation combination structure of claim 1, wherein the first and second vapor chamber plates are made of stainless steel and copper material, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010263059.5A CN111447791A (en) | 2020-04-07 | 2020-04-07 | Heat radiation combination structure of hand-held device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010263059.5A CN111447791A (en) | 2020-04-07 | 2020-04-07 | Heat radiation combination structure of hand-held device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111447791A true CN111447791A (en) | 2020-07-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010263059.5A Pending CN111447791A (en) | 2020-04-07 | 2020-04-07 | Heat radiation combination structure of hand-held device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201530076A (en) * | 2014-01-21 | 2015-08-01 | Htc Corp | Electronic device |
| TWM575647U (en) * | 2018-12-11 | 2019-03-11 | 奇鋐科技股份有限公司 | Heat-dissipation structure of middle frame |
| US20190132993A1 (en) * | 2016-07-06 | 2019-05-02 | Hewlett-Packard Development Company, L.P. | Heat spreader to structurally support an outer housing |
| CN109890174A (en) * | 2018-12-14 | 2019-06-14 | 奇鋐科技股份有限公司 | Center radiator structure |
-
2020
- 2020-04-07 CN CN202010263059.5A patent/CN111447791A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201530076A (en) * | 2014-01-21 | 2015-08-01 | Htc Corp | Electronic device |
| US20190132993A1 (en) * | 2016-07-06 | 2019-05-02 | Hewlett-Packard Development Company, L.P. | Heat spreader to structurally support an outer housing |
| TWM575647U (en) * | 2018-12-11 | 2019-03-11 | 奇鋐科技股份有限公司 | Heat-dissipation structure of middle frame |
| CN109890174A (en) * | 2018-12-14 | 2019-06-14 | 奇鋐科技股份有限公司 | Center radiator structure |
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