CN211792641U - High-performance radiator for motor controller - Google Patents
High-performance radiator for motor controller Download PDFInfo
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- CN211792641U CN211792641U CN202020563068.1U CN202020563068U CN211792641U CN 211792641 U CN211792641 U CN 211792641U CN 202020563068 U CN202020563068 U CN 202020563068U CN 211792641 U CN211792641 U CN 211792641U
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- heat dissipation
- dissipation substrate
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- heat
- controller box
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Abstract
The utility model provides a high-performance radiator for a motor controller, which comprises a controller box body and a radiating substrate, wherein the controller box body is provided with a radiating envelope cavity communicated with the inside of the controller box body, and the radiating envelope cavity is communicated with an external water cooling system through a water inlet pipeline and a water outlet pipeline; the heat dissipation substrate is made of copper, one surface of the heat dissipation substrate is used for being in heat transfer connection with a power device, and the other surface of the heat dissipation substrate is connected with the heat dissipation enveloping cavity, so that the heat dissipation enveloping cavity forms a closed cavity. The utility model discloses to dispel the heat the base plate with controller box integrated back, controller box assembly's configuration is unanimous with traditional controller box to not occupy extra design space, nevertheless become copper by die-casting aluminum alloy through with the cooling surface material, the utility model discloses will obtain radiating effect's very big promotion.
Description
Technical Field
The utility model relates to a high performance radiator for machine controller.
Background
In recent years, the whole new energy automobile industry has a vigorous development situation under the support of a policy of vigorously advocating developing energy automobiles in China.
The electric drive system is used as a power output unit of the whole vehicle and determines the power performance of the electric vehicle, so the electric drive system is called as the heart of a performance source vehicle, and the importance of the electric drive system is remarkable. Along with the pursuit of large manufacturers for high power density of motor controller products, the model selection of power devices tends to be more and more miniaturized and compact. Therefore, the heat dissipation area is smaller on the premise of the same power, and the heat dissipation heat flux density is larger, so that the heat dissipation difficulty of the controller is increased.
In the design process of the motor controller radiator, the heat dissipation performance of the motor controller radiator is greatly determined by the heat conductivity of the material of the heat dissipation substrate. Due to cost and manufacturability considerations, the heat sink design is generally integrated on the controller housing, which results in that the designer is forced to use the body material (generally die-cast aluminum alloy) of the controller housing as the heat sink substrate material of the heat sink. The thermal conductivity of die-cast aluminum alloys is only 1/4 for copper, which greatly limits the heat dissipation performance of the controller heat sink relative to copper, which is commonly used for heat dissipation.
To solve this technical problem, there are two common solutions: 1) adjusting the type selection of the power device and increasing the design margin; 2) a split type radiator is adopted, and the controller box body and the radiator are made of different materials. However, the two solutions often bring about a large cost increase, and the overall competitiveness of the product is weakened.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a high performance radiator for machine controller provides new thinking for solving above-mentioned problem to the promotion of great heat dispersion is traded for to the less increase in cost of accessible.
In order to achieve the above object, the utility model adopts the following technical scheme:
a high performance radiator for machine controller which characterized in that: including controller box and heat dissipation base plate, wherein:
the controller box is provided with a heat dissipation envelope cavity communicated with the inside of the controller box, and the heat dissipation envelope cavity is communicated with an external water cooling system through a water inlet pipeline and a water outlet pipeline;
the heat dissipation substrate is made of copper, one surface of the heat dissipation substrate is used for being in heat transfer connection with a power device, and the other surface of the heat dissipation substrate is connected with the heat dissipation enveloping cavity, so that the heat dissipation enveloping cavity forms a closed cavity.
The motor controller uses high performance radiator, wherein: one surface of the heat dissipation substrate, which is in heat transfer connection with the power device, is a plane.
The motor controller uses high performance radiator, wherein: a water path partition plate is convexly arranged on the other surface of the heat dissipation substrate and can divide the heat dissipation enveloping cavity into a labyrinth shape.
The motor controller uses high performance radiator, wherein: and a heat dissipation rib plate or a heat dissipation column is convexly arranged on the other surface of the heat dissipation substrate.
The motor controller uses high performance radiator, wherein: and an assembling shoulder is arranged on one side of the heat dissipation envelope cavity communicated with the inside of the controller box body, and the heat dissipation substrate is connected with the heat dissipation envelope cavity through the assembling shoulder.
The motor controller uses high performance radiator, wherein: the controller box body is made of die-casting aluminum alloy and is integrally die-cast and molded.
The motor controller uses high performance radiator, wherein: the heat dissipation substrate is connected with the controller box body in a friction stir welding or vacuum brazing mode.
The motor controller uses high performance radiator, wherein: the heat dissipation substrate and the controller box body are sealed through a sealing ring and fixed through screws.
The motor controller uses high performance radiator, wherein: and the heat dissipation substrate fixed on the controller box body is milled to obtain a flat copper heat dissipation surface.
The motor controller uses high performance radiator, wherein: the heat dissipation substrate is formed by adopting an extrusion mode, a powder metallurgy mode or a metal injection mode.
Compared with the prior art, the utility model discloses the beneficial effect who has is: the heat dissipation effect is good, the structure is compact, and the cost is lower.
Drawings
Fig. 1 is an exploded view of the present invention.
Fig. 2 is a schematic structural diagram of the controller box.
Fig. 3 is a schematic structural diagram of a heat dissipation substrate.
Fig. 4 is a schematic view showing the complete assembly of the present invention.
Description of reference numerals: a controller case 11; a water inlet and outlet pipeline 111; a heat dissipating envelope cavity 112; a fitting shoulder 113; a heat-dissipating substrate 12; heat radiation ribs 121; a waterway barrier 122; a power device 2.
Detailed Description
As shown in fig. 1, which is an exploded schematic view of the present invention, a high performance heat sink for a motor controller is provided, which includes a controller case 11 and a heat dissipation substrate 12, and is used for guiding heat of a power device 2 from the inside of the controller case 11 to the outside; wherein:
as shown in fig. 2, the controller housing 11 is made of die-cast aluminum alloy, and is integrally die-cast, wherein a heat dissipation envelope cavity 112 communicated with the inside of the controller housing 11 is formed on one side of the controller housing, the heat dissipation envelope cavity 112 is communicated with an external water cooling system through a water inlet and outlet pipeline 111, and an assembly shoulder 113 is arranged on one side of the heat dissipation envelope cavity 112 communicated with the inside of the controller housing 11;
as shown in fig. 3, the heat dissipation substrate 12 is made of copper and can be obtained by an extrusion molding process, one surface of which is a plane, and the other surface of which is convexly provided with heat dissipation ribs 121 (which can also be heat dissipation columns in the shape of a circle, a diamond, etc.) and a water path partition plate 122; as shown in fig. 1 to 4, the heat dissipation substrate 12 is tightly connected to the heat dissipation envelope cavity 112 via the mounting shoulder 113, so that the heat dissipation envelope cavity 112 forms a closed cavity, the plane of the heat dissipation substrate 12 is used for thermally contacting with the power device 2, the heat dissipation ribs 121 and the water path partition plates 122 on the other side of the heat dissipation substrate 12 extend into the heat dissipation envelope cavity 112, the water path partition plates 122 can partition the heat dissipation envelope cavity 112 into a labyrinth shape to increase the length of the flow path of the cooling liquid in the heat dissipation envelope cavity 112, and the heat dissipation ribs 121 can enhance the heat transfer area and the heat transfer efficiency between the heat dissipation substrate 12 and the cooling liquid.
The heat dissipation substrate 12 and the controller case 11 may be connected by friction stir welding, and a flat copper heat dissipation surface is obtained by milling after welding to serve as a heat dissipation and exchange surface with the power device 2. It should be noted that the heat dissipation substrate 12 and the controller case 11 may also be connected by vacuum brazing; on the premise that the design space allows, the heat dissipation substrate 12 and the controller box 11 may also be sealed in a sealing manner by a sealing ring, and fixed by screws.
The heat dissipation envelope cavity 112 of the controller case 11 and the closed cavity formed by the heat dissipation substrate 12 constitute a main structure of the heat sink of the motor controller, and the heat dissipation rib 121 and the water path partition plate 122 arranged on the heat dissipation substrate 12 are used to increase the heat dissipation effect and form a flow path of the cooling liquid. The power device 2 is mounted on the heat dissipation substrate 12, and heat is transferred to the surface of the heat dissipation rib plate 121 through the heat dissipation substrate 12, so that the coolant can efficiently take away the heat.
Further, after the heat dissipation substrate 12 is integrated with the controller housing 11 in the above manner, the configuration of the controller housing assembly is consistent with that of a conventional controller housing (integrally formed by die casting) (as shown in fig. 4), and no additional design space is occupied. But through becoming the cooling surface material into copper by die-casting aluminum alloy, the utility model discloses the very big promotion that will obtain the radiating effect. The controller case 11 is still formed by a die casting process, and the heat dissipation substrate 12 may be formed by extrusion (powder metallurgy and metal injection molding). From the perspective of cost, the increased cost is concentrated on the heat dissipation substrate 12, but the cost is much lower than that of a split type heat sink, and the purpose of equal-cost power device type selection and smaller design size can be achieved by virtue of good heat dissipation effect.
The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A high performance radiator for machine controller which characterized in that: including controller box and heat dissipation base plate, wherein:
the controller box is provided with a heat dissipation envelope cavity communicated with the inside of the controller box, and the heat dissipation envelope cavity is communicated with an external water cooling system through a water inlet pipeline and a water outlet pipeline;
the heat dissipation substrate is made of copper, one surface of the heat dissipation substrate is used for being in heat transfer connection with a power device, and the other surface of the heat dissipation substrate is connected with the heat dissipation enveloping cavity, so that the heat dissipation enveloping cavity forms a closed cavity.
2. The high-performance heat sink for a motor controller according to claim 1, wherein: one surface of the heat dissipation substrate, which is in heat transfer connection with the power device, is a plane.
3. The high-performance heat sink for a motor controller according to claim 1, wherein: a water path partition plate is convexly arranged on the other surface of the heat dissipation substrate and can divide the heat dissipation enveloping cavity into a labyrinth shape.
4. The high-performance heat sink for a motor controller according to claim 1, wherein: and a heat dissipation rib plate or a heat dissipation column is convexly arranged on the other surface of the heat dissipation substrate.
5. The high-performance heat sink for a motor controller according to claim 1, wherein: and an assembling shoulder is arranged on one side of the heat dissipation envelope cavity communicated with the inside of the controller box body, and the heat dissipation substrate is connected with the heat dissipation envelope cavity through the assembling shoulder.
6. The high-performance heat sink for a motor controller according to claim 1, wherein: the controller box body is made of die-casting aluminum alloy and is integrally die-cast and molded.
7. The high-performance heat sink for a motor controller according to claim 1, wherein: the heat dissipation substrate is connected with the controller box body in a friction stir welding or vacuum brazing mode.
8. The high-performance heat sink for a motor controller according to claim 1, wherein: the heat dissipation substrate and the controller box body are sealed through a sealing ring and fixed through screws.
9. The high performance heat sink for motor controller according to claim 1, 7 or 8, wherein: and the heat dissipation substrate fixed on the controller box body is milled to obtain a flat copper heat dissipation surface.
10. The high-performance heat sink for a motor controller according to claim 1, wherein: the heat dissipation substrate is formed by adopting an extrusion mode, a powder metallurgy mode or a metal injection mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020563068.1U CN211792641U (en) | 2020-04-15 | 2020-04-15 | High-performance radiator for motor controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020563068.1U CN211792641U (en) | 2020-04-15 | 2020-04-15 | High-performance radiator for motor controller |
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| Publication Number | Publication Date |
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| CN211792641U true CN211792641U (en) | 2020-10-27 |
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| CN202020563068.1U Active CN211792641U (en) | 2020-04-15 | 2020-04-15 | High-performance radiator for motor controller |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111405833A (en) * | 2020-04-15 | 2020-07-10 | 稳力(广东)科技有限公司 | High-performance radiator for motor controller |
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2020
- 2020-04-15 CN CN202020563068.1U patent/CN211792641U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111405833A (en) * | 2020-04-15 | 2020-07-10 | 稳力(广东)科技有限公司 | High-performance radiator for motor controller |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210929 Address after: Room 101, 1f, building 5, yard 9, Fengyuan street, Daxing District, Beijing 100162 Patentee after: BEIJING WENLI TECH Co.,Ltd. Address before: 527326 Building 2, area o, Foshan (Yunfu) industrial transfer park, Silao Town, Yuncheng district, Yunfu City, Guangdong Province Patentee before: Steady Power (Guangdong) Technology Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220624 Address after: 527326 Building 2, area o, Foshan (Yunfu) industrial transfer park, Silao Town, Yuncheng district, Yunfu City, Guangdong Province Patentee after: Steady Power (Guangdong) Technology Co.,Ltd. Address before: Room 101, 1f, building 5, yard 9, Fengyuan street, Daxing District, Beijing 100162 Patentee before: BEIJING WENLI TECH Co.,Ltd. |
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| TR01 | Transfer of patent right |